LED lamp bead, module and light-emitting equipment

Abstract

The utility model provides an LED lamp bead, a module and light-emitting equipment. The LED lamp bead comprises a support, a plurality of LED chips and a fluorescent film. The support is provided with a first electrode and a second electrode. The plurality of LED chips are fixed on the support. The plurality of LED chips are arranged on the bracket in a b-row a-column arrangement mode, a is greater than or equal to 1, and b is greater than or equal to 1. The LED chips in each row are connected in series, the end, away from the second electrode, of the LED chip on the leftmost side of each row is connected with the first electrode, and the end, away from the first electrode, of the LED chip on the rightmost side of each row is connected with the second electrode. The fluorescent film covers the sides, away from the support, of the LED chips. By adopting the mode, the light emitting rate of the LED lamp bead can be effectively improved, and the consumed energy is less under the same lighting effect.

Description

Technical Field

[0001] This application relates to the field of light-emitting device technology, and in particular to an LED bead, module and light-emitting device. Background Technology

[0002] Nowadays, LED lights are increasingly widely used in various fields of daily life and production, including landscape lighting, signage and directional lighting, indoor lighting, and vehicle indicator lights. Compared with traditional halogen lamps, LED lights have the advantages of high luminous efficiency, low power consumption, long lifespan, safety, reliability, and energy saving and environmental protection.

[0003] However, most LED lights currently have low light output efficiency, resulting in excessive energy consumption while maintaining brightness, which can no longer meet market demand. Utility Model Content

[0004] Therefore, it is necessary to provide an LED bead, module, and light-emitting device to address the aforementioned technical problems.

[0005] An LED light bead, comprising:

[0006] A support, wherein a first electrode and a second electrode are provided;

[0007] Multiple LED chips are fixed on the bracket, arranged in a 'b' x 'a' column configuration, where a ≥ 1 and b ≥ 1. The LED chips in each row are connected in series. The leftmost LED chip in each row has its end furthest from the second electrode connected to the first electrode, and the rightmost LED chip in each row has its end furthest from the first electrode connected to the second electrode.

[0008] A fluorescent film covers the side of the plurality of LED chips away from the support.

[0009] In one embodiment, the support is an SMD support or a COB support.

[0010] In one embodiment, the fluorescent film is applied to the side of the plurality of LED chips away from the support by adhesive.

[0011] In one embodiment, the leftmost end of the LED chip in each row, away from the second electrode, is connected to the first electrode via a wire, and the rightmost end of the LED chip in each row, away from the first electrode, is connected to the second electrode via a wire.

[0012] An LED module, comprising:

[0013] PCB circuit board, the PCB circuit board being provided with a third electrode and a fourth electrode; and

[0014] A plurality of LED beads as described in any of the above embodiments are arranged on the PCB circuit board in an N-row, M-column arrangement, wherein N≥1 and M≥1;

[0015] Multiple LED beads in each row are connected in series with each other, and the leftmost LED bead in each row is connected to the third electrode at the end furthest from the fourth electrode, while the rightmost LED bead in each row is connected to the fourth electrode at the end furthest from the third electrode.

[0016] In one embodiment, the spacing between adjacent LED beads in each row is greater than or equal to 10 mil.

[0017] In one embodiment, the spacing between adjacent LED beads in each column is greater than or equal to 10 mil.

[0018] An LED lighting device, comprising:

[0019] The LED module described in any of the above embodiments; and

[0020] A control device is connected to the LED module.

[0021] Compared with existing technologies, the above-described LED lamp bead, module, and light-emitting device include: an LED lamp bead comprising: a bracket, multiple LED chips, and a fluorescent film. The bracket is provided with a first electrode and a second electrode. Multiple LED chips are fixed on the bracket. The multiple LED chips are arranged in a b-row, a-column configuration on the bracket, where a≥1 and b≥1. The multiple LED chips in each row are connected in series, and the leftmost LED chip in each row has its end furthest from the second electrode connected to the first electrode, and the rightmost LED chip in each row has its end furthest from the first electrode connected to the second electrode. The fluorescent film covers the side of the multiple LED chips furthest from the bracket. By adopting the above method, this application can effectively improve the light extraction efficiency of the LED lamp bead and consume less energy under the same lighting effect. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 A circuit diagram of an LED lamp bead provided in an embodiment of this application;

[0024] Figure 2 This is a circuit diagram of an LED module provided in one embodiment of this application;

[0025] Figure 3 This is a schematic diagram of the structure of an LED light-emitting device provided in an embodiment of this application.

[0026] Explanation of reference numerals in the attached figures:

[0027] 10. LED lamp bead; 101. First electrode; 102. Second electrode; 110. Bracket; 120. LED chip; 130. Fluorescent film; 20. LED module; 201. Third electrode; 202. Fourth electrode; 210. PCB circuit board; 30. LED light-emitting device; 310. Control device. Detailed Implementation

[0028] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0029] The serial numbers assigned to components in this document, such as "first" and "second," are used solely to distinguish the objects being described and do not have any sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages). It should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used solely for the convenience of describing this application and for simplification, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0030] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0031] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0033] Please see Figure 1 This application provides an embodiment of an LED lamp bead 10. The LED lamp bead 10 includes: a bracket 110, a plurality of LED chips 120, and a fluorescent film 130. The bracket 110 is provided with a first electrode 101 and a second electrode 102. The plurality of LED chips 120 are fixed on the bracket 110. The plurality of LED chips 120 are arranged in a row of b and column of a on the bracket 110, where a≥1 and b≥1. The plurality of LED chips 120 in each row are connected in series with each other. The leftmost LED chip 120 in each row has its end away from the second electrode 102 connected to the first electrode 101. The rightmost LED chip 120 in each row has its end away from the first electrode 101 connected to the second electrode 102. The fluorescent film 130 covers the side of the plurality of LED chips 120 away from the bracket 110.

[0034] In some embodiments, the specific dimensions of the bracket 110 can be selected according to actual needs. For example, a certain specification size (n*m) of LED bracket 110 and a rated operating power of W can be selected. 芯片 LED chip 120. In some embodiments, the bracket 110 can be selected as an SMD (Surface Mount Device) bracket or a COB (Chip-on-Board) bracket.

[0035] In some embodiments, the method by which the LED chip 120 is fixed to the bracket 110 is not limited, as long as it ensures that the LED chip 120 does not fall off the bracket 110. In some embodiments, the LED chip 120 can be glued to the bracket 110. The LED chip 120 can also be fixed to the bracket 110 by soldering.

[0036] In some embodiments, multiple LED chips 120 can be connected in series according to the principle of connecting positive and negative electrodes. In some embodiments, the multiple LED chips 120 are arranged in a row of b and column of a on the bracket 110, then the rated power of a single LED bead 10 is a*b*W. 芯片 .

[0037] In some embodiments, the way the leftmost end of the LED chip 120 in each row, away from the second electrode 102, is connected to the first electrode 101 is not limited, as long as conductivity between the LED chip 120 and the first electrode 101 is ensured. In some embodiments, the leftmost end of the LED chip 120 in each row, away from the second electrode 102, can be connected to the first electrode 101 via a wire. The material of the wire is not limited, as long as it is conductive. In some embodiments, the wire can be made of copper or aluminum. The specific material of the wire can be selected according to actual needs.

[0038] In some embodiments, the connection method between the rightmost end of the LED chip 120 in each row, away from the first electrode 101, and the second electrode 102 is not limited, as long as conductivity between the LED chip 120 and the second electrode 102 is ensured. In some embodiments, the rightmost end of the LED chip 120 in each row, away from the first electrode 101, can be connected to the second electrode 102 via a wire. The material of the wire is not limited, as long as it is conductive. In some embodiments, the wire can be made of copper or aluminum. The specific material of the wire can be selected according to actual needs.

[0039] This embodiment, by employing the above-described structure, effectively improves the luminous efficacy of LED beads. Under the same lighting effect, it consumes less energy, directly translating the reduced electricity consumption into reduced fossil fuel consumption and emissions of carbon dioxide and other greenhouse gases, thus contributing to environmental protection and sustainable development. Simultaneously, the high-efficiency light source has lower operating costs due to its longer lifespan, greater durability, and easier maintenance. The total cost over its entire lifespan is lower.

[0040] In some embodiments, the manner in which the fluorescent film 130 covers the side of the plurality of LED chips 120 away from the support 110 is not limited, as long as it ensures that the fluorescent film 130 can form a light-emitting LED bead after covering the plurality of LED chips 120. In some embodiments, the fluorescent film 130 can be covered with adhesive on the side of the plurality of LED chips 120 away from the support 110. The fluorescent film 130 can be made of phosphor and adhesive, covering the relevant area to form a light-emitting LED bead.

[0041] In some embodiments, the current of the LED chip 120 during actual operation is less than or equal to 79% of the rated operating current of the light-emitting diode.

[0042] Please see Figure 2 Another embodiment of this application provides an LED module 20. The LED module 20 includes a PCB circuit board 210 and a plurality of LED beads 10 as described in any of the above embodiments. The PCB circuit board 210 is provided with a third electrode 201 and a fourth electrode 202. The plurality of LED beads 10 are arranged in an N-row, M-column configuration on the PCB circuit board 210, where N≥1 and M≥1. Multiple LED beads 10 in each row are connected in series. The leftmost LED bead 10 in each row, with its end furthest from the fourth electrode 202, is connected to the third electrode 201. The rightmost LED bead 10 in each row, with its end furthest from the third electrode 201, is connected to the fourth electrode 202.

[0043] In some embodiments, the method by which the plurality of LED beads 10 are fixed to the PCB circuit board 210 is not limited, as long as it ensures that the plurality of LED beads 10 do not fall off the PCB circuit board 210. In some embodiments, the LED beads 10 can be glued to the PCB circuit board 210. The LED beads 10 can also be fixed to the PCB circuit board 210 by soldering.

[0044] In some embodiments, multiple LED beads 10 can be connected in series according to the principle of connecting positive and negative terminals. In some embodiments, multiple LED beads 10 are arranged in an N-row, M-column configuration on the PCB circuit board 210. If the rated operating power of the LED module 20 is W... LED Then the total rated operating power of a single LED module is W. 模组 =M*N*W LED If the apparent power of the LED module 20 during actual operation is W S The usage of a single LED module 20 needs to meet the following requirements: W 模组 ≥1.25* W S .

[0045] In some embodiments, the connection method between the leftmost end of the LED bead 10 in each row, away from the fourth electrode 202, and the third electrode 201 is not limited, as long as electrical conductivity between the LED bead 100 and the third electrode 201 is ensured. In some embodiments, the leftmost end of the LED bead 10 in each row, away from the fourth electrode 202, can be connected to the third electrode 201 via a wire. The material of the wire is not limited, as long as it is conductive. In some embodiments, the wire can be made of copper or aluminum. The specific material of the wire can be selected according to actual needs.

[0046] In some embodiments, the connection method between the rightmost end of the LED bead 10 in each row, away from the third electrode 201, and the fourth electrode 202 is not limited, as long as electrical conductivity is ensured between the LED bead 10 and the fourth electrode 202. In some embodiments, the rightmost end of the LED bead 10 in each row, away from the third electrode 201, can be connected to the fourth electrode 202 via a wire. The material of the wire is not limited, as long as it is conductive. In some embodiments, the wire can be made of copper or aluminum. The specific material of the wire can be selected according to actual needs.

[0047] In some embodiments, the spacing between adjacent LED beads 10 in each row is greater than or equal to 10 mil. In some embodiments, the spacing between adjacent LED beads 10 in each column is greater than or equal to 10 mil. That is, N rows and M columns of LED beads 10 are uniformly arranged on the PCB circuit board 210.

[0048] This embodiment, by employing the above-described structure and specifying the usage method of the LED module 20, effectively improves the luminous efficiency of the LED beads. Under the same lighting effect, it consumes less energy, directly translating the reduced power consumption into reduced fossil fuel consumption and emissions of carbon dioxide and other greenhouse gases, thus contributing to environmental protection and sustainable development. Simultaneously, the high-efficiency light source has lower operating costs due to its longer lifespan, greater durability, and easier maintenance. The total cost over its entire lifespan is lower.

[0049] Please see Figure 3 Another embodiment of this application provides an LED light-emitting device 30. The LED light-emitting device 30 includes: an LED module 20 as described in any of the above embodiments and a control device 310. The control device 310 is connected to the LED module.

[0050] In some embodiments, the connection method between the control device 310 and the LED module is not limited, as long as the control device 310 can control whether the LED module emits light. In some embodiments, the control device 310 can be connected to the LED module via a wire. The material of the wire is not limited, as long as it is conductive. In some embodiments, the wire can be made of copper or aluminum. The specific material of the wire can be selected according to actual needs.

[0051] In some embodiments, the specific structure of the control device 310 is not limited, as long as it has the function of controlling whether the LED module emits light. In some embodiments, the control device 310 may be an LED driver controller, or it may be an MCU (microcontroller unit).

[0052] In some embodiments, the specific type of the light-emitting device 30 is not limited, such as the light-emitting device 30 being an energy-saving lamp.

[0053] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0054] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An LED lamp bead, characterized in that, include: A support, wherein a first electrode and a second electrode are provided; Multiple LED chips are fixed on the bracket. The multiple LED chips are arranged in a row of b and column of a on the bracket, where a≥1 and b≥1. The multiple LED chips in each row are connected in series with each other. The leftmost LED chip in each row has its end away from the second electrode connected to the first electrode, and the rightmost LED chip in each row has its end away from the first electrode connected to the second electrode. as well as A fluorescent film covers the side of the plurality of LED chips away from the support.

2. The LED lamp bead as described in claim 1, characterized in that, The support structure is either an SMD support structure or a COB support structure.

3. The LED lamp bead as described in claim 1, characterized in that, The fluorescent film is applied to the side of the multiple LED chips away from the support by adhesive.

4. The LED lamp bead as described in claim 3, characterized in that, The leftmost end of the LED chip in each row, away from the second electrode, is connected to the first electrode via a wire, and the rightmost end of the LED chip in each row, away from the first electrode, is connected to the second electrode via a wire.

5. An LED module, characterized in that, include: A PCB circuit board, wherein the PCB circuit board is provided with a third electrode and a fourth electrode; as well as A plurality of LED beads as described in any one of claims 1-4, wherein the plurality of LED beads are arranged in an N-row M-column configuration on the PCB circuit board, wherein N≥1 and M≥1; Multiple LED beads in each row are connected in series with each other, and the leftmost LED bead in each row is connected to the third electrode at the end furthest from the fourth electrode, while the rightmost LED bead in each row is connected to the fourth electrode at the end furthest from the third electrode.

6. The LED module as described in claim 5, characterized in that, The spacing between adjacent LED beads in each row is greater than or equal to 10 mil.

7. The LED module as described in claim 6, characterized in that, The spacing between adjacent LED beads in each column is greater than or equal to 10 mil.

8. An LED light-emitting device, characterized in that, include: The LED module as described in any one of claims 5-7; as well as A control device is connected to the LED module.

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