Multi-stage buffering column nail roller structure

Abstract

The utility model discloses a multi-stage buffering column nail roller structure which is composed of a column nail piece, a buffering piece, nail holes and a roller sleeve structure. And the surface of the buffer piece is coated with fixing glue, and then the buffer piece is pressed into the bottom of the nail hole in a high-pressure press-fitting mode. The fixing glue can enable the buffering piece to be tightly combined with the bottom of the nail hole, and meanwhile the effect of buffering stress is achieved to a certain degree. High-pressure press fitting can ensure that the buffer piece is firmly mounted, and the buffer piece can better adapt to the shape and the size of a nail hole. And the surface of the column nail piece is coated with the fixing glue, and then the column nail piece is pressed into the nail hole in a high-pressure press-fitting mode. At the moment, the column nail piece is in close contact with the buffering piece, and the tiny gap between the column nail piece and the nail hole is filled with the fixing glue, so that the column nail piece, the buffering piece and the nail hole form a whole.

Description

Technical Field

[0001] This utility model belongs to the field of mining roller mill technology, specifically a multi-stage buffer pin roller structure. Background Technology

[0002] Roller mills are developed based on the "lamination crushing principle" and are widely used in crushing industries such as mining, cement, and metallurgy. In order to improve the operating cycle and service life of roller mills, most companies use pin roller sleeves, in which the pins are directly embedded in the pin holes of the roller sleeve. However, in actual operation, the roller surface of the pin roller is subjected to huge alternating loads and the stress situation is very complex. Pin roller failure phenomena such as pin falling off, roller surface peeling, and roller sleeve cracking often occur. Utility Model Content

[0003] The purpose of this invention is to reduce the impact stress at the bottom of the nail hole and delay the cycle of fatigue crack formation, thereby solving the problems of nail roller failure such as nail detachment, roller surface peeling, and roller sleeve cracking.

[0004] To solve the above-mentioned technical problems, the inventors, through practice and summarization, derived the technical solution of this utility model, which adopts the following technical solution:

[0005] A multi-stage buffer pin roller structure includes:

[0006] The roller sleeve structure has nail holes evenly distributed on its surface.

[0007] A buffer element is fitted at the root of the nail hole;

[0008] The stud fitting fits into the stud hole and its end is in close contact with the buffer;

[0009] The space between the buffer components, the stud components, and the stud holes is filled with retaining adhesive.

[0010] In a preferred embodiment, the thickness of the buffer element is 3-15mm, and the hardness is HB80-HB230, which is lower than the hardness of the roller sleeve structure.

[0011] In a preferred embodiment, the inner wall of the nail hole is provided with a ceramic coating, the thickness of which is controlled between 50-500 μm.

[0012] In a preferred embodiment, the bottom of the buffer component has a flat bottom, a conical angle, a spherical or hemispherical structure, and the bottom of the nail hole is adapted to the bottom structure of the buffer component;

[0013] The bottom of the stud component has a flat bottom, conical angle, spherical or hemispherical structure, and the head of the buffer component is adapted to the bottom structure of the stud component.

[0014] In a preferred embodiment, an annular groove is provided on the inner wall of the root of the nail hole, and the depth of the annular groove is 0.5-3mm.

[0015] In a preferred embodiment, a second annular groove is provided on the inner wall of the root of the ceramic coating, and the depth of the second annular groove is 25-250μm.

[0016] In a preferred embodiment, the bottom of the stud is provided with a connector, the bottom of the connector has an arc-shaped surface structure, the bottom dimension of the connector is larger than the head dimension of the connector, and the taper of the connector is 1:10-30.

[0017] The head of the buffer component is provided with a connecting groove corresponding to the position of the connector.

[0018] The manufacturing process of a multi-stage buffer column nail roller structure includes the following steps:

[0019] Step 1, Preparation

[0020] Inspect and clean the nail holes, studs, and buffer components to ensure the surfaces are clean and free of impurities;

[0021] Step 2, Install the buffer

[0022] Apply retaining adhesive to the surface of the buffer component, and then press the buffer component into the bottom of the nail hole using a high-pressure pressing method;

[0023] The retaining adhesive ensures a tight bond between the buffer and the bottom of the nail hole, while also acting as a buffer against stress to some extent.

[0024] Step 3, Install the post nails

[0025] Apply retaining adhesive to the surface of the stud component, and then press the stud component into the stud hole using a high-pressure pressing method;

[0026] At this point, the stud and the buffer are in close contact, and the retaining adhesive fills the tiny gap between the stud and the stud hole, making the three of them a whole.

[0027] The manufacturing process of a multi-stage buffer column nail roller structure includes the following steps:

[0028] Step 1, Preparation

[0029] Inspect and clean the nail holes, studs, and buffer components to ensure the surfaces are clean and free of impurities.

[0030] Step 2, apply ceramic coating

[0031] High-hardness, wear-resistant coating alloy powder with strong adhesion to the metal substrate is selected and uniformly sprayed onto the inner wall of the nail hole using plasma spraying or supersonic flame spraying processes.

[0032] The coating thickness is controlled between 50-500μm to ensure that the coating is dense and non-porous, and has both high strength and impact resistance.

[0033] Through natural curing, the coating forms a strong bond with the pore walls;

[0034] After spraying, grinding is performed to adjust the hole diameter to the design tolerance;

[0035] Step 3, polish the ceramic coating

[0036] Grind at a uniform speed along the axial direction of the nail hole to reduce the surface roughness of the coating to Ra0.8~1.6μm, remove local protrusions or nodular defects, ensure that the inner wall is smooth and the dimensional accuracy meets the installation requirements of the buffer, and avoid excessive grinding that leads to insufficient coating thickness.

[0037] Confirm that there are no residual grinding debris, blow away the dust in the hole with compressed air, and finally wipe it clean with a cleaning agent;

[0038] Step 4, Install the buffer.

[0039] Apply retaining adhesive to the surface of the buffer component, and then press the buffer component into the bottom of the nail hole using a high-pressure pressing method;

[0040] The retaining adhesive ensures a tight bond between the buffer and the bottom of the nail hole, while also acting as a buffer against stress to some extent.

[0041] Step 5, Install the post nails

[0042] Apply retaining adhesive to the surface of the stud component, and then press the stud component into the stud hole using a high-pressure pressing method;

[0043] The stud and the buffer are in close contact, and the retaining adhesive fills the tiny gap between the stud and the stud hole, making the three parts a whole.

[0044] Compared with the prior art, the present invention has the following beneficial effects:

[0045] In one embodiment, the structure of this utility model comprises a stud component, a buffer component, a stud hole, and a roller sleeve structure. A retaining adhesive is applied to the surface of the buffer component, and then the buffer component is pressed into the bottom of the stud hole using a high-pressure pressing method. The retaining adhesive ensures a tight bond between the buffer component and the bottom of the stud hole, while also providing stress buffering to a certain extent. High-pressure pressing ensures the buffer component is securely installed and can better adapt to the shape and size of the stud hole. Similarly, a retaining adhesive is applied to the surface of the stud component, and then the stud component is pressed into the stud hole using a high-pressure pressing method. At this point, the stud component and the buffer component are in close contact, and the retaining adhesive fills the tiny gaps between the stud component and the stud hole, making the three components form a unified whole.

[0046] In another approach, this invention first applies a ceramic coating to the inner wall of the nail hole, enhancing the strength of the inner wall while maintaining the toughness of the roller sleeve structure. Based on this, a buffer is added between the nail and the nail hole. When the nail is subjected to compressive force and alternating loads, the buffer absorbs the impact kinetic energy through plastic deformation, converting the concentrated stress field into distributed energy dissipated to the bottom of the nail hole. The alternating stress amplitude at the bottom of the nail hole is reduced below the fatigue limit of the roller sleeve material, significantly delaying the cycle of fatigue crack formation. This effectively prevents roller surface peeling and roller sleeve cracking during the service life of the nail roller, greatly improving the service life of the roller sleeve. Attached Figure Description

[0047] Figure 1 This is a schematic diagram of the structure of Scheme 1 of this utility model;

[0048] Figure 2 This is a schematic diagram of the nail hole structure of Scheme 1 of this utility model;

[0049] Figure 3 This is a schematic diagram of the structure of Scheme 2 of this utility model;

[0050] Figure 4 This is a schematic diagram of the nail hole structure of Scheme 2 of this utility model;

[0051] Figure 5 This is a schematic diagram of the structure of Scheme 3 of this utility model;

[0052] Figure 6 This is a schematic diagram of the nail hole structure of Scheme 3 of this utility model;

[0053] Figure 7 This is a schematic diagram of the structure of Scheme 4 of this utility model;

[0054] Figure 8 This is a schematic diagram of the nail hole structure of Scheme 4 of this utility model;

[0055] Figure 9 The diagram shows the structure of the buffer component in Scheme 2 and Scheme 4 of this utility model.

[0056] Figure 10 The diagram shows the structure of the column nail in Scheme 2 and Scheme 4 of this utility model;

[0057] Figure 11 The image shows the bottom view of the column nail component in Scheme 2 and Scheme 4 of this utility model.

[0058] Figure 12 This is a schematic diagram of the structure of Scheme 5 of this utility model;

[0059] Figure 13 This is a schematic diagram of the nail hole structure of Scheme 5 of this utility model;

[0060] Figure 14 This is a schematic diagram of the column nail structure of Scheme 5 of this utility model;

[0061] Figure 15 This is a cross-sectional view of the post nail component according to Scheme 5 of this utility model;

[0062] Figure 16 This is a cross-sectional view of the buffer component in Scheme 5 of this utility model;

[0063] Figure 17 This is a schematic diagram of the structure of the assembly of Scheme 5 of this utility model. Detailed Implementation

[0064] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0065] Roller mills are developed based on the "laminated crushing principle" and are widely used in crushing industries such as mining, cement, and metallurgy. To improve the operating cycle and roller surface lifespan of roller mills, most companies use pinned roller sleeves, with pins directly embedded in the pin holes of the sleeve. However, in actual operation, the roller surface of the pinned roller is subjected to enormous alternating loads, resulting in very complex stress conditions. Pin detachment, roller surface peeling, and sleeve cracking are common failure phenomena of pinned rollers. Among these:

[0066] Stub detachment: When the stub hole and stub are fitted with a clearance fit, the stub's hardness is much higher than the stub hole's hardness. When the stub is subjected to non-axial cyclic alternating loads, and when the material contains large pieces of hard material or metal foreign objects, the compressive stress far exceeds the strength that the retaining adhesive can withstand. The retaining adhesive will gradually lose its bonding function. When the retaining adhesive no longer functions, the cyclic alternating stress generated by the material extrusion will directly act on the stub hole, continuously impacting the lower-hardness stub hole. Under the continuous action of alternating stress, the stub hole deforms, and the hole diameter gradually increases. When the gap between the stub and the stub hole reaches a certain level, the stub will detach from the stub hole.

[0067] Fatigue cracks: Since the strength of the pins is much higher than that of the roller sleeve matrix, when the pins are subjected to alternating loads, and when the material contains large pieces of hard material or metal foreign objects, when the pins transmit the force to the bottom of the pin holes on the roller surface, they squeeze and rub the sleeve at the bottom of the holes. After repeated cycles, fatigue cracks will occur in the area at the bottom of the pin holes due to the large stress concentration.

[0068] Roll surface spalling: When cracks extend in a direction parallel to the roller surface, large areas of cracks and hollowing are formed in the bottom area of ​​the pin hole. The cracks extend further into the roller surface, causing the roller surface to spall.

[0069] Roll surface cracking: When the crack extends into the roll surface at a certain angle, as the fatigue crack continues to extend, the bearing area of ​​the roll sleeve decreases. When the crack extends to a certain extent, it will crack instantaneously under the action of external load and residual stress.

[0070] Therefore, the inventor proposes the following technical solution to address the above problems.

[0071] Option 1: As Figure 1 and Figure 2 As shown, a three-stage buffer pin roller structure is composed of a pin 20, a buffer 30, pin holes 11, and a roller sleeve structure 10. By adding a buffer 30 between the pin 20 and the pin holes 11, the pin 20 is subjected to compressive force and alternating load. The buffer 30 absorbs the impact kinetic energy through plastic deformation, and the concentrated stress field is converted into distributed energy dissipated to the bottom of the pin holes 11. The amplitude of the alternating stress at the bottom of the pin holes 11 is reduced to below the fatigue limit of the roller sleeve structure 10 material, which greatly delays the cycle of fatigue crack formation. At the same time, due to the absorption of alternating load capacity by the buffer 30, the failure time of the retaining adhesive is also delayed.

[0072] By adding a buffer component 30 between the pin component 20 and the pin hole 11, a three-stage buffer pin roller structure of "pin-buffer component-roller sleeve structure" is constructed. The stress at the root of the pin is reduced by 30%-50%, and the fatigue life of the base body is extended by more than 1.5-3 times. This effectively avoids the peeling of the roller surface and cracking of the roller sleeve during the service life of the pin roller. The service life of the roller sleeve is increased by 2-3 times compared with the traditional structure, and the pin detachment cycle is extended to 1.5-3 times compared with the traditional structure.

[0073] A buffer element 30 is added between the pin 20 and the pin hole 11. It can be made of metal or multi-layer composite material with a hardness between HB80 and HB230, which is lower than the hardness of the roller sleeve matrix.

[0074] The nail hole 11 and the buffer 30, and the nail hole 11 and the stud 20 can be fitted with an interference fit, a clearance fit, or a transition fit.

[0075] Both the buffer component 30 and the stud component 20 are pressed into the stud hole using a high-pressure pressing method;

[0076] The outer diameter of the buffer 30 is adapted to the outer diameter of the stud 20 and the inner diameter of the stud hole 11. The height of the buffer 30 is 3mm-15mm.

[0077] The bottom shape of the buffer 30 can be flat, conical, spherical, or hemispherical, and the bottom of the nail hole 11 is adapted to the bottom structure of the buffer 30.

[0078] Preparation process:

[0079] Preparation: Inspect and clean the nail hole 11, the post nail 20 and the buffer 30 to ensure that the surface is clean and free of impurities.

[0080] Installing the buffer 30: Apply retaining adhesive to the surface of the buffer 30, and then press the buffer 30 into the bottom of the nail hole 11 using a high-pressure pressing method. The retaining adhesive ensures a tight bond between the buffer 30 and the bottom of the nail hole 11, and also serves to buffer stress to a certain extent. High-pressure pressing ensures that the buffer 30 is securely installed and can better adapt to the shape and size of the nail hole 11.

[0081] Install the stud pin 20: Apply retaining adhesive to the surface of the stud pin 20, and then press the stud pin 20 into the nail hole 11 using a high-pressure pressing method. At this time, the stud pin 20 and the buffer 30 are in close contact, and the retaining adhesive fills the tiny gap between the stud pin 20 and the nail hole 11, making the three of them form a whole.

[0082] Option 2: Figure 5 and Figure 6 As shown, the structure consists of a column nail 20, a buffer 30, a ceramic coating 12, nail holes 11, and a roller sleeve structure 10. First, a ceramic coating 12 is sprayed onto the inner wall of the nail hole 11 to enhance its strength while maintaining the toughness of the roller sleeve structure 10. Then, a buffer 30 is added between the column nail 20 and the nail hole 11. When the column nail 30 is subjected to compressive force and alternating loads, the buffer 30 absorbs the impact kinetic energy through plastic deformation, converting the concentrated stress field into distributed energy dissipated to the bottom of the nail hole 11. By spraying a ceramic coating 12 onto the inner wall of the nail hole 11, a four-stage buffer column nail roller structure of "column nail - buffer - ceramic coating - roller sleeve structure" is constructed. Compared to Scheme 1, this extends the substrate fatigue life by 1.5-2 times, and the roller sleeve's service life is increased by 3-4 times compared to the traditional structure.

[0083] A ceramic coating can be sprayed onto the inner wall of the nail hole 11, such as tungsten carbide, alumina, or chromium carbide.

[0084] A buffer element 30 is added between the pin 20 and the pin hole 11. It can be made of metal or multi-layer composite material with a hardness between HB80 and HB230, which is lower than the hardness of the roller sleeve matrix.

[0085] The coating thickness is controlled between 50-500μm, and grinding is performed after spraying to adjust the pore diameter to the design tolerance;

[0086] The pin hole 11 and the buffer 30, and the pin hole 11 and the pin 20 can be fitted with an interference fit, a clearance fit, or a transition fit.

[0087] Both the buffer component 30 and the stud component 20 are pressed into the stud hole using a high-pressure pressing method;

[0088] The outer diameter of the buffer 30 is adapted to the outer diameter of the stud 20, and the outer diameter is adapted to the inner diameter of the stud hole 11. The height of the buffer 30 is 3mm-15mm.

[0089] The bottom shape of the buffer 30 can be flat, conical, spherical, or hemispherical, and the bottom of the nail hole 11 is adapted to the bottom structure of the buffer 30.

[0090] The bottom shape of the stud component 20 can be flat, conical, spherical, or hemispherical, and the head of the buffer component 30 is adapted to the bottom structure of the stud component 20.

[0091] Preparation process:

[0092] Preparation: Inspect and clean the nail hole 11, the post nail 20 and the buffer 30 to ensure that the surface is clean and free of impurities.

[0093] Ceramic Coating Application 12: A high-hardness, wear-resistant coating with strong adhesion to the metal substrate (such as tungsten carbide, alumina, chromium carbide, etc.) is selected and uniformly sprayed onto the inner wall of the stud hole using plasma spraying or supersonic flame spraying processes. The coating thickness is controlled between 50-500 μm mm to ensure a dense, non-porous coating with both high strength and impact resistance. Natural curing allows the coating to form a strong bond with the hole wall. Grinding is performed after spraying to adjust the hole diameter to the design tolerance.

[0094] Polishing the ceramic coating 12: Polish along the axial direction of the nail hole 11 at a uniform speed to reduce the surface roughness of the coating to Ra0.8~1.6μm, remove local protrusions or nodular defects, ensure that the inner wall is smooth and the dimensional accuracy meets the installation requirements of the buffer 30, and avoid excessive polishing that would result in insufficient coating thickness. Confirm that there are no residual grinding debris, blow away the dust in the hole with compressed air, and finally wipe clean with a cleaning agent.

[0095] Installing the buffer 30: Apply retaining adhesive to the surface of the buffer 30, and then press the buffer 30 into the bottom of the pin hole using a high-pressure pressing method. The retaining adhesive ensures a tight bond between the buffer 30 and the bottom of the pin hole 11, and also serves to buffer stress to a certain extent. High-pressure pressing ensures that the buffer 30 is securely installed and can better adapt to the shape and size of the pin hole 11.

[0096] Install the stud pin 20: Apply retaining adhesive to the surface of the stud pin 20, and then press the stud pin 20 into the nail hole 11 using a high-pressure pressing method. At this time, the stud pin 20 and the buffer 30 are in close contact, and the retaining adhesive fills the tiny gap between the stud pin 20 and the nail hole 11, making the three of them form a whole.

[0097] Option 3: As Figure 5 and Figure 6 , Figures 9 to 11 As shown, in Scheme 1, an annular groove 111 is provided on the inner wall of the root of the nail hole 11, and the depth of the annular groove 111 is 0.5-3mm.

[0098] The bottom of the stud member 20 is provided with a connector 21. The bottom of the connector 21 has an arc-shaped surface structure. The bottom dimension of the connector 21 is larger than the head dimension of the connector 21. The taper of the connector 21 is 1:10-30.

[0099] The head of the buffer 30 is provided with a connecting groove 31 corresponding to the position of the connector 21, and a wrapping part is provided at the opening of the connecting groove 31.

[0100] Preparation process:

[0101] Preparation: Machine an annular groove 111 at the root of the nail hole 11. The depth of the annular groove 111 is 0.5-3mm. Inspect and clean the nail hole 11, the post nail 20 and the buffer 30 to ensure that the surface is clean and free of impurities.

[0102] Installing the buffer 30: Apply retaining adhesive to the surface of the buffer 30, and then press the buffer 30 into the bottom of the nail hole 11 using a high-pressure pressing method. The retaining adhesive ensures a tight bond between the buffer 30 and the bottom of the nail hole 11, and also serves to buffer stress to a certain extent. High-pressure pressing ensures that the buffer 30 is securely installed and can better adapt to the shape and size of the nail hole 11.

[0103] Installing the stud 20: Apply retaining adhesive to the surface of the stud 20 as well. Axially align the connector 21 and the connecting groove 31, then press the stud 20 into the nail hole 11 using a high-pressure pressing method. The connector 21 enters the connecting groove 31, forcing the buffer pad 30 to embed into the annular groove 111. Subsequently, the end face of the stud 20 squeezes and wraps around the outside of the connector 21, constraining it. The bottom view projection of the connector 21 can be square or circular to prevent the stud 20 from falling off after the retaining adhesive fails. Greater plastic deformation of the buffer 30 results in better resistance to falling off, while also increasing the stud 20's resistance to rotation under alternating stress. Even when the retaining adhesive ages, it is less likely to fall off. At this point, the stud 20 and the buffer 30 are axially connected, and the retaining adhesive fills the tiny gap between the stud 20 and the nail hole 11, making the three a unified whole.

[0104] Option 4: Figure 7 and Figures 8 to 11 As shown, in Scheme 2, an annular groove 121 is provided on the inner wall of the root of the ceramic coating 12, and the depth of the annular groove 121 is 25-250μm.

[0105] The bottom of the stud member 20 is provided with a connector 21. The bottom of the connector 21 has an arc-shaped surface structure. The bottom dimension of the connector 21 is larger than the head dimension of the connector 21. The taper of the connector 21 is 1:10-30.

[0106] The head of the buffer 30 is provided with a connecting groove 31 corresponding to the position of the connector 21, and a wrapping part is provided at the opening of the connecting groove 31.

[0107] Preparation process:

[0108] Preparation: Inspect and clean the nail hole 11, the post nail 20 and the buffer 30 to ensure that the surface is clean and free of impurities.

[0109] Ceramic Coating 12: A high-hardness, wear-resistant coating with strong adhesion to the metal substrate (such as tungsten carbide, alumina, chromium carbide, etc.) is selected and uniformly sprayed onto the inner wall of the stud hole using plasma spraying or supersonic flame spraying processes. The coating thickness is controlled between 50-500 μm mm to ensure a dense, non-porous coating with both high strength and impact resistance. Natural curing allows the coating to form a strong bond with the hole wall. After spraying, grinding is performed to adjust the hole diameter to the design tolerance.

[0110] Processing the second annular groove 121: The second annular groove 121 is obtained by processing the ceramic coating 12 at the root of the nail hole 11. The depth of the second annular groove 121 is 25-250μm.

[0111] Polishing the ceramic coating 12: Polish along the axial direction of the nail hole 11 at a uniform speed to reduce the surface roughness of the coating to Ra0.8~1.6μm, remove local protrusions or nodular defects, ensure that the inner wall is smooth and the dimensional accuracy meets the installation requirements of the buffer 30, and avoid excessive polishing that would result in insufficient coating thickness. Confirm that there are no residual grinding debris, blow away the dust in the hole with compressed air, and finally wipe clean with a cleaning agent.

[0112] Installing the buffer 30: Apply retaining adhesive to the surface of the buffer 30, and then press the buffer 30 into the bottom of the pin hole using a high-pressure pressing method. The retaining adhesive ensures a tight bond between the buffer 30 and the bottom of the pin hole 11, and also serves to buffer stress to a certain extent. High-pressure pressing ensures that the buffer 30 is securely installed and can better adapt to the shape and size of the pin hole 11.

[0113] Installing the stud 20: Apply retaining adhesive to the surface of the stud 20 as well. Axially align the connector 21 and the connecting groove 31, then press the stud 20 into the nail hole 11 using a high-pressure pressing method. The connector 21 enters the connecting groove 31, forcing the buffer pad 30 to embed into the annular groove 111. Subsequently, the end face of the stud 20 squeezes and wraps around the outside of the connector 21, constraining it. The bottom view projection of the connector 21 can be square or circular to prevent the stud 20 from falling off after the retaining adhesive fails. Greater plastic deformation of the buffer 30 results in better resistance to falling off, while also increasing the stud 20's resistance to rotation under alternating stress. Even when the retaining adhesive ages, it is less likely to fall off. At this point, the stud 20 and the buffer 30 are axially connected, and the retaining adhesive fills the tiny gap between the stud 20 and the nail hole 11, making the three a unified whole.

[0114] Option 5: As Figures 12 to 17 As shown, a multi-stage buffer pin roller structure includes:

[0115] Roller sleeve structure 10, with nail holes 11 evenly distributed on the surface of roller sleeve structure 10;

[0116] The buffer 30 is fitted at the root of the nail hole 11;

[0117] The stud member 20 fits into the stud hole 11 and its end is in close contact with the buffer member 12.

[0118] The space between the buffer component 30, the stud component 20 and the stud hole 11 is filled with retaining adhesive.

[0119] like Figure 12 , Figure 16 , Figure 17As shown, the buffer 30 includes an outward expansion portion 301, a deformable portion 302, and a compression portion 303 sequentially from the bottom to the head. The cross-section of the deformable portion 302 is a wave-shaped structure. The inner diameter of the inner wave peak of the deformable portion 302 before deformation is equal to and slightly larger than the outer wall of the stud member 20. The outer diameter of the outer wave peak is equal to or slightly smaller than the inner diameter of the nail hole 11. The positions where the outward expansion portion 301, the compression portion 303, and the deformable portion 302 are connected are all connected by a gradual transition section. The thickness of the outward expansion portion 301 and the compression portion 303 is greater than the thickness of the deformable portion 302, which is about 1.5-3 times the thickness of the deformable portion 302. The outer wall of the stud member 20 and the inner wall of the nail hole 11 are provided with an inwardly recessed annular groove 202 corresponding to the deformable portion 302. The bottom of the stud component 20 is provided with an outer extrusion head 201, which is used to extrude the outward expansion portion 301 to make it expand outward within the annular groove 13 of the roller sleeve structure 10. At the same time, the top surface of the outer extrusion head 201 adopts a downward slope of 1-3°, which can wrap around the top surface of the outer extrusion head 201 after the deformation portion 302 is deformed, and the two adjacent peaks form a teardrop-shaped sandwich-type (filled with retaining rubber) buffer structure. The number of troughs in the annular groove 202 is at least equal to the number of corresponding peaks in the deformation portion 302. Compared with Scheme 1, the fatigue life of the substrate is extended by 3.5-4 times, the service life of the roller sleeve is increased by 5-6 times compared with the traditional structure, and the stud is not easy to fall off. During alternating stress, the plastic deformation of the buffer 30 can, firstly, make the pin 20 more tightly wrapped (especially the outer extrusion head 201), improving its anti-detachment performance; secondly, it can further release the buffering performance of the side of the buffer 30, especially the deformed part 302 area. While bearing alternating stress, the stress will be dispersed from the bearing point to the surrounding area of ​​the buffer 30, avoiding the problem of cracking caused by local stress concentration. The better the wrapping performance while releasing the buffering performance, the better the anti-detachment performance.

[0120] like Figure 13 As shown, an annular groove 3 13 is provided at the root of the nail hole 11, and the depth of the annular groove 3 13 is 0.5-3mm.

[0121] Preparation process:

[0122] Preparation: Inspect and clean the nail hole 11, the post nail 20 and the buffer 30 to ensure that the surface is clean and free of impurities.

[0123] like Figure 17 As shown, assemble the buffer 30 and the stud 20, and fit the stud 20 into the inside of the buffer 30 to obtain the assembly. Of course, before fitting the stud 20 into the buffer 20, you can also apply a retaining adhesive to the surface.

[0124] Assembly Installation: Apply retaining adhesive to the surface of the buffer 30, and then press the assembly into the bottom of the nail hole 11 using a high-pressure pressing method along the axial direction of the nail hole 11. The end of the stud 20 first acts on the outward expansion 301, causing the outward expansion 301 to enter the annular groove 13, maintaining the holding force of the stud 20, and applying pressure to the compression part 303. The deformable part 302 deforms under force, causing the crests of the inner wall of the deformable part to shift inward and the troughs to shift outward, and the crests of the outer wall to shift outward and the troughs to shift inward. At the same time, adjacent inner and outer wall crests move closer to each other, and the deformable part 302 fills the corresponding annular grooves 202 on the inner walls of the stud 20 and the nail hole 11. The retaining adhesive enables the buffer 30 to be tightly bonded to the bottom of the nail hole 11, and also plays a role in buffering stress to a certain extent. High-pressure fitting ensures that the buffer 30 is securely installed and can better adapt to the shape and size of the nail hole 11, using retaining adhesive and deformable part 302 to form a whole.

[0125] The above description is merely a preferred embodiment of this utility model, but the protection scope of this utility model is not limited thereto. The substitutions may be replacements of some structures, devices, or method steps, or they may be complete technical solutions. Equivalent substitutions or modifications made based on the technical solution and inventive concept of this utility model should all be covered within the protection scope of this utility model.

Claims

1. A multi-stage buffer pin roller structure, characterized in that, include: The roller sleeve structure has nail holes evenly distributed on its surface. A buffer element is fitted at the root of the nail hole; The stud fitting fits into the stud hole and its end is in close contact with the buffer; The space between the buffer components, the stud components, and the stud holes is filled with retaining adhesive.

2. A multi-stage cushioning stud roller structure according to claim 1, wherein, The thickness of the buffer is 3-15mm, and the hardness is HB80-HB230, which is lower than the hardness of the roller sleeve structure.

3. The multi-stage buffer column nail roller structure according to claim 1, characterized in that, The inner wall of the nail hole is provided with a ceramic coating, the thickness of which is controlled between 50-500μm.

4. The multi-stage cushioning stud roller structure of claim 1, wherein, The bottom of the buffer component has a flat bottom, a conical angle, a spherical or hemispherical structure, and the bottom of the nail hole is adapted to the bottom structure of the buffer component; The bottom of the stud component has a flat bottom, conical angle, spherical or hemispherical structure, and the head of the buffer component is adapted to the bottom structure of the stud component.

5. The multi-stage cushioning stud roller structure of claim 2, wherein, A ring groove is provided on the inner wall of the root of the nail hole, and the depth of the ring groove is 0.5-3mm.

6. A multi-stage cushioning stud roller structure according to claim 3, wherein, The inner wall of the root of the ceramic coating is provided with a second annular groove, the depth of which is 25-250μm.

7. A multi-stage cushioning stud roller structure according to claim 5 or 6, wherein The bottom of the stud is provided with a connector, the bottom of the connector has an arc-shaped surface structure, the bottom dimension of the connector is larger than the head dimension of the connector, and the taper of the connector is 1:10-30. The head of the buffer component is provided with a connecting groove corresponding to the position of the connector.

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