Continuous silicon wafer conveying mechanism

Abstract

The utility model relates to the technical field of silicon wafer processing, in particular to a continuous silicon wafer conveying mechanism, which comprises a support frame provided with a first bottom conveying module and a second bottom conveying module in seamless butt joint with the tail end of the first bottom conveying module. The first movable frame and the second movable frame can move close to each other or away from each other, the first movable frame is provided with a first material clamping and conveying module, and the second movable frame is provided with a second material clamping and conveying module; the material clamping and conveying device further comprises a supporting cross beam arranged on the supporting frame body, the supporting cross beam is provided with a first fixing frame and a second fixing frame, the first fixing frame is provided with a third material clamping and conveying module, and the second fixing frame is provided with a fourth material clamping and conveying module. The first material clamping and conveying module and the second material clamping and conveying module are controlled to be far away from each other, the next batch of silicon wafers can be placed on the first bottom conveying module, material supplementing can be conducted in the process of conveying the silicon wafers, and the machining efficiency of the silicon wafers is improved.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer processing technology, and in particular to a continuous silicon wafer conveying mechanism. Background Technology

[0002] In the field of silicon wafer processing technology, efficient silicon wafer transport is a key link in ensuring production continuity and processing efficiency. In existing technologies, a wafer carrier is typically used to load silicon wafers, and the wafer-loaded wafer carrier is transported or moved as a whole to transfer the wafers between different processing stations. However, in the wafer transport process, the wafer-loaded wafer carrier must first be moved into a conveyor device, then the carrier is opened and removed, and subsequently, the wafers are continuously transported by the conveyor device, as detailed below.

[0003] Chinese patent document CN117577568A discloses a silicon wafer slicing and conveying device, specifically comprising: a water tank, a supporting conveying assembly located in the water tank, and two sets of clamping conveying assemblies. The supporting conveying assembly includes a first conveyor belt arranged laterally and a first drive mechanism for driving the first conveyor belt forward. The supporting surface of the first conveyor belt is arranged upward to support the laterally stacked silicon wafers. The two sets of clamping conveying assemblies each include a second conveyor belt and a second drive mechanism for driving the second conveyor belt forward. The clamping surfaces of the second conveyor belts of the two sets of clamping conveying assemblies are arranged laterally facing each other and the distance between them is adjustable to clamp the sides of the laterally stacked silicon wafers. A water jet mechanism is provided at the front end of the second conveyor belt to rinse and separate the front part of the stacked silicon wafers. The laterally stacked silicon wafers are conveyed forward under clamping, and the silicon wafers will not shift perpendicular to the stacking direction, thereby ensuring the effect of wafer-by-wafer output from the front.

[0004] Existing conveying devices have significant drawbacks: once the silicon wafers on the conveying assembly have been conveyed, the system needs to be stopped to replenish them with new wafers, causing production interruptions, severely impacting processing efficiency, and extending the production line cycle time. Especially in large-scale automated production, frequent shutdowns significantly reduce overall capacity. Therefore, a continuous silicon wafer conveying mechanism is provided to solve the aforementioned technical problems. Utility Model Content

[0005] The purpose of this invention is to provide a continuous silicon wafer conveying mechanism to address the shortcomings of existing technologies, thereby solving the technical problem that existing silicon wafer conveying mechanisms require shutdown before material replenishment can be performed.

[0006] To achieve the above objectives, the technical solution of this utility model is as follows:

[0007] A continuous silicon wafer conveying mechanism includes a support frame and a second conveying section for continuously conveying silicon wafers; the second conveying section includes a support frame, the support frame is provided with a first bottom conveying module for supporting and conveying silicon wafers, and is also provided with a second bottom conveying module that is seamlessly connected to the end of the first bottom conveying module.

[0008] It also includes a support plate installed on the support frame. The support plate is provided with a first movable frame and a second movable frame that can move closer to or further away from each other. The first movable frame is equipped with a first clamping and conveying module, and the second movable frame is equipped with a second clamping and conveying module for cooperating with the first clamping and conveying module to clamp and convey the silicon wafer placed on the first bottom conveying module.

[0009] It also includes a support beam installed on the support frame, the support beam is provided with a first fixed frame and a second fixed frame, the first fixed frame is provided with a third clamping conveying module, and the second fixed frame is provided with a fourth clamping conveying module for cooperating with the third clamping conveying module to clamp and convey the silicon wafers conveyed to the second bottom conveying module.

[0010] Furthermore, it also includes a first insert slot and a second insert slot installed on the support frame and filled with water, a first conveying part installed in the first insert slot and a second conveying part installed in the second insert slot.

[0011] Furthermore, the support plate is equipped with a horizontally arranged slide rail, the length direction of which is perpendicular to the silicon wafer conveying direction. The first movable frame and the second movable frame are both slidably mounted on the slide rail. The support plate is also equipped with a pair of control cylinders whose length direction is parallel to the length direction of the slide rail and arranged in opposite directions. The end of the extension rod of one control cylinder is fixedly mounted to the first movable frame, and the end of the extension rod of the other control cylinder is fixedly mounted to the second movable frame.

[0012] Furthermore, the support frame is equipped with positioning blocks for positioning and supporting the material frame, with two positioning blocks on each side of the first bottom conveying module.

[0013] Furthermore, the first bottom conveying module includes a first support base fixedly mounted on a support frame. A pair of first pulleys arranged along the silicon wafer conveying track are rotatably mounted on the first support base. A first conveyor belt for conveying the silicon wafer is wound around the first pulleys. The upper half of the first conveyor belt is placed on top of the first support base.

[0014] Furthermore, guide bars are provided on both sides of the first support base for guiding and limiting the first conveyor belt during the operation.

[0015] Furthermore, the support plate is equipped with a first drive motor, and the output shaft of the first drive motor is connected to one of the first pulleys through a first transmission component.

[0016] Furthermore, the second bottom conveying module includes a second support base and a pair of continuous conveying components mounted on the second support base. The continuous conveying components include a first rotating shaft and a second rotating shaft rotatably mounted on the second support base and arranged along the silicon wafer conveying trajectory. The first rotating shaft is provided with a second pulley, and the second rotating shaft is provided with a third pulley. A second conveying belt for conveying silicon wafers is wound around the second pulley and the third pulley. The upper half of the second conveying belt is placed on top of the second support base.

[0017] Furthermore, the first clamping and conveying module includes a first transmission gear and a second transmission gear rotatably mounted on the first movable frame and arranged along the silicon wafer conveying trajectory. The axes of rotation of the first transmission gear and the second transmission gear are arranged vertically, and a transmission toothed belt is wound around both of them. The outer surface of the transmission toothed belt is provided with an anti-slip layer for contacting the silicon wafer.

[0018] Furthermore, the first movable frame is also equipped with a vertically arranged third drive motor, and the output shaft of the third drive motor is connected to the first transmission gear through a connecting shaft.

[0019] The beneficial effects of this utility model are as follows: Before use, a material frame containing a batch of silicon wafers is placed between the first clamping conveyor module and the second clamping conveyor module. Then, the material frame is opened and removed. At this time, the silicon wafers are placed on the first bottom conveyor module and positioned between the first clamping conveyor module and the second clamping conveyor module. First, the first movable frame and the second movable frame are controlled to move closer to each other, thereby causing the first clamping conveyor module and the second clamping conveyor module to move closer to each other as well. After moving until they contact both sides of this batch of silicon wafers, the silicon wafers are clamped. At the same time, the first bottom conveyor module, the first clamping conveyor module, and the second clamping conveyor module are operated to transport this batch of silicon wafers. During the transport process, the first clamping conveyor module and the second clamping conveyor module limit the silicon wafers, ensuring that the silicon wafers always maintain their original upright state (the state when placed in the material frame) and preventing collapse.

[0020] In addition, while the first bottom conveying module conveys the silicon wafer to the second bottom conveying module, it is clamped by the third and fourth clamping conveying modules. The second, third, and fourth clamping conveying modules operate simultaneously, continuing to convey the silicon wafer in the same way as described above. The silicon wafer is then conveyed to the designated position by the second bottom conveying module for loading and insertion. Because the second bottom conveying module is seamlessly connected to the first bottom conveying module (seamless connection of the transmission path), the silicon wafer can be smoothly conveyed to the second bottom conveying module without any issues such as jamming, shifting, or falling.

[0021] Once all the silicon wafers on the first bottom conveying module have been transferred to the second bottom conveying module, the first and second clamping conveying modules are moved away from each other, allowing the next batch of silicon wafers to be placed on the first bottom conveying module. This allows for material replenishment during the silicon wafer conveying process, improving the processing efficiency of the silicon wafers. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0023] Figure 2 This is a schematic diagram of the structure of the second conveying part of this utility model.

[0024] Figure 3 This is a schematic diagram of the structure of the material frame, the first bottom conveying module, and the second bottom conveying module of this utility model.

[0025] Figure 4 This is a schematic diagram of the structure of the first clamping and conveying module of this utility model.

[0026] Figure 5 This is an enlarged view of part A of this utility model.

[0027] The reference numerals in the figures include:

[0028] 114. Material frame; 1141. Frame plate; 1142. Connecting frame; 1143. First mounting plate; 1144. First slide groove; 1145. Limiting roller; 1146. First slide rod; 1147. Second mounting plate; 1148. Positioning groove; 1149. Second slide groove; 11410. Support roller; 11411. Second slide rod; 11413. Clearance groove; 117. Silicon wafer;

[0029] 201. Support frame; 202. First insert slot; 203. Second insert slot; 204. First conveying section; 205. Second conveying section; 2051. Support plate; 2052. Slide rail; 2053. First movable frame; 2054. Second movable frame; 2055. Control cylinder; 2056. First clamping and conveying module; 20561. First transmission gear; 20562. Second transmission gear; 20563. Transmission toothed belt; 20564. Anti-slip layer; 20565. Third drive motor; 20566. Connecting shaft; 2057. Second clamping and conveying module; 2058. Support beam; 2059. First fixed frame; 20510. Second fixed frame; 20511. Third clamping and conveying module; 20512. Fourth clamping and conveying module; 20513. Support frame ; 20514, Positioning block; 20515, First bottom conveyor module; 205151, First support base; 205152, First pulley; 205153, First conveyor belt; 205154, Guide bar; 205155, First drive motor; 205156, First transmission component; 20516, Second bottom conveyor module; 205161, Second support base; 205162, First rotating shaft; 205163, Second rotating shaft; 205164, Second pulley; 205165, Third pulley; 205166, Second conveyor belt; 205167, Second drive motor; 205168, Second transmission component; 20517, Fixed base; 20518, First conveyor wheel; 20519, Second conveyor wheel; 20520, Conveyor belt. Detailed Implementation

[0030] The following is a detailed description of a silicon wafer continuous conveying mechanism according to the present invention, with reference to the accompanying drawings.

[0031] like Figure 1As shown, an embodiment of the silicon wafer continuous conveying mechanism of this utility model includes a support frame 201. The support frame 201 is equipped with a first wafer insertion slot 202 and a second wafer insertion slot 203 filled with water. The first wafer insertion slot 202 is equipped with a first conveying part 204 for continuously conveying silicon wafers 117. The second wafer insertion slot 203 is equipped with a second conveying part 205 for continuously conveying silicon wafers 117. The first conveying part 204 and the second conveying part 205 have the same structure and the same operating mode. A feed frame 114 containing a batch of silicon wafers 117 is placed in the first insertion slot 202 and the second insertion slot 203, and while being placed stably, the silicon wafers 117 inside the feed frame 114 are supported by the first conveying section 204 and the second conveying section 205. Then, the feed frame 114 is opened and removed, and the silicon wafers 117 automatically detach from the feed frame 114, thus placing the silicon wafers 117 onto the first conveying section 204 and the second conveying section 205. After the first conveying section 204 and the second conveying section 205 are activated, this batch of silicon wafers 117 can be continuously conveyed to the designated position for insertion processing. Furthermore, during the conveying process, the silicon wafers 117 are always immersed in water to prevent them from being exposed to air for extended periods.

[0032] like Figure 2 As shown, the second conveying section 205 includes a support frame 20513 installed in the second insert slot 203. The support frame 20513 is provided with a first bottom conveying module 20515 for supporting and conveying the silicon wafer 117, and also provides a second bottom conveying module 20516 that is seamlessly connected to the end of the first bottom conveying module 20515. The second bottom conveying module 20516 can also support and convey the silicon wafer 117, and the top surface of the first bottom conveying module 20515 and the top surface of the second bottom conveying module 20516 are at the same level or based on the same level. After a batch of silicon wafers 117 is placed on the first bottom conveying module 20515, the first bottom conveying module 20515 is operated to transport the batch of silicon wafers 117 horizontally or based on a horizontal path. Because the second bottom conveying module 20516 is seamlessly connected to the first bottom conveying module 20515 (seamless connection of the transmission path), the silicon wafers 117 can be smoothly transported to the second bottom conveying module 20516 without any jamming, offset, or falling. The second bottom conveying module 20516 can then continue to transport the silicon wafers 117. After the silicon wafers 117 are transported to the second bottom conveying module 20516, the next batch of silicon wafers 117 can be placed on the first bottom conveying module 20515 to achieve continuous transport.

[0033] Furthermore, in order to achieve stable transport of silicon wafer 117, a support plate 2051 is installed on the support frame 201 above the second insert slot 203. The support plate 2051 is provided with a first movable frame 2053 and a second movable frame 2054 that can move closer or further apart from each other. A first clamping conveying module 2056 is installed on the first movable frame 2053, and a second clamping conveying module 2057 is installed on the second movable frame 2054 for cooperating with the first clamping conveying module 2056 to clamp and transport the silicon wafer 117 placed on the first bottom conveying module 20515. The silicon wafer 117 placed on the first bottom conveying module 20515 is placed between the first clamping conveying module 2056 and the second clamping conveying module 2057. Before the first bottom conveying module 20515 operates, the first movable frame 2053 and the second movable frame 2054 are controlled to move closer to each other, thereby causing the first clamping conveying module 2056 and the second clamping conveying module 2057 to move closer to each other as well. After they move to contact both sides of the silicon wafers 117 in this batch, the silicon wafers 117 are clamped. Then, the first bottom conveying module 20515, the first clamping conveying module 2056 and the second clamping conveying module 2057 are operated simultaneously to convey this batch of silicon wafers 117. During the conveying process, the first clamping conveying module 2056 and the second clamping conveying module 2057 limit the silicon wafers 117, so that the silicon wafers 117 always maintain their original upright state (the state when placed in the material frame 114) to prevent collapse. In addition, the spacing between the silicon wafers 117 is also kept consistent, which facilitates the subsequent loading and insertion processing.

[0034] Furthermore, a support beam 2058 is also installed on the support frame 201, which is positioned above the second insert slot 203. The support beam 2058 is provided with a first fixing frame 2059 and a second fixing frame 20510. A third clamping and conveying module 20511 is installed on the first fixing frame 2059, and a fourth clamping and conveying module 20512 is installed on the second fixing frame 20510 for cooperating with the third clamping and conveying module 20511 to clamp and convey the silicon wafer 117 conveyed to the second bottom conveying module 20516. While the first bottom conveying module 20515 conveys the silicon wafer 117 to the second bottom conveying module 20516, it is simultaneously clamped by the third clamping conveying module 20511 and the fourth clamping conveying module 20512. Furthermore, the second bottom conveying module 20516, the third clamping conveying module 20511, and the fourth clamping conveying module 20512 operate simultaneously, continuing to convey the silicon wafer 117 in the same manner as described above. The second bottom conveying module 20516 then conveys the silicon wafer 117 to the designated location. The wafer insertion process involves positioning the wafers for loading. During this process, the silicon wafers 117 are sequentially detached from the second bottom conveyor module 20516. Once all the silicon wafers 117 on the first bottom conveyor module 20515 have been transferred to the second bottom conveyor module 20516, the first clamping conveyor module 2056 and the second clamping conveyor module 2057 are moved away from each other. This allows the next batch of silicon wafers 117 to be placed on the first bottom conveyor module 20515. Material replenishment can also be performed during the wafer insertion process, improving the processing efficiency of the silicon wafers 117. Furthermore, after the first clamping conveyor module 2056 and the second clamping conveyor module 2057 move closer together to clamp the silicon wafers 117, the first clamping conveyor module 2056 seamlessly connects with the third clamping conveyor module 20511, and the second clamping conveyor module 2057 seamlessly connects with the fourth clamping conveyor module 20512.

[0035] In this embodiment, to control the movement of the first movable frame 2053 and the second movable frame 2054 on the support plate 2051, the support plate 2051 is equipped with a horizontally arranged slide rail 2052. The length direction of the slide rail 2052 is perpendicular to the conveying direction of the silicon wafer 117. Both the first movable frame 2053 and the second movable frame 2054 are slidably mounted on the slide rail 2052. The support plate 2051 is also equipped with a pair of control cylinders 2055, whose length direction is parallel to the length direction of the slide rail 2052 and arranged in opposite directions. The extension rod end of one control cylinder 2055 is fixedly set to the first movable frame 2053, and the extension rod end of the other control cylinder 2055 is fixedly set to the second movable frame 2054. When this pair of control cylinders 2055 are operated simultaneously, the extension rods of the two cylinders extend or retract in opposite directions, thereby causing the first movable frame 2053 and the second movable frame 2054 to move closer or further apart.

[0036] The support frame 20513 is equipped with positioning blocks 20514 for positioning and supporting the material frame 114. Two positioning blocks 20514 are provided on each side of the first bottom conveying module 20515. The four positioning blocks 20514 can position and support the four corners of the material frame 114, so that the material frame 114 is stably placed in the designated position. The bottom of the material frame 114 is formed with a relief groove 11413 that can accommodate the first bottom conveying module 20515 (e.g., Figure 3 As shown, when the material frame 114 is placed on the positioning block 20514, the first bottom conveying module 20515 is placed in the relief groove 11413. At the same time, the first bottom conveying module 20515 supports the silicon wafer 117 in the material frame 114 so that the material frame 114 can be opened and taken out later.

[0037] like Figure 3 As shown, the first bottom conveying module 20515 includes a first support base 205151 fixedly mounted on a support frame 20513. A pair of first pulleys 205152, arranged along the conveying trajectory of the silicon wafer 117, are rotatably mounted on the first support base 205151. The pair of first pulleys 205152 are respectively located at both ends of the first support base 205151 and at the same height. A first conveyor belt 205153 for conveying the silicon wafer 117 is wound around the first pulleys 205152. The upper half of the first conveyor belt 205153 is positioned on top of the first support base 205151. After the silicon wafer 117 is placed on the upper half of the first conveyor belt 205153, it is supported by the first support base 205151, driving the first pulleys 205152 to rotate, and the first conveyor belt 205153 to move to convey the silicon wafer 117.

[0038] In this embodiment, guide strips 205154 are provided on both sides of the first support base 205151 to guide and limit the first conveyor belt 205153 during the operation, so as to prevent the first conveyor belt 205153 from deviating and improve the conveying effect of the bone silicon wafer 117. In order to drive the first pulley 205152 to rotate, the support plate 2051 is equipped with a first drive motor 205155. The output shaft of the first drive motor 205155 is connected to one of the first pulleys 205152 through a first transmission component 205156. The first transmission component 205156 is the prior art and can be a structure of transmission wheel and transmission belt. Transmission wheels are provided on the output shaft of the first drive motor 205155 and on the central shaft of one of the first pulleys 205152. A transmission belt is wound on the transmission wheel. After the first drive motor 205155 is running, the first pulley 205152 is driven to rotate under the transmission action of the transmission wheel and the transmission belt.

[0039] The second bottom conveying module 20516 includes a second support base 205161 and a pair of continuous conveying components mounted on the second support base 205161. The continuous conveying components are in the same conveying direction as the first bottom conveying module 20515, and are used to continue conveying the silicon wafers 117 conveyed by the first bottom conveying module 20515. The initial ends of the pair of continuous conveying components are respectively placed on both sides of the end of the first bottom conveying module 20515. When the first bottom conveying module 20515 conveys the silicon wafers 117 to its end, the silicon wafers 117 are exactly placed at the initial ends of the pair of continuous conveying components. After continued conveying, the remaining silicon wafers 117 in this batch are completely placed on the continuous conveying components, and there are no silicon wafers 117 on the first bottom conveying module 20515, so that the next batch of silicon wafers 117 can be placed on the first bottom conveying module 20515, thus achieving continuous conveying.

[0040] Furthermore, the continuous conveying assembly includes a first rotating shaft 205162 and a second rotating shaft 205163 rotatably mounted on the second support 205161 and arranged along the conveying trajectory of the silicon wafer 117. The first rotating shaft 205162 is equipped with a second pulley 205164, and the second rotating shaft 205163 is equipped with a third pulley 205165. A second conveying belt 205166 for conveying the silicon wafer 117 is wound around the second pulley 205164 and the third pulley 205165. The upper half of the second conveying belt 205166 is positioned on top of the second support 205161. The function and operation mode of the second conveying belt 205166 are the same as those of the first conveying belt 205153. The support frame 201 is equipped with a second drive motor 205167, and the output shaft of the second drive motor 205167 is connected to the second rotating shaft 205163 through a second transmission component 205168. The structure of the second transmission component 205168 is the same as that of the first transmission component 205156. The second drive motor 205167 runs and, under the transmission action of the second transmission component 205168, drives the second conveyor belt 205166 to move to transport the silicon wafer 117.

[0041] A support frame 20513 is equipped with a fixed base 20517 near the third pulley 205165. Several first conveyor wheels 20518 are rotatably mounted on the fixed base 20517. Several second conveyor wheels 20519, corresponding to the first conveyor wheels 20518, are mounted on the second rotating shaft 205163. A conveyor belt 20520 is wound around the first and second conveyor wheels 20518 and the second conveyor wheels 20519. The first conveyor wheels 20518 are positioned between the third pulleys 205165 on both sides. The initial end of the conveyor belt 20520 is connected to the end of the second conveyor belt 205166, and the end of the conveyor belt 20520 is connected to the wafer loading and insertion station. When the second rotating shaft 205163 rotates, it drives the third pulley 205165 and the first conveyor wheels 20518 to rotate synchronously. The conveyor belt 20520 is used to transport the silicon wafers 117 one by one to the wafer loading and insertion station, thus acting as a bridging mechanism.

[0042] like Figure 4-5 As shown, the first clamping conveyor module 2056, the second clamping conveyor module 2057, the third clamping conveyor module 20511, and the fourth clamping conveyor module 20512 have the same structure and the same operating mode. The first clamping conveyor module 2056 includes a first transmission gear 20561 and a second transmission gear 20562 rotatably mounted on the first movable frame 2053 and arranged along the conveying trajectory of the silicon wafer 117. The axes of rotation of the first transmission gear 20561 and the second transmission gear 20562 are arranged vertically, and a transmission toothed belt 20563 is wound around them. The outer surface of the transmission toothed belt 20563 is provided with an anti-slip layer 20564 for contacting the silicon wafer 117. When the first movable frame 2053 is moved, the anti-slip layer 20564 on the transmission belt 20563 contacts the side of the silicon wafer 117. The anti-slip layers 20564 on both sides contact the two sides of the silicon wafer 117 respectively to clamp it. Then, the first transmission gear 20561 or the second transmission gear 20562 is driven to rotate clockwise (rotation direction is...). Figure 4 Based on this, it is then combined with the first bottom conveying module 20515 to realize the conveying of silicon wafer 117.

[0043] To drive the first transmission gear 20561 or the second transmission gear 20562 to rotate, the first movable frame 2053 is also equipped with a vertically arranged third drive motor 20565. The output shaft of the third drive motor 20565 is connected to the first transmission gear 20561 (or the second transmission gear 20562) via a connecting shaft 20566. When the third drive motor 20565 is operated, the first transmission gear 20561 is driven to rotate under the transmission action of the connecting shaft 20566, and the transmission belt 20563 moves to transport the silicon wafer 117.

[0044] like Figure 3As shown, the specific steps for opening and removing the material frame 114 are as follows: The material frame 114 includes a connecting frame 1142. Frame plates 1141 are installed at both the left and right ends of the connecting frame 1142. The silicon wafer 117 is placed between the left and right frame plates 1141. A pair of second mounting plates 1147 are installed on both the left and right frame plates 1141. The pair of second mounting plates 1147 on the left and the pair of second mounting plates 1147 on the right are arranged opposite each other. Each second mounting plate 1147 has a second sliding groove 1149 formed therein. The second sliding grooves 1149 on the left and the second sliding grooves 1149 on the right are arranged in a figure-eight pattern. A pair of support rollers 11410 for supporting silicon wafers 117 are provided between the left and right frame plates 1141. The two ends of each support roller 11410 are aligned with a left second mounting plate 1147 and a right second mounting plate 1147, respectively. Each support roller 11410 has a second slide rod 11411 at both ends, and each second slide rod 11411 is slidably disposed in a different second slide groove 1149. Since the second slide grooves 1149 on the left and right are arranged in a figure-eight pattern, each second slide groove 1149 is inclined. The upper end of each second slide groove 1149 has a positioning groove 1148 formed to position the second slide rod 11411.

[0045] When the silicon wafer 117 is placed in the material frame 114, it is supported by the support roller 11410. After the material frame 114 is placed on the positioning block 20514, the first bottom conveying module 20515 is placed in the relief groove 11413 to support the silicon wafer 117, so that the silicon wafer 117 is separated from the support roller 11410. Then, force is applied to the second slide rod 11411 to make it disengage from the positioning groove 1148. Under the action of the weight of the support roller 11410 itself, the second slide rod 11411 automatically moves in the second slide groove 1149 in a downward direction. When the pair of support rollers 11410 move in the downward direction, they move away from each other. After they are deviated from directly below the silicon wafer 117, the material frame 114 can be taken out from bottom to top.

[0046] Furthermore, both the left and right frame plates 1141 are equipped with a pair of first mounting plates 1143. The pair of first mounting plates 1143 on the left and the pair of first mounting plates 1143 on the right are arranged opposite each other. Each first mounting plate 1143 is formed with a first sliding groove 1144. The first sliding grooves 1144 on the left and the first sliding grooves 1144 on the right are arranged in an inverted "V" shape. A pair of limiting rollers 1145 are arranged between the left and right frame plates 1141, respectively placed on the front and rear sides of the silicon wafer 117. The limiting rollers 1145 are positioned above the support rollers 11410. The two ends of one limiting roller 1145 are aligned with one left first mounting plate 1143 and one right first mounting plate 1143, respectively. Each end of each limiting roller 1145 is provided with a first sliding rod 1146, and each first sliding rod 1146 is slidably disposed in a different first sliding groove 1144. Because both the first slide groove 1144 on the left and the first slide groove 1144 on the right are arranged in an inverted "V" shape, each of the first slide grooves 1144 is inclined. Under the weight of the limiting roller 1145, the first slide rod 1146 automatically moves in a downward direction within the first slide groove 1144, and the limiting roller 1145 also moves in a downward direction. When it moves to contact the side of the silicon wafer 117, it can limit the silicon wafer 117 to prevent it from collapsing on the support roller 11410. The limiting roller 1145 is a sponge roller. When the material frame 114 is removed, an upward force is applied to each of the first slide rods 1146, causing the first slide rods 1146 to move upward in the first slide groove 1144. The limiting roller 1145 separates from the side of the silicon wafer 117 to prevent the limiting roller 1145 from scratching or damaging the silicon wafer 117 during the removal process.

[0047] In summary, this utility model possesses the aforementioned excellent characteristics, enabling it to achieve unprecedented efficiency in use and thus become a highly practical product.

[0048] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. A silicon wafer continuous conveying mechanism, characterized in that: It includes a support frame (201) and a second conveying section (205) for continuously conveying silicon wafers (117); the second conveying section (205) includes a support frame (20513), the support frame (20513) is provided with a first bottom conveying module (20515) for supporting and conveying silicon wafers (117), and is also provided with a second bottom conveying module (20516) that is seamlessly connected to the end of the first bottom conveying module (20515); It also includes a support plate (2051) installed on the support frame (201). The support plate (2051) is provided with a first movable frame (2053) and a second movable frame (2054) that can move closer to or further away from each other. The first movable frame (2053) is equipped with a first clamping and conveying module (2056), and the second movable frame (2054) is equipped with a second clamping and conveying module (2057) for cooperating with the first clamping and conveying module (2056) to clamp and convey the silicon wafer (117) placed on the first bottom conveying module (20515). It also includes a support beam (2058) installed on the support frame (201), the support beam (2058) is provided with a first fixing frame (2059) and a second fixing frame (20510), the first fixing frame (2059) is provided with a third clamping conveying module (20511), and the second fixing frame (20510) is provided with a fourth clamping conveying module (20512) for cooperating with the third clamping conveying module (20511) to clamp and convey the silicon wafer (117) conveyed to the second bottom conveying module (20516).

2. The silicon wafer continuous conveying mechanism according to claim 1, characterized in that: It also includes a first insert groove (202) and a second insert groove (203) installed in the support frame (201) and filled with water. A first conveying part (204) is installed in the first insert groove (202) and a second conveying part (205) is installed in the second insert groove (203).

3. The silicon wafer continuous conveying mechanism according to claim 1, characterized in that: The support plate (2051) is equipped with a horizontally arranged slide rail (2052), the length direction of which is perpendicular to the conveying direction of the silicon wafer (117). The first movable frame (2053) and the second movable frame (2054) are both slidably arranged on the slide rail (2052). The support plate (2051) is also equipped with a pair of control cylinders (2055) whose length direction is parallel to the length direction of the slide rail (2052) and arranged in opposite directions. The end of the telescopic rod of one control cylinder (2055) is fixedly set to the first movable frame (2053), and the end of the telescopic rod of the other control cylinder (2055) is fixedly set to the second movable frame (2054).

4. The silicon wafer continuous conveying mechanism according to claim 1, characterized in that: The support frame (20513) is equipped with positioning blocks (20514) for positioning and supporting the material frame (114), and two positioning blocks (20514) are provided on both sides of the first bottom conveying module (20515).

5. A silicon wafer continuous conveying mechanism according to claim 1, characterized in that: The first bottom conveying module (20515) includes a first support base (205151) fixedly mounted on a support frame (20513). A pair of first pulleys (205152) arranged along the conveying track of the silicon wafer (117) are rotatably mounted on the first support base (205151). A first conveyor belt (205153) for conveying the silicon wafer (117) is wound around the first pulleys (205152). The upper half of the first conveyor belt (205153) is placed on the top of the first support base (205151).

6. A silicon wafer continuous conveying mechanism according to claim 5, characterized in that: The first support base (205151) has guide bars (205154) on both sides for guiding and limiting the first conveyor belt (205153) during the operation.

7. A silicon wafer continuous conveying mechanism according to claim 5, characterized in that: The support plate (2051) is equipped with a first drive motor (205155), and the output shaft of the first drive motor (205155) is connected to one of the first pulleys (205152) through a first transmission component (205156).

8. A silicon wafer continuous conveying mechanism according to claim 5, characterized in that: The second bottom conveying module (20516) includes a second support base (205161) and a pair of continuous conveying components mounted on the second support base (205161). The continuous conveying components include a first rotating shaft (205162) and a second rotating shaft (205163) rotatably mounted on the second support base (205161) and arranged along the conveying trajectory of the silicon wafer (117). The first rotating shaft (205162) is provided with a second pulley (205164), and the second rotating shaft (205163) is provided with a third pulley (205165). A second conveying belt (205166) for conveying the silicon wafer (117) is wound around the second pulley (205164) and the third pulley (205165). The upper half of the second conveying belt (205166) is placed on the top of the second support base (205161).

9. A silicon wafer continuous conveying mechanism according to claim 1, characterized in that: The first clamping and conveying module (2056) includes a first transmission gear (20561) and a second transmission gear (20562) rotatably mounted on a first movable frame (2053) and arranged along the conveying trajectory of the silicon wafer (117). The axes of rotation of the first transmission gear (20561) and the second transmission gear (20562) are arranged vertically, and a transmission toothed belt (20563) is wound around both of them. The outer surface of the transmission toothed belt (20563) is provided with an anti-slip layer (20564) for contacting the silicon wafer (117).

10. A silicon wafer continuous conveying mechanism according to claim 9, characterized in that: The first movable frame (2053) is also equipped with a vertically arranged third drive motor (20565), the output shaft of which is connected to the first transmission gear (20561) via a connecting shaft (20566).

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