Temperature control device for electronic module test and test equipment

Abstract

The utility model discloses a temperature control device for electronic module test and test equipment, comprising a heating module, the heating module comprises a heating surface, the heating surface is used for heating an electronic module to be tested, the heating module is provided with an air channel, and the air channel passes through the heating surface; and the fan assembly is used for guiding external airflow to the air duct, and the external airflow enters a temperature control area through the air duct. According to the utility model, the temperature control stability of the electronic module during testing is improved, the influence of temperature change on the performance of the electronic module is reduced, and the technical effects of constant temperature control in the temperature control area can be realized more easily.

Description

Technical Field

[0001] This utility model relates to the field of electronic module testing technology, and more specifically, to a temperature control device and testing equipment for testing electronic modules. Background Technology

[0002] Electronic modules typically require a series of tests to screen out substandard products. Taking memory module testing as an example, the conventional screening test involves inserting the finished product into a PC motherboard, server motherboard, or dedicated test motherboard, running preset test levels and pattern data, triggering faults, and achieving the purpose of screening.

[0003] Industry research and practice show that temperature has a significant effect on triggering memory failures. Therefore, heating devices can be added to the memory testing process to accelerate the screening of defective products. During memory module testing, good temperature uniformity and stability are required. Existing common memory temperature control systems activate fans to cool the memory module when its temperature exceeds a set value. However, the air blown in by the fan at this time is close to room temperature, creating a significant temperature difference between this air and the air in the memory module's heating area. This can easily lead to large temperature fluctuations in the memory module's heating area, making it difficult to maintain a constant temperature for the memory module. Utility Model Content

[0004] The main purpose of this invention is to provide a temperature control device for testing electronic modules, so as to solve the problem that the temperature of the temperature control area fluctuates greatly and the stability is difficult to control when the temperature is cooled down in related technologies.

[0005] To achieve the above objectives, this utility model provides a temperature control device for testing electronic modules, comprising:

[0006] A heating module, comprising a heating surface for heating an electronic module to be tested arranged in a temperature control area, and an air duct provided on the heating module, the air duct passing through the heating surface so that the airflow passing through the air duct can be preheated;

[0007] A fan assembly for guiding external airflow to the air duct and through the air duct into the temperature control zone.

[0008] Furthermore, it also includes a temperature control module, which is used to detect the temperature of the electronic module under test, and control the heating power of the heating module and the power of the fan assembly based on the temperature.

[0009] Furthermore, the heating surface of the heating module can conduct heat through far-infrared radiation.

[0010] Furthermore, the heating module includes a graphene component, and the air duct includes multiple through holes disposed on the graphene component.

[0011] Furthermore, the fan assembly is fixed on the heating module, the air outlet of the fan assembly corresponds to the air inlet of the air duct, and the air outlet of the air duct corresponds to the temperature control area and the electronic module under test.

[0012] Furthermore, the heating module is positioned above the electronic module under test, the fan assembly is fixed to the upper surface of the heating module, and the air duct includes a through hole that runs vertically through the heating module.

[0013] Furthermore, the heating module also includes a heat insulation cover, which is placed over the electronic module to be tested, and the temperature control area is located between the heat insulation cover and the electronic module to be tested;

[0014] The graphene component is fixed inside the heat insulation cover, which has an opening. The fan component is fixed to the heat insulation cover and corresponds to the opening.

[0015] Furthermore, the heat insulation cover is equipped with vent holes.

[0016] According to another aspect of the present invention, a testing device is provided, including the temperature control device described above and an electronic module to be tested.

[0017] Furthermore, the electronic module under test includes a memory module under test, which is electrically connected to the test motherboard. The test motherboard is connected to a temperature control module, which detects the temperature of the memory module under test through the test motherboard.

[0018] In this embodiment of the invention, a heating module is provided, comprising a heating surface for heating the electronic module under test, an air duct passing through the heating surface, and a fan assembly for guiding external airflow into the air duct and then into the temperature control area. This achieves the goal of preheating the external airflow as it passes through the heating surface of the heating module before entering the temperature control area and contacting the electronic module under test, thus reducing the temperature difference and minimizing temperature fluctuations within the temperature control area. This improves the temperature control stability of the electronic module during testing, reduces the impact of temperature changes on the module's performance, and facilitates better constant temperature control within the temperature control area. This solves the problem of large temperature fluctuations and difficulty in controlling stability in related technologies when temperature control devices are used for cooling. Attached Figure Description

[0019] The accompanying drawings, which form part of this utility model, are used to provide a further understanding of the utility model, making other features, objects, and advantages of the utility model more apparent. The illustrative embodiments of the utility model and their descriptions are used to explain the utility model and do not constitute an undue limitation of the utility model. In the drawings:

[0020] Figure 1 This is an exploded structural diagram of the temperature control device according to an embodiment of this utility model;

[0021] Figure 2 This is a schematic diagram of the assembly structure of the temperature control device according to an embodiment of the present utility model;

[0022] The components include: 1. Fan assembly; 2. Heat insulation cover; 20. Openings; 3. Heating module; 30. Graphene assembly; 4. Air duct; 5. Electronic module to be tested; and 6. Insulation space. Detailed Implementation

[0023] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0024] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this utility model described herein.

[0025] In this invention, the terms "upper," "lower," "inner," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0026] Furthermore, in addition to indicating direction or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances.

[0027] Furthermore, the terms "set up," "equipped with," "connected," and "fixed" should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0028] In addition, the term "multiple" should mean two or more.

[0029] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.

[0030] To solve related technical problems, such as Figure 1 and Figure 2 As shown, this embodiment of the present invention provides a temperature control device for testing electronic modules, comprising:

[0031] Heating module 3 includes a heating surface for heating the electronic module 5 to be tested arranged in the temperature control area. Heating module 3 is provided with an air duct 4 that passes through the heating surface so that the airflow passing through the air duct 4 can be preheated.

[0032] Fan assembly 1 is used to guide external airflow to air duct 4 and into the temperature control area via air duct 4.

[0033] In this embodiment, the temperature control device is installed on the test equipment to control the temperature when performing performance testing on the electronic module 5 under test on the test equipment. Specifically, the temperature control device includes a heating module 3 and a fan assembly 1, wherein the heating module 3 can controllably generate heat and conduct the heat to the electronic module 5 under test through the heating surface, thereby raising the temperature of the electronic module 5 under test and the temperature control area.

[0034] In one embodiment, the heating module 3 can conduct heat through radiation or through hot air. In this embodiment, heat is preferably conducted via far-infrared radiation. Compared to other conduction methods, far-infrared radiation improves temperature uniformity, is easier to control, and has simpler structural requirements, facilitating arrangement. The fan assembly 1 guides airflow through the rotation of its blades. Therefore, in this embodiment, an air duct 4 is provided on the heating module 3, and the air duct 4 passes through the heating surface of the heating module 3. The fan assembly 1 guides external airflow into the air duct 4 through its blades, where it is heated as it passes the heating surface, thus reducing the temperature difference between the air flowing out of the air duct 4 and the temperature control area and the electronic module 5 under test.

[0035] In one implementation, such as Figure 1 As shown, the fan assembly 1 can be positioned directly above the heating module 3, and the fan assembly 1 can directly blow external airflow onto the heating module 3. In another embodiment, the fan assembly 1 can be positioned in other locations, and the fan assembly 1 can guide airflow to the heating module 3 through an air duct.

[0036] It should be noted that during the testing process, the heating module 3 first needs to heat the electronic module 5 under test to the set temperature. During the test, the electronic module 5 generates heat, so to control the temperature, it is necessary to reduce the heating power of the heating module 3, or guide external airflow into the temperature control area through the fan assembly 1 to achieve cooling, or simultaneously reduce the heating power and introduce external airflow to achieve cooling. The temperature control device in this embodiment mainly preheats the external airflow through the air duct 4, reducing the temperature difference between the external airflow entering the temperature control area and the temperature control area and the electronic module 5 under test during cooling, thus reducing temperature fluctuations within the temperature control area. This improves the temperature control stability of the electronic module during testing, reduces the impact of temperature changes on the electronic module's performance, and also makes it easier to achieve constant temperature control within the temperature control area. This solves the problem in related technologies where temperature control devices experience large temperature fluctuations and difficulty in controlling stability during cooling.

[0037] To achieve temperature control, this embodiment also includes a temperature control module (not shown in the figure). The temperature control module is used to detect the temperature of the electronic module 5 under test, and to control the heating power of the heating module 3 and the power of the fan assembly 1 based on the temperature.

[0038] Specifically, in this embodiment, the temperature control module first detects the temperature of the electronic module 5 under test, and then controls the power of the heating module 3 and the fan assembly 1 based on the temperature of the electronic module 5 under test. The temperature of the electronic module 5 under test can be detected by infrared imaging or by directly reading the temperature by electrically connecting the temperature control module to the electronic module 5 under test. To accurately obtain the temperature of the electronic module 5 under test, this embodiment preferably connects the temperature control module to the motherboard of the testing equipment, with the electronic module 5 under test mounted on the motherboard, and its temperature read from the motherboard.

[0039] In a specific testing process, the temperature control module first controls the heating module 3 to heat up, raising the temperature of the electronic module 5 under test and the temperature control area. Simultaneously, the temperature control module acquires the real-time temperature of the electronic module 5 under test and adjusts the heating power of the heating module 3 in real time. When the temperature of the electronic module 5 under test exceeds the set value, the temperature control module controls the heating module 3 to stop heating, and simultaneously controls the fan assembly 1 to start and controls its power. The fan assembly 1 guides external airflow through the air duct 4 on the heating module 3. Since the heating module 3 still has a certain temperature at this time, the airflow flowing through the air duct 4 can be heated. Thus, the temperature difference between the heated airflow and the temperature control area is relatively small, and the temperature change during the mixing process is relatively slow, preventing large temperature fluctuations in the temperature control area and the electronic module 5 under test, thereby achieving a more stable constant temperature effect.

[0040] In one implementation, such as Figure 1 As shown, the heating module 3 includes a graphene component 30, and the air duct 4 includes multiple through holes disposed on the graphene component 30. Specifically, compared with other devices capable of achieving far-infrared radiation heating, the graphene component 30 in this embodiment has a simple structure, is easy to lay out, and due to its high thermal conductivity, it can further improve temperature uniformity. At the same time, the overall structure is lighter and easier to arrange with the air duct 4 after using the graphene component 30.

[0041] It should be noted that in this embodiment, the graphene component uses far-infrared radiation to heat the object under test. Compared with the conventional technology that uses a wind-heating module to conduct heat through wind, the heating efficiency is greatly improved because the heat conduction method has been changed.

[0042] To avoid the reduced heating efficiency caused by creating air ducts through holes in the graphene components, multiple layers of graphene can be printed, and a two-zone parallel connection can be used to ensure power.

[0043] In one embodiment, the fan assembly 1 is fixedly mounted on the heating module 3, and the air outlet of the fan assembly 1 corresponds to the air inlet of the air duct 4. The air outlet of the air duct 4 corresponds to the temperature control area and the electronic module 5 under test. Furthermore, the heating module 3 is located above the electronic module 5 under test, the fan assembly 1 is fixedly mounted on the upper surface of the heating module 3, and the air duct 4 includes a through hole that runs vertically through the heating module 3.

[0044] In one implementation, such as Figure 1 and Figure 2 As shown, in order to reduce the influence of the external environment on the temperature within the temperature control area, the heating module 3 in this embodiment also includes a heat insulation cover 2, which covers the electronic module 5 to be tested. The temperature control area is located between the heat insulation cover 2 and the electronic module 5 to be tested. The graphene component 30 is fixed inside the heat insulation cover 2, and the heat insulation cover 2 has an opening 20. The fan component 1 is fixed on the heat insulation cover 2 and corresponds to the opening 20.

[0045] Specifically, the heat shield 2 in this embodiment is made of a material with high heat insulation performance, such as asbestos. The specific shape of the heat shield 2 can be set according to the actual test environment. Generally speaking, the heat shield 2 includes at least walls distributed around the electronic module 5 to be tested, with the lower end of the walls fitting into the test equipment. The graphene component 30 is fixed inside the heat shield 2 and has a certain distance from the upper end of the heat shield 2 to facilitate gas flow. An opening 20 is provided at the upper end of the heat shield 2, and the fan component 1 is fixed at the upper end of the heat shield 2 and corresponds to the opening 20.

[0046] To achieve better cooling, an air vent is provided on the heat insulation cover 2 in this embodiment. In one embodiment, a one-way valve can be installed in the air vent, which allows only the gas inside the heat insulation cover 2 to flow outward, thereby reducing the influence of the external environment on the temperature within the temperature control area while facilitating the discharge of gas during the cooling process.

[0047] According to another aspect of the present invention, a testing device is provided, including the temperature control device described above and the electronic module 5 to be tested.

[0048] Furthermore, the electronic module under test 5 includes a memory module under test, which is electrically connected to the test motherboard. The test motherboard is connected to a temperature control module, which detects the temperature of the memory module under test through the test motherboard.

[0049] Specifically, in this embodiment, a heat-insulating space 6 can be formed on the test motherboard through a shell, the memory module to be tested is installed in the heat-insulating space 6, and the heat insulation cover 2 is placed on the memory module to be tested.

[0050] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A temperature control device for testing electronic modules, characterized in that, include: A heating module, comprising a heating surface for heating an electronic module to be tested arranged in a temperature control area, and an air duct provided on the heating module, the air duct passing through the heating surface so that the airflow passing through the air duct can be preheated; A fan assembly for guiding external airflow to the air duct and through the air duct into the temperature control zone.

2. The temperature control device for testing electronic modules according to claim 1, characterized in that, It also includes a temperature control module, which is used to detect the temperature of the electronic module under test and control the heating power of the heating module and the power of the fan assembly based on the temperature.

3. The temperature control device for testing electronic modules according to claim 1, characterized in that, The heating surface of the heating module can conduct heat through far-infrared radiation.

4. The temperature control device for testing electronic modules according to claim 3, characterized in that, The heating module includes a graphene component, and the air duct includes multiple through holes disposed on the graphene component.

5. The temperature control device for testing electronic modules according to claim 1, characterized in that, The fan assembly is fixed on the heating module. The air outlet of the fan assembly corresponds to the air inlet of the air duct. The air outlet of the air duct corresponds to the temperature control area and the electronic module under test.

6. The temperature control device for testing electronic modules according to claim 5, characterized in that, The heating module is located above the electronic module under test, the fan assembly is fixed to the upper surface of the heating module, and the air duct includes a through hole that runs vertically through the heating module.

7. The temperature control device for testing electronic modules according to claim 4, characterized in that, The heating module also includes a heat insulation cover, which is placed over the electronic module to be tested, and the temperature control area is located between the heat insulation cover and the electronic module to be tested. The graphene component is fixed inside the heat insulation cover, which has an opening. The fan component is fixed to the heat insulation cover and corresponds to the opening.

8. The temperature control device for testing electronic modules according to claim 7, characterized in that, The heat insulation cover is provided with vent holes.

9. A testing device, characterized in that, It includes the temperature control device as described in any one of claims 1 to 8 and the electronic module to be tested.

10. The testing equipment according to claim 9, characterized in that, The electronic module under test includes a memory module under test, which is electrically connected to the test motherboard. The test motherboard is connected to a temperature control module, which detects the temperature of the memory module under test through the test motherboard.

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