Etching antenna connection structure for NFC chip

Abstract

The utility model relates to the technical field of NFC chip tags, in particular to an etched antenna connecting structure for an NFC chip, which comprises a flexible substrate, an etched antenna is fixedly connected to the edge of the outer wall of the flexible substrate, two terminals are fixedly connected to the inner ring of the etched antenna, a chip is fixedly connected to the middle of the flexible substrate, and the chip is fixedly connected to the outer wall of the flexible substrate. One side, close to the terminal, of the chip is fixedly connected with two pins, the chip and the pins are connected with each other, one side, close to the terminal, of the chip is provided with a fixing mechanism used for reinforcing the joint of the terminal and the pins, and the top of the flexible substrate is provided with a protection mechanism used for protecting the etched antenna and the chip. Compared with the prior art, the structure can resist the influence of external force such as bending, collision, pulling and the like in the use process, prevents the connection part from loosening, breaking or falling off, avoids communication abnormity or failure, and is particularly suitable for long-time, multi-frequency and complex-environment flexible label application scenes such as logistics inventory and the like.

Description

Technical Field

[0001] This utility model relates to the field of NFC chip tag technology, and in particular to an etched antenna connection structure for NFC chips. Background Technology

[0002] Near Field Communication (NFC) is a short-range wireless communication technology widely used in access control, mobile payment, product anti-counterfeiting, and logistics information statistics. To enable NFC communication, an etched antenna is typically placed on the tag substrate and electrically connected to the NFC chip to complete energy reception and data signal transmission.

[0003] Existing NFC chip and etched antenna connections typically rely solely on conductive adhesive or solder for electrical bonding, lacking a dedicated fixing structure. In flexible tag applications, NFC chips are small, with finely detailed pads, and the etched antenna terminals are usually located on the surface of the flexible substrate, making the connection area structurally fragile. Because these connection methods primarily depend on adhesion or compression for fixation, lacking further restraint mechanisms, the connection is highly susceptible to loosening, breakage, or detachment during large-scale material inventory operations, especially under bending, collision, or pulling forces. This can lead to NFC tag communication abnormalities or complete failure. This connection method, lacking structural support, struggles to meet the reliability requirements of long-term, high-frequency use scenarios, particularly in areas like logistics inventory management where complex environments must be encountered, presenting significant technical shortcomings. Utility Model Content

[0004] The purpose of this invention is to propose an etched antenna connection structure for NFC chips, in order to solve the problem that electrical connection is achieved only through conductive adhesive or solder, which lacks a dedicated fixing structure. If external forces such as bending, collision, or pulling are applied, the connection is prone to loosening, breakage, or detachment, causing abnormal or complete failure of NFC tag communication.

[0005] To achieve the above objectives, this utility model provides an etched antenna connection structure for an NFC chip, comprising a flexible substrate, an etched antenna fixedly connected to the outer edge of the flexible substrate, two terminals fixedly connected to the inner ring of the etched antenna, a chip fixedly connected to the middle part of the flexible substrate, two pins fixedly connected to the side of the chip near the terminals, the chip and the pins being interconnected, a fixing mechanism for reinforcing the connection between the terminals and the pins being provided on the side of the chip near the terminals, and a protective mechanism for protecting the etched antenna and the chip being provided on the top of the flexible substrate.

[0006] Preferably, the fixing mechanism includes a fixing plate fixedly connected to the side near the terminal. The fixing plate is U-shaped, and receiving slots are provided on both sides of the top of the fixing plate. The pin is located inside the receiving slot. A receiving frame is fixedly connected to the inner wall edge of the receiving slot. The receiving frame is filled with conductive adhesive for fixing the connection between the pin and the terminal.

[0007] Preferably, the protective mechanism includes an epoxy resin layer fixedly connected to the top of the flexible substrate and the chip for reinforcing the etched antenna and terminals and the chip, a PI film layer for protecting the etched antenna and terminals and the chip fixedly connected to the top of the epoxy resin layer, and an elastic silicone pad for preventing the chip from being damaged by pressure fixedly connected between the chip and the epoxy resin layer.

[0008] Preferably, a PU tape is fixedly connected to the outer edge of the flexible substrate, and the epoxy resin adhesive layer and PI film layer are located inside the PU tape.

[0009] Preferably, the bottom of the flexible substrate is fixedly connected to an adhesive layer for attaching to the surface of an object, and a peel-off tab is provided at the bottom of the adhesive layer.

[0010] Preferably, after the conductive adhesive is filled into the receiving channel, it will fill the internal space of the receiving channel and the receiving frame and wrap around the connection between the terminal and the pin.

[0011] Preferably, the sidewall of the tear strip is fixedly connected with a tear-off tab for tearing the tear strip off from the bottom of the adhesive layer.

[0012] The beneficial effects of this utility model are:

[0013] 1. This etched antenna connection structure for NFC chips, through a connection mechanism including a fixing plate, a receiving slot, a receiving frame, and conductive adhesive, forms a composite structure with limiting, supporting, and protective functions. It effectively solves the problems of existing technologies where the NFC chip and etched antenna rely solely on conductive adhesive or solder for connection, resulting in a fragile structure susceptible to external damage. It also significantly enhances the mechanical stability and electrical reliability between pins and terminals. During use, this structure can resist external forces such as bending, collision, and pulling, preventing loosening, breakage, or detachment at the connection point, and avoiding communication abnormalities or failures. It is particularly suitable for flexible tag applications in long-term, high-frequency, and complex environments such as logistics inventory management, overcoming the technical defects of traditional connection methods that lack structural support, and significantly improving the durability and practicality of NFC tags.

[0014] 2. This invention discloses an etched antenna connection structure for NFC chips. By employing a multi-layered protective mechanism consisting of an epoxy resin layer, a PI film layer, an elastic silicone pad, PU tape, and an adhesive layer, the flexible tag achieves excellent structural protection while maintaining its flexibility. The epoxy resin layer comprehensively encapsulates the etched antenna, terminals, and chip, effectively enhancing adhesion strength and providing comprehensive protection against moisture, dust, and vibration. The PI film layer further enhances surface abrasion resistance and high-temperature resistance, preventing UV aging and mechanical damage. The elastic silicone pad acts as a buffer, effectively absorbing external impacts and preventing chip damage from pressure. The PU tape improves edge sealing and structural stability, preventing delamination of materials. This protective structure effectively withstands vibration, compression, and friction impacts in high-frequency, complex environments such as logistics inventory checks, significantly enhancing the environmental adaptability and reliability of the flexible tag, extending its service life, and meeting the stringent long-term stability requirements of practical applications. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention;

[0016] Figure 2 This is a schematic diagram of the three-dimensional structure of the PU tape and epoxy resin adhesive layer of this utility model;

[0017] Figure 3 This is a schematic diagram of the three-dimensional structure of the adhesive layer and the peel-off sheet of this utility model;

[0018] Figure 4 This is a three-dimensional structural diagram of the fixing mechanism of this utility model.

[0019] The diagram is marked as follows:

[0020] 1. Flexible substrate; 2. Etched antenna; 3. Terminal; 4. Chip; 5. Pin; 6. Fixing plate; 7. Receiving slot; 8. Receiving frame; 9. Conductive adhesive; 10. Epoxy resin adhesive layer; 11. PI film layer; 12. Elastic silicone pad; 13. PU tape; 14. Adhesive layer; 15. Peel-off sheet; 16. Easy-tear sheet. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments.

[0022] like Figures 1 to 4As shown, an etched antenna connection structure for an NFC chip includes a flexible substrate 1. An etched antenna 2 is fixedly connected to the outer edge of the flexible substrate 1. Two terminals 3 are fixedly connected to the inner ring of the etched antenna 2. A chip 4 is fixedly connected to the middle part of the flexible substrate 1. Two pins 5 are fixedly connected to the side of the chip 4 near the terminals 3. The chip 4 and the pins 5 are interconnected. A connection mechanism for reinforcing the connection between the terminals 3 and the pins 5 is provided on the side of the chip 4 near the terminals 3. A protective mechanism for protecting the etched antenna 2 and the chip 4 is provided on the top of the flexible substrate 1.

[0023] Further, see attached document. Figure 4 As shown, the connection mechanism includes a fixing plate 6 fixedly connected to the side near the terminal 3. The fixing plate 6 is U-shaped. Both sides of the top of the fixing plate 6 are provided with receiving slots 7. The pin 5 is located inside the receiving slots 7. The inner wall edge of the receiving slots 7 is fixedly connected to a receiving frame 8. The inside of the receiving frame 8 is filled with conductive adhesive 9 for fixing the connection between the pin 5 and the terminal 3.

[0024] Chip 4 is electrically connected to two terminals 3 of etched antenna 2 via two pins 5. To ensure the connection is stable and reliable, a fixing plate 6 is fixedly connected to the side of chip 4 near the terminals 3. The fixing plate 6 has a U-shaped structure and receiving slots 7 are provided on both sides of its top. The pins 5 pass through the receiving slots 7. To further prevent the pins 5 and terminals 3 from loosening during use, a receiving frame 8 is provided on the inner wall edge of the receiving slot 7. The frame is filled with conductive glue 9 to physically limit and protect the connection area, so that the force it receives will act on the fixing plate 6 and the receiving frame 8.

[0025] During assembly, conductive adhesive 9 is filled into the receiving groove 7 and further fills the internal space of the receiving frame 8. After curing, conductive adhesive 9 not only achieves electrical conductivity between terminal 3 and pin 5, but also completely wraps the contact area, reinforcing the mechanical stability of the connection point. Through this structure, pin 5 and terminal 3 no longer rely solely on traditional adhesion or welding methods for connection, but instead achieve a stable connection in a fixed structure with limiting, supporting and protecting functions. This effectively prevents breakage and detachment caused by bending, vibration or pulling, and significantly improves the structural integrity and reliability of the NFC circuit system in the flexible substrate 1.

[0026] Further, see attached document. Figure 2 As shown, the protective mechanism includes an epoxy resin layer 10 fixedly connected to the top of the flexible substrate 1 and the chip 4 for reinforcing the etched antenna 2, the terminal 3 and the chip 4. A PI film layer 11 for protecting the etched antenna 2, the terminal 3 and the chip 4 is fixedly connected to the top of the epoxy resin layer 10. An elastic silicone pad 12 for preventing the chip 4 from being damaged by pressure is fixedly connected between the chip 4 and the epoxy resin layer 10.

[0027] An epoxy resin adhesive layer 10 is disposed on top of the flexible substrate 1 and the chip 4. The epoxy resin adhesive layer 10 forms a covering and fixing layer for the etched antenna 2, terminal 3 and chip 4, which not only plays a structural bonding role, but also effectively prevents moisture, dust and vibration. The top of the epoxy resin adhesive layer 10 is covered with a PI film layer 11. This film layer has good high temperature resistance, mechanical flexibility and UV protection, providing an additional outer layer protection for the overall circuit structure and preventing wear and scratches.

[0028] Meanwhile, an elastic silicone pad 12 is placed between the chip 4 and the epoxy resin adhesive layer 10. The elastic silicone pad 12 acts as a buffer element to absorb external impact forces, preventing damage to the chip 4 due to compression. To enhance edge sealing stability, PU tape 13 is provided on the outer edge of the flexible substrate 1. The PU tape 13 seals the epoxy resin adhesive layer 10 and the PI film layer 11, effectively preventing edge detachment or delamination. During installation, an adhesive layer 14 is provided at the bottom of the flexible substrate 1 for attaching the overall label structure to the object surface. A tear-off tab 15 is also attached to the bottom of the adhesive layer 14. A tear-off tab 16 on its sidewall allows users to quickly remove the tear-off tab 15 before use, exposing the adhesive layer 14 to complete the installation. This overall protective mechanism significantly improves the product's protective capabilities while maintaining the characteristics of the flexible structure, giving the flexible label higher environmental adaptability and a longer service life, making it particularly suitable for frequent operation scenarios such as logistics inventory management.

[0029] Further, see attached document. Figure 2 As shown, a PU tape 13 is fixedly connected to the outer edge of the flexible substrate 1, and the epoxy resin adhesive layer 10 and the PI film layer 11 are located inside the PU tape 13.

[0030] This structure effectively enhances the overall sealing and structural stability of the circuit packaging area by placing PU tape 13 on the outer edge of the flexible substrate 1 to encapsulate the epoxy resin adhesive layer 10 and the PI film layer 11 inside. The PU tape 13 has good flexibility and adhesion, which can prevent the protection of the epoxy resin and PI film layer 11 from failing due to warping, peeling or delamination at the edges, thus improving the edge peel resistance.

[0031] Further, see attached document. Figure 3 As shown, the bottom of the flexible substrate 1 is fixedly connected to an adhesive layer 14 for sticking to the surface of an object. A tear strip 15 is provided at the bottom of the adhesive layer 14. A tear strip 16 for tearing off the tear strip 15 from the bottom of the adhesive layer 14 is fixedly connected to the side wall of the tear strip 15.

[0032] This structure, by setting an adhesive layer 14 at the bottom of the flexible substrate 1, and attaching a tear strip 15 and a quick-tear tab 16 below it, achieves effective protection before label installation and efficient operation during use. The adhesive layer 14 provides reliable adhesion, enabling the label to be firmly adhered to various object surfaces; the tear strip 15 prevents the adhesive layer 14 from being contaminated or prematurely sticking before use, ensuring its adhesive effect; the quick-tear tab 16 allows users to quickly remove the tear strip 15, completing the installation without the need for tools, improving ease of use and efficiency.

[0033] Further, see attached document. Figure 4 As shown, after the conductive adhesive 9 is filled into the receiving groove 7, it will fill the internal space of the receiving groove 7 and the receiving frame 8 and wrap the connection between the terminal 3 and the pin 5.

[0034] By injecting conductive adhesive 9 into the receiving groove 7 and further filling the internal space of the receiving frame 8, the connection area between the terminal 3 and the pin 5 is fully covered, which not only ensures stable electrical conduction, but also protects the cured conductive adhesive 9 through the receiving groove 7 and the receiving frame 8, significantly improving the mechanical strength and anti-detachment performance of the connection part.

[0035] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of the present invention (including the claims) is limited to these examples; within the framework of the present invention, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of the different aspects of the present invention as described above, which are not provided in the details for the sake of brevity.

[0036] This utility model is intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An etched antenna connection structure for an NFC chip, comprising a flexible substrate (1), an etched antenna (2) fixedly connected to the outer edge of the flexible substrate (1), two terminals (3) fixedly connected to the inner ring of the etched antenna (2), a chip (4) fixedly connected to the middle portion of the flexible substrate (1), two pins (5) fixedly connected to the side of the chip (4) near the terminals (3), and the chip (4) and the pins (5) being interconnected, characterized in that: The chip (4) is provided with a fixing mechanism for reinforcing the connection between the terminal (3) and the pin (5) on the side near the terminal (3), and a protective mechanism for protecting the etched antenna (2) and the chip (4) is provided on the top of the flexible substrate (1).

2. The etched antenna connection structure for an NFC chip according to claim 1, characterized in that, The fixing mechanism includes a fixing plate (6) fixedly connected to the side near the terminal (3). The fixing plate (6) is U-shaped. Both sides of the top of the fixing plate (6) are provided with receiving slots (7). The pin (5) is located inside the receiving slot (7). The inner wall edge of the receiving slot (7) is fixedly connected to a receiving frame (8). The inside of the receiving frame (8) is filled with conductive adhesive (9) for fixing the connection between the pin (5) and the terminal (3).

3. The etched antenna connection structure for an NFC chip according to claim 1, characterized in that, The protective mechanism includes an epoxy resin layer (10) fixedly connected to the top of the flexible substrate (1) and the chip (4) for reinforcing the etched antenna (2) and the terminal (3) and the chip (4). A PI film layer (11) for protecting the etched antenna (2) and the terminal (3) and the chip (4) is fixedly connected to the top of the epoxy resin layer (10). An elastic silicone pad (12) for preventing the chip (4) from being damaged by pressure is fixedly connected between the chip (4) and the epoxy resin layer (10).

4. The etched antenna connection structure for an NFC chip according to claim 3, characterized in that, The outer edge of the flexible substrate (1) is fixedly connected with PU tape (13), and the epoxy resin adhesive layer (10) and PI film layer (11) are located inside the PU tape (13).

5. The etched antenna connection structure for an NFC chip according to claim 1, characterized in that, The bottom of the flexible substrate (1) is fixedly connected to an adhesive layer (14) for attaching to the surface of an object, and a tear-off tab (15) is provided at the bottom of the adhesive layer (14).

6. The etched antenna connection structure for an NFC chip according to claim 2, characterized in that, After the conductive adhesive (9) is filled into the receiving channel (7), it will fill the internal space of the receiving channel (7) and the receiving frame (8) and wrap the connection between the terminal (3) and the pin (5).

7. The etched antenna connection structure for an NFC chip according to claim 5, characterized in that, The sidewall of the tear strip (15) is fixedly connected to a tear piece (16) for tearing the tear strip (15) off from the bottom of the adhesive layer (14).

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