Thermal imaging apparatus

Abstract

The embodiment of the utility model provides thermal imaging equipment, and relates to the technical field of optical instruments. The thermal imaging equipment comprises a supporting piece, a visible light imaging assembly, an illumination assembly and a thermal imaging assembly, the visible light imaging assembly, the illumination assembly and the thermal imaging assembly are arranged on the supporting piece, and the illumination assembly and the thermal imaging assembly are located on the two opposite sides of the visible light imaging assembly in the first direction respectively. The first and second electrodes are respectively located at two ends of the support member in a first direction, and the first direction is parallel to the support member. The thermal imaging equipment is used for imaging a target.

Description

Technical Field

[0001] This application relates to the technical field of optical instruments, and more particularly to a thermal imaging device. Background Technology

[0002] In related technologies, integrated thermal imaging products can include multiple components, such as lighting components, thermal imaging components, and visible light imaging components. When the lighting and thermal imaging components work together, the higher operating temperature of the lighting component leads to an increase in the ambient temperature of the thermal imaging component. The thermal imaging component has high temperature requirements for its operating environment, and the lighting component, being located within the product, can easily affect the thermal imaging component. Utility Model Content

[0003] This application provides a thermal imaging device for reducing the impact of lighting components on thermal imaging components.

[0004] This application provides a thermal imaging device, including: a support member, a visible light imaging component, an illumination component, and a thermal imaging component, wherein the visible light imaging component, the illumination component, and the thermal imaging component are disposed on the support member, the illumination component and the thermal imaging component are respectively located on opposite sides of the visible light imaging component in a first direction, and are respectively located at both ends of the support member in the first direction, wherein the first direction is parallel to the support member.

[0005] As can be seen from the thermal imaging device described above, by positioning the illumination component and the thermal imaging component on opposite sides of the support in the first direction, the distance between the two components is increased, thereby reducing the impact of the illumination component's temperature rise on the thermal imaging component. Furthermore, because the thermal imaging device simultaneously houses both a thermal imaging component and a visible light imaging component, it can control both components to perform imaging based on dual-light fusion technology, thus improving the device's versatility.

[0006] In some embodiments, the centers of the orthographic projections of the lighting component on the support, the thermal imaging component on the support, and the visible light imaging component on the support are located on the same straight line extending along a first direction.

[0007] As can be seen from the above embodiments, dual-light fusion requires ensuring that the fields of view received by the thermal imaging component and the visible light imaging component are equal. The direction of the field of view includes both horizontal and vertical directions. Generally speaking, the field of view of visible light is larger than that of infrared light. Therefore, the field of view received by the visible light imaging component needs to be cropped. This is achieved by aligning the centers of the orthographic projections of the three components along the same straight line extending along a first direction, ensuring that the illumination component and the thermal imaging component are aligned in one direction of the imaging field of view. In use, the user can adjust the thermal imaging device to make the first direction parallel to the horizontal direction of the field of view, or parallel to the vertical direction of the field of view. Thus, when the illumination component and the thermal imaging component perform imaging using dual-light fusion technology, only the visible light field of view in the other direction needs to be cropped, reducing the complexity of image processing and improving the consistency and correlation between different imaging modes.

[0008] In some embodiments, the support member has a notch located between the lighting component and the thermal imaging component. A portion of the orthographic projection of the visible light imaging component onto the support member covers the support member, and another portion covers the notch. The visible light imaging component includes an imaging body, a first connecting portion, and a first flexible circuit board. The imaging body includes a first surface facing away from the support member. The first connecting portion is disposed on the first surface. The first flexible circuit board is connected to the first connecting portion and extends along the side surface of the imaging body to the notch.

[0009] As can be seen from the above embodiments, the imaging body can generate an electrical signal based on the optical signal. By connecting the first flexible circuit board to the imaging body, the electrical signal generated by the imaging body can be transmitted to other devices capable of processing the electrical signal. The first flexible circuit board is bendable. In this embodiment, by extending the first flexible circuit board from the first surface of the imaging body away from the support member, along the side of the imaging body to the notch, the space occupied by the first flexible circuit board can be reduced, which is beneficial for the miniaturization of thermal imaging hot standby. The fact that the first flexible circuit board can extend to the notch facilitates electrical connection between the first flexible circuit board and the aforementioned devices capable of processing the electrical signal, thereby improving space utilization.

[0010] In some embodiments, the lighting assembly includes: a base, a light source, and a reflector, wherein the base is disposed on a support member and a receiving cavity is provided on the base; the reflector is disposed within the receiving cavity and the reflector forms a first light channel, wherein the opening area of ​​the first light channel at the end near the support member is smaller than the opening area of ​​the first light channel at the end away from the support member; and the light source is disposed at the end of the first light channel near the support member.

[0011] As can be seen from the above embodiments, when a reflector is installed inside the base, and the light source in the first light channel emits light, some of the light rays will directly pass through the first light channel and be directed to the opening at the end away from the support member, while the other part of the light rays will be directed to the reflector and then reflected by the reflector to change the direction of light propagation, thereby allowing more light rays to be emitted to the opening at the end away from the support member, reducing the loss of light rays in the first light channel.

[0012] In some embodiments, the thermal imaging device further includes a laser ranging component disposed on a support member and located on one side of the visible light imaging component in a second direction, wherein the second direction is parallel to the support member and perpendicular to the first direction.

[0013] As can be seen from the above embodiments, since both the illumination component and the thermal imaging component are distributed in the first direction of the visible light imaging component, the laser ranging component is positioned on one side of the visible light imaging component in the second direction, taking the visible light imaging component as the base point. This makes full use of the space of the support component and facilitates the miniaturization and integration of the thermal imaging device.

[0014] In some embodiments, the support member has a notch located between the lighting component and the thermal imaging component. A portion of the orthographic projection of the laser ranging component onto the support member covers the support member, and another portion covers the notch. The laser ranging component includes a laser ranging body, a second connecting portion, and a second flexible circuit board. The laser ranging body includes a second surface facing away from the support member, and the second connecting portion is disposed on the second surface. The second flexible circuit board is connected to the second connecting portion and extends along the side surface of the laser ranging body to the notch.

[0015] As can be seen from the above embodiments, the laser ranging body can generate an electrical signal based on the laser signal. By setting a second flexible circuit board connected to the laser ranging body, the electrical signal generated by the laser ranging body can be transmitted to other devices capable of processing the electrical signal. The second flexible circuit board is bendable. In this embodiment, by extending the second flexible circuit board from the second surface of the laser ranging body away from the support member, along the side of the laser ranging body to the notch, the space occupied by the hardware for transmitting the electrical signal can be reduced, which is beneficial for the miniaturization of thermal imaging hot standby. Furthermore, the extension of the second flexible circuit board to the notch facilitates electrical connection between the second flexible circuit board and the aforementioned devices capable of processing the electrical signal, thereby improving space utilization.

[0016] In some embodiments, the thermal imaging device further includes a laser pointing component disposed on a support member and located on one side of the visible light imaging component in a second direction.

[0017] As can be seen from the above embodiments, by placing the laser pointer component on one side of the visible light imaging component in the second direction, the size of the support component in the first direction can be reduced, which is beneficial to the miniaturization and integration of the thermal imaging device.

[0018] In some embodiments, the laser pointing component and the laser ranging component are located on opposite sides of the visible light imaging component in the second direction.

[0019] As can be seen from the above embodiments, by setting the laser pointing component and the laser ranging component on both sides of the second direction with the visible light imaging component as the base point, the center of gravity of the product can be more balanced and the aesthetics of the thermal imaging device can be improved.

[0020] In some embodiments, the area of ​​the visible light imaging component projected onto the support is smaller than the area of ​​the illumination component projected onto the support; the area of ​​the visible light imaging component projected onto the support is smaller than the area of ​​the thermal imaging component projected onto the support.

[0021] As can be seen from the above embodiments, the visible light imaging component is smaller than the illumination component and the thermal imaging component. Therefore, placing the smaller visible light imaging component in the middle can make full use of the surrounding space to place the other components, avoiding a large amount of redundant space on the support, which is conducive to the miniaturization and integration of thermal imaging equipment.

[0022] In some embodiments, the thermal imaging device further includes: a housing having a receiving space therein, a window provided on the housing, a support member, a visible light imaging component, an illumination component, and a thermal imaging component disposed within the receiving space, and the visible light imaging component, the illumination component, and the thermal imaging component being exposed through the window.

[0023] As can be seen from the above embodiments, by placing the support, visible light imaging component, illumination component and thermal imaging component inside the housing, the visible light imaging component, illumination component and thermal imaging component are protected, while each component is exposed to the window to perform imaging operations on the target, thus taking into account both the protection and functionality of the thermal imaging device.

[0024] In some embodiments, the window includes a first window, a second window, and a third window, the first window and the third window being located on opposite sides of the second window in a first direction, wherein the illumination component is exposed to the first window, the visible light imaging component is exposed to the second window, and the thermal imaging component is exposed to the third window.

[0025] As can be seen from the above embodiments, the split window design allows for optimization of the first, second, and third windows based on the characteristics of the illumination component, visible light imaging component, and thermal imaging component, thereby improving the scalability of the thermal imaging device. Attached Figure Description

[0026] The accompanying drawings are provided to further illustrate the technical solution of this utility model and constitute a part of the specification. They are used together with the embodiments of this application to explain the technical solution of this utility model and do not constitute a limitation on the technical solution of this utility model.

[0027] Figure 1 This is a first structural schematic diagram of a thermal imaging device according to an embodiment of this application;

[0028] Figure 2 This is a schematic diagram of the second structure of the thermal imaging device according to an embodiment of this application;

[0029] Figure 3 for Figure 2 A magnified view of a section at point A in the middle;

[0030] Figure 4 for Figure 2 A magnified view of a section at point B. Detailed Implementation

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0032] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0033] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral connection. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. Furthermore, when describing pipelines, the terms "connected" and "linked" as used in this application have the meaning of establishing electrical connection. The specific meaning needs to be understood in conjunction with the context.

[0034] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0035] The following provides an exemplary description of the application scenarios of the embodiments of this application.

[0036] Currently, in related technologies, thermal imaging products can use visible light imaging modules and thermal imaging modules to image together. In addition, thermal imaging products are also equipped with supplementary lights, which can provide supplementary light for the visible light imaging modules. The temperature of the supplementary lights increases when they are working, which in turn causes the ambient temperature of the thermal imaging products to rise.

[0037] Based on this, embodiments of this application provide a thermal imaging device.

[0038] Figure 1 This is a first structural schematic diagram of the thermal imaging device 1 disclosed in an embodiment of this application; Figure 2 This is a schematic diagram of the second structure of the thermal imaging device 1 disclosed in an embodiment of this application.

[0039] like Figure 1 and Figure 2 As shown, the thermal imaging device 1 includes: a support member 10, a visible light imaging component 11, an illumination component 12, and a thermal imaging component 13. The visible light imaging component 11, the illumination component 12, and the thermal imaging component 13 are disposed on the support member 10. The illumination component 12 and the thermal imaging component 13 are respectively located on opposite sides of the visible light imaging component 11 in a first direction X, and are respectively located at both ends of the support member 10 in the first direction X. The first direction X is parallel to the support member 10.

[0040] In the above embodiments, the support member 10 can support the visible light imaging component 11, the illumination component 12 and the thermal imaging component 13, define the positions of the visible light imaging component 11, the illumination component 12 and the thermal imaging component 13, and thus determine the relative positional relationship between the visible light imaging component 11, the illumination component 12 and the thermal imaging component 13.

[0041] In some examples, the support member 10 may include a first plane and a second plane arranged opposite to each other. The visible light imaging component 11, the illumination component 12 and the thermal imaging component 13 are all arranged on the first plane, thereby enabling the visible light imaging component 11 and the thermal imaging component 13 to perform imaging operations on the same target simultaneously. Furthermore, the illumination component 12 can also provide supplementary lighting to the target, thereby improving the adaptability of the thermal imaging device 1.

[0042] For example, the support member 10 can be plate-shaped.

[0043] In some examples, the thermal imaging device 1 also includes a control module. The support 10 has multiple wiring holes with wires installed inside. The wires connect the control module to the lighting component 12 and to the thermal imaging component 13. The control module controls the lighting component 12 to illuminate and controls the thermal imaging component 13 to emit infrared signals and perform thermal imaging based on the infrared signals.

[0044] Visible light imaging refers to the process of using electromagnetic waves in the visible light band (wavelength range of approximately 380 to 780 nanometers) to image a target object through an optical system.

[0045] Because the imaging of the visible light imaging component 11 has certain requirements for light intensity, this application sets up an illumination component 12 to cooperate with the visible light imaging component 11. When the light intensity does not meet the requirements of the visible light imaging component 11, the illumination component 12 provides a stable and uniform light intensity for the visible light imaging component 11, thereby improving the imaging quality of the target and providing a reliable data foundation for subsequent tasks such as image analysis and target recognition.

[0046] In some examples, the visible light imaging component 11 may include a device capable of visible light imaging, such as a camera. This visible light imaging device can complement the thermal image, thereby increasing the detail of the target image and improving the recognition accuracy and environmental adaptability of the thermal imaging device. Thermal imaging is a technique that uses infrared radiation for imaging. Devices capable of thermal imaging capture the infrared radiation emitted by an object, convert it into electrical signals, and then generate a visualized thermal image based on these signals. Different colors or brightness levels in the image represent different temperature distributions.

[0047] In some examples, thermal imaging component 13 may include devices such as infrared sensors capable of performing thermal imaging operations.

[0048] Because the thermal imaging device 1 is equipped with both a thermal imaging component 13 and a visible light imaging component 11, it can control the thermal imaging component 13 and the visible light imaging component 11 to perform imaging based on dual-light fusion technology, thus improving the applicability of the thermal imaging device 1. Dual-light fusion technology, also known as visible light and infrared light fusion technology, is a technique that uses two different wavelengths of light, visible light and infrared light (or thermal imaging), to perform imaging and then fuses these two images together using image processing algorithms.

[0049] Because the illumination component 12 heats up during operation, it raises the ambient temperature of the thermal imaging component 13, reducing the imaging clarity of the thermal imaging product. Therefore, this application positions the illumination component 12 and the thermal imaging component 13 on opposite sides of the visible light imaging component 11 in the first direction X, thereby increasing the distance between the illumination component 12 and the thermal imaging component 13. This reduces the impact of the heating of the illumination component 12 on the thermal imaging component 13, improves the imaging accuracy of the thermal imaging, and enhances the reliability and stability of the thermal imaging device 1.

[0050] In some examples, the first spacing h1 is the distance between the center of the orthographic projection of the thermal imaging component 13 on the support 10 and the center of the orthographic projection of the visible light imaging component 11 on the support 10, and the second spacing h2 is the distance between the center of the orthographic projection of the illumination component 12 on the support 10 and the center of the orthographic projection of the visible light imaging component 11 on the support 10. The first spacing h1 and the second spacing h2 are equal; this symmetrical design increases the aesthetics of the thermal imaging device 1 and enhances the user experience.

[0051] In some embodiments, the centers of the orthographic projections of the illumination component 12 onto the support 10, the centers of the orthographic projections of the thermal imaging component 13 onto the support 10, and the centers of the orthographic projections of the visible light imaging component 11 onto the support 10 are located on the same straight line extending along a first direction. This straight line is parallel to the first direction X; that is, the centers of the orthographic projections of the illumination component 12 onto the support 10, the visible light imaging component 11 onto the support 10, and the thermal imaging component 13 onto the support 10 are sequentially arranged along the first direction X.

[0052] As can be seen from the above embodiments, this application enables the visible light imaging component 11 and the thermal imaging component 13 to image together based on dual-light fusion technology. The premise of dual-light fusion technology is that when the visible light imaging component 11 and the thermal imaging component 13 image the same target, the field of view of the visible light received by the visible light imaging component 11 and the field of view of the infrared radiation emitted by the thermal imaging component 13 are the same. Generally speaking, the field of view of visible light is larger than that of infrared radiation. Therefore, when imaging a target based on dual-light fusion technology, the field of view of the visible light received by the visible light imaging component 11 needs to be cropped so that the cropped visible light field of view is consistent with the infrared field of view, and then subsequent imaging processing can be performed. The field of view (FOV) in optics and imaging refers to the spatial range that an observer or imaging system can see. It is usually measured in angles (such as degrees) or distances (such as meters, feet, etc., but angles are more commonly used in optics), representing the horizontal and vertical spatial range that can be covered from the imaging system. The field of view includes two directions: horizontal and vertical. The horizontal direction refers to the extent of the field of view in the left-right direction, usually expressed as the horizontal field of view (HFOV), which describes the maximum angular range that an observer can see to the left and right without rotating their head or the device. The vertical direction refers to the extent of the field of view in the up-down direction, usually expressed as the vertical field of view (VFOV), which determines the height of the image that the observer or device can capture in the vertical direction. Therefore, in the field of two-light fusion, cropping the field of view usually requires cropping both the horizontal and vertical directions separately.

[0053] In the embodiments provided in this application, by making the center of the orthographic projection of the illumination component 12 on the support 10, the center of the orthographic projection of the visible light imaging component 11 on the support 10, and the center of the orthographic projection of the thermal imaging component 13 on the support 10 lie on the same straight line extending along the first direction X, when imaging based on dual-light fusion technology is required, the user can adjust the position of the thermal imaging device so that the first direction X is parallel to the horizontal direction of the field of view, or makes the first direction X parallel to the vertical direction of the field of view. This makes the illumination component 12 and the thermal imaging component 13 consistent in one direction of the field of view, ensuring that when the illumination component 12 and the thermal imaging component 13 are imaging, only the visible light field of view in the other direction needs to be cropped, reducing the complexity of image processing and improving the consistency and correlation between different imaging modes.

[0054] Figure 3 for Figure 2 A magnified view of a portion of point A in the middle.

[0055] In some embodiments, such as Figure 3 As shown, and in combination Figure 2 The support member 10 has a notch 101 located between the lighting component 12 and the thermal imaging component 13.

[0056] In some examples, the support member 10 may be U-shaped. For example, the support member 10 includes a first support plate 102, a second support plate 103, and a third support plate 104. One end of the second support plate 103 is connected to the first support plate 102, and the other end is connected to the third support plate 104. The second support plate 103 and the third support plate 104 are located on opposite sides of the first support plate 102. An illumination assembly 12 is disposed on the first support plate 102, and a thermal imaging assembly 13 is disposed on the third support plate 104. The second support plate 103 limits the distance between the first support plate 102 and the third support plate 104, thereby maximizing the distance between the illumination assembly 12 and the thermal imaging assembly 13 on the support member 10. The orthogonal projection of the visible light imaging assembly 11 onto the support member 10 partially covers the support member 10, and the other part covers the notch 101.

[0057] In some examples, the visible light imaging component 11 can be mounted on the first support plate 102 or the third support plate 104, which improves the flexibility of installation.

[0058] In other examples, the visible light imaging component 11 can be connected to the first support plate 102 and the third support plate 104. In this case, the orthographic projection of the visible light imaging component 11 onto the support member 10 can cover both the first support plate 102 and the third support plate 104. Therefore, the visible light imaging component 11 can distribute the force it receives to the two support areas of the first support plate 102 and the third support plate 104, avoiding stress concentration at a single point and thus improving the stability of the connection between the visible light imaging component 11 and the support member 10.

[0059] The visible light imaging assembly 11 includes an imaging body 111, a first connecting portion 112, and a first flexible circuit board 113. The imaging body 111 includes a first surface facing away from the support member 10. The first connecting portion 112 is disposed on the first surface. The first flexible circuit board 113 is connected to the first connecting portion 112 and extends along the side surface of the imaging body 111 to the notch 101.

[0060] The imaging body 111 is used to capture visible light signals in the scene, and then process the visible light signals accordingly to obtain an image under visible light.

[0061] In some examples, the side of the imaging body 111 facing away from the first surface is connected to the support 10, thereby ensuring that the imaging body 111 can be stabilized by the support 10, thus facilitating stable and efficient acquisition of visible light signals.

[0062] In some examples, the imaging body 111 may include an image sensor.

[0063] A flexible printed circuit board (FPC) is a type of circuit connection component that can be bent and folded, made from a flexible substrate through processes such as etching and electroplating.

[0064] In some examples, the first connection portion 112 is electrically connected to the imaging body 111, and the first connection portion 112 is also electrically connected to the first flexible circuit board 113.

[0065] The visible light signal acquired by the imaging body 111 can be transmitted to the first flexible circuit board 113 through the first connecting part 112, and then the visible light signal can be transmitted to the module that can process the visible light signal through the first flexible circuit board 113, thus realizing the transmission of the signal.

[0066] Furthermore, the first connecting portion 112 is located on the side of the imaging body 111 opposite to the support member 10, thereby facilitating the connection between the first connecting portion 112 and the first flexible circuit board 113. Moreover, due to the bendable and foldable nature of the first flexible circuit board 113, extending along the side surface of the imaging body 111 further reduces the space occupied by the hardware used for signal transmission, improving the product's portability and installability. Simultaneously, the first flexible circuit board 113 extends to the notch 101, facilitating its connection with the module that processes visible light signals. By incorporating the first flexible circuit board 113, the internal space layout of the product is optimized while ensuring signal transmission, improving the space utilization of the thermal imaging product and promoting its miniaturization and integration.

[0067] In some examples, where the thermal imaging device 1 includes a control module, the thermal imaging device 1 also includes an information processing module, wherein the control module is connected to the first flexible circuit board 113, the control module is used to control the imaging body 111 to acquire visible light signals, the control module is connected to the information processing module, and the control module is also used to send the visible light signals to the information processing module, the information processing module outputs an image based on the visible light signals, thereby acquiring an imaging image under visible light.

[0068] For example, the control module can be an MCU (microcontroller unit).

[0069] For example, the information processing module may be at least one of a digital signal processor (DSP), a field-programmable gate array (FPGA), and a graphics processing unit (GPU).

[0070] Figure 4 for Figure 2 A magnified view of a section at point B.

[0071] In some embodiments, such as Figure 4 As shown, the lighting assembly 12 includes: a base 121, a light source 122, and a reflector 123. The base 121 is disposed on the support member 10, and a receiving cavity is provided on the base 121. The reflector is disposed in the receiving cavity and forms a first light channel. The opening area of ​​the first light channel at the end near the support member is smaller than the opening area at the end of the first light channel away from the support member. The light source is disposed at the end of the first light channel near the support member.

[0072] In the above embodiments, the illumination component 12 includes a base 121, a light source 122, and a reflector 123. When the intensity of visible light is weak, the illumination component 12 is needed to supplement the visible light. However, the high temperature generated by the high-power illumination component 12 during operation can affect the imaging quality of the thermal imaging component 13, while a low-power illumination component 12 cannot effectively supplement the illumination of the thermal imaging component 13.

[0073] In this application, a reflector 123 is disposed on the receiving cavity. When the light source 122 emits light, part of the light will be directly directed toward the end of the first light channel away from the support member 10, while the other part of the light will be directed toward the side wall of the first light channel. The side wall of the first light channel is surrounded by the reflector 123. The reflector 123 will reflect the light that hits it, changing the direction of light propagation, thereby causing more light to be emitted toward the end of the first light channel away from the support member 10, reducing the loss of light in the first light channel. Under the premise of avoiding the impact on the thermal imaging component 13, the utilization rate of the light source 122 is improved by the reflector 123, and the stability and reliability of visible light imaging are improved.

[0074] In some examples, light source 122 can be a white light lamp, which has a better supplementary lighting effect when the intensity of visible light is weak.

[0075] In some examples, reflector 123 may include any one of metal reflector 123, glass reflector 123 and plastic reflector 123.

[0076] In some embodiments, the thermal imaging device 1 further includes a laser ranging component 14, which is disposed on the support member 10 and located on one side of the visible light imaging component 11 in the second direction Y, wherein the second direction Y is parallel to the support member 10 and perpendicular to the first direction X. Laser ranging is a technique that uses laser light to measure the distance between a target object and a ranging device. It is based on the propagation characteristics of light, allowing the laser to propagate in space at the speed of light. When the laser beam is directed at the target object, it is reflected back. By accurately measuring the time interval from laser emission to reception of the reflected light, and combining this with the known constant of the speed of light, the distance to the target object can be calculated.

[0077] In the above embodiment, the laser ranging component 14 is used to measure the distance to the target. Since the intensity of infrared radiation emitted during thermal imaging decreases with increasing distance, the laser ranging component 14 allows the user to choose whether to move closer to or away from the target based on the acquired distance, thereby assisting in thermal imaging.

[0078] By placing the laser ranging component 14 on the support member 10, the relative position of the laser ranging component 14 remains unchanged, thereby preventing the laser ranging component 14 from shifting when measuring the distance to the target and improving the stability of the laser ranging component 14.

[0079] By placing the laser ranging component 14 on one side of the visible light imaging component 11 in the second direction Y, the size of the support member 10 in the first direction X of the visible light imaging component 11 can be reduced, making full use of the size of the support member 10 in the second direction Y of the visible light imaging component 11, which is beneficial to the miniaturization and integration of the thermal imaging device 1.

[0080] In some embodiments, the support member 10 is provided with a notch 101, which is located between the lighting component 12 and the thermal imaging component 13. The laser ranging component 14 is partially projected onto the support member 10, and the other part covers the notch 101. The laser ranging component 14 includes a laser ranging body 141, a second connecting portion 142, and a second flexible circuit board 143. The laser ranging body 141 includes a second surface facing away from the support member 10, and the second connecting portion 142 is disposed on the second surface. The second flexible circuit board 143 is connected to the second connecting portion 142 and extends along the side surface of the laser ranging body 141 to the notch 101.

[0081] The laser ranging body 141 is used to emit lasers at the target and receive the lasers reflected from the target to obtain the reflected signals.

[0082] In some examples, the laser ranging body 141 can be any of a laser or a laser diode.

[0083] Since the emitted and reflected signals from the laser ranging body 141 need to be processed by an algorithm to obtain the distance between the thermal imaging device 1 and the target, the emitted and reflected signals need to be sent to a module capable of processing the two signals. This application provides a second connecting part 142 as a connector to send the emitted and reflected signals output by the laser ranging body 141 to the second flexible circuit board 143. Simultaneously, the second flexible circuit board 143 extends along the side surface of the laser ranging body 141, further avoiding the use of unnecessary space.

[0084] Furthermore, after the transmitted and reflected signals are sent to the second flexible circuit board 143, they still need to be further transmitted to a module capable of processing the transmitted and reflected signals. Therefore, a portion of the laser ranging component 14 is mounted on the support 10 to secure the connection and maintain the positional relationship of the remaining components, while another portion covers the notch 101, allowing the second flexible circuit board 143 to make electrical connections with the remaining modules through the notch 101, thus improving the product's portability and installability.

[0085] In some examples, the side of the laser ranging body 141 facing away from the second surface is connected to the support 10, thereby ensuring that the laser ranging body 141 can be stabilized in relative position by the support 10.

[0086] By setting up a second flexible circuit board 143, under the premise of completing signal transmission, the second flexible circuit board 143 can extend along the side surface of the laser ranging body 141 because it has the characteristics of being flexible and foldable, thus optimizing the spatial layout within the product and improving the space utilization of the thermal imaging product.

[0087] In some examples, when the thermal imaging device 1 includes a control module and a signal processing module, the control module is connected to the second flexible circuit board 143. The control module is used to control the laser ranging body 141 to emit and reflect signals. The control module is also connected to the information processing module and is used to send the emitted and reflected signals to the information processing module. The information processing module obtains the distance to the target based on the emitted and reflected signals.

[0088] In some examples, the second connection part 142 can be electrically connected to the laser ranging body 141 and the second flexible circuit board 143, thereby transmitting the transmitted signal and the reflected signal from the laser ranging body 141 to the second flexible circuit board through the second connection part 142, thus completing the transmission of the transmitted signal and the reflected signal.

[0089] In some embodiments, the thermal imaging device 1 further includes a laser designation component 15, disposed on the support member 10, located on one side of the visible light imaging component 11 in the second direction Y. Laser designation is a technique that uses a laser beam to precisely mark or locate a target. Its core purpose is to quickly and accurately identify the target location using a visible or invisible laser beam, providing a reference for subsequent operations (such as aiming or measurement).

[0090] In the above embodiments, the laser pointing component 15 is used to mark the target. For the marked target, the target can be imaged by the thermal imaging component 13 and the visible light imaging component 11. Alternatively, when the light intensity is poor, the laser pointing component 15 can indicate the lighting direction, thereby assisting the thermal imaging component 13, the lighting component 12 and the visible light imaging component 11 in their operation.

[0091] By placing the laser pointing component 15 on the support member 10, the relative position of the laser pointing component 15 can remain unchanged, thereby preventing the laser pointing component 15 from shifting when pointing at the target, making its operation more stable.

[0092] Furthermore, since both the illumination component 12 and the thermal imaging component 13 are distributed on the first direction X of the visible light imaging component 11, the laser pointing component 15 is positioned on one side of the visible light imaging component 11 in the second direction Y, with the visible light imaging component 11 as the base point. This reduces the size of the support member 10 in the first direction X of the visible light imaging component 11, which is beneficial for miniaturization and integration of the thermal imaging device 1.

[0093] In some examples, the laser pointing component 15 can work in conjunction with the laser ranging component 14. The laser pointing component 15 marks the target and the laser ranging component 14 measures the distance to the marked component, thereby achieving collaborative operation and improving the positioning accuracy when ranging the target.

[0094] In some embodiments, the laser pointing component 15 and the laser ranging component 14 are located on opposite sides of the visible light imaging component 11 in the second direction Y.

[0095] In the above embodiment, in the first direction X, the thermal imaging component 13 and the illumination component 12 are located on both sides of the visible light imaging component 11 in the first direction X, and in the second direction Y, the laser pointing component 15 and the laser ranging component 14 are located on both sides of the visible light imaging component 11. This makes the center of gravity of the product more balanced, the overall appearance more beautiful, and improves the user experience.

[0096] In some examples, the distance between the laser pointing component 15 and the visible light imaging component 11 is a third distance h3 (e.g., Figure 1 As shown), the distance between the laser pointing component 14 and the visible light imaging component 11 is the fourth distance h4 (as shown). Figure 1 As shown in the figure, the third spacing h3 and the fourth spacing h4 are equal. This symmetrical design can increase the aesthetics of the thermal imaging device 1 and improve the user experience.

[0097] In some embodiments, the area of ​​the visible light imaging component 11 projected onto the support 10 is smaller than the area of ​​the illumination component 12 projected onto the support; the area of ​​the visible light imaging component 11 projected onto the support 10 is smaller than the area of ​​the thermal imaging component 13 projected onto the support 10.

[0098] With this configuration, because the areas of the orthographic projection of the illumination component 12 and the thermal imaging component 13 onto the support member 10 are relatively large, the space occupied by the illumination component 12 and the thermal imaging component 13 will also be relatively large. In this case, placing the smaller visible light imaging component 11 in the middle can make full use of the surrounding space. Furthermore, combined with the technical feature that the laser pointing component 15 and the laser ranging component 14 are located on opposite sides of the visible light imaging component 11 in the second direction Y, the size of the support member 10 in the first direction X can be reduced. At the same time, because the visible light imaging component 11 is relatively small, extending the support member 10 in the second direction Y with the visible light imaging component 11 as the base point will also reduce the size of the support member 10 in the second direction Y, avoiding a large amount of redundant space on the support member, which is conducive to the miniaturization and integration of the thermal imaging device 1.

[0099] In some examples, the area of ​​the orthographic projection of the laser pointing component 15 onto the support 10 is smaller than the area of ​​the orthographic projection of the illumination component 12 onto the support; the area of ​​the orthographic projection of the laser ranging component 14 onto the support 10 is smaller than the area of ​​the orthographic projection of the illumination component 12 onto the support; the area of ​​the orthographic projection of the laser pointing component 15 onto the support 10 is smaller than the area of ​​the orthographic projection of the thermal imaging component 13 onto the support 10; and the area of ​​the orthographic projection of the laser ranging component 14 onto the support 10 is smaller than the area of ​​the orthographic projection of the thermal imaging component 13 onto the support 10.

[0100] Because the visible light imaging component 11, the laser pointing component 15, and the laser ranging component 14 are all relatively small, setting the laser pointing component 15 and the laser ranging component 14 along the second direction Y of the visible light imaging component 11 can make full use of the space other than the illumination component 12 and the thermal imaging component 13, which is beneficial to the miniaturization and integration of the thermal imaging device 1.

[0101] Please see you later. Figure 1 and Figure 2In some embodiments, the thermal imaging device 1 further includes: a housing 16 having a receiving space inside the housing 16, a window 17 provided on the housing 16, a support member 10, a visible light imaging component 11, an illumination component 12 and a thermal imaging component 13 disposed in the receiving space, and the visible light imaging component 11, the illumination component 12 and the thermal imaging component 13 exposed to the window 17.

[0102] In the above embodiments, because electronic components such as the visible light imaging component 11, the illumination component 12, and the thermal imaging component 13 are relatively easy to be damaged by external forces, and water and dust may cause circuit breaks in the visible light imaging component 11, the illumination component 12, and the thermal imaging component 13, it is possible to extend the service life of the thermal imaging device 1 and improve the stability and reliability of the device by placing the support member 10, the visible light imaging component 11, the illumination component 12, and the thermal imaging component 13 together in the housing space.

[0103] Furthermore, while ensuring the protection of the visible light imaging component 11, the illumination component 12, and the thermal imaging component 13, each component is exposed to the window 17 to perform imaging operations on the target, thus balancing the protection and functionality of the thermal imaging device 1.

[0104] In some examples, there is one window 17, within which the visible light imaging component 11, the illumination component 12, and the thermal imaging component 13 can be exposed.

[0105] In some embodiments, window 17 includes a first window 171, a second window 172, and a third window 173, with the first window 171 and the third window 173 located on opposite sides of the second window 172 in a first direction X. The lighting component 12 is exposed to the first window 171, the visible light imaging component 11 is exposed to the second window 172, and the thermal imaging component 13 is exposed to the third window 173.

[0106] In the above embodiments, the lighting component 12, the visible light imaging component 11 and the thermal imaging component 13 are respectively placed in the first window 171, the second window 172 and the third window 173 by the split window design, which avoids the bulkiness caused by a single window and improves the aesthetics of the thermal imaging device 1.

[0107] Furthermore, the first window 171, the second window 172, and the third window 173 only need to be designed to meet the requirements of the lighting component 12, the visible light imaging component 11, and the thermal imaging component 13, respectively. This effectively reduces the area of ​​the windows, thereby reducing the area of ​​the lighting component 12, the visible light imaging component 11, and the thermal imaging component 13 exposed to the external environment. This reduces the interference of the external environment on the lighting component 12, the visible light imaging component 11, and the thermal imaging component 13, improves the stability and reliability of the thermal imaging device 1, and enhances the aesthetics of the thermal imaging device 1.

[0108] In the case where the thermal imaging device 1 also includes a laser ranging component 14 and a laser pointing component 15, the laser ranging component 14 and the laser pointing component 15 are disposed within the receiving space and exposed at the window 17, which improves the protection of the laser ranging component 14 and the laser pointing component 15 and increases the functionality of the thermal imaging device 1.

[0109] In some examples, window 17 further includes a fourth window 174 and a fifth window 175, which are located on opposite sides of the second window 172 in the second direction Y, respectively. The laser ranging component 14 is exposed to the fourth window 174, and the laser pointing component 15 is exposed to the fifth window 175, thereby improving the scalability of the thermal imaging device 1.

[0110] In other examples, the fourth window 174 and the fifth window 175 may be located on the same side of the second window 172 in the second direction Y.

[0111] like Figure 1 and Figure 2 As shown, in some examples, the housing 16 includes a first panel 161, a window panel 162, and a third connecting portion 163. The third connecting portion 163 is arranged around the edge of the window panel 162, and some of it is connected to the first panel 161 away from the window panel 162. A first receiving space is provided between the window panel 162 and the first panel 161, and the support member 10, visible light imaging component 11, illumination component 12, thermal imaging component 13, laser ranging component 14, and laser pointing component 15 are all located within the first receiving space. Because the first receiving space is provided between the window panel 162 and the first panel 161, the window panel 162 protrudes forward compared to the first panel 161, improving space utilization and facilitating the miniaturization and integration of the thermal imaging device 1.

[0112] In some examples, the housing 16 also includes a frame 164 and a second panel. One side of the frame 164 is connected to the first panel 161, and the other side of the frame 164 is located on the side opposite to the first panel 161. An anti-slip element 165 is provided at the frame 164 to help the user hold the device and improve the user experience.

[0113] In some examples, the first panel 161 includes a first portion 1611 and a second portion 1612. A window panel 162 is disposed on the first portion 1611. The width of the first portion 1611 in the first direction X is greater than the width of the second portion 1612 in the first direction X. Because the width of the second portion 1612 is smaller, it is easier for the user to hold compared to the first portion 1611, thus improving the user experience. In some examples, the window panel 162 is provided with a second recess 1621, and the second window 172, the fourth window 174, and the fifth window 175 are all disposed at the bottom of the second recess 1621.

[0114] The thermal imaging device 1 also includes a cover plate that can be detachably installed in the slot of the second groove 1621, wherein the shape of the cover plate is adapted to the shape of the slot of the second groove 1621. This arrangement allows the visible light imaging component 11, the laser ranging component 14, and the laser pointing component 15, respectively exposed to the second window 172, the fourth window 174, and the fifth window 175, to be protected by the cover plate when the thermal imaging device 1 is not in use, thereby improving the reliability of the thermal imaging device 1.

[0115] In some examples, the second groove 1621 is referred to as a strip, and the second groove 1621 extends along the second direction Y. For example, the second groove 1621 can be in the shape of a semi-circular racetrack. A semi-circular racetrack refers to a ring-shaped racetrack composed of two semi-circular curves and two straight segments. The curves at both ends are semi-circular, the first ends of the two straight segments are connected to the ends of one of the curves, and the second ends of the two straight segments are connected to the ends of the other curve, thus forming a semi-circular racetrack.

[0116] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A thermal imaging device, characterized in that, include: The device includes a support member, a visible light imaging component, an illumination component, and a thermal imaging component, wherein the visible light imaging component, the illumination component, and the thermal imaging component are disposed on the support member, the illumination component and the thermal imaging component are respectively located on opposite sides of the visible light imaging component in a first direction, and are respectively located at both ends of the support member in the first direction, wherein the first direction is parallel to the support member.

2. The thermal imaging device according to claim 1, characterized in that, The centers of the orthographic projections of the lighting component, the thermal imaging component, and the visible light imaging component onto the support are located on the same straight line extending along the first direction.

3. The thermal imaging device according to claim 1 or 2, characterized in that, The support member has a notch located between the lighting component and the thermal imaging component. The visible light imaging component's orthogonal projection onto the support member covers the support member, while the other part covers the notch. The visible light imaging assembly includes an imaging body, a first connecting portion, and a first flexible circuit board. The imaging body includes a first surface facing away from the support member. The first connecting portion is disposed on the first surface. The first flexible circuit board is connected to the first connecting portion and extends along the side surface of the imaging body to the notch.

4. The thermal imaging device according to claim 1 or 2, characterized in that, The lighting assembly includes: A base is disposed on the support member, and a receiving cavity is provided on the base; A reflector is disposed within the receiving cavity, the reflector forming a first light channel, wherein the opening area of ​​the first light channel at the end closer to the support is smaller than the opening area of ​​the first light channel at the end farther from the support. The light source is located at one end of the first light channel near the support member.

5. The thermal imaging device according to claim 1 or 2, characterized in that, Also includes: A laser ranging component is disposed on the support member. The laser ranging component is located on one side of the visible light imaging component in a second direction, wherein the second direction is parallel to the support member and perpendicular to the first direction.

6. The thermal imaging device according to claim 5, characterized in that, The support member has a notch located between the lighting component and the thermal imaging component. The portion of the laser ranging component's orthographic projection onto the support member covers the support member, while the other portion covers the notch. The laser ranging component includes: a laser ranging body, a second connecting part, and a second flexible circuit board. The laser ranging body includes a second surface facing away from the support member, and the second connecting part is disposed on the second surface. The second flexible circuit board is connected to the second connection portion and extends along the side surface of the laser ranging body to the notch.

7. The thermal imaging device according to claim 5, characterized in that, Also includes: A laser pointing component is disposed on the support member, and the laser pointing component is located on one side of the visible light imaging component in the second direction.

8. The thermal imaging device according to claim 7, characterized in that, The laser pointing component and the laser ranging component are located on opposite sides of the visible light imaging component in the second direction.

9. The thermal imaging device according to claim 8, characterized in that, The area of ​​the visible light imaging component projected onto the support is smaller than the area of ​​the illumination component projected onto the support. The area of ​​the visible light imaging component projected onto the support is smaller than the area of ​​the thermal imaging component projected onto the support.

10. The thermal imaging device according to claim 1 or 2, characterized in that, Also includes: The housing has a receiving space inside and a window is provided on the housing. The support, the visible light imaging component, the illumination component and the thermal imaging component are disposed in the receiving space, and the visible light imaging component, the illumination component and the thermal imaging component are exposed to the window.

11. The thermal imaging device according to claim 10, characterized in that, The window includes a first window, a second window, and a third window. The first window and the third window are located on opposite sides of the second window in the first direction. The lighting component is exposed to the first window, the visible light imaging component is exposed to the second window, and the thermal imaging component is exposed to the third window.

Images