Die polishing device capable of automatically collecting impurities

By coordinating the X-axis, Y-axis, and Z-axis drive modules and the chip blowing assembly, the waste chips of the mold grinding device can be collected in all directions, solving the problems of waste chip splash pollution and time-consuming cleaning in traditional devices, thus improving production efficiency and environmental protection.

CN224223509UActive Publication Date: 2026-05-12JIANGSU HIGH SHINE METAL TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
JIANGSU HIGH SHINE METAL TECH CO LTD
Filing Date
2025-05-20
Publication Date
2026-05-12

AI Technical Summary

Technical Problem

Traditional mold grinding equipment suffers from problems such as splashing and polluting the environment, posing health risks, and time-consuming and labor-intensive cleaning, which affects production efficiency.

Method used

The X-axis, Y-axis, and Z-axis drive modules are used in conjunction with the grinding equipment, combined with the chip blowing assembly and electromagnetic plate to achieve all-round collection of waste chips. The air pump and the split air pipe nozzle blow out airflow for precise collection, the electromagnetic plate adsorbs splashed waste chips, and the waste chip holes on the mounting plate and the collection drawer are used for secondary collection.

Benefits of technology

It effectively prevents the spread of waste, reduces the frequency of equipment maintenance, lowers production costs, and improves production continuity and efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of polishing devices, in particular to a die polishing device capable of automatically collecting impurities. A pair of opening and closing doors is arranged on the front face of the operation shell, a pair of X-axis driving modules is arranged at the top in the operation shell, Y-axis driving modules are arranged at the bottoms of the two X-axis driving modules in a driving mode, Z-axis driving cylinders are arranged at the bottoms of the Y-axis driving modules in a driving mode, and grinding equipment is arranged at the bottoms of the Z-axis driving cylinders. A scrap blowing assembly is arranged on the outer wall of the operation shell. During operation, the electromagnetic plates on the two sides can quickly adsorb splashing waste chips and prevent the splashing waste chips from diffusing and polluting; a part of sweeps can directly fall into the first sweeps collecting drawer through the sweeps holes in the mounting plate, meanwhile, the sweeps blowing assembly blows out airflow through an air pump, a flow dividing air pipe and a nozzle, the residual sweeps are accurately blown into the sweeps holes, all-directional collection is achieved, after operation is finished, an electromagnetic plate is closed, the sweeps are adsorbed to fall into the second sweeps collecting drawer, the equipment maintenance frequency is reduced, and the working efficiency is improved. The equipment loss is reduced, and the production continuity is improved.
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Description

Technical Field

[0001] This utility model relates to the field of polishing device technology, and in particular to a mold polishing device that can collect impurities. Background Technology

[0002] In the field of mold manufacturing and processing, the grinding process is a crucial step, as its precision and quality directly affect the quality of the finished mold and its subsequent performance. Traditional mold grinding equipment has revealed many challenging problems in actual operation.

[0003] The problem of disposing of waste shavings generated during grinding has remained unresolved. The shavings fly everywhere, filling the work area, which not only seriously pollutes the workshop environment and endangers the health of operators, such as causing respiratory diseases due to long-term inhalation of metal shavings; but also requires a lot of manpower and time to clean up these scattered shavings, which seriously slows down the production pace and reduces overall production efficiency. Utility Model Content

[0004] The purpose of this invention is to provide a mold polishing device that can collect impurities, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution, which includes a working housing. A pair of opening and closing doors are provided on the front of the working housing. A pair of X-axis drive modules are provided at the top inside the working housing. A Y-axis drive module is driven at the bottom of the two X-axis drive modules. A Z-axis drive cylinder is driven at the bottom of the Y-axis drive module. A grinding device is provided at the bottom of the Z-axis drive cylinder. A chip blowing assembly is provided on the outer wall of the working housing. Telescopic cylinders are symmetrically arranged on both outer walls of the working housing. The telescopic rods of the telescopic cylinders are located inside the working housing, and a clamping plate is provided at the top of the telescopic rods. Electromagnetic plates are provided on both inner walls of the working housing.

[0006] As a preferred embodiment of the present invention, the chip blowing assembly includes split air pipes respectively disposed on the left and right sides and the outer wall of the back of the working housing. Each split air pipe is provided with several nozzles. The nozzles are located inside the working housing, and two adjacent split air pipes are connected by a connecting pipe. An air pump is disposed on the back of the working housing, and the air outlet of the air pump is connected to one of the split air pipes.

[0007] As a preferred embodiment of this utility model, placement plates are symmetrically arranged on the inner walls of both sides of the working housing. The placement plates are located below the electromagnetic plate. A second waste collection drawer is provided on the placement plate. A pair of sliding grooves are opened in the placement plate. A pair of sliding bars are provided at the bottom of the second waste collection drawer. The two sliding bars are respectively slidably arranged in the two sliding grooves.

[0008] As a preferred embodiment of this utility model, an installation plate is provided inside the working housing, and several waste chip holes are opened on the installation plate. A detachable first waste chip collection drawer is also provided inside the working housing, and the first waste chip collection drawer is located below the installation plate.

[0009] As a preferred embodiment of this utility model, a pair of support blocks are symmetrically arranged on the mounting plate, and a sliding sleeve is provided inside the support block. The telescopic rod of the telescopic cylinder is movably arranged inside the sliding sleeve.

[0010] Compared with the prior art, the above-mentioned technical solution of this utility model has the following beneficial technical effects:

[0011] 1. During operation, the electromagnetic plates on both sides of this utility model can quickly adsorb splashed waste debris, preventing its spread and pollution; the waste debris holes on the mounting plate allow some waste debris to fall directly into the first waste debris collection drawer, while the blowing component uses an air pump, a diversion air pipe and a nozzle to blow airflow to accurately blow the remaining waste debris into the waste debris holes, achieving all-round collection. After the operation is completed, the electromagnetic plates are turned off, and the adsorbed waste debris falls into the second waste debris collection drawer, reducing the frequency of equipment maintenance, reducing equipment wear and tear, saving production costs and improving production continuity. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0013] Figure 2 This is a schematic diagram of the overall rear structure of this utility model;

[0014] Figure 3 This is a schematic diagram of the structure of the entire opening and closing door of this utility model after it has been completely disassembled;

[0015] Figure 4 for Figure 3 A schematic diagram of the structure for removing the first and second waste collection drawers;

[0016] Figure 5 This is a schematic diagram of the structure of the working shell of this utility model;

[0017] Figure 6 for Figure 5 A bottom-view illustration;

[0018] Figure 7 This is a schematic diagram of the chip blowing assembly of this utility model.

[0019] Reference numerals: 1. Working housing; 10. Mounting plate; 11. Waste chip hole; 12. Placement plate; 13. Slide groove; 14. First waste chip collection drawer; 15. Second waste chip collection drawer; 16. Slide bar; 17. Opening and closing door; 2. Electromagnetic plate; 3. Waste chip blowing assembly; 30. Diverting air pipe; 31. Nozzle; 32. Connecting pipe; 33. Air pump; 4. X-axis drive module; 5. Y-axis drive module; 6. Z-axis drive cylinder; 7. Grinding equipment; 8. Support block; 80. Sliding sleeve; 81. Telescopic cylinder; 82. Clamping plate. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be understood that these descriptions are merely exemplary and not intended to limit the scope of this utility model. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concept of this utility model.

[0021] like Figures 1-7 As shown, the mold grinding device for self-collecting impurities proposed in this utility model mainly includes a working shell 1, on the front of which a pair of opening and closing doors 17 are firmly connected. The opening and closing doors 17 are connected to the working shell 1 by hinges. Inside the top of the working shell 1, a pair of X-axis drive modules 4 are firmly fixed on it, and a Y-axis drive module 5 is located at the bottom of the X-axis drive module 4. The two are driven by a transmission component. A Z-axis drive cylinder 6 is installed at the bottom of the Y-axis drive module 5, and a grinding device 7 is installed at the bottom of the Z-axis drive cylinder 6.

[0022] The chip blowing assembly 3 is securely connected to the working housing 1. It includes split air pipes 30 distributed on the left, right and back outer walls of the working housing 1. Adjacent split air pipes 30 are connected by connecting pipes 32. Several nozzles 31 on each split air pipe 30 extend into the working housing 1. It also includes an air pump 33, which is installed at a specific position on the back of the working housing 1. The air outlet is connected to the split air pipe 30 corresponding to its bottom.

[0023] Telescopic cylinders 81 are provided on the outer walls of both sides of the working housing 1. The telescopic rods extend into the interior through the pre-reserved holes in the working housing 1. The top of the telescopic rods is connected to the clamping plate 82. Electromagnetic plates 2 are provided on the inner walls of both sides of the working housing 1.

[0024] The inner walls of both sides of the working housing 1 are symmetrically welded with placement plates 12, which are located below the electromagnetic plate 2. The slide bar 16 at the bottom of the second waste collection drawer 15 and the slide groove 13 in the placement plate 12 cooperate well.

[0025] The mounting plate 10 is horizontally placed inside the working housing 1. Several waste chip holes 11 are provided on the mounting plate 10 to facilitate the rapid fall of waste chips to the bottom. The first waste chip collection drawer 14 is placed in the corresponding groove below the mounting plate 10. The drawer fits tightly with the groove around the perimeter with minimal gaps to prevent waste chip leakage. A pair of support blocks 8 on the mounting plate 10 are firmly welded to the mounting plate 10. The sliding sleeve 80 inside the support block 8 is well matched with the telescopic rod of the telescopic cylinder 81 to ensure that the telescopic rod extends and retracts smoothly and orderly, making the clamping action accurate and error-free.

[0026] When using this equipment, the following steps must be followed: First, place the mold to be processed stably on the mounting plate 10, ensuring that it is in a suitable position between the two clamping plates 82. After it is properly placed, start the telescopic cylinders 81 on both sides. The telescopic rod will slowly push out, and the two clamping plates 82 will gradually approach the mold until the mold is tightly clamped and fixed, ensuring that it will not shift during subsequent processing.

[0027] After the mold is fixed, each component is turned on in sequence. With the coordinated operation of the X-axis drive module 4, Y-axis drive module 5 and Z-axis drive cylinder 6, the grinding equipment 7 will be precisely positioned to the part of the mold to be ground and the grinding operation will begin. During the grinding process, the waste chips that fall off the surface of the mold will fly everywhere. At this time, the electromagnetic plates 2 located on both sides of the equipment will play an adsorption role and use their own magnetic force to capture most of the scattered waste chips. At the same time, some waste chips will fall directly into the first waste chip collection drawer 14 below through the waste chip hole 11 on the mounting plate 10 under the action of gravity, thus achieving preliminary waste chip collection.

[0028] During the grinding operation, the chip blowing assembly 3 also operates simultaneously. The air pump 33 starts, draws gas and injects it into one of the split air pipes 30. The airflow is then split through two connecting pipes 32 and delivered to the split air pipes 30 on both sides. Finally, it is sprayed out from several evenly distributed nozzles 31 at multiple angles. The sprayed airflow forcefully blows the waste chips that remain in various places on the mounting plate 10 and are not easy to slide naturally into the waste chip hole 11 into the waste chip hole 11, ensuring that the waste chips are collected without any omission.

[0029] After the grinding process is completed, the operator opens the opening door 17 of the equipment and then turns off the power to the electromagnetic plates 2 on both sides. The moment the electromagnetic plates 2 are de-energized, the magnetic force disappears, and the waste that was originally adsorbed on its surface falls directly into the second waste collection drawer 15 below due to gravity. At this point, the operator can then pull out the first waste collection drawer 14 and the second waste collection drawer 15 in sequence, and dump the collected waste into the designated waste disposal area, completing the entire cleaning process and preparing for subsequent processing.

[0030] It should be understood that the specific embodiments described above are merely illustrative or explanatory of the principles of this utility model and do not constitute a limitation thereof. Therefore, any modifications, equivalent substitutions, improvements, etc., made without departing from the spirit and scope of this utility model should be included within its protection scope. Furthermore, the appended claims are intended to cover all variations and modifications falling within the scope and boundaries of the appended claims, or equivalent forms of such scope and boundaries.

Claims

1. A mold polishing device for self-collecting impurities, comprising a working housing (1), wherein a pair of opening and closing doors (17) are provided on the front of the working housing (1), a pair of X-axis drive modules (4) are provided at the top inside the working housing (1), a Y-axis drive module (5) is provided at the bottom of the two X-axis drive modules (4), a Z-axis drive cylinder (6) is provided at the bottom of the Y-axis drive module (5), and a polishing device (7) is provided at the bottom of the Z-axis drive cylinder (6), characterized in that: A chip blowing assembly (3) is provided on the outer wall of the working housing (1). Telescopic cylinders (81) are symmetrically arranged on the outer walls of both sides of the working housing (1). The telescopic rod of the telescopic cylinder (81) is arranged inside the working housing (1), and a clamping plate (82) is provided on the top of the telescopic rod of the telescopic cylinder (81). Electromagnetic plates (2) are provided on the inner walls of both sides of the working housing (1).

2. The mold polishing device for self-collecting impurities according to claim 1, characterized in that: The chip blowing assembly (3) includes split air pipes (30) respectively disposed on the left and right sides and the outer wall of the back of the working housing (1). Each split air pipe (30) is provided with several nozzles (31). The nozzles (31) are located inside the working housing (1), and two adjacent split air pipes (30) are connected by a connecting pipe (32). An air pump (33) is provided on the back of the working housing (1), and the air outlet of the air pump (33) is connected to one of the split air pipes (30).

3. The mold polishing device for self-collecting impurities according to claim 1, characterized in that: The working housing (1) has symmetrical placement plates (12) on both inner walls. The placement plates (12) are located below the electromagnetic plate (2). The placement plates (12) have a second waste collection drawer (15). The placement plates (12) have a pair of sliding grooves (13). The bottom of the second waste collection drawer (15) has a pair of sliding bars (16). The two sliding bars (16) are slidably disposed in the two sliding grooves (13).

4. The mold polishing device for self-collecting impurities according to claim 1, characterized in that: The working housing (1) is provided with an installation plate (10), and the installation plate (10) has several waste chip holes (11). The working housing (1) is also provided with a detachable first waste chip collection drawer (14), which is located below the installation plate (10).

5. The mold polishing device for self-collecting impurities according to claim 4, characterized in that: A pair of support blocks (8) are symmetrically arranged on the mounting plate (10). A sliding sleeve (80) is provided inside the support block (8). The telescopic rod of the telescopic cylinder (81) is movably arranged inside the sliding sleeve (80).