Sensor assembly and electronic equipment

Abstract

The utility model relates to the technical field of optics, in particular to a sensor assembly and electronic equipment. According to the sensor assembly provided by the invention, the adjusting piece is connected with the imaging circuit board, the elastic piece is arranged between the adjusting piece and the cover plate structure, the adjusting piece and the cover plate structure are in threaded connection through the first fastening piece, and the elastic deformation of the elastic piece is adjusted by adjusting the threaded connection length of the first fastening piece; therefore, the inclination angle of the imaging circuit board relative to the cover plate of the cover plate structure is adjusted, the focusing adjustment of the photosensitive chip and the Sammer lens is realized, the structure is simple, and the adjustment operation is simple; the optical path focusing device is suitable for scenes with high-precision Sammer optical path focusing requirements, structural parts do not need to have very high machining precision, and the overall structural stability is good after adjustment is completed.

Description

Technical Field

[0001] This disclosure relates to the field of optical technology, and more particularly to a sensor assembly and electronic device. Background Technology

[0002] Machine vision technology primarily acquires images through image acquisition devices consisting of light sources and lenses, and then uses image processing algorithms to analyze and process the images of target objects to obtain their features. Its vision technology is widely used in manufacturing, quality inspection, logistics, medicine, scientific research, and other fields.

[0003] Among these processes, focusing between the SAM lens and the image sensor is a crucial step in ensuring measurement accuracy. Therefore, adjusting the focus of the SAM lens and the image sensor is of paramount importance. However, current technologies suffer from complex focusing mechanisms, cumbersome adjustments, and low efficiency. Utility Model Content

[0004] This disclosure provides a sensor assembly and electronic device to solve the technical problems of complex focusing adjustment structure, cumbersome adjustment, and low efficiency in related technologies.

[0005] To solve the above-mentioned technical problems, the present disclosure adopts the following technical solution:

[0006] In a first aspect, this disclosure provides a sensor assembly for use in a SAM optical path, comprising: a cover plate structure, an imaging circuit board, and an adjustment component; a photosensitive chip is disposed on the imaging circuit board.

[0007] The cover plate structure is located on one side of the photosensitive surface of the photosensitive chip, and light is imaged onto the photosensitive surface of the photosensitive chip through the cover plate structure;

[0008] The adjusting member is connected to the imaging circuit board; an elastic element is provided between the adjusting member and the cover plate structure, and the adjusting member and the cover plate structure are connected by a first fastener threadedly. The first fastener is configured to adjust the length of the threaded connection to adjust the elastic deformation of the elastic element.

[0009] As an optional implementation, the elastic element is provided with a through hole, and the elastic element is sleeved on the outside of the first fastener.

[0010] As an optional implementation, at least one of the first fasteners is provided at each end of the adjusting member along the tilt direction of the image plane.

[0011] As an optional implementation, a plurality of first fasteners are provided at intervals along a first direction; wherein, the first direction is perpendicular to the tilt direction of the image plane, and the plane determined by the first direction and the tilt direction of the image plane is parallel to the photosensitive surface.

[0012] As an optional implementation, the adjusting member includes a frame body and a first connecting portion. The frame body is fixedly connected to the imaging circuit board. The frame body is configured to form a hollow hole so that the photosensitive surface is opposite to the cover plate structure.

[0013] The first connecting part is disposed on the outer edge of the frame body, and the first connecting part is connected to the first fastener; the projection of the first connecting part on the plane where the photosensitive surface is located protrudes from the imaging circuit board.

[0014] As an optional implementation, the elastic element is a disc spring.

[0015] As an optional implementation, a plurality of disc springs are provided along the axial direction of the first fastener, with the concave or convex surfaces of two adjacent disc springs facing each other.

[0016] As an optional implementation, the sensor assembly further includes a heat sink fixed to the side of the imaging circuit board opposite to the adjustment member.

[0017] As an optional implementation, the sensor assembly further includes a thermally conductive spring, one end of which is fixedly connected to the heat sink, and the other end of which is fixedly connected to the cover plate structure.

[0018] A portion of the thermally conductive spring sheet is suspended relative to the heat sink and the cover plate structure and is configured to be elastically deformable.

[0019] As an optional implementation, the heat-conducting spring includes: a first portion, a second portion, and a third portion, wherein the third portion connects the first portion and the second portion; the first portion is fixedly connected to the heat sink and in surface contact; the second portion is fixedly connected to the cover plate structure and in surface contact; the third portion is suspended relative to the heat sink and the cover plate structure and is configured to be elastically deformable.

[0020] The sensor assembly disclosed herein includes an adjustment component connected to an imaging circuit board, and an elastic component positioned between the adjustment component and a cover plate structure. A first fastener is threadedly connected to the adjustment component and the cover plate structure. By adjusting the thread length of the first fastener, the elastic deformation of the elastic component is adjusted, thereby adjusting the tilt angle of the imaging circuit board relative to the cover plate structure. This achieves focus adjustment between the photosensitive chip and the SAM lens. The assembly is not only simple in structure but also easy to operate. It is suitable for scenarios requiring high-precision SAM optical path focusing, does not require extremely high machining precision in the structural components, and exhibits good overall structural stability after adjustment.

[0021] In a second aspect, this disclosure provides an electronic device comprising: a Sham lens and the sensor assembly described in the first aspect, wherein object-side light passes sequentially through the cover structure of the Sham lens and the sensor assembly and is imaged onto the photosensitive chip of the sensor assembly.

[0022] The electronic device provided in the second aspect of this disclosure, since it includes the sensor assembly described in the first aspect, also has the same advantages as the sensor assembly described in the first aspect.

[0023] As an alternative implementation, the electronic device is a 3D camera.

[0024] In addition to the technical problems solved by this disclosure, the technical features constituting the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions as described above, other technical problems that can be solved by the sensor components and electronic devices provided by this disclosure, other technical features contained in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific embodiments. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of Scham's Law.

[0027] Figure 2 This is a schematic diagram of the structure of the sensor assembly provided in the embodiments of this disclosure;

[0028] Figure 3 An exploded view of the sensor assembly provided in the embodiments of this disclosure;

[0029] Figure 4 A front view of the sensor assembly and Sham lens provided in some embodiments of this disclosure;

[0030] Figure 5 This is a schematic diagram of the structure of the adjusting member provided in some embodiments of this disclosure;

[0031] Figure 6 for Figure 4 AA section view in the middle;

[0032] Figure 7 A cross-sectional schematic diagram of a flexible joint provided in some embodiments of this disclosure;

[0033] Figure 8 This is a schematic diagram of the structure of the fixing base provided in some embodiments of this disclosure;

[0034] Figure 9 A schematic diagram of the sensor assembly provided in some embodiments of this disclosure without the cover plate structure and elastic element;

[0035] Figure 10 for Figure 9 Exploded view of the middle structure;

[0036] Figure 11 This is a BB section view in section 4;

[0037] Figure 12 The present disclosure provides structural schematic diagrams of electronic devices according to some embodiments.

[0038] Explanation of reference numerals in the attached figures:

[0039] 100: Cover plate structure; 110: Cover plate; 120: Fixing base; 121: Second connecting hole; 122: Recess; 123: First part; 124: Second part;

[0040] 200: Imaging circuit board; 201: Fourth connection hole; 202: Positioning hole; 210: Photosensitive chip;

[0041] 300: Adjusting component; 301: First connecting hole; 302: Third connecting hole; 310: Frame body; 311: Hollow hole; 320: First connecting part; 330: Positioning post; 340: Second connecting part; 350: First fastener; 360: Second fastener;

[0042] 400: Elastic element; 410: Disc spring; 411: Concave surface; 412: Convex surface;

[0043] 500: Heat sink; 501: Fifth connection hole;

[0044] 600: Thermal conductive spring; 610: First part; 611: Third fastener; 620: Second part; 621: Fourth fastener; 630: Third part;

[0045] 710: Laser light source; 720: SAM lens; 730: Target object; 740: Outer shell. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0047] The Schimmel optical system is an imaging system that utilizes Schimmel's law. According to Schimmel's law, when the extensions of the target plane, the lens principal plane, and the imaging plane intersect on a single line, a clear image can be captured across the entire field of view of the tilted target. When Schimmel lenses are used in industrial measurement, they can increase the range of sharpness and improve measurement accuracy.

[0048] The imaging plane of a SAM lens is tilted relative to the optical axis. The optical path length of light rays reaching the imaging plane varies at different positions, resulting in geometric aberrations and affecting image quality. In particular, when a SAM lens is used at close working distances and high magnification, these geometric aberrations are more pronounced, leading to poor image quality and impacting detection performance.

[0049] Specific combination Figure 1 The diagram of Scherm's Law shows that the angle β between the imaging plane and the optical axis of the lens must satisfy the following relationship:

[0050]

[0051] Where α is the angle between the target plane and the lens optical axis, β is the angle between the imaging plane and the lens optical axis; a' is the object distance of point D on the lens optical axis, b' is the image distance of point D on the optical axis, and f' is the focal length of the lens.

[0052] Focusing the SAM lens with the image sensor is a crucial step in ensuring measurement accuracy. Therefore, the focus adjustment of the SAM lens and the image sensor is of paramount importance. Currently, related technologies suffer from complex focus adjustment structures, cumbersome adjustments, and low efficiency.

[0053] In view of this, embodiments of the present disclosure provide a sensor assembly in which an elastic element is provided between an imaging circuit board on which a photosensitive chip is disposed and a cover plate structure, and the tilt angle of the image plane of the photosensitive chip relative to the cover plate glass is adjusted by adjusting the elastic compression of the elastic element.

[0054] This embodiment of the invention avoids collisions or damage to electrical components caused by directly placing the elastic element on the imaging circuit board, by adding an adjustment component to the imaging circuit board and setting an elastic element between the adjustment component and the cover plate structure. Furthermore, the adjustment component does not require extremely high machining precision; the overall structural stability is good after the paper is completed.

[0055] Furthermore, the embodiments of this disclosure, by setting a first fastener threaded connection adjustment component and a cover plate structure, adjust the elastic compression of the elastic component by adjusting the threaded connection length of the first fastener, thereby adjusting the tilt angle of the image plane of the photosensitive chip relative to the cover glass. The adjustment method is simple, and the structure is also simple.

[0056] Embodiments of this disclosure are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this disclosure, and should not be construed as limiting this disclosure.

[0057] Combination Figure 2 and Figure 3 This disclosure provides a sensor assembly for use in a SAM optical path, comprising: a cover plate structure 100, an imaging circuit board 200, and an adjustment component 300.

[0058] An image circuit board 200 is equipped with a photosensitive chip 210, which can be a CMOS (Complementary Metal Oxide Semiconductor) chip or a CCD (Charge Coupled Device) chip, etc. The photosensitive chip 210 can receive the light signal reflected from the surface of an object and convert it into an electrical signal, thereby generating a contour image.

[0059] The cover plate structure 100 is located on one side of the photosensitive surface of the photosensitive chip 210, and light is imaged onto the photosensitive surface of the photosensitive chip 210 through the cover plate structure 100.

[0060] The cover structure 100 may include a cover 110 and a fixing base 120, wherein the cover 110 is fixed to the fixing base 120. Exemplarily, the cover 110 is bonded to the fixing base 120. For example, the cover 110 is fixed to the fixing base 120 with UV adhesive.

[0061] The cover plate 110 is a light-transmitting cover plate, which can be colorless optical glass, optical plastic, etc. The cover plate 110 not only protects the photosensitive chip 210, but also refracts light by setting the shape of the incident and exit surfaces of the cover plate 110, thereby improving the image quality.

[0062] For example, the cover plate 110 is a light wedge, and the incident surface and the exit surface of the light wedge can both be planes, and the incident surface and the exit surface of the light wedge are not parallel.

[0063] The incident surface of the cover plate 110 is the side where light enters the cover plate 110, and the exit surface of the cover plate 110 is the side where light exits the cover plate 110. The light enters the cover plate 110 through the incident surface, and then exits through the exit surface to reach the photosensitive chip 210.

[0064] In this embodiment of the present disclosure, the adjustment member 300 is connected to the imaging circuit board 200. The adjustment member 300 may be located on one side of the photosensitive chip 210 of the imaging circuit board 200.

[0065] For example, the adjustment member 300 and the imaging circuit board 200 are connected by screws or other fasteners, which provides a stable connection; for example, the adjustment member 300 and the imaging circuit board 200 are bonded together, which provides a simple connection.

[0066] An elastic element 400 is provided between the adjusting element 300 and the cover plate structure 100. The elastic element 400 is located between the fixing seat 120 of the cover plate structure 100 and the adjusting element 300.

[0067] The adjusting member 300 is threadedly connected to the cover plate structure 100 via a first fastener 350, which is configured to adjust the length of the threaded connection to adjust the elastic deformation of the elastic member 400.

[0068] The first fastener 350 can be a screw, stud, etc.

[0069] The adjusting component 300 is provided with a first connecting hole 301, and the fixed base 120 is provided with a second connecting hole 121. The first fastener 350 connects the adjusting component 300 and the fixed base 120 by means of the first connecting hole 301 and the second connecting hole 121.

[0070] For example, the second connecting hole 121 is a threaded hole, and the first fastener 350 passes through the first connecting hole 301 and is threadedly connected to the second connecting hole 121. By adjusting the threaded connection length between the first fastener 350 and the second connecting hole 121, the elastic deformation of the elastic element 400 is adjusted, thereby adjusting the pitch angle of the imaging circuit board 200. The pitch angle of the imaging circuit board 200 is the tilt angle of the photosensitive surface of the photosensitive chip 210 relative to the cover plate 110.

[0071] For example, the first connecting hole 301 is a threaded hole, and the first fastener 350 passes through the second connecting hole 121 and is threadedly connected to the first connecting hole 301. By adjusting the threaded connection length between the first fastener 350 and the first connecting hole 301, the elastic deformation of the elastic element 400 is adjusted, thereby adjusting the pitch angle of the imaging circuit board 200.

[0072] Therefore, the sensor assembly of this embodiment of the present disclosure is provided with an adjustment member 300 connected to the imaging circuit board 200, and an elastic member 400 provided between the adjustment member 300 and the cover plate structure 100. The adjustment member 300 and the cover plate structure 100 are connected by a threaded first fastener 350. By adjusting the threaded connection length of the first fastener 350, the elastic deformation of the elastic member 400 is adjusted, thereby adjusting the tilt angle of the imaging circuit board 200 relative to the cover plate 110 of the cover plate structure 100, realizing the focusing adjustment of the photosensitive chip 210 and the SAM lens 720. It is not only simple in structure, but also simple in adjustment operation; it is suitable for scenarios that require high-precision SAM optical path focusing, and does not require the structural components to have very high processing precision, and the overall structural stability is good after adjustment.

[0073] In some embodiments, the elastic element 400 is not coaxially arranged with the first fastener 350, and a guide is provided so that the elastic element 400 extends and deforms along the axial direction of the first fastener 350. The arrangement of the elastic element 400 is flexible. For example, the elastic element 400 is annular, and the guide is inserted inside the elastic element 400. The guide is provided on one of the fixing base 120 and the adjusting member 300, and the other has a guide hole that mates with the guide.

[0074] In some embodiments, the elastic element 400 and the first fastener 350 are coaxially arranged. The elastic element 400 is provided with a through hole and is sleeved on the outside of the first fastener 350. This arrangement allows the first fastener 350 to also guide the deformation direction of the elastic element 400, which helps to simplify the structure of the sensor assembly. Furthermore, since the elastic element 400 and the first fastener 350 are coaxially arranged, the force direction of the elastic element 400 is collinear with the axial direction of the first fastener 350, resulting in no additional bending moment. This helps to improve the stability of the connection between the adjusting member 300 and the fixed base 120, making it less prone to loosening due to vibration or impact.

[0075] Combination Figure 3 and Figure 4 In some embodiments of this disclosure, along the image plane tilt direction (corresponding to...) Figure 3 In the X-axis direction, at least one first fastener 350 is provided at each end of the adjusting member 300. The outer side of each first fastener 350 is sleeved on the elastic member 400.

[0076] Among them, Figure 1 The diagram illustrates the principle of Scherm's law, where the image plane tilt direction corresponds to the X-axis direction. Figure 4 In the middle, the optical axis O of the Sham lens 720 is perpendicular to the plane of the cover plate 110.

[0077] The tilt angle A of the photosensitive surface of the photosensitive chip 210 relative to the plane of the cover plate 110 is the pitch angle of the imaging circuit board 200.

[0078] The ease of adjustment is improved by setting at least one first fastener 350 at each end of the image plane tilt direction by the adjusting member 300.

[0079] In some embodiments, a plurality of first fasteners 350 are provided at intervals along a first direction; wherein, the first direction (corresponding to) Figure 3 The plane defined by the first direction (Y-axis direction) is perpendicular to the tilt direction of the image plane, and the plane defined by the first direction and the tilt direction of the image plane is parallel to the photosensitive surface.

[0080] For example, two first fasteners 350 are provided along the first direction, and the outer sides of the two first fasteners 350 are respectively sleeved on the elastic member 400.

[0081] This embodiment of the disclosure improves the reliability and stability of the connection between the adjusting member 300 and the fixed base 120 by providing a plurality of first fasteners 350 at intervals along the first direction, thereby ensuring stability after the photosensitive chip 210 and the SAM lens 720 are focused.

[0082] Combination Figure 5 In some embodiments of this disclosure, the adjustment member 300 includes a frame body 310 and a first connecting portion 320. The frame body 310 is fixedly connected to the imaging circuit board 200. The frame body 310 is constructed to form a hollow hole 311 so that the photosensitive surface is opposite to the cover plate structure 100, thereby avoiding the setting of the adjustment member 300 from affecting the photosensitive chip 210's perception of light.

[0083] For example, the frame body 310 can be a rectangular frame, which has a simple structure and is easy to process.

[0084] The first connecting portion 320 is disposed on the outer edge of the frame body 310, and the first connecting portion 320 is connected to the first fastener 350. The first connecting portion 320 is provided with a first connecting hole 301.

[0085] The projection of the first connecting portion 320 onto the plane of the photosensitive surface protrudes from the imaging circuit board 200. This can be understood as the projection of the first connecting portion 320 onto the plane of the photosensitive surface (corresponding to...) Figure 3 (in the XY plane), the first connecting part 320 protrudes relative to the edge of the imaging circuit board 200.

[0086] This configuration allows the projection of the first fastener 350 onto the plane of the photosensitive surface to protrude beyond the imaging circuit board 200, thus placing the first fastener 350 outside the imaging circuit board 200, facilitating the adjustment of the first fastener 350, and reducing the possibility of collision with the imaging circuit board 200 when adjusting the first fastener 350.

[0087] In this embodiment, the elastic element 400 can be a spring, an elastic pad, etc.

[0088] In some specific implementation methods disclosed herein, combined with Figure 6 and Figure 7 The elastic element 400 is a disc spring 410.

[0089] Among them, the disc spring 410 adopts a conical disc structure, which can withstand a large load under axial compression and has the characteristics of high stiffness and small elastic deformation stroke; moreover, the disc spring 410 also has the advantages of small axial space occupation and compact structure.

[0090] like Figure 7 As shown, the disc spring 410 has a concave surface 411 and a convex surface 412 that are opposite each other along its axial direction.

[0091] In some embodiments of this disclosure, a plurality of disc springs 410 are provided along the axial direction of the first fastener 350 to increase the amount of elastic deformation.

[0092] When there are multiple first fasteners 350, each first fastener 350 is provided with the same number of disc springs 410. This arrangement allows the imaging circuit board 200 to be in the same adjustment position, which is convenient for adjustment.

[0093] With the concave surfaces 411 or convex surfaces 412 of two adjacent disc springs 410 facing each other, it can be understood that multiple disc springs 410 are stacked in opposite directions, with the convex surfaces 412 and concave surfaces 411 stacked in opposite directions. This arrangement helps to reduce the overall stiffness of the multiple disc springs 410 and increase the amount of elastic deformation.

[0094] Combination Figure 6 and Figure 8 In some embodiments of this disclosure, a recess 122 is provided on the fixing base 120, and a second connecting hole 121 is provided in the recess 122. At least a portion of the disc spring 410 is located in the recess 122, which can restrict the disc spring 410.

[0095] Reference Figure 9 and Figure 10 In some embodiments of this disclosure, the sensor assembly further includes a heat sink 500, which is fixed to the side of the imaging circuit board 200 away from the adjustment member 300.

[0096] The embodiments of this disclosure improve the heat dissipation performance of the sensor assembly by providing a heat sink 500 on the side of the imaging circuit board 200 away from the photosensitive chip 210.

[0097] The heat sink 500 is fixedly connected to the imaging circuit board 200 by means including but not limited to screw connection, adhesive connection, etc.

[0098] In some possible implementations of this disclosure, the sensor assembly may further include a second fastener 360, which is threadedly connected to the adjusting member 300 and the imaging circuit board 200, so that the connection between the adjusting member 300 and the imaging circuit board 200 is stable and reliable.

[0099] In this embodiment, the second fastener 360 also securely connects the heat sink 500 and the imaging circuit board 200, which helps to simplify the structure of the sensor assembly.

[0100] Combination Figure 5 and Figure 10 The adjusting component 300 is provided with a third connecting hole 302, the imaging circuit board 200 is provided with a fourth connecting hole 201, and the heat sink 500 is provided with a fifth connecting hole 501. The second fastener 360 is fixedly connected to the adjusting component 300, the imaging circuit board 200, and the heat sink 500 through the third connecting hole 302, the fourth connecting hole 201, and the fifth connecting hole 501.

[0101] For example, the third connecting hole 302 is a threaded hole, and the second fastener 360 passes through the fifth connecting hole 501 and the fourth connecting hole 201 and is threadedly connected to the third connecting hole 302.

[0102] For example, the fifth connecting hole 501 is a threaded hole, and the second fastener 360 passes through the third connecting hole 302 and the fourth connecting hole 201 and is threadedly connected to the fifth connecting hole 501.

[0103] Multiple second fasteners 360 can be provided, and the multiple second fasteners 360 can be arranged in a rectangular matrix on the imaging circuit board 200 to improve the reliability of the connection between the adjustment component 300, the imaging circuit board 200 and the heat sink 500.

[0104] In some embodiments, the heads of the second fastener 360 and the first fastener 350 are located on the same side, facilitating adjustment and assembly. For example... Figure 2 As shown, the heads of both the second fastener 360 and the first fastener 350 are away from the cover plate 110.

[0105] Reference Figure 5 In some embodiments, the adjusting member 300 may further include a second connecting portion 340, which is connected to the outer edge of the frame body 310. When multiple second fasteners 360 are provided, some of the third connecting holes 302 may be provided on the frame body 310, and others may be provided on the second connecting portion 340.

[0106] In some embodiments, the frame body 310 may also be provided with a positioning post 330 and the imaging circuit board 200 is provided with a positioning hole 202. The cooperation of the positioning post 330 and the positioning hole 202 improves the accuracy of the assembly of the adjustment member 300 and the imaging circuit board 200 and reduces the possibility of collision with the electrical components on the imaging circuit board 200 when assembling the adjustment member 300.

[0107] Continue to refer to Figures 8 to 11 In some embodiments of this disclosure, the sensor assembly further includes a thermally conductive spring 600, one end of which is fixedly connected to the heat sink 500, and the other end of which is fixedly connected to the cover plate structure 100.

[0108] The two ends of the thermally conductive spring 600 are connected to the heat sink 500 and the cover plate structure 100, respectively, so that the two ends of the thermally conductive spring 600 are in contact with the heat sink 500 and the cover plate structure 100, respectively. In this way, the heat transferred from the imaging circuit board 200 to the cover plate structure 100 is transferred to the heat sink 500 through the thermally conductive spring 600, ensuring the heat dissipation effect.

[0109] In some embodiments, the two ends of the thermally conductive spring sheet 600 are in contact with the heat sink 500 and the cover plate structure 100 respectively, ensuring the contact area, thereby ensuring the heat transfer effect and increasing the heat dissipation effect of the sensor assembly.

[0110] Among them, such as Figure 8 and Figure 9 As shown, the mounting base 120 has a bent structure and includes a first part 123 and a second part 124. The first part 123 is fitted with a cover plate 110 and is located on the side of the imaging circuit board 200 where the photosensitive chip 210 is located. The second part 124 is perpendicular to the first part 123, and a portion of the second part 124 is exposed on the side of the heat sink 500 away from the imaging circuit board 200. The other end of the thermally conductive spring 600 is fixedly connected to the second part 124.

[0111] A portion of the thermally conductive spring 600 is suspended relative to the heat sink 500 and the cover structure 100, and is configured to be elastically deformable to adapt to different pitch angles of the imaging circuit board 200, ensuring the heat dissipation performance of the imaging circuit board 200 and helping to improve heat dissipation efficiency. "Suspended" can be understood as meaning that a portion of the thermally conductive spring 600 does not contact the heat sink 500 or the cover structure 100.

[0112] For example, one end of the thermally conductive spring 600 is fixedly connected to the heat sink 500 by a third fastener 611, and the thermally conductive spring 600 is in surface contact with the heat sink 500 to improve thermal conductivity.

[0113] For example, the other end of the heat-conducting spring 600 is fixedly connected to the fixing seat 120 of the cover structure 100 by the fourth fastener 621, and the heat-conducting spring 600 is in contact with the second part 124 of the fixing seat 120, which helps to improve heat dissipation performance.

[0114] In some embodiments of this disclosure, the thermally conductive spring 600 includes a first portion 610, which is fixedly connected to the heat sink 500 by a third fastener 611 and is in contact with the surface of the heat sink 500.

[0115] The thermally conductive spring 600 also includes a second piece 620, which is fixedly connected to the mounting base 120 via a fourth fastener 621 and contacts the second portion 124 of the mounting base 120. The second piece 620 may be perpendicular to the first piece 610. The second piece 620 is provided with a connection hole, which may be an oblong hole, and the extension direction of the oblong hole is perpendicular to the plane of the imaging circuit board 200.

[0116] The heat-conducting spring 600 also includes a third piece 630, which connects the first piece 610 and the second piece 620. The third piece 630 is suspended relative to the heat sink 500 and the second part 124 of the mounting base 120, so that the third piece 630 does not contact the heat sink 500 and does not contact the second part 124.

[0117] For example, the first piece 610 extends towards the imaging circuit board 200 at one end facing the second piece 620 to form the third piece 630; the third piece 630 extends away from the imaging circuit board 200 at one end facing away from the first piece 610 to form the second piece 620. Thus, the thermally conductive and elastic components are integrally molded, resulting in a stable structure. A V-shaped structure is formed between the second piece 620 and the third piece 630, which helps to improve the elastic deformation of the third piece 630.

[0118] In this embodiment, the third portion 630 of the thermally conductive spring 600 is suspended relative to the heat sink 500 and the cover plate structure 100. When adjusting the pitch angle of the imaging circuit board 200, the suspended third portion 630 elastically deforms, reducing the possibility of the first portion 610 and the second portion 620 deforming and lifting. This ensures stable and reliable surface contact between the first portion 610 and the heat sink 500, and between the second portion 620 and the cover plate structure 100, thereby ensuring the heat dissipation performance of the imaging circuit board 200 and helping to improve heat dissipation efficiency.

[0119] Combination Figure 12 Some embodiments of this disclosure also provide an electronic device, which includes: a Sham lens 720 and a sensor assembly of the above embodiments, wherein object-side light passes sequentially through the cover structure 100 of the Sham lens 720 and the sensor assembly and is imaged on the photosensitive chip 210 of the sensor assembly.

[0120] exist Figure 12 In this context, a dashed line with an arrowhead can indicate the direction of light.

[0121] In some embodiments, the electronic device is a 3D camera. The laser source 710 emits a linear laser and illuminates the target object 730 to be measured. The SAM lens 720 acquires the laser reflected back from the target object 730 and images it onto the photosensitive chip 210 to determine the surface contour of the target object 730. This method has the advantages of high precision, high speed, and high stability.

[0122] The electronic device may also include a housing 740, which provides a mounting location for the laser light source 710, the SAM lens 720, and the sensor assembly. The sensor assembly mounting bracket 120 can be fixed to the housing 740.

[0123] The structure, function, and effect of the sensor assembly provided in this embodiment are the same as those in the above embodiments. For details, please refer to the above embodiments, and they will not be repeated here.

[0124] The electronic device provided in this disclosure includes the sensor components of the above embodiments, and therefore has the same advantages as the sensor components of the above embodiments, which will not be repeated here.

[0125] In the above description, the use of terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refers to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0126] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this disclosure.

Claims

1. A sensor assembly used in a Sham optical path, characterized in that, include: The system includes a cover plate structure (100), an imaging circuit board (200), and an adjustment component (300); a photosensitive chip (210) is disposed on the imaging circuit board (200). The cover plate structure (100) is located on one side of the photosensitive surface of the photosensitive chip (210), and light is imaged onto the photosensitive surface of the photosensitive chip (210) through the cover plate structure (100). The adjusting member (300) is connected to the imaging circuit board (200); an elastic member (400) is provided between the adjusting member (300) and the cover plate structure (100), and the adjusting member (300) and the cover plate structure (100) are threadedly connected by a first fastener (350), the first fastener (350) being configured to adjust the length of the threaded connection to adjust the elastic deformation of the elastic member (400).

2. The sensor assembly according to claim 1, characterized in that, The sensor assembly also includes a heat sink (500) fixed to the side of the imaging circuit board (200) away from the adjustment member (300).

3. The sensor assembly according to claim 2, characterized in that, The sensor assembly also includes a thermally conductive spring sheet (600), one end of which is fixedly connected to the heat sink (500), and the other end of which is fixedly connected to the cover plate structure (100). A portion of the thermally conductive sheet (600) is suspended relative to the heat sink (500) and the cover structure (100) and is configured to be elastically deformable.

4. The sensor assembly according to claim 3, characterized in that, The thermally conductive spring sheet (600) includes: a first piece (610), a second piece (620), and a third piece (630), wherein the third piece (630) connects the first piece (610) and the second piece (620); the first piece (610) is fixedly connected to the heat sink (500) and in surface contact; the second piece (620) is fixedly connected to the cover plate structure (100) and in surface contact; the third piece (630) is suspended relative to the heat sink (500) and the cover plate structure (100) and is configured to be elastically deformable.

5. The sensor assembly according to any one of claims 1-4, characterized in that, The elastic element (400) is provided with a through hole, and the elastic element (400) is sleeved on the outside of the first fastener (350).

6. The sensor assembly according to claim 5, characterized in that, Along the tilt direction of the image plane, at least one of the first fasteners (350) is provided at each end of the adjusting member (300).

7. The sensor assembly according to claim 6, characterized in that, A plurality of first fasteners (350) are provided at intervals along a first direction; wherein, the first direction is perpendicular to the tilt direction of the image plane, and the plane determined by the first direction and the tilt direction of the image plane is parallel to the photosensitive surface.

8. The sensor assembly according to any one of claims 1-4, characterized in that, The adjusting member (300) includes a frame body (310) and a first connecting part (320). The frame body (310) is fixedly connected to the imaging circuit board (200). The frame body (310) is constructed to form a hollow hole (311) so that the photosensitive surface is opposite to the cover plate structure (100). The first connecting part (320) is disposed on the outer edge of the frame body (310), and the first connecting part (320) is connected to the first fastener (350); the projection of the first connecting part (320) on the plane where the photosensitive surface is located protrudes from the imaging circuit board (200).

9. The sensor assembly according to any one of claims 1-4, characterized in that, The elastic element (400) is a disc spring (410); A plurality of disc springs (410) are provided along the axial direction of the first fastener (350), with the concave surfaces (411) or convex surfaces (412) of two adjacent disc springs (410) facing each other.

10. An electronic device, characterized in that, include: The object-side light passes sequentially through the Sham lens (720) and the cover plate structure (100) of the sensor assembly according to any one of claims 1-9, and is imaged on the photosensitive chip (210) of the sensor assembly.

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