Silicon wafer feeding and conveying device

Abstract

The utility model relates to the technical field of solar cell manufacturing, in particular to a silicon wafer feeding and conveying device which comprises a fixing frame. The conveying assembly is in sliding connection with the fixing frame; a flower basket; by means of the mode, the driving connecting part slides along the first sliding part in the first direction, the driven connecting part is driven to slide along the second sliding part in the first direction, then reciprocating motion of the flower basket in the first direction is achieved, and the flower basket can adapt to different transportation runways; the basket can move to the operation runway of the carrier plate structure which is not fully loaded along the first direction, so that the silicon wafer feeding efficiency is improved, and empty silicon wafer placement positions on the carrier plate structure are avoided, thereby avoiding pollution caused by empty suction of a suction cup, and being beneficial to reducing equipment pollution; and the flower basket slides along the third sliding part in the second direction, so that the flower basket reciprocates in the second direction, the flower basket can be aligned with the transportation runway, the wafer drawing mechanism can draw wafers and feed the wafers conveniently, and the silicon wafer feeding efficiency can be improved.

Description

Technical Field

[0001] This application relates to the field of solar cell manufacturing technology, and in particular to a silicon wafer feeding and conveying device. Background Technology

[0002] In the fabrication of solar cells, at least one functional layer needs to be deposited on the surface of a silicon wafer using CVD (Chemical Vapor Deposition). When using a plate-type CVD equipment for functional layer deposition, the silicon wafer must first be placed on the carrier structure of the plate-type CVD equipment, and then the carrier structure enters the sputtering chamber for film deposition.

[0003] Currently, during silicon wafer loading, baskets loaded with silicon wafers are moved to corresponding transport tracks. A wafer extraction mechanism extracts the wafers from the baskets and places them onto the transport tracks, which then transport the wafers to the carrier structure. In the final stage of silicon wafer loading, some carrier structures may be fully loaded and unable to continue loading wafers; others may not be fully loaded, but the baskets on their corresponding transport tracks may be empty, preventing further loading. This method is not conducive to improving the efficiency of silicon wafer loading.

[0004] Furthermore, after the coating is completed, the unloading mechanism uses vacuum chucks to pick up multiple silicon wafers one by one from the carrier structure. The vacuum chucks correspond one-to-one with the silicon wafer placement positions on the carrier structure. During unloading, the vacuum chucks corresponding to the empty silicon wafer placement positions on the carrier structure that are not fully loaded will experience empty suction, which will lead to chuck contamination. Utility Model Content

[0005] Based on this, this application provides a silicon wafer feeding and conveying device to solve the technical problems in the prior art that are not conducive to improving silicon wafer feeding efficiency and reducing equipment pollution.

[0006] This application provides a silicon wafer feeding and conveying device, including:

[0007] The fixing frame includes a first sliding portion and a second sliding portion extending along a first direction, respectively;

[0008] At least one conveying assembly slidably connected to the fixed frame, the conveying assembly including a driving connection portion slidably connected to the first sliding portion and a driven connection portion connected to the driving connection portion, the driven connection portion being slidably connected to the second sliding portion, the driven connection portion including a third sliding portion extending along a second direction, the second direction being perpendicular to the first direction;

[0009] And a flower basket slidably connected to the third sliding part, the flower basket being used to carry a silicon wafer, the driving connection part sliding along the first direction to drive the driven connection part connected to the flower basket to move along the first direction.

[0010] Optionally, multiple conveying components are provided, and the multiple conveying components are arranged sequentially at intervals along the first direction.

[0011] Optionally, the fixing frame includes two side plates arranged opposite to each other in the first direction, a first fixing part connected to the two side plates respectively, and a second fixing part connected to the two side plates respectively, wherein the first sliding part is located on the first fixing part and the second sliding part is located on the second fixing part.

[0012] Optionally, the first fixing part includes a first fixing member and a second fixing member that are arranged at a relative interval, and the first sliding part includes a first slide rail disposed on the first fixing member and a second slide rail disposed on the second fixing member;

[0013] The drive connection includes a sliding connector spanning the first fixing member and the second fixing member, and a connecting protrusion provided on the sliding connector. The connecting protrusion is connected to the driven connection through the gap between the first fixing member and the second fixing member.

[0014] Optionally, the drive connection part further includes a drive gear component, which is rotatably connected to the side of the sliding connector facing away from the connection protrusion;

[0015] The first fixing part further includes a linear guide member, which is disposed opposite to the first fixing member in the second direction; the linear guide member includes a plurality of first guide teeth arranged along the first direction, and the first guide teeth mesh with the drive gear member.

[0016] Optionally, the drive gear component includes a rotating shaft connected to the sliding connector via a first bearing, a drive gear body sleeved on the rotating shaft, and a plurality of second guide teeth arranged circumferentially along the drive gear body, wherein the second guide teeth mesh with the first guide teeth.

[0017] Optionally, the drive connection portion further includes a first drive motor connected to the rotating shaft.

[0018] Optionally, the first fixing part further includes:

[0019] A fourth sliding portion is provided on the side of the first fixing member facing away from the linear guide member, and the driven connecting portion is slidably connected to the fourth sliding portion;

[0020] A fifth sliding portion is provided on the side of the second fixing member facing away from the second slide rail, and the driven connecting portion is slidably connected to the fifth sliding portion.

[0021] Optionally, the second sliding part includes a third slide rail, and the third sliding part includes a plurality of fourth slide grooves arranged in parallel.

[0022] Optionally, a placement space is formed between the side plate and the adjacent conveying assembly.

[0023] The silicon wafer feeding and conveying device of this application includes a fixed frame, the fixed frame including a first sliding portion and a second sliding portion extending along a first direction; at least one conveying assembly slidably connected to the fixed frame, the conveying assembly including a driving connection portion slidably connected to the first sliding portion and a driven connection portion connected to the driving connection portion, the driven connection portion being slidably connected to the second sliding portion, the driven connection portion including at least one third sliding portion extending along a second direction, the second direction being perpendicular to the first direction; and a basket slidably connected to the third sliding portion, the basket being used to carry silicon wafers, the driving connection portion sliding along the first direction to drive the driven connection portion connected to the basket along the first direction. Directional movement: Through the above method, the drive connecting part slides along the first sliding part in the first direction, causing the driven connecting part to slide along the second sliding part in the first direction, thereby realizing the reciprocating motion of the basket in the first direction. It can adapt to different transport tracks. When the carrier plate structure on the current transport track is fully loaded, the basket can move along the first direction to the computing track of the carrier plate structure that is not fully loaded, improving the efficiency of silicon wafer loading and avoiding empty silicon wafer placement positions on the carrier plate structure, thereby avoiding the suction cup from being empty and contaminated, which helps to reduce equipment contamination. The basket slides along the third sliding part in the second direction, realizing the reciprocating motion of the basket in the second direction, which can align the basket with the transport track, making it easier for the wafer extraction mechanism to extract and load wafers, which helps to improve the efficiency of silicon wafer loading. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the silicon wafer feeding and conveying device of this application.

[0025] Figure 2 for Figure 1 The diagram shows the coordination between the fixed frame and the conveying components in the silicon wafer feeding and conveying device.

[0026] Figure 3 for Figure 1 The diagram shows a rear view of the silicon wafer feeding and conveying device.

[0027] Figure 4 for Figure 1 A top view of the silicon wafer feeding and conveying device shown.

[0028] Figure 5 for Figure 4 The silicon wafer feeding and conveying device shown is a cross-sectional view along the AA direction.

[0029] Figure 6 for Figure 4 Another embodiment of the silicon wafer feeding and conveying device shown is a cross-sectional view along the AA direction.

[0030] The meanings of the labels in the attached diagram are as follows:

[0031] 100-Silicon wafer feeding and conveying device; 11-Fixed frame; 111-First sliding part; 1111-First slide rail; 1112-Second slide rail; 112-Second sliding part; 113-Side plate; 114-First fixed part; 1141-First fixing member; 1142-Second fixing member; 1143-Linear guide member; 11431-First guide tooth; 1144-Fourth sliding part; 1145-Fifth sliding part; 115-Second fixed part; 116-Placement space; 12-Conveying assembly; 121-Drive connection Part; 1211-Sliding connector; 1211a-End; 1212-Connecting protrusion; 1213-First slider; 1214-Drive gear; 12141-Rotating shaft; 12142-First bearing; 12143-Drive gear body; 12144-Second guide tooth; 1215-First drive motor; 122-Driven connection; 1221-Third sliding part; 12211-Fourth slide groove; 1222-Second slider; 1223-Third slider; 13-Basket; 14-Second drive motor. Detailed Implementation

[0032] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0033] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0035] like Figures 1 to 6The figure shows a silicon wafer feeding and conveying device according to an embodiment of this application. In each figure, arrows indicate the directions of up / down, front / back, left / right. Unless otherwise specified, the directions of up / down, front / back, and left / right are described according to the directions indicated by these arrows. Furthermore, in each figure, the left / right direction is the first direction, the up / down direction is the second direction, and the front / back direction is the third direction; the first, second, and third directions are perpendicular to each other. The first direction corresponds to the length direction of the fixing frame in the silicon wafer feeding and conveying device.

[0036] like Figures 1 to 6 As shown, the silicon wafer feeding and conveying device 100 includes a fixed frame 11, at least one conveying component 12, and a basket 13.

[0037] The fixing frame 11 includes a first sliding part 111 and a second sliding part 112 that extend along a first direction, the first direction being the length direction of the fixing frame 11.

[0038] One or more conveying assemblies 12 may be provided, and the conveying assembly 12 is slidably connected to the fixed frame 11. The conveying assembly 12 includes a drive connection part 121 and a driven connection part 122, which are connected to each other. The drive connection part 121 is slidably connected to the first sliding part 111, and the driven connection part 122 is slidably connected to the second sliding part 112.

[0039] The driven connection portion 122 includes a third sliding portion 1221, which extends along a second direction, the height direction of the fixing frame 11. The basket 13 is used to carry the silicon wafer, and the basket 13 is slidably connected to the third sliding portion 1221.

[0040] The drive connection 121 slides along the first direction on the first sliding part 111, driving the driven connection 122 to slide along the first direction on the second sliding part 112, thus enabling the conveying assembly 12 to slide along the first direction on the fixed frame 11, thereby enabling the flower basket 13 to move along the first direction. Furthermore, the flower basket 13 can slide along the second direction on the third sliding part 1221.

[0041] In this embodiment, the driving connection part slides along the first sliding part in the first direction, driving the driven connection part to slide along the second sliding part in the first direction, thereby realizing the reciprocating motion of the basket in the first direction. It can adapt to different transport tracks. When the carrier structure on the current transport track is fully loaded, the basket can move along the first direction to the computing track of the carrier structure that is not fully loaded, improving the efficiency of silicon wafer loading and avoiding empty silicon wafer placement positions on the carrier structure, thereby avoiding the suction cup from being contaminated due to empty suction, which helps to reduce equipment contamination. The basket slides along the third sliding part in the second direction, realizing the reciprocating motion of the basket in the second direction, which can align the basket with the transport track, making it easier for the wafer extraction mechanism to extract and load wafers, which helps to improve the efficiency of silicon wafer loading.

[0042] In one implementation, multiple conveying components 12 are provided, and the multiple conveying components 12 are arranged sequentially at intervals along a first direction. In this embodiment, the conveying components 12 can be arranged one-to-one with the transport tracks, and all transport tracks can perform silicon wafer loading operations simultaneously, thereby accelerating the loading speed. In the final stage of silicon wafer loading, assuming... Figure 1 The basket 13 on the leftmost conveying assembly 12 still has unloaded silicon wafers and the corresponding carrier structure is fully loaded. The baskets 13 on the middle conveying assembly 12 and the rightmost conveying assembly 12 are empty and the corresponding carrier structures are not fully loaded. At this time, the middle conveying assembly 12 and the rightmost conveying assembly 12 can be slid away along the first direction, and the leftmost conveying assembly 12 can be moved along the first direction to the transport track corresponding to the unloaded carrier structure to continue loading silicon wafers.

[0043] As one implementation method, please refer to Figures 1 to 4 As shown, the fixing frame 11 includes two side plates 113 arranged opposite to each other in a first direction, a first fixing part 114 and a second fixing part 115. The first fixing part 114 is connected to the two side plates 113 respectively, and the second fixing part 115 is connected to the two side plates 113 respectively. The first sliding part 111 is located on the first fixing part 114, and the second sliding part 112 is located on the second fixing part 115.

[0044] In some implementations, please refer to Figure 1 As shown, the first fixing part 114 includes a first fixing member 1141 and a second fixing member 1142 arranged at a distance from each other, and the first fixing member 1141 and the second fixing member 1142 can extend along a first direction respectively. The first sliding part 111 includes a first slide rail 1111 provided on the first fixing member 1141 and a second slide rail 1112 provided on the second fixing member 1142.

[0045] The drive connection part 121 includes a sliding connector 1211 and a connecting protrusion 1212 provided on the sliding connector 1211. The sliding connector 1211 is disposed across the first fixing member 1141 and the second fixing member 1142. The connecting protrusion 1212 is fixedly connected to the driven connection part 122. The connecting protrusion 1212 is connected to the driven connection part 122 through the gap between the first fixing member 1141 and the second fixing member 1142.

[0046] In some embodiments, the first slide rail 1111 is disposed on the upper surface of the first fixing member 1141, and the second slide rail 1112 is disposed on the upper surface of the second fixing member 1142, with the first slide rail 1111 and the second slide rail 1112 located at the same height in the second direction.

[0047] In some implementations, please refer to Figure 5 As shown, the two ends 1211a of the sliding connector 1211 are respectively formed with first sliders 1213, one of the first sliders 1213 is slidably connected to the first slide rail 1111, and the other first slider 1213 is slidably connected to the second slide rail 1112.

[0048] In some implementations, please refer to Figures 1 to 4 As shown, the drive connection part 121 also includes a drive gear 1214, which is rotatably connected to the side of the sliding connection part 1211 facing away from the connection protrusion 1212.

[0049] The first fixing part also includes a linear guide 1143, which is disposed opposite to the first fixing part 1141 in the second direction; the linear guide 1143 includes a plurality of first guide teeth 11431 arranged along the first direction, and the first guide teeth 11431 mesh with the drive gear 1214.

[0050] In this embodiment, during the rotation of the drive gear 1214, by meshing with the first guide tooth 11431, the drive gear 1214 moves along the side of the linear guide 1143 where the first guide tooth 11431 is meshed, thereby driving the sliding connector 1211 and the driven connector 122 to slide along the first direction.

[0051] In some implementations, please refer to Figure 5 and Figure 6 As shown, the drive gear component 1214 includes a rotating shaft 12141, a first bearing 12142, and a drive gear body 12143. The rotating shaft 12141 is connected to the sliding connector 1211 through the first bearing 12142. The drive gear body 12143 is sleeved on the rotating shaft 12141. A plurality of second guide teeth 12144 are arranged sequentially along the circumference of the drive gear body 12143. The second guide teeth 12144 mesh with the first guide teeth 11431.

[0052] In some implementations, please refer to [the relevant documentation]. Figure 5 and Figure 6 As shown, the drive connection part 121 also includes a first drive motor 1215 connected to the rotating shaft 12141.

[0053] In some embodiments, a second slider 1222 is formed on the driven connection portion 122, and the second slider 1222 is slidably connected to the second sliding portion 112.

[0054] In some embodiments, the first fixing part 114 further includes a fourth sliding part 1144 and a fifth sliding part 1145, wherein the fourth sliding part 1144 is disposed on the side of the first fixing member 1141 opposite to the linear guide member 1143, and the driven connecting part 122 is slidably connected to the fourth sliding part 1144; the fifth sliding part 1145 is disposed on the side of the second fixing member 1142 opposite to the second slide rail 1112, and the driven connecting part 122 is slidably connected to the fifth sliding part 1145.

[0055] For example, please refer to Figure 6 As shown, the fourth sliding part 1144 and the fifth sliding part 1145 can be slide rails respectively. A third slider 1223 is formed on the side of the driven connection part 122 facing the first fixed part 114. One of the third sliders 1223 is slidably connected to the fourth sliding part 1144, and the other third slider 1223 is slidably connected to the fifth sliding part 1145.

[0056] In some embodiments, the second sliding portion 112 includes a third slide rail, and the third sliding portion 1221 includes a plurality of parallel fourth slide grooves 12211. Each fourth slide groove 12211 extends along a second direction.

[0057] In some implementations, please refer to Figure 3 As shown, it also includes a second drive motor 14, which is used to drive the flower basket 13 to slide along the second direction on the third sliding part 1221.

[0058] In some implementations, please refer to Figure 2 As shown, a placement space 116 is formed between the side plate 113 and the adjacent conveying assembly 12. Exemplarily, the placement space 116 is formed between the side plate 113 and the driven connection portion 122 of the adjacent conveying assembly 12.

[0059] In this embodiment, during the initial and intermediate stages of material loading, the conveying assembly 12 does not need to move in the first direction to load the material onto its respective transport track. The placement space 116 is used to accommodate the empty flower baskets 13 after loading.

[0060] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0061] The above embodiments merely illustrate preferred implementations of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the scope of protection of this patent application should be determined by the appended claims.

Claims

1. A silicon wafer feeding and conveying device, characterized in that, include: The fixing frame includes a first sliding portion and a second sliding portion extending along a first direction, respectively; At least one conveying assembly slidably connected to the fixed frame, the conveying assembly including a driving connection portion slidably connected to the first sliding portion and a driven connection portion connected to the driving connection portion, the driven connection portion being slidably connected to the second sliding portion, the driven connection portion including a third sliding portion extending along a second direction, the second direction being perpendicular to the first direction; And, a flower basket slidably connected to the third sliding part, the flower basket being used to carry a silicon wafer, the driving connection part sliding along the first direction to drive the driven connection part connected to the flower basket to move along the first direction; The fixing frame further includes two side plates arranged opposite each other in the first direction, a first fixing part connected to the two side plates respectively, and a second fixing part connected to the two side plates respectively. The first sliding part is located on the first fixing part, and the second sliding part is located on the second fixing part.

2. The silicon wafer feeding and conveying device according to claim 1, characterized in that, The conveying components are provided in multiple ways, and the multiple conveying components are arranged sequentially at intervals along the first direction.

3. The silicon wafer feeding and conveying device according to claim 1, characterized in that, The first fixing part includes a first fixing member and a second fixing member that are arranged at a relative interval, and the first sliding part includes a first slide rail provided on the first fixing member and a second slide rail provided on the second fixing member; The drive connection includes a sliding connector spanning the first fixing member and the second fixing member, and a connecting protrusion provided on the sliding connector. The connecting protrusion is connected to the driven connection through the gap between the first fixing member and the second fixing member.

4. The silicon wafer feeding and conveying device according to claim 3, characterized in that, The drive connection part further includes a drive gear component, which is rotatably connected to the side of the sliding connector facing away from the connection protrusion. The first fixing part further includes a linear guide member, which is disposed opposite to the first fixing member in the second direction; the linear guide member includes a plurality of first guide teeth arranged along the first direction, and the first guide teeth mesh with the drive gear member.

5. The silicon wafer feeding and conveying device according to claim 4, characterized in that, The drive gear component includes a rotating shaft connected to the sliding connector via a first bearing, a drive gear body sleeved on the rotating shaft, and a plurality of second guide teeth arranged circumferentially along the drive gear body, wherein the second guide teeth mesh with the first guide teeth.

6. The silicon wafer feeding and conveying device according to claim 5, characterized in that, The drive connection part also includes a first drive motor connected to the rotating shaft.

7. The silicon wafer feeding and conveying device according to claim 4, characterized in that, The first fixing part further includes: A fourth sliding portion is provided on the side of the first fixing member opposite to the linear guide member, and the driven connecting portion is slidably connected to the fourth sliding portion; A fifth sliding portion is provided on the side of the second fixing member facing away from the second slide rail, and the driven connecting portion is slidably connected to the fifth sliding portion.

8. The silicon wafer feeding and conveying device according to claim 1, characterized in that, The second sliding part includes a third slide rail, and the third sliding part includes a plurality of fourth slide grooves arranged in parallel.

9. The silicon wafer feeding and conveying device according to claim 1, characterized in that, A placement space is formed between the side plate and the adjacent conveying assembly.

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