Conductive member

Abstract

The embodiment of the utility model discloses a conductive component. According to one specific embodiment, the conductive part comprises a first supporting layer, a second supporting layer and an I-shaped conductive core, wherein a step surface is arranged on the first supporting layer; the two step surfaces are symmetrically arranged on the two sides of the first supporting layer; fillets are arranged on the step surfaces; the second supporting layer and the first supporting layer are the same in shape; the I-shaped conductive core is integrally formed and comprises a first horizontal part, a second horizontal part and a vertical supporting part; the first horizontal part and the second horizontal part are symmetrically connected to the two sides of the vertical supporting part. Fillet structures are arranged at the joints of the first horizontal part and the vertical supporting part and the joints of the second horizontal part and the vertical supporting part; the first supporting layer and the second supporting layer are symmetrically arranged on the two sides of the I-shaped conductive core; the first supporting layer and the second supporting layer are attached to the vertical supporting part; and the step surface is in close contact with the I-shaped conductive core. According to the embodiment, the first supporting layer and the second supporting layer are attached to the vertical supporting part, so that the structural strength of the conductive part is improved.

Description

Technical Field

[0001] The embodiments disclosed herein relate to the field of intelligent manufacturing technology, specifically to conductive components. Background Technology

[0002] As smart devices become increasingly integrated, the structures of the conductive components required are also becoming more diverse. Currently, the only commonly used conductive component is the conductive core.

[0003] However, when the above-mentioned conductive components are used, there is often a technical problem that the conductive components are prone to breakage.

[0004] The information disclosed in this background section is only intended to enhance the understanding of the background of the present disclosure concept, and therefore may contain information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0005] The summary portion of this disclosure is intended to provide a brief overview of the concepts, which will be described in detail in the detailed description portion. This summary portion is not intended to identify key or essential features of the claimed technical solutions, nor is it intended to limit the scope of the claimed technical solutions.

[0006] Some embodiments of this disclosure provide conductive components to address one or more of the technical problems mentioned in the background section above.

[0007] Some embodiments of this disclosure provide a conductive component, which includes a first support layer, a second support layer, and an I-shaped conductive core. The first support layer has two stepped surfaces, symmetrically arranged on both sides of the first support layer. The stepped surfaces have rounded corners. The second support layer has the same shape as the first support layer. The I-shaped conductive core is integrally formed and includes a first horizontal portion, a second horizontal portion, and a vertical support portion. The first and second horizontal portions are symmetrically connected to both sides of the vertical support portion. Rounded corner structures are provided at the connections between the first and second horizontal portions and the vertical support portion. The first and second support layers are symmetrically arranged on both sides of the I-shaped conductive core. The first and second support layers are attached to the vertical support portion. The stepped surfaces are in close contact with the I-shaped conductive core.

[0008] Optionally, the first horizontal portion and the second horizontal portion have the same dimensions; the top end of the vertical support portion is vertically connected to the middle of the lower surface of the first horizontal portion; and the bottom end of the vertical support portion is vertically connected to the middle of the upper surface of the second horizontal portion.

[0009] Optionally, both the first support layer and the second support layer are provided with rounded corner edges parallel to the I-shaped conductive core.

[0010] Optionally, the lengths of the first support layer and the second support layer are equal to the length of the I-shaped conductive core.

[0011] Optionally, the height of the I-shaped conductive core is greater than the height of the first support layer and the second support layer.

[0012] Optionally, the width ratio of the first horizontal portion to the second horizontal portion is 1:1 to 1:2; the thickness of the first horizontal portion is 2 to 5 mm; and the thickness of the vertical support portion is 1.5 to 2 times the thickness of the first horizontal portion.

[0013] Optionally, the cross-sections of the first support layer and the second support layer are both convex; the rounded corners are located at the two bends at the top of the convex shape.

[0014] Optionally, both the first and second support layers are provided with a honeycomb-shaped buffer structure; the buffer structure includes at least two regular hexagonal unit cavities, and the unit cavities are continuously arranged along the length of the support layer; the side length of each unit cavity is 0.5 to 1.2 mm, and a 0.1 to 0.3 mm partition wall is maintained between adjacent unit cavities; each unit cavity is a structure that is open at both ends.

[0015] Some embodiments of this disclosure provide a conductive component that can improve the structural strength of the conductive component. Specifically, the reason why most conductive components have poor structural strength is that they only contain a conductive core and lack a supporting structure. Based on this, some embodiments of this disclosure provide a conductive component including a first support layer, a second support layer, and an I-shaped conductive core, wherein the first support layer has a stepped surface; there are two stepped surfaces, which are symmetrically arranged on both sides of the first support layer; the stepped surfaces have rounded corners; the second support layer has the same shape as the first support layer; the I-shaped conductive core is integrally formed and includes a first horizontal portion, a second horizontal portion, and a vertical support portion; the first horizontal portion and the second horizontal portion are symmetrically connected to both sides of the vertical support portion; the connection between the first horizontal portion and the second horizontal portion and the vertical support portion is provided with a rounded corner structure; the first support layer and the second support layer are symmetrically arranged on both sides of the I-shaped conductive core; the first support layer and the second support layer are attached to the vertical support portion; the stepped surface is in close contact with the I-shaped conductive core. By symmetrically connecting the first support layer and the second support layer on both sides of the vertical support, the structural strength of the conductive component is improved. Attached Figure Description

[0016] The above and other features, advantages, and aspects of the embodiments of this disclosure will become more apparent from the accompanying drawings and the following detailed description. Throughout the drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic, and elements are not necessarily drawn to scale.

[0017] Figure 1 This is a front view of a conductive component according to some embodiments of this disclosure;

[0018] Figure 2 This is a top view of a conductive component according to some embodiments of this disclosure;

[0019] Figure 3 This is a perspective view of a conductive component according to some embodiments of this disclosure. Detailed Implementation

[0020] Embodiments of this disclosure will now be described in more detail with reference to the accompanying drawings. While some embodiments of this disclosure are shown in the drawings, it should be understood that this disclosure can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of this disclosure. It should be understood that the accompanying drawings and embodiments of this disclosure are for illustrative purposes only and are not intended to limit the scope of protection of this disclosure.

[0021] It should also be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings. Unless otherwise specified, the embodiments and features described in this disclosure can be combined with each other.

[0022] It should be noted that the concepts of "first" and "second" mentioned in this disclosure are used only to distinguish different devices, modules or units, and are not used to limit the order of functions performed by these devices, modules or units or their interdependencies.

[0023] It should be noted that the terms "a" and "a plurality of" used in this disclosure are illustrative rather than restrictive, and those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".

[0024] The names of messages or information exchanged between multiple devices in the embodiments of this disclosure are for illustrative purposes only and are not intended to limit the scope of such messages or information.

[0025] This disclosure will now be described in detail with reference to the accompanying drawings and embodiments.

[0026] Figure 1 This is a front view of a conductive component according to some embodiments of this disclosure. Figure 1It includes a first support layer 1, an I-shaped conductive core 2, a first horizontal part 3, a second support layer 4, a vertical support part 5, a second horizontal part 6, a rounded corner structure 7, and a stepped surface 8.

[0027] Figure 2 This is a top view of a conductive component according to some embodiments of this disclosure. Figure 2 It includes a first support layer 1, an I-shaped conductive core 2, and a second support layer 4.

[0028] Figure 3 This is a perspective view of a conductive component according to some embodiments of this disclosure. Figure 3 It includes a first support layer 1, an I-shaped conductive core 2, and a second support layer 4.

[0029] In some embodiments, the conductive component may include a first support layer 1, a second support layer 4, and an I-shaped conductive core 2. The first support layer 1 may be an insulating support structure, made of rubber, and with a thickness of 1-2 mm. The second support layer 4 may have the same shape as the first support layer 1 and may be connected to both sides of the I-shaped conductive core 2 to support it and strengthen its strength. The I-shaped conductive core 2 may be integrally molded, and its material may include, but is not limited to, conductive silicone.

[0030] In some embodiments, the first support layer 1 may be provided with stepped surfaces 8. There may be two stepped surfaces 8, symmetrically arranged on the upper and lower sides of the first support layer 1, making the cross-section of the first support layer convex. The stepped surfaces 8 allow the first support layer 1 to fit against the protruding portions of the upper and lower ends of the I-shaped conductive core 2, providing better support for the I-shaped conductive core 2. The stepped surfaces 8 may have rounded corners, which can fit against the rounded corner structure 7 of the I-shaped conductive core 2. It should be noted that the second support layer 4 has the same shape as the first support layer 1, and the structural description of the first support layer 1 described above is also applied to the second support layer 4.

[0031] In some embodiments, the I-shaped conductive core 2 can be integrally formed and may include a first horizontal portion 3, a second horizontal portion 6, and a vertical support portion 5. The first horizontal portion 3 and the second horizontal portion 6 can be symmetrically connected on both sides of the vertical support portion 5 to form an I-shaped structure. The I-shaped conductive core 2 can be a strip-shaped conductive core with an I-shaped axial cross-section. The first horizontal portion 3 and the second horizontal portion 6 respectively serve as two horizontal structures of the I-shaped structure, and the vertical support portion 5 can serve as a vertical structure of the I-shaped structure. Rounded corner structures 7 can be provided at the connection points between the first horizontal portion 3 and the second horizontal portion 6 and the vertical support portion 5. The rounded corner structures 7 can strengthen the connection between the first horizontal portion 3 and the second horizontal portion 6 and the vertical support portion 5.

[0032] In some embodiments, the first support layer 1 and the second support layer 4 can be symmetrically disposed on both sides of the I-shaped conductive core 2 and fixed by adhesive bonding to form a sandwich-type composite structure. It should be noted that the connection method between the first support layer 1, the second support layer 4, and the I-shaped conductive core 2 is not specifically limited here. The stepped surface 8 can be in close contact with the I-shaped conductive core 2 to enhance the supporting effect of the first support layer 1 and the second support layer 4 on the I-shaped conductive core 2.

[0033] Optionally, such as Figure 1 As shown, the first horizontal portion 3 and the second horizontal portion 6 can have the same dimensions to ensure the symmetry of the conductive core and thus improve conductivity. The top end of the vertical support portion 5 can be vertically connected to the middle of the lower surface of the first horizontal portion 3. The bottom end of the vertical support portion 5 can be vertically connected to the middle of the upper surface of the second horizontal portion 6.

[0034] Optionally, such as Figure 3 As shown, both the first support layer 1 and the second support layer 4 can have rounded corners parallel to the I-shaped conductive core 2. These rounded corners can be located on the side of each support layer that does not contact the I-shaped conductive core 2 (i.e., the outer surface of the conductive component). These rounded corners can reduce the probability of damage to the first support layer 1 and the second support layer 4 to a certain extent.

[0035] Optionally, such as Figure 2 As shown, the lengths of the first support layer 1 and the second support layer 4 can be equal to the length of the I-shaped conductive core 2. This allows the first support layer 1 and the second support layer 4 to completely cover the axial length of the I-shaped conductive core 2, preventing the ends of the I-shaped conductive core 2 from being exposed, improving the support effect on the I-shaped conductive core 2, and further reducing the possibility of deformation or even damage to the I-shaped conductive core 2.

[0036] Optionally, such as Figure 1 As shown, the height of the I-shaped conductive core 2 can be greater than the heights of the first support layer 1 and the second support layer 4. This makes the conductivity of the conductive component more stable during use. For example, assuming that the current flows from the first horizontal portion 3 to the second horizontal portion 6 when the conductive component is in operation, the upper and lower ends of the I-shaped conductive core 2 protruding from the first support layer 1 and the second support layer 4 can make the connection between the conductive component and the working environment tighter and more secure.

[0037] Optionally, the width ratio of the first horizontal portion 3 to the second horizontal portion 6 can be 1:1 to 1:2. For example, a 1:1 ratio can be used when symmetrical conductivity is required, and a 1:1.2 ratio can be used when unilateral connection is emphasized, optimizing the local conductive area through the width difference. The thickness of the first horizontal portion 3 can be 2 to 5 mm to accommodate different current carrying capacities. For example, a thickness of 4 to 5 mm can be used when the current carrying capacity is greater than or equal to 300A to meet the requirements of high current conduction. The thickness of the vertical support portion 5 can be 1.5 to 2 times the thickness of the first horizontal portion 3 to improve the structural strength and compressive strength of the I-shaped conductive core 2 itself.

[0038] Optionally, such as Figure 1 As shown, the cross-sections of both the first support layer 1 and the second support layer 4 can be convex. The rounded corners can be located at the two bends at the top of the convex shape to improve the fit between the first support layer 1, the second support layer 4, and the I-shaped conductive core 2, thus providing better support.

[0039] Optionally, both the first support layer 1 and the second support layer 4 may have a honeycomb-shaped buffer structure inside. This buffer structure can be formed by injection molding. The buffer structure may include at least two regular hexagonal unit cavities, and these unit cavities may be continuously arranged along the length of the support layer. The side length of each unit cavity may be 0.5–1.2 mm, and a 0.1–0.3 mm spacer wall may be maintained between adjacent unit cavities. Each unit cavity may be a structure that is open at both ends to allow heat dissipation for the I-shaped conductive core 2. It should be noted that the honeycomb-shaped buffer structure is not shown in the accompanying drawings.

[0040] Optionally, the conductive component may further include a protective sleeve. The protective sleeve may be made of insulating rubber or plastic, and its purpose is to provide physical protection for the conductive component, reducing the possibility of wear caused by external impacts during transportation. The protective sleeve may wrap around the outer surface of the internal component composed of the first support layer 1, the I-shaped conductive core 2, and the second support layer 4. The wrapping method can be a tight fit. The thickness of the protective sleeve can be set to 0.5–2 mm depending on the protection level requirements. The inner surface of the protective sleeve may have an anti-slip structure. The anti-slip structure can increase the friction between the protective sleeve and the internal component, reducing the possibility of displacement of the internal component within the protective sleeve, thereby improving the overall structural stability of the conductive component. The anti-slip structure can be in close contact with the first support layer 1 and the second support layer 4. The close contact design allows the anti-slip structure to effectively transmit constraint forces, reducing component wobbling caused by gaps, and also helps to evenly distribute external stress, improving the vibration resistance of the conductive component. The anti-slip structure may include at least one strip-shaped protrusion. The aforementioned strip-shaped protrusions may include axial protrusions distributed along the axial direction of the conductive component and circumferential protrusions distributed along the circumference of the conductive component. The axial and circumferential protrusions respectively prevent circumferential and axial sliding between the conductive component and the protective sleeve. The cross-sectional shape can be semi-circular, trapezoidal, or rectangular, and the height can be set to 0.2–1 mm. The protective sleeve may have an easy-tear strip. The easy-tear strip may have a pre-cut structure, and the material may be thinner than the main body of the protective sleeve. The easy-tear strip allows for quick opening of the protective sleeve by tearing when the conductive component needs to be installed, improving installation efficiency. The easy-tear strip may be located in the first horizontal portion 3. It should be noted that the protective sleeve is not shown in the accompanying drawings.

[0041] The above-described optional embodiments, as an inventive point of this disclosure, solve the technical problem of "poor protective effect of protective sleeves on conductive components." The specific factors leading to poor protective effect of protective sleeves on conductive components are as follows: Traditional protective sleeves for conductive components typically only provide simple coverage, lacking an internal anti-slip structure. This makes the conductive components prone to relative displacement when subjected to vibration or external impact during transportation, potentially causing breakage of the conductive core. Solving these factors improves the protective effect of the protective sleeve on the conductive components. To achieve this effect, this disclosure also provides a protective sleeve with an anti-slip structure. Axial and circumferential strip-shaped protrusions restrict the circumferential and axial sliding of the conductive components. This improves the protective effect of the protective sleeve on the conductive components.

[0042] Some embodiments of this disclosure provide a conductive component that can improve the structural strength of the conductive component. Specifically, the reason why most conductive components have poor structural strength is that they only contain a conductive core and lack a supporting structure. Based on this, some embodiments of this disclosure provide a conductive component including a first support layer, a second support layer, and an I-shaped conductive core, wherein the first support layer has a stepped surface; there are two stepped surfaces, which are symmetrically arranged on both sides of the first support layer; the stepped surfaces have rounded corners; the second support layer has the same shape as the first support layer; the I-shaped conductive core is integrally formed and includes a first horizontal portion, a second horizontal portion, and a vertical support portion; the first horizontal portion and the second horizontal portion are symmetrically connected to both sides of the vertical support portion; the connection between the first horizontal portion and the second horizontal portion and the vertical support portion is provided with a rounded corner structure; the first support layer and the second support layer are symmetrically arranged on both sides of the I-shaped conductive core; the first support layer and the second support layer are attached to the vertical support portion; the stepped surface is in close contact with the I-shaped conductive core. By symmetrically connecting the first support layer and the second support layer on both sides of the vertical support, the structural strength of the conductive component is improved.

[0043] The above description is merely a selection of preferred embodiments of this disclosure and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in the embodiments of this disclosure is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-described inventive concept. For example, technical solutions formed by substituting the above-described features with (but not limited to) technical features with similar functions disclosed in the embodiments of this disclosure.

Claims

1. A conductive component, characterized in that, The conductive component includes a first support layer, a second support layer, and an I-shaped conductive core, wherein, The first support layer has a stepped surface; The number of stepped surfaces is two, and they are symmetrically arranged on both sides of the first support layer; The step surface is provided with rounded corners; The second support layer has the same shape as the first support layer; The I-shaped conductive core is integrally formed and includes a first horizontal part, a second horizontal part, and a vertical support part; The first horizontal section and the second horizontal section are symmetrically connected to both sides of the vertical support section; Both the first horizontal section and the second horizontal section are provided with rounded corner structures at the connection points with the vertical support section; The first support layer and the second support layer are symmetrically disposed on both sides of the I-shaped conductive core; The first support layer and the second support layer are attached to the vertical support portion; The stepped surface is in close contact with the I-shaped conductive core.

2. The conductive component according to claim 1, characterized in that, The first horizontal portion and the second horizontal portion have the same dimensions; The top of the vertical support is vertically connected to the middle of the lower surface of the first horizontal part; The bottom end of the vertical support is vertically connected to the middle of the upper surface of the second horizontal part.

3. The conductive component according to claim 1, characterized in that, Both the first support layer and the second support layer have rounded corner edges that are parallel to the I-shaped conductive core.

4. The conductive component according to claim 1, characterized in that, The lengths of the first support layer and the second support layer are equal to the length of the I-shaped conductive core.

5. The conductive component according to claim 1, characterized in that, The height of the I-shaped conductive core is greater than the height of the first support layer and the second support layer.

6. The conductive component according to claim 1, characterized in that, The width ratio between the first horizontal portion and the second horizontal portion is 1:1 to 1:2; The thickness of the first horizontal portion is 2-5 mm; The thickness of the vertical support portion is 1.5 to 2 times the thickness of the first horizontal portion.

7. The conductive component according to claim 1, characterized in that, Both the first support layer and the second support layer have convex cross-sections; The rounded corners are located at the two bends at the top of the convex shape.

8. The conductive component according to claim 1, characterized in that, Both the first support layer and the second support layer have a honeycomb-shaped buffer structure inside; The buffer structure includes at least two regular hexagonal unit cavities, and the unit cavities are continuously arranged along the length direction of the support layer; Each unit cavity has a side length of 0.5 to 1.2 mm, and a partition wall of 0.1 to 0.3 mm is maintained between adjacent unit cavities; Each unit cavity has a structure that is open at both ends.

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