PCB for LED display screen module

Abstract

The utility model relates to the technical field of LED (light-emitting diode) display, in particular to a PCB (printed circuit board) for an LED display screen module, which comprises a substrate, the substrate is of a four-layer structure and sequentially comprises a first signal layer, a main power supply layer, a ground wire layer and a second signal layer from top to bottom, a plurality of LED lamp bead mounting positions are arranged on the upper surface of the first signal layer and used for mounting LED lamp beads, and the second signal layer is arranged on the lower surface of the main power supply layer. A high-speed signal line and a driving chip are further arranged on one side of the LED lamp bead mounting positions and located on the upper surface of the first signal layer, the main power supply layer is used for providing main power supply voltage, the ground wire layer is used for providing ground wires, a low-speed signal line is arranged on the surface of the second signal layer, and a heat dissipation structure is arranged at the bottom of the second signal layer. And a plurality of through holes are formed among the first signal layer, the main power supply layer, the ground wire layer and the second signal layer in a penetrating manner.

Description

Technical Field

[0001] This utility model relates to the field of LED displays, and in particular to a PCB board for LED display module. Background Technology

[0002] Existing LED display module PCBs typically employ a single-layer or double-layer structure, resulting in low wiring density and slow signal transmission speeds, making it difficult to meet the demands of high-resolution, high-refresh-rate LED displays. Furthermore, existing LED display module PCBs suffer from poor heat dissipation, easily leading to overheating of LED chips and impacting the lifespan of the LED display. Utility Model Content

[0003] In view of the above situation and to overcome the defects of the prior art, the purpose of this utility model is to provide a PCB board for LED display module, which has the advantages of solving the problems mentioned in the background art.

[0004] The above-mentioned technical objective of this utility model is achieved through the following technical solution:

[0005] A PCB board for an LED display module includes a substrate with a four-layer structure, consisting of a first signal layer, a main power layer, a ground layer, and a second signal layer from top to bottom. The upper surface of the first signal layer has multiple LED mounting positions for mounting LEDs. High-speed signal lines and a driver chip are also arranged on one side of the multiple LED mounting positions on the upper surface of the first signal layer. The main power layer provides the main power voltage, and the ground layer provides the ground. Low-speed signal lines are arranged on the surface of the second signal layer, and a heat dissipation structure is provided at the bottom of the second signal layer. Multiple vias are formed between the first signal layer, the main power layer, the ground layer, and the second signal layer.

[0006] By adopting the above technical solution and designing the substrate as a four-layer structure (first signal layer, main power layer, ground layer, and second signal layer), the wiring density and signal transmission speed are significantly improved. The first signal layer is equipped with high-speed signal lines to ensure the signal transmission requirements of high-resolution, high-refresh-rate LED displays, while the second signal layer is equipped with low-speed signal lines to ensure the stable transmission of control and configuration signals, thus meeting the needs of high-resolution, high-refresh-rate LED displays and improving display effects and user experience.

[0007] Further configuration: The main power layer and ground layer both adopt a large-area copper-clad structure to reduce power impedance and improve power integrity, and are connected to the power pins of LED beads and driver chips through vias.

[0008] By adopting the above technical solution, the main power layer and ground layer use a large-area copper-clad structure, which reduces power impedance and improves power integrity. Through vias, the power pins of the LED chips and driver chips are connected, ensuring power supply stability, reducing power noise and voltage fluctuations, and guaranteeing the stable operation of the LED display screen.

[0009] Further configuration: The heat dissipation structure includes heat dissipation fins disposed at the bottom of the second signal layer. Thermally conductive adhesive is connected between the heat dissipation fins and the bottom of the second signal layer. The heat dissipation fins have a wavy design, a height of 10 mm, a thickness of 0.8 mm, a spacing of 2 mm, and are arranged in an alternating pattern. A heat pipe with a diameter of 3 mm is embedded at the bottom of the heat dissipation fins. A phase change material with a melting point of 50℃-60℃ is filled between the heat dissipation fins.

[0010] By adopting the above technical solution, the wave-shaped design of the heat dissipation fins can increase the heat dissipation surface area. The heat pipes embedded at the bottom of the heat dissipation fins can quickly conduct heat. The phase change material filled between the heat dissipation fins can absorb and store heat, delay the temperature rise, effectively reduce the temperature of the LED beads, extend the service life of the LED display, and prevent performance degradation caused by overheating.

[0011] Further details: The substrate is made of aluminum and has a metal core board (MCPCB) with a thermal conductivity of 8 W / (m·K), a mechanical strength of 200MPa, and a high temperature resistance of 150℃.

[0012] By adopting the above technical solutions, the mechanical strength and high temperature resistance of the PCB board are improved, ensuring stable operation under high power density and high temperature environments.

[0013] Further features: positioning holes are provided around all four sides of the substrate, the inner walls of the positioning holes are provided with anti-slip textures, and reinforcing ribs are provided around the positioning holes.

[0014] By adopting the above technical solutions, and through the combination of positioning, anti-slip texture, and reinforcing ribs, the installation accuracy and stability can be improved, ensuring reliable installation of the PCB board and reducing errors during the installation process.

[0015] Furthermore, the substrate surface is coated with an antistatic coating, which is a conductive polymer. A protective layer is coated on the surface of the antistatic coating, and the thickness of the protective layer is designed to be 5μm-10μm. The protective layer is made of polyurethane material.

[0016] By adopting the above technical solutions and designing antistatic coatings and protective layers, electrostatic damage can be effectively prevented, the reliability of the PCB board can be improved, and the service life of the LED display screen can be extended.

[0017] In summary, this utility model has the following beneficial effects:

[0018] The technical solution of this utility model significantly improves the wiring density, signal transmission speed, heat dissipation performance, mechanical strength, installation accuracy, and anti-static performance of LED display module PCB boards through a four-layer structure design, a large-area copper-clad structure, heat dissipation fins, heat pipes, phase change materials, high thermal conductivity materials, positioning hole design, and anti-static coating. These designs effectively solve the problems of low wiring density, slow signal transmission speed, and poor heat dissipation performance in existing technologies. Attached Figure Description

[0019] The accompanying drawings, which are provided to further illustrate the present invention and form part of this application, do not constitute an undue limitation of the present invention. In the drawings:

[0020] Figure 1 This is the front view of this utility model;

[0021] Figure 2 This is a schematic diagram of the main structure of this utility model.

[0022] In the diagram, 1. Substrate; 2. First signal layer; 3. Main power layer; 4. Ground layer; 5. Second signal layer; 6. LED chip mounting position; 7. High-speed signal line; 8. Driver chip; 9. Low-speed signal line; 10. Heat dissipation structure; 11. Via; 12. Copper-clad structure; 13. Heat dissipation fins; 14. Thermal adhesive; 15. Heat pipe; 16. Phase change material; 17. Positioning hole; 18. Anti-slip texture; 19. Reinforcing rib; 20. Antistatic coating; 21. Protective layer. Detailed Implementation

[0023] The foregoing and other technical contents, features and effects of this utility model are described in conjunction with the appendix below. Figure 1 To be continued Figure 2 The detailed description of the embodiments will make this clear. All structural details mentioned in the following embodiments are based on the accompanying drawings.

[0024] Exemplary embodiments of the present invention will now be described with reference to the accompanying drawings.

[0025] Example 1: A PCB board for an LED display module, such as Figure 1 , 2As shown, the system includes a substrate 1, which has a four-layer structure. From top to bottom, the layers are a first signal layer 2, a main power layer 3, a ground layer 4, and a second signal layer 5. The upper surface of the first signal layer 2 has multiple LED mounting positions 6 for mounting LEDs. High-speed signal lines 7 and a driver chip 8 are also arranged on one side of the LED mounting positions 6 on the upper surface of the first signal layer 2. The main power layer 3 provides the main power voltage, and the ground layer 4 provides the ground. Low-speed signal lines 9 are arranged on the surface of the second signal layer 5. A heat dissipation structure 10 is provided at the bottom of the second signal layer 5. The heat dissipation structure 10 includes heat dissipation fins 13 disposed at the bottom of the second signal layer 5. Thermally conductive adhesive 14 is connected between them. The heat dissipation fins 13 have a wave-shaped design, with a height of 10mm, a thickness of 0.8mm, a spacing of 2mm, and are arranged in an alternating pattern. A heat pipe 15 with a diameter of 3mm is embedded at the bottom of the heat dissipation fins 13. A phase change material 16 is filled between the heat dissipation fins 13. The melting point of the phase change material 16 is 50℃-60℃. Multiple vias 11 are opened through the first signal layer 2, the main power layer 3, the ground layer 4, and the second signal layer 5. The main power layer 3 and the ground layer 4 both adopt a large-area copper-clad structure 12 to reduce power impedance and improve power integrity. They are connected to the power pins of the LED beads and the driver chip 8 through the vias 11.

[0026] The substrate 1 uses a metal core board (MCPCB) with a thermal conductivity of 8 W / (m·K), a mechanical strength of 200MPa, and a high temperature resistance of 150℃.

[0027] The substrate 1 has positioning holes 17 through all four sides. The inner wall of the positioning holes 17 is provided with anti-slip texture 18, and the positioning holes 17 are also provided with reinforcing ribs 19 around the positioning holes 17.

[0028] The substrate 1 is also coated with an antistatic coating 20, which is a conductive polymer. The surface of the antistatic coating 20 is coated with a protective layer 21, which is designed to be 5μm-10μm thick and is made of polyurethane material.

[0029] In this embodiment of the invention, the LED display module PCB board solves the problems of low wiring density, slow signal transmission speed, and poor heat dissipation performance in the prior art through a four-layer structure design, optimized power layer and ground layer 4 layout, efficient heat dissipation structure 10, and selection of high thermal conductivity materials. Specifically, the design of the heat sink fins 13, heat pipes 15, fan, and phase change material 16 significantly enhances the heat dissipation effect; the design of the anti-static coating 20 and protective layer 21 effectively prevents electrostatic damage; the design of the positioning holes 17 and reinforcing ribs 19 improves installation accuracy and stability; and the intelligent heat dissipation control system and modular design further enhance the reliability and practicality of the PCB board. This LED display module PCB board can meet the needs of high-resolution, high-refresh-rate LED displays and has broad application prospects.

[0030] The above description is a further detailed explanation of the present utility model in conjunction with specific embodiments, and it should not be considered that the specific implementation of the present utility model is limited to this. For those skilled in the art to which the present utility model pertains and related fields, any extensions, operation methods, and data substitutions made based on the technical solution concept of the present utility model should fall within the protection scope of the present utility model.

Claims

1. A PCB board for an LED display module, comprising a substrate (1), characterized in that: The substrate (1) has a four-layer structure, consisting of a first signal layer (2), a main power layer (3), a ground layer (4), and a second signal layer (5) from top to bottom. The upper surface of the first signal layer (2) is provided with multiple LED lamp bead mounting positions (6) for mounting LED lamp beads. On one side of the multiple LED lamp bead mounting positions (6), high-speed signal lines (7) and driver chips (8) are also arranged on the upper surface of the first signal layer (2). The main power layer (3) is used to provide the main power supply voltage, and the ground layer (4) is used to provide the ground. The surface of the second signal layer (5) is provided with low-speed signal lines (9). The bottom of the second signal layer (5) is provided with a heat dissipation structure (10). Multiple vias (11) are opened through the first signal layer (2), the main power layer (3), the ground layer (4), and the second signal layer (5).

2. The PCB board for an LED display module according to claim 1, characterized in that: The main power layer (3) and ground layer (4) both adopt a large-area copper-clad structure (12) to reduce power impedance and improve power integrity, and are connected to the power pins of LED beads and driver chip (8) through vias (11).

3. The PCB board for an LED display module according to claim 1, characterized in that: The heat dissipation structure (10) includes heat dissipation fins (13) disposed at the bottom of the second signal layer (5). Thermal conductive adhesive (14) is connected between the heat dissipation fins (13) and the bottom of the second signal layer (5). The heat dissipation fins (13) are wavy in design. The heat dissipation fins (13) are 10 mm high, 0.8 mm thick, and 2 mm apart, and are arranged in an alternating pattern. A heat pipe (15) is embedded at the bottom of the heat dissipation fins (13). The heat pipe (15) has a diameter of 3 mm. A phase change material (16) is filled between the heat dissipation fins (13). The melting point of the phase change material (16) is 50℃-60℃.

4. The PCB board for an LED display module according to claim 1, characterized in that: The substrate (1) adopts a metal core board (MCPCB) with a thermal conductivity of 8 W / (m·K), a mechanical strength of 200MPa, and a high temperature resistance of 150℃.

5. The PCB board for an LED display module according to claim 1, characterized in that: The substrate (1) has positioning holes (17) through all four sides. The inner wall of the positioning holes (17) is provided with anti-slip texture (18), and the positioning holes (17) are also provided with reinforcing ribs (19).

6. The PCB board for an LED display module according to claim 1, characterized in that: The substrate (1) is also coated with an antistatic coating (20), which is a conductive polymer. The antistatic coating (20) is coated with a protective layer (21), which is designed to be 5μm-10μm thick and is made of polyurethane material.

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