Wave soldering preheating device and wave soldering device
By using a multi-directional moving drive component and a dual-layer heating mode in the preheating device, the problems of poor connection between the preheating device and other processes and high energy consumption are solved, thus achieving an efficient and stable welding process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FOSHAN PANLONG INTELLIGENT TECH CO LTD
- Filing Date
- 2025-03-21
- Publication Date
- 2026-05-15
AI Technical Summary
Existing preheating devices suffer from poor integration with other processes and high energy consumption, especially in automated welding equipment, leading to reduced efficiency.
The circuit board is moved in multiple directions by the first and second drive components respectively to create clearance space, and is flexibly connected with the heating device. The heating efficiency is improved by the dual-layer heating mode of the heater and the heating tube, and the heating process is precisely controlled by the temperature detection device.
It improves the integration of the preheating device with other processes, reduces energy consumption, increases heating efficiency and welding quality, and ensures stable movement of circuit boards and safe processes.
Smart Images
Figure CN224238440U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of welding technology, and more specifically, relates to a wave soldering preheating device and a wave soldering device. Background Technology
[0002] With the increasing sophistication and miniaturization of electronic components and the significant increase in circuit board wiring density, automated soldering processes, as a core component, face increasingly stringent requirements for soldering precision and uniformity. Against this backdrop, preheating has become one of the key methods to improve soldering results.
[0003] The preheating process primarily increases the temperature of the solder joint, effectively preventing premature solder solidification due to heat loss during soldering, thus ensuring uniform solder filling. Simultaneously, preheating also promotes the appropriate evaporation of additives or moisture in the flux on the circuit board surface, thereby enhancing flux activity and optimizing soldering quality.
[0004] However, existing preheating devices are often designed to work with automated welding equipment. To achieve closed-loop preheating, a box structure is typically used to enclose the circuit board, requiring continuous maintenance of the box temperature, which leads to high energy consumption. Another existing technology uses a drive component to clamp the circuit board and move it sequentially to each process station to complete the corresponding work. When the drive component has not reached the corresponding station, the station can only be in standby or off state, resulting in poor coordination between processes and reduced efficiency.
[0005] The above problems urgently need to be addressed. Utility Model Content
[0006] To address the aforementioned technical problems, this utility model provides a wave soldering preheating device and a wave soldering device, thereby solving the problems of poor integration between the preheating device and other processes and high energy consumption in the prior art.
[0007] To achieve the above objectives, this utility model is accomplished by the following specific technical means:
[0008] A wave soldering preheating device includes a frame, a heating device mounted on the frame, a first drive assembly, and a second drive assembly. The first and second drive assemblies are used to drive a circuit board to move up and down, left and right, and / or back and forth. The first drive assembly includes a first power output mechanism, a first circuit board clamp, and a first connecting bracket connecting the first power output mechanism and the first circuit board clamp. The second drive assembly includes a second power output mechanism, a second circuit board clamp, and a second connecting bracket connecting the second power output mechanism and the second circuit board clamp. A clearance space is formed between the running trajectories of the first and second drive assemblies.
[0009] Compared with the prior art, the present invention has the following beneficial effects:
[0010] Through the cooperation of the first and second drive components, the two drive components can independently connect the flux spraying process and the soldering process, respectively. During their movement, they can flexibly coordinate by relying on the clearance space, improving the connectivity between the preheating device and the preceding and following processes. Furthermore, based on the vertical movement performance of the drive components, the circuit board to be heated can be placed as close as possible to the heating device, resulting in higher heating efficiency. When the circuit board has completed flux spraying and is waiting for another circuit board to be soldered, heating can be initiated within a predicted timeframe, reducing energy consumption.
[0011] To facilitate the creation of clearance space, the first and second power output mechanisms can be configured in the following two ways:
[0012] The first type: Both the first power output mechanism and the second power output mechanism are located on the upper or lower part of the frame; the first connecting bracket and the second connecting bracket are in the form of an L-shape, and the first circuit board clamp and the second circuit board clamp are located at the horizontal end of the L-shape; the opening areas of the L-shape structure of the first connecting bracket and the second connecting bracket are arranged facing each other, so that when the first driving component and the second driving component are running, a clearance space is formed between the running trajectories of the first circuit board clamp and the second circuit board clamp.
[0013] The second configuration: the first power output mechanism is located on the upper part of the frame, the first connecting bracket extends downward, and the first circuit board clamp is located on the lower part of the first connecting bracket; the second power output mechanism is located on the lower part of the frame, the second connecting bracket extends upward, and the second circuit board clamp is located on the upper part of the second connecting bracket; this allows the first drive assembly and the second drive assembly to move away from each other during operation, forming a clearance space.
[0014] Furthermore, the heating device includes a warm air blower, a uniform air distribution plate, and a heating tube arranged from bottom to top.
[0015] Furthermore, the air distribution plate is flared to make the hot air spread more evenly.
[0016] Furthermore, the heating light tubes are provided in at least two form and arranged in an array, so that the heating light tubes in the corresponding area can be turned on according to the illumination area required to be covered by the circuit board.
[0017] Furthermore, the circuit board fixture is equipped with a temperature detection device, which can accurately monitor the heating temperature of the circuit board, providing a basis for turning the heating device on and off and adjusting its power.
[0018] This utility model also provides a wave soldering device with a preheating device, including a frame, a soldering device, a flux spraying device, a heating device, a first driving component and a second driving component mounted on the frame; the first driving component and the second driving component are used to drive the circuit board to move up and down, left and right, and back and forth to complete the corresponding process.
[0019] The location of the heating device can be chosen to be between the flux spraying device and the soldering device, or it can be located outside the spraying device and the soldering device, and can be flexibly adjusted according to the required number of heating devices and the installation space requirements.
[0020] Furthermore, the working area of the soldering device is higher than the working area of the heating device to prevent hot air from the heating device from blowing onto the working area of the soldering device, which could cause accelerated oxidation of the soldering device or misalignment of the solder joints. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the structure of a wave soldering preheating device according to the present invention;
[0022] Figure 2 This is a schematic diagram of the structure of a wave soldering device according to the present invention;
[0023] Figure 3 This is a schematic diagram illustrating the alternation of processes in this utility model.
[0024] In the diagram, the correspondence between component names and drawing numbers is as follows:
[0025] 11. Frame; 21. Heating device; 22. First drive assembly; 23. Second drive assembly; 31. Soldering device; 32. Flux spraying device; 41. First circuit board clamp; 42. Second circuit board clamp. Detailed Implementation
[0026] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.
[0027] Example 1:
[0028] like Figure 1 , 3As shown, this utility model provides a wave soldering preheating device, including a frame 11, on which a heating device 21, a first drive assembly 22, and a second drive assembly 23 are arranged in an orderly manner. The heating device 21 is responsible for providing the required heat to preheat the circuit board, which is an important step in achieving good soldering results. The first drive assembly 22 and the second drive assembly 23 drive the circuit board to move in multiple directions. They can drive the circuit board to move up and down, left and right, and / or back and forth in space. For example, when the circuit board enters the preheating process, the first drive assembly 22 may first drive the circuit board to move horizontally to directly below the heating device 21, and then move it up and down to gradually bring the circuit board closer to the heating device 21 to obtain a suitable preheating temperature.
[0029] The first drive assembly 22 includes a first power output mechanism that continuously outputs power to provide energy for the operation of subsequent components. The first circuit board clamp 41 holds the circuit board, preventing it from shaking or shifting during movement and ensuring its stable position in each process. A first connecting bracket, connecting the first power output mechanism and the first circuit board clamp 41, transmits the power generated by the first power output mechanism to the first circuit board clamp 41, thereby driving the circuit board. Simultaneously, the second drive assembly 23 also has a complete structure. The second power output mechanism acts as a power source, injecting power into the operation of the second drive assembly 23. The second circuit board clamp 42 stabilizes the other side of the circuit board, cooperating with the first circuit board clamp 41 to jointly ensure the stability of the circuit board during movement. The second connecting bracket connects the second power output mechanism and the second circuit board clamp 42, smoothly transmitting power to move the circuit board. During the operation of the first drive assembly 22 and the second drive assembly 23, a clearance space is formed between their running trajectories. As the pins on the circuit board move along with the board, during the transition between different processes, such as from flux spraying to preheating and then to soldering, the two drive components can cooperate with this clearance space to avoid collisions and interference, allowing the pins and other components on the circuit board to safely complete each process and ensuring the smooth progress of the entire wave soldering preheating process.
[0030] In the overall structure of the wave soldering preheating device, the first power output mechanism and the second power output mechanism can be positioned either together on the upper part of the frame 11 or simultaneously on the lower part of the frame 11. Meanwhile, the matching first and second connecting brackets both exhibit an L-shaped structure. In this structure, the first circuit board clamp 41 and the second circuit board clamp 42 are stably positioned at the horizontal end of the L-shaped structure, and the opening areas of the L-shaped structures of the first and second connecting brackets are positioned opposite each other. When the first drive assembly 22 and the second drive assembly 23 are activated, this arrangement ensures that the running trajectories of the first circuit board clamp 41 and the second circuit board clamp 42 have clearance space during movement. If the pins on one circuit board are being transported by the first circuit board clamp 41, while another circuit board is being driven forward by the second circuit board clamp 42, this clearance space allows them to effectively avoid each other, preventing collisions and ensuring the safe completion of the transport process.
[0031] Another layout involves the first power output mechanism located at the upper part of the frame 11, from which the first connecting bracket extends directly downwards, while the first circuit board clamp 41 is located at the lower part of the first connecting bracket. Correspondingly, the second power output mechanism is located at the lower part of the frame 11, the second connecting bracket extends upwards from below, and the second circuit board clamp 42 is located at the upper part of the second connecting bracket. When the first drive assembly 22 and the second drive assembly 23 operate, they can move away from each other in opposite directions, thus forming another type of clearance space. In actual operation, when different processes are performed alternately, this layout allows the two drive assemblies to move the circuit board, ensuring the safety of circuit board components such as pins and ensuring smooth connection between processes.
[0032] The heating device 21 consists of a heater, a fan distribution plate, and heating tubes arranged sequentially from bottom to top. The heater generates airflow, which passes through the fan distribution plate, which is flared to ensure even diffusion of the airflow. Simultaneously, the heating tubes radiate heat the circuit board, achieving a dual-layer heating effect. The radiating arrangement of the heating tubes provides comprehensive, all-around heating, while the heater continuously blows hot air, accelerating heat transfer from the circuit board surface. The heater and heating tubes work together; the heater penetrates the circuit board internally with radiant heat, while the heater envelops it externally with convective heat, resulting in dual-layer heating. This dual heating mode not only ensures more even heating of the circuit board but also significantly shortens preheating time, providing more ideal temperature conditions for subsequent soldering processes and further improving the overall performance of the wave soldering equipment. It also ensures that the heat generated by the heating tubes is more evenly transferred to the circuit board to be preheated. In addition, a temperature detection device is provided on the circuit board fixture. This device monitors the temperature of the circuit board at all times. Taking the area of the circuit board where the pins are located as an example, the data fed back by the temperature detection device can provide a basis for the opening, closing and power regulation of the heating device 21, so as to better meet the temperature requirements of the wave soldering preheating device at different stages.
[0033] Example 2: Welding Equipment Complete Unit
[0034] like Figure 2 As shown, a wave soldering apparatus utilizing the aforementioned preheating device has a core carrier, a frame 11, which supports various key components of the entire soldering system. On the frame 11, a soldering device 31, a flux spraying device 32, a heating device 21, a first drive assembly 22, and a second drive assembly 23 are arranged sequentially. The heating device 21 is positioned between the flux spraying device 32 and the soldering device 31, playing a crucial role in the entire soldering process. When the circuit board enters the wave soldering apparatus, it first reaches the flux spraying device 32, which evenly sprays flux onto the circuit board surface, creating favorable conditions for subsequent soldering steps. Subsequently, the first drive assembly 22 and the second drive assembly 23 begin operation, moving the circuit board vertically, horizontally, and forward and backward in space, transporting it to the heating device 21 for preheating. This ensures the circuit board is heated evenly across its entire surface, including the pins, preparing it for soldering. After preheating, the circuit board continues to move to the soldering device 31 for soldering.
[0035] The working area of the soldering device 31 is higher than the working area of the heating device 21. This height difference prevents the hot air generated by the heating device 21 from blowing directly onto the working area of the soldering device 31, effectively avoiding accelerated oxidation of the soldering device 31 due to the hot air, and also preventing problems such as solder joint misalignment, ensuring the stable and efficient operation of each process of the wave soldering device.
[0036] The embodiments of this utility model are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the utility model to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical applications of this utility model, and to enable those skilled in the art to understand this utility model and design various embodiments with various modifications suitable for a particular purpose.
Claims
1. A wave soldering preheating device, characterized in that: Includes a frame (11), a heating device (21) mounted on the frame (11), a first drive assembly (22) and a second drive assembly (23); The first driving component (22) and the second driving component (23) are used to drive the circuit board to move up and down, left and right and / or back and forth; The first drive assembly (22) includes a first power output mechanism, a first circuit board clamp (41), and a first connecting bracket connected between the first power output mechanism and the first circuit board clamp (41); The second drive assembly (23) includes a second power output mechanism, a second circuit board clamp, and a second connecting bracket connected between the second power output mechanism and the second circuit board clamp (42); There is a clearance space between the running trajectories of the first drive component (22) and the second drive component (23).
2. The wave soldering preheating device as described in claim 1, characterized in that: The first power output mechanism and the second power output mechanism are both located on the upper or lower part of the frame (11); The first connecting bracket and the second connecting bracket are in an L-shaped structure, and the first circuit board clamp (41) and the second circuit board clamp (42) are located at the horizontal end of the L-shaped structure; The L-shaped opening areas of the first connecting support and the second connecting bracket are arranged facing each other, so that when the first driving component (22) and the second driving component (23) are running, a clearance space is formed between the running trajectories of the first circuit board clamp (41) and the second circuit board clamp (42).
3. The wave soldering preheating device as described in claim 1, characterized in that: The first power output mechanism is located on the upper part of the frame (11), the first connecting bracket extends downward, and the first circuit board clamp (41) is located on the lower part of the first connecting bracket; The second power output mechanism is located at the lower part of the frame (11), the second connecting bracket extends upward, and the second circuit board clamp (42) is located at the upper part of the second connecting bracket; so that the first drive assembly (22) and the second drive assembly (23) can move away from each other during operation, forming a clearance space.
4. The wave soldering preheating device as described in claim 1, characterized in that: The heating device (21) includes a warm air blower, a uniform air plate, and a heating tube arranged from bottom to top.
5. The wave soldering preheating device as described in claim 4, characterized in that: The heating tubes are provided in at least two form and arranged in an array.
6. The wave soldering preheating device as described in claim 4, characterized in that: The air distribution plate is flared.
7. The wave soldering preheating device as described in claim 1, characterized in that: The circuit board fixture is equipped with a temperature detection device.
8. A wave soldering apparatus using the preheating device according to any one of claims 1-7, characterized in that: Includes a frame (11), a soldering device (31), a flux spraying device (32), a heating device (21), a first drive assembly (22), and a second drive assembly (23) mounted on the frame (11); The first driving component (22) and the second driving component (23) are used to drive the circuit board to move up and down, left and right, and forward and backward to complete the corresponding process.
9. The wave soldering apparatus as described in claim 8, characterized in that: The working area of the soldering device (31) is higher than the working area of the heating device (21).