Ultrathin conductive adhesive tape with exhaust function

Abstract

The utility model discloses an ultrathin conductive adhesive tape with an exhaust function, and relates to the field of conductive adhesive tapes, the ultrathin conductive adhesive tape comprises a conductive adhesive tape body, and the conductive adhesive tape body comprises a black double-sided adhesive tape, an omnibearing conductive double-sided adhesive tape and an antistatic release film; the black double-sided adhesive tape comprises a surface layer, a bottom layer, a polyester release film, an acrylic acid adhesive layer, a bionic cobweb structure aramid nanofiber, a photo-initiation layer, a temperature control adhesive layer and a reversible Diels-Alder bond layer. According to the ultrathin conductive adhesive tape with the exhaust function, through the collaborative design of the honeycomb-shaped microstructure conductive base material and the low-viscosity conductive filler, the conductive adhesive tape body can form a directional air guide channel in the attaching process, the bubble residual rate can be reduced, the conductive adhesive tape body can be suitable for curved-surface and special-shaped structures, and the adhesive tape has the advantages of being simple in structure, low in cost and the like. According to the conductive adhesive sticker, the bonding yield can be effectively improved, the shearing strength of the conductive adhesive sticker body can be improved through the graphene reinforced composite adhesive layer, and the requirement for reliability when outdoor equipment is used in a high-latitude area is met.

Description

Technical Field

[0001] This utility model relates to the field of conductive adhesive tapes, and in particular to an ultra-thin conductive adhesive tape with venting function. Background Technology

[0002] Conductive adhesive is an adhesive that has a certain conductivity after curing or drying. It can connect various conductive materials together, forming an electrical path between the connected materials. In the electronics industry, conductive adhesive has become an indispensable new material. There are many types of conductive adhesives. From an application perspective, conductive adhesives can be divided into two categories: general conductive adhesives and special conductive adhesives. General conductive adhesives only have certain requirements for conductivity and bonding strength. Special conductive adhesives, in addition to certain requirements for conductivity and bonding strength, also have certain special requirements, such as high temperature resistance, ultra-low temperature resistance, instant curing, anisotropy, and transparency. According to the different types of conductive particles in the conductive adhesive, conductive adhesives can be divided into silver-based conductive adhesives, gold-based conductive adhesives, copper-based conductive adhesives, and carbon-based conductive adhesives, etc. Silver-based conductive adhesives are the most widely used.

[0003] Traditional conductive adhesive tapes can cause fluctuations in contact resistance due to air bubbles left behind caused by poor venting. Under dynamic vibration, micro-cracks in the adhesive layer cause the resistance value to drift over time, and its shear strength cannot be guaranteed. At high temperatures, the release film residue increases, leading to adhesive layer contamination. After the conductive adhesive tape is removed, residue is easily left behind, which can damage micro-components. In addition, static electricity can attract dust, increasing the failure rate of equipment after maintenance.

[0004] Therefore, it is necessary to propose an ultra-thin conductive adhesive with venting function to solve the above problems. Utility Model Content

[0005] The main objective of this invention is to provide an ultra-thin conductive adhesive with venting function, which can effectively solve the problems in the background art.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0007] An ultra-thin conductive adhesive tape with venting function includes a conductive adhesive tape body, wherein the conductive adhesive tape body includes black double-sided adhesive, an all-around conductive double-sided adhesive and an antistatic release film;

[0008] The black double-sided adhesive includes a surface layer, a bottom layer, a polyester release film, an acrylic adhesive layer, a biomimetic spider web structure aramid nanofiber, a photoinitiating layer, a temperature-controlled adhesive layer, and a reversible Diels-Alder bond layer.

[0009] The all-around conductive double-sided adhesive includes a honeycomb microstructure conductive substrate, a low-viscosity conductive filler, a graphene-reinforced composite adhesive layer, a flexible support layer, a thermally responsive self-healing adhesive, and an intelligent conductivity monitoring module.

[0010] The antistatic release film includes a release agent, a first antistatic coating, a PET substrate, and a second antistatic coating.

[0011] Preferably, the outer layer of the bottom layer is mounted on the polyester release film, the polyester release film is mounted on the biomimetic spider web structure aramid nanofibers, the biomimetic spider web structure aramid nanofibers are mounted on the photoinitiating layer, the temperature-controlled adhesive layer is mounted on the photoinitiating layer, the reversible Diels-Alder bond layer is mounted on the temperature-controlled adhesive layer, the acrylic adhesive layer is mounted on the reversible Diels-Alder bond layer, and the surface layer is mounted on the acrylic adhesive layer.

[0012] Preferably, the surface layer is low-viscosity acrylic acid containing glass microsphere spacers; the bottom layer is high-viscosity cross-linked acrylic acid, and a V-shaped groove is formed at the polyester release film.

[0013] Preferably, the biomimetic spider web structure aramid nanofibers are used to improve the creep resistance of the conductive adhesive body; the temperature-controlled adhesive layer is a paraffin-based phase change microcapsule, which is used to absorb heat at high temperatures to prevent the conductive adhesive body from softening, and to release heat at low temperatures to accelerate the curing of the conductive adhesive body; the reversible Diels-Alder bond layer is used to achieve residue-free debonding after heating the conductive adhesive body.

[0014] Preferably, the honeycomb microstructure conductive substrate is laser-etched onto the low-viscosity conductive filler, and the graphene-reinforced composite adhesive layer is installed on the low-viscosity conductive filler. The flexible support layer is installed on the graphene-reinforced composite adhesive layer, the thermally responsive self-healing adhesive is installed on the flexible support layer, and the intelligent conductivity monitoring module is installed on the thermally responsive self-healing adhesive.

[0015] Preferably, the honeycomb microstructure conductive substrate is used to accelerate the expulsion of bubbles through a physical gas-conducting structure, and the low-viscosity conductive filler includes acrylic adhesive and low-viscosity silver nanowire conductive filler, which are used to reduce the viscosity of the graphene-reinforced composite adhesive layer and improve its fluidity under pressure.

[0016] Preferably, the graphene-reinforced composite adhesive layer is used to improve the shear strength of the conductive adhesive body; the flexible support layer is a flexible polyimide support layer used to disperse stress concentration; the thermally responsive self-healing adhesive is a thermally responsive acrylic resin containing dynamic disulfide bonds, used to achieve self-repair of micro-cracks when the temperature increases; and the intelligent conductivity monitoring module is a type of resistance sensor printed at the thermally responsive self-healing adhesive, used to monitor the resistance change of the conductive adhesive body in real time and provide early warning of connection failure of the conductive adhesive body.

[0017] Preferably, the release agent is applied to the first antistatic coating, the PET substrate is applied to the first antistatic coating, and the second antistatic coating is applied to the PET substrate.

[0018] Preferably, the release agent is one of fluorine-modified organosilicon release agent, conductive carbon-doped release agent, and photothermal responsive release agent; the first antistatic coating and the second antistatic coating are one of PEDOT:PSS waterborne coating, ITO nanowire coating, and carbon nanotube / polyurethane composite layer; and the PET substrate is one of copper-nickel alloy plating, carbon black / silica composite masterbatch layer, and PET microporous membrane.

[0019] Compared with the prior art, this utility model provides an ultra-thin conductive adhesive with venting function, which has the following beneficial effects:

[0020] 1. This ultra-thin conductive adhesive tape with venting function achieves ultra-low peel force through the release agent, making it particularly suitable for precision electronic mounting scenarios. Its high-temperature resistance matches the high-temperature curing process, avoiding the residue contamination problem caused by traditional release agents during hot pressing, and ensuring the integrity of the conductive adhesive tape itself. The first and second antistatic coatings provide good antistatic effect. The PET substrate allows the conductive adhesive tape to perfectly adapt to the dynamic bending requirements of flexible electronic devices. The combination of the release agent and the PET substrate improves the bonding accuracy of the conductive adhesive tape. The first and second antistatic coatings effectively reduce the risk of static electricity.

[0021] 2. This ultra-thin conductive adhesive tape with venting function, through the synergistic design of honeycomb microstructure conductive substrate and low viscosity conductive filler, can form directional air-guiding channels during the bonding process, which can reduce the residual rate of air bubbles. Based on this, the conductive adhesive tape can be applied to curved surfaces and irregular structures, which can effectively improve the bonding yield. The graphene-reinforced composite adhesive layer can improve the shear strength of the conductive adhesive tape and meet the reliability requirements of outdoor equipment in high-latitude areas.

[0022] 3. This ultra-thin conductive adhesive with venting function, through the setting of heat-responsive self-healing adhesive, can repair cracks after local heating, which can effectively improve the service life of the conductive adhesive body and reduce maintenance costs. Through the setting of intelligent conductivity monitoring module, the resistance change of the conductive adhesive body can be monitored in real time, thereby reducing the occurrence of accidents and enabling monitoring and handling of equipment adhered to by the conductive adhesive body.

[0023] 4. This ultra-thin conductive adhesive with venting function, through the use of low-viscosity conductive filler, can reduce the overall material cost and waste emissions of the conductive adhesive itself, and is easy to recycle, thus reducing the generation of electronic waste. At the same time, the overall cost and installation time are also lower.

[0024] 5. This ultra-thin conductive adhesive with venting function effectively reduces air bubble formation through its polyester release film and acrylic adhesive layer, ensuring the integrity of the adhesive during use. The V-shaped grooves provide directional airflow, effectively reducing bonding pressure and preventing deformation of precision components. The biomimetic spiderweb-structured aramid nanofibers effectively improve the shear and peel strength of the adhesive, completely replacing traditional screw fastening methods. The reversible Diels-Alder bond layer allows for residue-free debonding after heating, and it retains most of its initial strength even after multiple uses. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0026] Figure 2 This is a schematic diagram of the structure of the black double-sided adhesive of this utility model;

[0027] Figure 3 This is a composition diagram of the black double-sided adhesive of this utility model;

[0028] Figure 4 This is a schematic diagram of the structure of the all-around conductive double-sided adhesive of this utility model;

[0029] Figure 5 This is a composition diagram of the all-around conductive double-sided adhesive of this utility model;

[0030] Figure 6 This is a schematic diagram of the structure of the antistatic release film of this utility model;

[0031] Figure 7 This is a composition diagram of the antistatic release film of this utility model.

[0032] In the diagram: 1. Conductive adhesive tape body; 2. Black double-sided tape; 3. Omnidirectional conductive double-sided tape; 4. Antistatic release film; 5. Release agent; 6. First antistatic coating; 7. PET substrate; 8. Second antistatic coating; 9. Honeycomb microstructure conductive substrate; 10. Low viscosity conductive filler; 11. Graphene-reinforced composite adhesive layer; 12. Flexible support layer; 13. Thermally responsive self-healing adhesive; 14. Intelligent conductivity monitoring module; 15. Surface layer; 16. Bottom layer; 17. Polyester release film; 18. Acrylic adhesive layer; 19. V-shaped groove; 20. Bionic spider web structure aramid nanofiber; 21. Photoinitiating layer; 22. Temperature-controlled adhesive layer; 23. Reversible Diels-Alder bond layer. Detailed Implementation

[0033] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0034] Example 1:

[0035] like Figures 1-3 As shown, an ultra-thin conductive adhesive tape with venting function includes a conductive adhesive tape body 1, which includes black double-sided adhesive 2, omnidirectional conductive double-sided adhesive 3, and an antistatic release film 4. A bottom layer 16 is mounted on the outside of a polyester release film 17, which is mounted on a biomimetic spiderweb-structured aramid nanofiber 20. The biomimetic spiderweb-structured aramid nanofiber 20 is mounted on a photoinitiating layer 21, a temperature-controlled adhesive layer 22 is mounted on the photoinitiating layer 21, a reversible Diels-Alder bond layer 23 is mounted on the temperature-controlled adhesive layer 22, and an acrylic adhesive layer 18 is mounted on the reversible Diels-Alder bond layer 23. At the r-bond layer 23, the surface layer 15 is installed at the acrylic adhesive layer 18. The surface layer 15 is low-viscosity acrylic acid containing glass microspheres as a placeholder. The bottom layer 16 is high-viscosity cross-linked acrylic acid. A V-shaped groove 19 is opened at the polyester release film 17. The biomimetic spider web structure aramid nanofiber 20 is used to improve the creep resistance of the conductive adhesive body 1. The temperature-controlled adhesive layer 22 is a paraffin-based phase change microcapsule, which is used to absorb heat at high temperature to prevent the conductive adhesive body 1 from softening, and to release heat at low temperature to accelerate the curing of the conductive adhesive body 1. The reversible Diels-Alder bond layer 23 is used to achieve residue-free debonding after heating the conductive adhesive body 1.

[0036] Example 2:

[0037] like Figure 1 , Figure 4 , Figure 5As shown, an ultra-thin conductive adhesive with venting function includes a black double-sided adhesive 2 comprising a surface layer 15, a bottom layer 16, a polyester release film 17, an acrylic adhesive layer 18, a biomimetic spider web structure aramid nanofiber 20, a photoinitiating layer 21, a temperature-controlled adhesive layer 22, and a reversible Diels-Alder bond layer 23. A honeycomb microstructure conductive substrate 9 is laser-etched onto a low-viscosity conductive filler 10, and a graphene-reinforced composite adhesive layer 11 is installed on the low-viscosity conductive filler 10. A flexible support layer 12 is installed on the graphene-reinforced composite adhesive layer 11, a thermally responsive self-healing adhesive 13 is installed on the flexible support layer 12, and an intelligent conductivity monitoring module 14 is installed on the thermally responsive self-healing adhesive 13. A honeycomb microstructure conductive substrate 9 is used to accelerate the expulsion of air bubbles through a physical air-conducting structure. The low-viscosity conductive filler 10 includes acrylic adhesive and low-viscosity silver nanowire conductive filler, which are used to reduce the viscosity of the graphene-reinforced composite adhesive layer 11 and improve its fluidity under pressure. The graphene-reinforced composite adhesive layer 11 is used to improve the shear strength of the conductive adhesive body 1. The flexible support layer 12 is a flexible polyimide support layer, which is used to disperse stress concentration. The thermally responsive self-healing adhesive 13 is a thermally responsive acrylic resin containing dynamic disulfide bonds, which is used to achieve self-repair of micro-cracks when the temperature increases. The intelligent conductivity monitoring module 14 is a type of resistance sensor printed on the thermally responsive self-healing adhesive 13, which is used to monitor the resistance change of the conductive adhesive body 1 in real time and provide early warning of connection failure of the conductive adhesive body 1.

[0038] Example 3:

[0039] like Figure 1 , Figure 6 , Figure 7 As shown, an ultra-thin conductive adhesive with venting function is disclosed. The omnidirectional conductive double-sided adhesive 3 includes a honeycomb microstructure conductive substrate 9, a low-viscosity conductive filler 10, a graphene-reinforced composite adhesive layer 11, a flexible support layer 12, a thermally responsive self-healing adhesive 13, and an intelligent conductive monitoring module 14. A release agent 5 is installed at the first antistatic coating 6, a PET substrate 7 is installed at the first antistatic coating 6, and a second antistatic coating 8 is installed at the PET substrate 7. The release agent 5 is one of a fluorine-modified organosilicon release agent, a conductive carbon-doped release agent, and a photothermal responsive release agent. The first antistatic coating 6 and the second antistatic coating 8 are one of a PEDOT:PSS water-based coating, an ITO nanowire coating, and a carbon nanotube / polyurethane composite layer. The PET substrate 7 is one of a copper-nickel alloy plating layer, a carbon black / silica composite masterbatch layer, and a PET microporous membrane.

[0040] The release agent 5 achieves ultra-low peel force, making it particularly suitable for precision electronic mounting scenarios. Its high-temperature resistance matches the high-temperature curing process, avoiding the residue contamination problem caused by traditional release agents during hot pressing, and ensuring the integrity of the conductive adhesive body 1. The first antistatic coating 6 and the second antistatic coating 8 provide good antistatic effect. The PET substrate 7 allows the conductive adhesive body 1 to perfectly adapt to the dynamic bending requirements of flexible electronic devices. The combination of release agent 5 and PET substrate 7 improves the bonding accuracy of the conductive adhesive body 1. The first antistatic coating 6 and the second antistatic coating 8 effectively reduce the risk of static electricity.

[0041] Through the synergistic design of honeycomb microstructure conductive substrate 9 and low viscosity conductive filler 10, conductive adhesive body 1 can form directional air guiding channels during the bonding process, which can reduce the residual rate of air bubbles. Based on this, conductive adhesive body 1 can be applied to curved surfaces and irregular structures, which can effectively improve the bonding yield. The graphene-reinforced composite adhesive layer 11 can improve the shear strength of conductive adhesive body 1 and meet the reliability requirements of outdoor equipment in high latitude regions.

[0042] The heat-responsive self-healing adhesive 13 can repair cracks after local heating, effectively improving the service life of the conductive adhesive body 1 and reducing maintenance costs. The intelligent conductivity monitoring module 14 can monitor the resistance change of the conductive adhesive body 1 in real time, thereby reducing the occurrence of accidents and monitoring the equipment bonded to the conductive adhesive body 1.

[0043] By using the low-viscosity conductive filler 10, the overall material cost and waste emissions of the conductive adhesive body 1 can be reduced, and it is easy to recycle in the future, thus reducing the generation of electronic waste. At the same time, the overall cost and installation time are also lower during installation.

[0044] The polyester release film 17 and acrylic adhesive layer 18 effectively reduce the generation of air bubbles, ensuring the bonding integrity of the conductive adhesive body 1 during use. The V-shaped groove 19 provides directional air conduction, effectively reducing the bonding pressure and preventing deformation of precision components. The biomimetic spider web structure aramid nanofibers 20 effectively improve the shear strength and peel strength of the conductive adhesive body 1, completely replacing traditional screw fixing methods. The reversible Diels-Alder bond layer 23 allows the conductive adhesive body 1 to achieve residue-free debonding after heating, and it retains most of its initial strength after repeated use.

[0045] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. An ultra-thin conductive adhesive tape with venting function, comprising a conductive adhesive tape body (1), characterized in that: The conductive adhesive body (1) includes black double-sided adhesive (2), all-around conductive double-sided adhesive (3), and antistatic release film (4); The black double-sided adhesive (2) includes a surface layer (15), a bottom layer (16), a polyester release film (17), an acrylic adhesive layer (18), a biomimetic spider web structure aramid nanofiber (20), a photoinitiating layer (21), a temperature-controlled adhesive layer (22), and a reversible Diels-Alder bond layer (23). The all-around conductive double-sided adhesive (3) includes a honeycomb microstructure conductive substrate (9), a low viscosity conductive filler (10), a graphene-reinforced composite adhesive layer (11), a flexible support layer (12), a thermally responsive self-healing adhesive (13), and an intelligent conductive monitoring module (14). The antistatic release film (4) includes a release agent (5), a first antistatic coating (6), a PET substrate (7), and a second antistatic coating (8).

2. The ultra-thin conductive adhesive with venting function according to claim 1, characterized in that: The outer layer (16) is mounted on a polyester release film (17), which is mounted on a biomimetic spider web structure aramid nanofiber (20). The biomimetic spider web structure aramid nanofiber (20) is mounted on a photoinitiating layer (21). The temperature-controlled adhesive layer (22) is mounted on the photoinitiating layer (21). The reversible Diels-Alder bond layer (23) is mounted on the temperature-controlled adhesive layer (22). The acrylic adhesive layer (18) is mounted on the reversible Diels-Alder bond layer (23). The surface layer (15) is mounted on the acrylic adhesive layer (18).

3. The ultra-thin conductive adhesive with venting function according to claim 2, characterized in that: The surface layer (15) is low-viscosity acrylic acid containing glass microsphere spacers; the bottom layer (16) is high-viscosity cross-linked acrylic acid, and a V-shaped groove (19) is formed at the polyester release film (17).

4. The ultra-thin conductive adhesive with venting function according to claim 2, characterized in that: The biomimetic spider web structure aramid nanofibers (20) are used to improve the creep resistance of the conductive adhesive body (1); the temperature-controlled adhesive layer (22) is a paraffin-based phase change microcapsule, which absorbs heat at high temperatures to prevent the conductive adhesive body (1) from softening, and releases heat at low temperatures to accelerate the curing of the conductive adhesive body (1); the reversible Diels-Alder bond layer (23) is used to achieve residue-free debonding after heating the conductive adhesive body (1).

5. The ultra-thin conductive adhesive with venting function according to claim 1, characterized in that: The honeycomb microstructure conductive substrate (9) is laser-etched onto the low-viscosity conductive filler (10), the graphene-reinforced composite adhesive layer (11) is installed on the low-viscosity conductive filler (10), the flexible support layer (12) is installed on the graphene-reinforced composite adhesive layer (11), the thermally responsive self-healing adhesive (13) is installed on the flexible support layer (12), and the intelligent conductive monitoring module (14) is installed on the thermally responsive self-healing adhesive (13).

6. The ultra-thin conductive adhesive with venting function according to claim 5, characterized in that: The honeycomb microstructure conductive substrate (9) is used to accelerate the discharge of bubbles through a physical gas-conducting structure. The low-viscosity conductive filler (10) includes acrylic adhesive and low-viscosity silver nanowire conductive filler, which are used to reduce the viscosity of the graphene-reinforced composite adhesive layer (11) and improve its fluidity under pressure.

7. The ultra-thin conductive adhesive with venting function according to claim 6, characterized in that: The graphene-reinforced composite adhesive layer (11) is used to improve the shear strength of the conductive adhesive body (1). The flexible support layer (12) is a flexible polyimide support layer used to disperse stress concentration. The thermally responsive self-healing adhesive (13) is a thermally responsive acrylic resin containing dynamic disulfide bonds, used to achieve self-repair of micro-cracks when the temperature increases. The intelligent conductive monitoring module (14) is a type of resistance sensor printed on the thermally responsive self-healing adhesive (13), used to monitor the resistance change of the conductive adhesive body (1) in real time and warn of connection failure of the conductive adhesive body (1).

8. The ultra-thin conductive adhesive with venting function according to claim 1, characterized in that: The release agent (5) is installed on the first antistatic coating (6), the PET substrate (7) is installed on the first antistatic coating (6), and the second antistatic coating (8) is installed on the PET substrate (7).

9. The ultra-thin conductive adhesive with venting function according to claim 8, characterized in that: The release agent (5) is one of fluorine-modified organosilicon release agent, conductive carbon-doped release agent and photothermal responsive release agent; the first antistatic coating (6) and the second antistatic coating (8) are one of PEDOT:PSS waterborne coating, ITO nanowire coating and carbon nanotube / polyurethane composite layer; the PET substrate (7) is one of copper-nickel alloy plating, carbon black / silica composite masterbatch layer and PET microporous membrane.

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