Chip picking and mounting device and chip packaging system

Abstract

The utility model relates to the technical field of chip packaging, in particular to a chip picking and mounting device and a chip packaging system. The chip picking and mounting device comprises a base, a suction cup and a suction nozzle, the base is provided with an air exhaust channel; the suction cup is arranged on the base and communicated with the air exhaust channel, the suction cup is provided with a rigid adsorption surface, and the rigid adsorption surface is used for adsorbing a central flat area of a chip to be picked up; the suction nozzle is arranged on the base and communicated with the air exhaust channel, the suction nozzle is provided with a flexible adsorption surface capable of elastically deforming, and the flexible adsorption surface is used for adsorbing a peripheral warping area of the chip to be picked up. According to the device, the adsorption effect on the chip to be picked up can be ensured, the problem of abnormal adsorption caused by chip warping is avoided, meanwhile, uniform stress during chip pressing can be ensured, and the problem that the chip is damaged or is not firmly mounted due to uneven stress is avoided.

Description

Technical Field

[0001] This application relates to the field of chip packaging technology, and more specifically, to a chip pick-and-place device and a chip packaging system. Background Technology

[0002] In the semiconductor packaging field, chip pick-up and placement are crucial steps that directly impact the quality and performance of the final product. Traditionally, chip pick-up and placement fixtures are made of hard metal materials such as tungsten carbide and undergo electrostatic discharge (ESD) treatment to protect sensitive electronic components. However, with the increasing prevalence of large-size chips, these traditional materials and designs face new challenges.

[0003] For large-sized chips, their larger area makes them more prone to warping during manufacturing. Rigid adsorption surfaces cannot accommodate this warping, leading to adsorption problems during pick-up or placement, impacting production stability and efficiency. To address this issue, current technological trends favor using flexible rubber surfaces to adapt to chip shape variations, thereby improving pick-up success rates.

[0004] However, the application of rubber materials also brings new problems. First, during chip mounting, a certain amount of pressure needs to be applied to the chip to ensure good electrical connection and mechanical fixation. Due to its material properties, the rubber surface makes it difficult to guarantee uniform pressure distribution, which may lead to chip damage or poor mounting. Second, the rubber surface easily accumulates dust, particles, and other impurities, which not only affects the mounting quality but may also directly damage the chip, increasing the product defect rate. Utility Model Content

[0005] This application provides at least one chip pick-up and placement device and a chip packaging system. The device can ensure the adsorption effect of the chip to be picked up, avoid the problem of abnormal adsorption caused by chip warping, and at the same time ensure that the chip is subjected to uniform force during pressing, avoiding the problem of chip damage or poor placement due to uneven force.

[0006] In a first aspect, embodiments of this application provide a chip pickup and mounting apparatus, comprising:

[0007] The base is provided with an air extraction channel;

[0008] A suction cup is disposed on the base and connected to the air extraction channel. The suction cup has a rigid adsorption surface, which is used to adsorb the central flat area of ​​the chip to be picked up.

[0009] The suction nozzle is disposed on the base and connected to the air extraction channel. The suction nozzle has a flexible adsorption surface that can be elastically deformed. The flexible adsorption surface is used to adsorb the outer warped area of ​​the chip to be picked up.

[0010] In one alternative embodiment, there is a height difference between the flexible adsorption surface and the rigid adsorption surface along the adsorption direction.

[0011] In one alternative embodiment, the nozzle is made of one of the following materials: rubber, silicone, fluororubber, and polyurethane.

[0012] In one alternative embodiment, the suction nozzle is detachably connected to the base.

[0013] In one optional embodiment, a connecting pipe is provided between the suction nozzle and the air extraction channel, and the suction nozzle is connected to the air extraction channel through the connecting pipe.

[0014] In one alternative embodiment, the connecting pipe is a rigid pipe and is fixedly connected to the base.

[0015] In one alternative embodiment, the number of suction nozzles is multiple, and the multiple suction nozzles are symmetrically distributed relative to the axis of the suction cup.

[0016] In one optional embodiment, an electromagnetic valve is provided between the suction nozzle and the air extraction channel, the electromagnetic valve being used to control the suction nozzle to adsorb and release the chip to be picked up.

[0017] In one alternative embodiment, the air extraction channel is disposed in the base.

[0018] Secondly, embodiments of this application also provide a chip packaging system, including the chip pick-and-place apparatus described in any of the first aspects.

[0019] The above-mentioned technical solution of this application has the following beneficial technical effects:

[0020] The chip pick-and-place apparatus of this application utilizes a suction cup to adsorb the central flat area of ​​the chip to be picked up, and a suction nozzle to adsorb the peripheral warped area of ​​the chip to be picked up, thereby achieving chip pickup. Because the flexible adsorption surface of the suction nozzle can elastically deform, it can conform to the warped surface of the chip during chip pickup, ensuring effective chip pickup and avoiding abnormal pickup due to chip warping. Simultaneously, since the suction cup's adsorption surface is rigid and adsorbs onto the central flat area of ​​the chip, the rigid adsorption surface ensures uniform force during chip placement, preventing damage or poor mounting due to uneven force.

[0021] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. These drawings are incorporated in and constitute a part of this specification. They illustrate embodiments conforming to this application and, together with the specification, serve to explain the technical solutions of this application. It should be understood that the following drawings only show some embodiments of this application and should not be considered as limiting the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0023] Figure 1 This illustration shows a schematic diagram of a chip pickup and mounting device according to an embodiment of this application;

[0024] Figure 2 It shows Figure 1 A schematic diagram of the chip pickup and placement device provided.

[0025] In the diagram: 1. Base; 11. Air extraction channel; 12. Connecting pipe; 13. Solenoid valve; 2. Suction cup; 21. Rigid adsorption surface; 3. Suction nozzle; 31. Flexible adsorption surface; 4. Chip. Detailed Implementation

[0026] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0027] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0028] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0029] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0030] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0031] refer to Figure 1 and Figure 2 This application provides a chip 4 pick-up and placement device, including: a base 1, a suction cup 2, and a nozzle 3. The base 1 is provided with an air extraction channel 11. The suction cup 2 is disposed on the base 1 and communicates with the air extraction channel 11. The suction cup 2 has a rigid adsorption surface 21, which is used to adsorb the central flat area of ​​the chip 4 to be picked up. The nozzle 3 is disposed on the base 1 and communicates with the air extraction channel 11. The nozzle 3 has a flexible adsorption surface 31 that can elastically deform, which is used to adsorb the peripheral warped area of ​​the chip 4 to be picked up.

[0032] During use, the chip 4 pick-up and placement device uses the suction cup 2 to adsorb the flat central area of ​​the chip 4 to be picked up, and the suction nozzle 3 to adsorb the warped outer area of ​​the chip 4 to be picked up, thereby achieving the picking up of the chip 4. Because the flexible adsorption surface 31 of the suction nozzle 3 can elastically deform, when adsorbing the chip 4, the flexible adsorption surface 31 can deform to conform to the warped surface of the chip 4 to be picked up, thus ensuring the adsorption effect of the chip 4 to be picked up and avoiding abnormal adsorption problems caused by chip 4 warping. At the same time, because the adsorption surface of the suction cup 2 is a rigid surface and adsorbs onto the flat central area of ​​the chip 4 to be picked up, the rigid adsorption surface 21 can ensure that the chip 4 is subjected to uniform force during placement, avoiding damage or poor placement of the chip 4 due to uneven force.

[0033] In this embodiment, the suction cup 2 is a rigid structure, and its rigid adsorption surface 21 is provided with a first adsorption hole that communicates with the air extraction channel 11. The air extraction channel 11 is connected to an air extraction device. When the air extraction device performs air extraction, the first adsorption hole generates negative pressure so that the suction cup 2 adsorbs the central flat area of ​​the chip 4 to be picked up.

[0034] In this embodiment, the suction nozzle 3 is a flexible structure, and its flexible adsorption surface 31 is provided with a second adsorption hole that communicates with the air extraction channel 11. The air extraction channel 11 is connected to the air extraction device. When the air extraction device performs air extraction, the second adsorption hole generates negative pressure so that the suction nozzle 3 adsorbs the outer warped area of ​​the chip 4 to be picked up.

[0035] refer to Figure 1 In this embodiment, there is a height difference between the flexible adsorption surface 31 and the rigid adsorption surface 21 along the adsorption direction. For example, the height of the flexible adsorption surface 31 is lower than the height of the rigid adsorption surface 21, which facilitates the adsorption of the downwardly warped area of ​​the outer periphery of the chip 4 by the flexible adsorption surface 31. Of course, the flexible adsorption surface 31 can also adapt to the deformation of the chip 4 by extending and retracting vertically.

[0036] In this embodiment, the nozzle 3 is made of one of the following materials: rubber, silicone, fluororubber, and polyurethane. For example, the nozzle 3 is preferably made of rubber.

[0037] In this embodiment, the nozzle 3 is detachably connected to the base 1. This design facilitates cleaning or replacement of the nozzle 3, preventing an increase in product defect rates due to the accumulation of dust, particles, and other impurities on the surface of the nozzle 3.

[0038] In this embodiment, a connecting pipe 12 is provided between the suction nozzle 3 and the air extraction channel 11, and the suction nozzle 3 is connected to the air extraction channel 11 through the connecting pipe 12. For example, the connecting pipe 12 is provided on the outer surface of the base 1, one end of the connecting pipe 12 is connected to the air extraction channel 11, and the other end is connected to the suction nozzle 3.

[0039] In this embodiment, the connecting pipe 12 is a rigid pipe and is fixedly connected to the base 1. This configuration allows the suction nozzle 3 to be mounted on the base 1 via the connecting pipe 12 without the need for an additional mounting bracket, which helps to reduce the structural size and lower costs.

[0040] In this embodiment, there are multiple suction nozzles 3, which are symmetrically distributed relative to the axis of the suction cup 2. This arrangement ensures that the chip 4 is evenly stressed when it is attracted, preventing localized weak adhesion due to uneven stress.

[0041] In this embodiment, a solenoid valve 13 is provided between the suction nozzle 3 and the air extraction channel 11. The solenoid valve 13 is used to control the suction nozzle 3 to pick up and release the chip 4 to be picked up. In a specific setting, the solenoid valve 13 can be located between the air extraction channel 11 and the connecting pipe 12. During the bonding process, the solenoid valve 13 can control the flow of air in the connecting pipe 12, thereby causing the suction nozzle 3 to preferentially release the chip 4 to be picked up. This setting can prevent the suction nozzle 3 from deforming during the release process, causing the chip 4 to shift, thereby affecting the bonding accuracy of the chip 4 and reducing product quality. Of course, the solenoid valve 13 can also be used to adjust the suction force of the suction nozzle 3.

[0042] In this embodiment, the air extraction channel 11 is disposed within the base 1. This arrangement saves external space and makes the overall structure more compact. Moreover, the built-in design reduces the risk of physical damage to the air extraction channel 11, which is beneficial to improving the stability and reliability of the system.

[0043] This application embodiment also provides a chip 4 packaging system, which includes a chip 4 pick-up and placement device. This chip 4 pick-up and placement device utilizes a suction cup 2 to adsorb the central flat area of ​​the chip 4 to be picked up, and a suction nozzle 3 to adsorb the peripheral warped area of ​​the chip 4 to be picked up, thereby achieving the picking up of the chip 4. Since the flexible adsorption surface 31 of the suction nozzle 3 can elastically deform, when adsorbing the chip 4, the flexible adsorption surface 31 can deform to conform to the warped surface of the chip 4 to be picked up, thereby ensuring the adsorption effect of the chip 4 to be picked up and avoiding abnormal adsorption problems caused by chip 4 warping. Simultaneously, since the adsorption surface of the suction cup 2 is a rigid surface and adsorbs onto the central flat area of ​​the chip 4 to be picked up, the rigid adsorption surface 21 can ensure uniform force on the chip 4 during placement, avoiding damage or poor placement of the chip 4 due to uneven force.

[0044] One or more embodiments in this specification are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of one or more embodiments in this specification should be included within the protection scope of this application.

[0045] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A chip pickup and mounting device, characterized in that, include: The base is provided with an air extraction channel; A suction cup is disposed on the base and connected to the air extraction channel. The suction cup has a rigid adsorption surface, which is used to adsorb the central flat area of ​​the chip to be picked up. The suction nozzle is disposed on the base and connected to the air extraction channel. The suction nozzle has a flexible adsorption surface that can be elastically deformed. The flexible adsorption surface is used to adsorb the outer warped area of ​​the chip to be picked up.

2. The chip pick-and-place apparatus according to claim 1, characterized in that, Along the adsorption direction, there is a height difference between the flexible adsorption surface and the rigid adsorption surface.

3. The chip pick-and-place apparatus according to claim 1, characterized in that, The nozzle is made of one of the following materials: rubber, silicone, fluororubber, and polyurethane.

4. The chip pick-and-place apparatus according to claim 1, characterized in that, The suction nozzle is detachably connected to the base.

5. The chip pick-and-place apparatus according to claim 1, characterized in that, A connecting pipe is provided between the suction nozzle and the air extraction channel, and the suction nozzle is connected to the air extraction channel through the connecting pipe.

6. The chip pick-and-place apparatus according to claim 5, characterized in that, The connecting pipe is a rigid pipe and is fixedly connected to the base.

7. The chip pick-and-place apparatus according to claim 1, characterized in that, The number of suction nozzles is multiple, and the multiple suction nozzles are symmetrically distributed with respect to the axis of the suction cup.

8. The chip pick-and-place apparatus according to claim 1, characterized in that, An electromagnetic valve is provided between the suction nozzle and the air extraction channel. The electromagnetic valve is used to control the suction nozzle to pick up and release the chip to be picked up.

9. The chip pick-and-place apparatus according to claim 1, characterized in that, The air extraction channel is located in the base.

10. A chip packaging system, characterized in that, Includes the chip pick-and-place apparatus according to any one of claims 1-9.

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