Warm die forming die for ceramic feeding

Abstract

The utility model relates to a warm die forming die for ceramic feeding, which comprises a fixed die and a movable die, the fixed die is provided with a guide sleeve and a first heating temperature control module, the movable die is provided with a guide pillar and a second heating temperature control module, and the fixed die and the movable die are positioned through the matching of the guide pillar and the guide sleeve; the movable mold comprises an upper mold bottom plate, a movable upper mold, an upper mold insert and an elastic buffer mechanism, the elastic buffer mechanism is connected with the upper mold bottom plate, the movable upper mold is connected with the elastic buffer mechanism, and the upper mold insert penetrates through the movable upper mold and is embedded in the elastic buffer mechanism; the second heating temperature control module is arranged on the movable upper die, and the guide column penetrates through the movable upper die to be connected with the elastic buffering mechanism. According to the warm mold forming mold, through the synergistic effect of the elastic buffering mechanism and the temperature control structure, the compact density and the forming quality are remarkably improved, and the service life of the mold is remarkably prolonged.

Description

Technical Field

[0001] This utility model relates to the field of ceramic mold technology, specifically to a ceramic feeding temperature forming mold. Background Technology

[0002] Ceramic compression molding is one of the commonly used ceramic green body forming processes in current production. It involves loading granulated ceramic powder into a mold and applying external force to extrude it, followed by sintering to obtain a ceramic block. This process offers advantages such as precise and controllable green body dimensions, simple processing, and low cost, making it suitable for mass production of ceramic products with simple geometric shapes. However, traditional compression molding processes suffer from poor flowability due to low or no binder content in the powder, resulting in uneven density distribution in the compressed green body. This leads to defects such as inconsistent dimensional shrinkage and cracks after sintering, resulting in a low yield. These problems limit the application of compression molding technology in high-end fields such as home furnishings and communication equipment, and make it difficult to meet the high-precision requirements of complex parts.

[0003] To address the shortcomings of compression molding, existing technologies primarily employ injection molding for ceramic feedstocks with high binder content. This process involves heating powder containing a high proportion of binder, injecting it into a mold, and then debinding and sintering to obtain the finished product. However, injection molding relies on specialized injection molding machines and matching molds, resulting in high equipment costs, low production efficiency, and poor mold replaceability, significantly limiting its application. Furthermore, the complex process of injection molding places stringent operational requirements, further hindering its widespread adoption in large-scale industrial production.

[0004] Existing technologies have shown that compression molding is difficult to use for producing complex parts due to insufficient fluidity, while injection molding faces bottlenecks in efficiency and cost. Therefore, there is an urgent need to develop a mold suitable for the warm molding process of ceramic powder with high binder content. Utility Model Content

[0005] To address the technical problems existing in the prior art, the purpose of this utility model is to provide a ceramic feeding temperature forming mold that significantly improves the compact density, forming quality and mold service life through the synergistic effect of the elastic buffer mechanism and the temperature control structure.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A ceramic feeding temperature forming mold includes a fixed mold and a moving mold. The fixed mold is provided with a guide sleeve and a first heating and temperature control module, and the moving mold is provided with a guide post and a second heating and temperature control module. The fixed mold and the moving mold are positioned by the cooperation of the guide post and the guide sleeve.

[0008] As a preferred embodiment, the fixed mold includes a lower mold base plate, a lower mold, and a movable lower mold insert. The lower mold is fixed on the lower mold base plate and has a slot. The movable lower mold insert is inserted into the slot. The side wall of the movable lower mold insert has a movable groove, and the side wall of the slot has a limiting member. The limiting member cooperates with the movable groove to restrict the movable lower mold insert. A first heating and temperature control module is installed in the lower mold. A guide sleeve is embedded in the lower mold.

[0009] As a preferred embodiment, the lower mold is provided with a lower mold through hole and a first blind hole, and the first heating and temperature control module includes a fixed mold heating tube and a first thermocouple, which are respectively installed in the lower mold through hole and the first blind hole.

[0010] As a preferred embodiment, the moving mold includes an upper mold base plate, a movable upper mold, an upper mold insert, and an elastic buffer mechanism. The elastic buffer mechanism is connected to the upper mold base plate, the movable upper mold is connected to the elastic buffer mechanism, and the upper mold insert passes through the movable upper mold and is embedded in the elastic buffer mechanism. A second heating and temperature control module is installed in the movable upper mold, and a guide post passes through the movable upper mold and is connected to the elastic buffer mechanism.

[0011] As a preferred embodiment, the elastic buffer mechanism includes a spring, a first upper mold pad, and a second upper mold pad. The first upper mold pad is connected to the upper mold base plate, and the second upper mold pad is connected to the first upper mold pad. Both ends of the spring are connected to the second upper mold pad and the movable upper mold, respectively. The first upper mold pad and the second upper mold pad are fitted together by a fixing groove to fix the upper mold insert. The second upper mold pad and the movable upper mold are connected by a shoulder screw. One end of the guide post is fixed to the first upper mold pad, and the other end of the guide post passes through the second upper mold pad and the movable upper mold in sequence, and protrudes from the movable upper mold.

[0012] As a preferred embodiment, there are multiple springs, and all of the multiple springs are connected to the second upper mold plate.

[0013] As a preferred option, the top surface of the movable lower mold insert is lower than the lower mold reference surface, forming a feeding and filling chamber.

[0014] As a preferred embodiment, the movable upper mold is provided with a moving mold through hole and a second blind hole, and the second heating and temperature control module includes a moving mold heating tube and a second thermocouple, which are respectively installed in the moving mold through hole and the second blind hole.

[0015] As a preferred option, a first heat insulation plate is provided between the lower mold base plate and the lower mold.

[0016] As a preferred embodiment, a second heat insulation plate is provided between the upper mold base plate and the first upper mold pad.

[0017] In summary, this utility model has the following advantages:

[0018] This utility model's temperature mold forming die is suitable for forming complex thin-walled parts. An elastic buffer mechanism significantly reduces the impact load on the moving die, preventing breakage of the pressed blank and significantly improving the density, forming quality, and die lifespan of the pressed blank. Independent temperature control modules for the fixed and moving dies, combined with a heat insulation design, ensure uniform and stable forming temperature. Precision guiding with guide pillars and guide sleeves, along with the coordinated movement of movable inserts, improves die centering accuracy and demolding efficiency. This die is particularly suitable for temperature mold forming of complex thin-walled parts from ceramic powders with high binder content, and can stably produce ceramic parts with complex structures. Attached Figure Description

[0019] Figure 1 A three-dimensional view of a ceramic feeding temperature forming mold.

[0020] Figure 2 An exploded view of a ceramic-feed temperature forming mold.

[0021] Among them, 1 is the upper mold base plate, 2 is the second heat insulation plate, 3 is the first upper mold pad plate, 4 is the second upper mold pad plate, 5 is the movable upper mold, 6 is the lower mold, 7 is the first heat insulation plate, 8 is the lower mold base plate, 9 is the shoulder screw, 10 is the spring, 11 is the guide sleeve, 12 is the guide post, 13 is the pin, 14 is the movable groove, 15 is the movable lower mold insert, 16 is the upper mold insert, 17 is the upper mold through hole, 18 is the second blind hole, 19 is the lower mold through hole, and 20 is the first blind hole. Detailed Implementation

[0022] The present invention will be further described in detail below with reference to specific embodiments.

[0023] like Figure 1-2 As shown, this embodiment provides a ceramic feeding temperature forming mold, including a fixed mold and a moving mold. The fixed mold is provided with a guide sleeve 11 and a first heating and temperature control module, and the moving mold is provided with a guide post 12 and a second heating and temperature control module. The fixed mold and the moving mold are positioned by the cooperation of the guide post 12 and the guide sleeve 11. The fixed mold and the moving mold are installed on a press.

[0024] The fixed mold includes a lower mold base plate 8, a lower mold 6, and a movable lower mold insert 15. The lower mold 6 is fixed on the lower mold base plate 8. The lower mold 6 has a slot into which the movable lower mold insert 15 is inserted. The side wall of the movable lower mold insert 15 has a movable groove 14. The side wall of the slot has a limiting member that cooperates with the movable groove 14 to restrict the movable lower mold insert 15. A first heating and temperature control module is installed in the lower mold 6. A guide sleeve 11 is embedded in the lower mold 6. The limiting member is a pin 13, which can move with the movable lower mold insert 15. The movable groove 14 restricts the vertical movement of the pin 13 through its two side walls. Specifically, the movable lower mold insert 15 can slide relative to the slot. The lower mold base plate is provided with a through groove for the ejector mechanism of the press to move. The ejector mechanism of the press passes through the through groove and cooperates with the movable lower mold insert 15 to move the movable lower mold insert 15 to the top plane of the lower mold. The range of motion of the movable lower mold insert 15 is consistent with the width range of the movable groove.

[0025] The lower mold 6 is provided with a lower mold through hole 19 and a first blind hole 20. The first heating and temperature control module includes a fixed mold heating tube and a first thermocouple, which are respectively installed in the lower mold through hole 19 and the first blind hole 20. The fixed mold heating tube and the first thermocouple achieve closed-loop control of the mold temperature through a temperature control box, ensuring that the temperature is stable within ±2℃ error range during the molding process, and keeping the mold temperature stable within the preset process window.

[0026] The moving mold includes an upper mold base plate 1, a movable upper mold 5, an upper mold insert 16, and an elastic buffer mechanism. The elastic buffer mechanism is connected to the upper mold base plate 1, the movable upper mold 5 is connected to the elastic buffer mechanism, and the upper mold insert 16 passes through the movable upper mold 5 and is embedded in the elastic buffer mechanism. The second heating and temperature control module is set in the movable upper mold 5, and the guide post 12 passes through the movable upper mold 5 and is connected to the elastic buffer mechanism.

[0027] The elastic buffer mechanism includes a spring 10, a first upper mold pad 3, and a second upper mold pad 4. The first upper mold pad 3 is connected to the upper mold base plate 1, and the second upper mold pad 4 is connected to the first upper mold pad 3. The two ends of the spring 10 are respectively connected to the second upper mold pad 4 and the movable upper mold 5. The first upper mold pad 3 and the second upper mold pad 4 are fixed to the upper mold insert 16 through a fixing groove. The second upper mold pad 4 and the movable upper mold 5 are connected by a shoulder screw 9. One end of the guide post 12 is fixed to the first upper mold pad 3, and the other end of the guide post 12 passes through the second upper mold pad 4 and the movable upper mold 5 in sequence, and protrudes from the movable upper mold 5. The elastic buffer mechanism of the moving mold uses a spring 10 and a shoulder screw 9 to alleviate impact. The shoulder screw 9 is fixed to the second upper mold pad 4 by a threaded connection. The movable upper mold 5 is slidably connected to the shoulder screw 9. When the moving mold and the fixed mold are in the initial pressing stage, the spring 10 is in an extended state, and the upper mold insert 16 is flush with the movable upper mold 5. When the main cylinder presses down, the spring 10 is compressed, and the movable upper mold 5 moves along the shoulder screw 9 to the second upper mold pad 4. The upper mold insert 16 extends from the surface of the moving mold, evenly transmitting pressure to the feed. After the pressure holding period, the spring 10 recovers its elasticity, driving the movable upper mold 5 to slide back to its original position along the shoulder screw 9, keeping the upper mold insert 16 flush with the movable upper mold 5 and avoiding secondary damage to the pressed blank during demolding. The shoulder screw 9 guides and limits the movement of the spring 10 during compression. The extended and compressed states of the spring 10 correspond to the demolding reset and pressurization stages, respectively.

[0028] There are multiple springs 10, and all of the multiple springs 10 are connected to the second upper mold plate 4. For example, there are six springs 10, which are divided into two groups, with three springs 10 in each group, and the two groups of springs 10 are symmetrically distributed.

[0029] The top surface of the movable lower mold insert 15 is lower than the reference surface of the lower mold 6, forming a feeding and filling chamber. When the moving mold and the fixed mold are in the pressing stage, the movable lower mold insert 15 is driven to rise by the ejection mechanism of the press, and its top surface is flush with the reference surface of the lower mold 6, forming the pressing and forming working surface. After pressing, the movable lower mold insert 15 returns to its initial position for easy demolding. The press is a device for assembling temperature mold forming dies, used for temperature mold forming of complex thin-walled parts from ceramic powder. The movement of the movable lower mold insert 15 is controlled by the ejection mechanism of the press. After pressing, the pressing is demolded by ejection, providing conditions for continuous production.

[0030] The movable upper mold 5 is provided with an upper mold through hole 17 and a second blind hole 18. The second heating and temperature control module includes a moving mold heating tube and a second thermocouple, which are respectively installed in the upper mold through hole 17 and the second blind hole 18. The moving mold heating tube and the second thermocouple achieve closed-loop control of the mold temperature through a temperature control box, ensuring that the temperature is stable within ±2℃ error range during the molding process, and keeping the mold temperature stable within the preset process window.

[0031] A first heat insulation plate 7 is provided between the lower mold base plate 8 and the lower mold 6. By providing the first heat insulation plate 7, the heat conduction loss between the lower mold base plate 8 and the lower mold 6 is reduced. The first heat insulation plate 7 is also provided with a through groove for the ejection mechanism of the press to move, so as to facilitate the ejection mechanism of the press to drive the movable lower mold insert 15.

[0032] A second heat insulation plate 2 is provided between the upper mold base plate 1 and the first upper mold pad. By providing the second heat insulation plate 2, the heat conduction loss between the upper mold base plate 1 and the first upper mold pad is reduced.

[0033] The above embodiments are preferred embodiments of the present utility model, but the embodiments of the present utility model are not limited to the above embodiments. Any changes, modifications, substitutions, combinations, or simplifications made without departing from the spirit and principle of the present utility model shall be considered equivalent substitutions and shall be included within the protection scope of the present utility model.

Claims

1. A ceramic feeding temperature forming mold, characterized in that: It includes a fixed mold and a moving mold. The fixed mold is equipped with a guide sleeve and a first heating and temperature control module, while the moving mold is equipped with a guide post and a second heating and temperature control module. The fixed mold and the moving mold are positioned by the cooperation of the guide post and the guide sleeve. The moving mold includes an upper mold base plate, a movable upper mold, an upper mold insert, and an elastic buffer mechanism. The elastic buffer mechanism is connected to the upper mold base plate, and the movable upper mold is connected to the elastic buffer mechanism. The upper mold insert passes through the movable upper mold and is embedded in the elastic buffer mechanism. The second heating and temperature control module is located in the movable upper mold, and the guide post passes through the movable upper mold and is connected to the elastic buffer mechanism.

2. A ceramic feeding temperature forming mold according to claim 1, characterized in that: The fixed mold includes a lower mold base plate, a lower mold, and a movable lower mold insert. The lower mold is fixed on the lower mold base plate and has a slot. The movable lower mold insert is inserted into the slot. The side wall of the movable lower mold insert has a movable groove, and the side wall of the slot has a limiting member. The limiting member cooperates with the movable groove to limit the movable lower mold insert. The first heating and temperature control module is set in the lower mold. The guide sleeve is embedded in the lower mold.

3. A ceramic feeding temperature forming mold according to claim 1, characterized in that: The lower mold is provided with a lower mold through hole and a first blind hole. The first heating and temperature control module includes a fixed mold heating tube and a first thermocouple, which are respectively installed in the lower mold through hole and the first blind hole.

4. A ceramic feeding temperature forming mold according to claim 1, characterized in that: The elastic buffer mechanism includes a spring, a first upper mold pad, and a second upper mold pad. The first upper mold pad is connected to the upper mold base plate, and the second upper mold pad is connected to the first upper mold pad. The two ends of the spring are respectively connected to the second upper mold pad and the movable upper mold. The first upper mold pad and the second upper mold pad are fitted together by a fixing groove to fix the upper mold insert. The second upper mold pad and the movable upper mold are connected by a shoulder screw. One end of the guide post is fixed to the first upper mold pad, and the other end of the guide post passes through the second upper mold pad and the movable upper mold in sequence, and protrudes from the movable upper mold.

5. A ceramic feeding temperature forming mold according to claim 4, characterized in that: There are multiple springs, and all of them are connected to the second upper mold plate.

6. A ceramic feeding temperature forming mold according to claim 2, characterized in that: The top surface of the movable lower mold insert is lower than the lower mold reference surface, forming a feeding and filling chamber.

7. A ceramic feeding temperature forming mold according to claim 1, characterized in that: The movable upper mold is provided with a moving mold through hole and a second blind hole. The second heating and temperature control module includes a moving mold heating tube and a second thermocouple, which are respectively installed in the moving mold through hole and the second blind hole.

8. A ceramic feeding temperature forming mold according to claim 2, characterized in that: A first heat insulation plate is provided between the lower mold base plate and the lower mold.

9. A ceramic feeding temperature forming mold according to claim 4, characterized in that: A second heat insulation plate is provided between the upper mold base plate and the first upper mold pad.

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