Headphone with replaceable module
By designing a headset with replaceable modules, using a detachable connection mechanism and magnetic attachment, the problem of non-replaceable headphone speakers in existing headphones is solved, enabling quick speaker replacement and flexible sound effect adjustment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN QINGGEMAN ELECTROACOUSTIC CO LTD
- Filing Date
- 2025-02-25
- Publication Date
- 2026-04-28
AI Technical Summary
The speakers in existing headphones are usually not replaceable, making it difficult to use speakers with different sound effects to meet different needs.
A replaceable module headset was designed, in which the shell and the sound module are detachably connected by a detachable connection mechanism, and the speaker can be quickly replaced by magnetic attraction or other connection methods.
It enables easy disassembly and connection of the housing and sound module, facilitating the replacement of speakers with different sound effects and simplifying the replacement process.
Smart Images

Figure CN224178276U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of headphone technology, and more particularly to a headphone with interchangeable modules. Background Technology
[0002] Currently, the speakers inside headphones are usually not replaceable. Therefore, it is difficult to use speakers with different sound effects to meet specific needs. Summary of the Invention
[0003] To address the aforementioned issues, this technical solution provides a headset with interchangeable modules.
[0004] To achieve the above objectives, the technical solution is as follows:
[0005] Interchangeable module headphones, including
[0006] The housing has a mounting slot, a first power connector, and an audio connector.
[0007] A sound module, comprising a front cover, a speaker disposed on the front cover, and a second power connector electrically connected to the speaker;
[0008] A detachable mechanism for detachably connecting the housing to the sound module;
[0009] The detachable mechanism includes a first connector on the housing and a second connector on the sound module. When the first connector corresponds to the second connector, the sound module is confined in the mounting slot.
[0010] The interchangeable-module headphones described above have ear cup slots arranged around their periphery on the front cover.
[0011] As described above, in the interchangeable-module headphones, the first connector and the second connector are magnetically engaged so that the sound module is attached to the housing.
[0012] As described above, in the replaceable module headphone, the mounting slot has a recessed cavity, and the cavity has a through hole communicating with the outside.
[0013] As described above, the interchangeable-module headset has a recess on the mounting slot for the first connector to be inserted.
[0014] As described above, in the replaceable module headset, the mounting slot includes a bottom surface and a top surface, and the front cover includes an insert portion embedded in the mounting slot and a main body portion abutting against the top surface.
[0015] As described above, the replaceable module headphones have a first buffer on the bottom surface and a second buffer on the embedded part. When the sound module enters the mounting slot, the first buffer and the second buffer abut against each other.
[0016] The interchangeable-module headphones described above also include a headband. The housing has a connection hole for connecting to the headband and a rotation hole. The housing rotates relative to the headband through the connection hole, and the rotation hole limits the range of rotation of the housing relative to the headband.
[0017] The interchangeable-module headphones described above have a rotating shaft inserted into the connection hole on the headband, and a limiting block disposed on the rotating shaft and corresponding to the rotating hole.
[0018] As described above, in the replaceable module headset, the first buffer and the second buffer are respectively provided with openings for the first power connector and the second power connector to be exposed.
[0019] The beneficial effects of this application are:
[0020] This invention provides a headset with a replaceable module. The shell and the sound module can be detached or connected via a detachable connection mechanism, facilitating the replacement of speakers with different sound effects. The replacement process is simple and quick. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below.
[0022] Figure 1 This is a schematic diagram of the installation of the housing and the sound module;
[0023] Figure 2 This is an exploded view of the casing and sound module.
[0024] Figure 3 yes Figure 1 Structural decomposition Figure 1 ;
[0025] Figure 4 yes Figure 1 Structural decomposition Figure 2 ;
[0026] Figure 5 yes Figure 1 A half-section diagram;
[0027] Figure 6 This is a structural diagram of this application. Detailed Implementation
[0028] To make the technical problems solved, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.
[0029] Interchangeable module headphones, including
[0030] The housing 1 has a mounting slot 11, a first power connector 12, and an audio connector 13.
[0031] The sound module 2 includes a front cover 21, a speaker 22 disposed on the front cover 21, and a second power connector 23 electrically connected to the speaker 22;
[0032] Detachable mechanism 3 is used to detachably connect the housing 1 and the sound module 2;
[0033] The detachable mechanism 3 includes a first connector 31 disposed on the housing 1 and a second connector 32 disposed on the sound module 2. When the first connector 31 corresponds to the second connector 32, the sound module 2 is confined in the mounting slot 11.
[0034] This invention provides a headset with a replaceable module. The shell and the sound module can be detached or connected via a detachable connection mechanism, facilitating the replacement of speakers with different sound effects. The replacement process is simple and quick.
[0035] Furthermore, as a preferred embodiment of this solution and not a limitation thereof, the front cover 21 is provided with ear cup slots 24 arranged around its periphery. The ear cup slots are for the ear cups to be fitted into.
[0036] Furthermore, as a preferred embodiment of this solution and not a limitation, the first connector 31 and the second connector 32 are magnetically engaged so that the sound module 2 is attached to the housing 1. In this embodiment, both the first and second connectors are magnets. Alternatively, the first and second connectors can be connected using demagnetizing methods, such as snap-fit, threaded connection, or adhesive bonding. In snap-fit, the first and second connectors can be a snap-fit and a slot; in threaded connection, the first and second connectors can be external threads and internal threads; in adhesive bonding, the first and second connectors can be Velcro.
[0037] Furthermore, as a preferred embodiment of this solution and not a limitation, the mounting groove 11 is recessed with a cavity 14, and the cavity 14 is provided with a through hole 15 communicating with the outside. The through hole allows for ventilation, improves sound effects, and at the same time, prevents air pressure from affecting the installation of the sound module.
[0038] Furthermore, as a preferred embodiment of this solution and not a limitation thereof, the mounting groove 11 is provided with a recess 16 for the first connector 31 to be embedded in.
[0039] Furthermore, as a preferred embodiment of this solution and not a limitation thereof, the mounting groove 11 includes a bottom surface 111 and a top surface 112, and the front cover 21 includes an insert portion 211 embedded in the mounting groove 11 and a main body portion 212 abutting against the top surface 112. This results in a more secure installation.
[0040] Furthermore, as a preferred embodiment of this solution and not a limitation, a first buffer 4 is provided on the bottom surface 111, and a second buffer 5 is provided on the embedded part 211. When the sound module 2 enters the mounting groove 11, the first buffer 4 and the second buffer 5 abut against each other. The first buffer and the second buffer can be soft materials such as sponge or silicone.
[0041] Furthermore, as a preferred embodiment of this solution and not a limitation, it also includes a headband 6. The housing 1 is provided with a connection hole 17 for connecting to the headband 6 and a rotation hole 18. The housing 1 rotates relative to the headband 6 through the connection hole 17, and the rotation hole 18 limits the range of rotation of the housing 1 relative to the headband 6.
[0042] Furthermore, as a preferred embodiment of this solution and not a limitation thereof, the headgear 6 is provided with a rotating shaft 61 that is inserted into the connecting hole 17, and a limiting block 62 provided on the rotating shaft 61 and corresponding to the rotating hole 18.
[0043] Furthermore, as a preferred embodiment of this solution and not a limitation, the first buffer 4 and the second buffer 5 are respectively provided with openings 7 for exposing the first power connector 12 and the second power connector 23, to avoid affecting power supply.
[0044] The above description is only a preferred embodiment of this application and is not intended to limit the scope of implementation of this application. Any other embodiments whose principles and basic structures are the same as or similar to those of this application are within the protection scope of this application.
Claims
1. A headset with interchangeable modules, characterized in that: include The housing (1) has a mounting slot (11), a first power connector (12), and an audio connector (13). The sound module (2) includes a front cover (21), a speaker (22) disposed on the front cover (21), and a second power connector (23) electrically connected to the speaker (22). A detachable mechanism (3) is provided for detachably connecting the housing (1) to the sound module (2); The detachable mechanism (3) includes a first connector (31) disposed on the housing (1) and a second connector (32) disposed on the sound module (2). When the first connector (31) corresponds to the second connector (32), the sound module (2) is confined in the mounting slot (11).
2. The headset with replaceable modules according to claim 1, characterized in that: The front cover (21) is provided with ear cup slots (24) arranged around its periphery.
3. The headset with replaceable modules according to claim 1, characterized in that: The first connector (31) and the second connector (32) are magnetically attached to each other so that the sound module (2) is attached to the housing (1).
4. The headset with a replaceable module according to claim 1, characterized in that: The mounting groove (11) has a cavity (14) recessed on it, and the cavity (14) has a through hole (15) connecting to the outside.
5. The headset with a replaceable module according to claim 3, characterized in that: The mounting slot (11) is provided with a groove (16) for the first connector (31) to be inserted.
6. The headset with a replaceable module according to claim 1, characterized in that: The mounting groove (11) includes a bottom surface (111) and a top surface (112). The front cover (21) includes an insert (211) embedded in the mounting groove (11) and a main body (212) abutting against the top surface (112).
7. The headset with a replaceable module according to claim 6, characterized in that: The bottom surface (111) is provided with a first buffer (4), and the embedded part (211) is provided with a second buffer (5). When the sound module (2) enters the mounting slot (11), the first buffer (4) and the second buffer (5) abut against each other.
8. The headset with a replaceable module according to claim 1, characterized in that: It also includes a headgear (6), the housing (1) is provided with a connection hole (17) for connecting to the headgear (6) and a rotation hole (18), the housing (1) rotates relative to the headgear (6) through the connection hole (17), and the rotation hole (18) limits the range of rotation of the housing (1) relative to the headgear (6).
9. The headset with a replaceable module according to claim 8, characterized in that: The headgear (6) is provided with a rotating shaft (61) that is inserted into the connecting hole (17), and a limiting block (62) provided on the rotating shaft (61) and corresponding to the rotating hole (18).
10. The headset with a replaceable module according to claim 7, characterized in that: The first buffer (4) and the second buffer (5) are respectively provided with openings (7) for the first power connector (12) and the second power connector (23) to be exposed.