Pick-and-place device and processing equipment
The automated placement of workpieces into molds via a pick-and-place device consisting of a support, implantation component, and transfer component solves the problems of high labor intensity and low output caused by manual workpiece placement, thereby improving the production efficiency and yield of electronic products.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FU TAI HUA IND SHENZHEN
- Filing Date
- 2025-05-30
- Publication Date
- 2026-05-15
AI Technical Summary
In the processing and assembly of electronic products, manually placing workpieces into molds is labor-intensive and inefficient, which can easily lead to low product yield and low output.
The device employs a pick-and-place mechanism that includes a support, an implantation component, and a transfer component. The first clamping component grips the workpiece, and the adsorption component adsorbs it. The transfer component drives the support to move, allowing the workpiece to be precisely implanted into the mold. Combined with a positioning device and an injection molding machine, automated injection molding is performed.
It improved workpiece insertion efficiency and product output, reduced manual labor intensity, and increased product yield.
Smart Images
Figure CN224240197U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of electronic product assembly technology, and specifically relates to a pick-and-place device and processing equipment. Background Technology
[0002] In the processing and assembly of electronic products, injection molding is involved. This process involves workers manually placing multiple parts into a mold, which is then injection molded to form the desired product. However, manually placing parts into the mold results in high labor intensity for workers, low efficiency, and a high risk of part misalignment, leading to lower product yield and output. Utility Model Content
[0003] In view of the above, it is necessary to provide a pick-and-place device and processing equipment that can increase product yield and efficiency.
[0004] Embodiments of this application provide a pick-and-place device, including a support, an implantation assembly, and a transfer assembly. The implantation assembly includes a first clamping member and an adsorption member. The first clamping member includes a first driving member and two first grippers. The first driving member is disposed on the support, and the two first grippers pass through the support. The first driving member is connected to the two first grippers and configured to drive the two first grippers to move relative to each other, causing the two first grippers to clamp or release a first workpiece. The adsorption member passes through the support and is configured to adsorb a second workpiece. The transfer assembly is connected to the support and is used to drive the support to move, enabling the implantation assembly to pick up the first and second workpieces and implant them into a mold.
[0005] In this application, the transfer component drives the support to move, enabling the implantation component to grip the first workpiece via the first clamping member and the suction member to pick up the second workpiece. The transfer component then drives the support to move, aligning the implantation component with the mold. At this point, the implantation component moves the first and second workpieces to the injection cavity of the mold. The first clamping member releases the first workpiece, and the suction member releases the second workpiece, allowing the implantation component to precisely implant the first and second workpieces into the mold, facilitating injection molding to obtain the desired product. Therefore, the aforementioned pick-and-place device can pick up the first and second workpieces and precisely implant them into the mold, exhibiting a high degree of automation. This reduces the labor intensity of workers, improves the implantation efficiency of the first and second workpieces, and increases product yield and productivity.
[0006] In some embodiments, the implantation assembly further includes a pressure member disposed on the support and configured to abut against the first workpiece when the first clamping member clamps the first workpiece; the pressure member is provided with a guide rod, and the support is provided with a pusher member configured to push the guide rod along a first direction so that the guide rod passes through the first workpiece, the first direction being parallel to the extension direction of the guide rod.
[0007] In some embodiments, the bracket is provided with a support frame, and the adsorption member is connected to an elastic member. The elastic member is elastically connected to the support frame, and the elastic member enables the adsorption member to move elastically relative to the bracket in a first direction.
[0008] In some embodiments, the adsorption member includes a main body and a suction nozzle connected to each other, and the adsorption member adsorbs the second workpiece through the suction nozzle; the support frame is slidably provided with a connecting rod, the connecting rod is fixedly provided to the main body, the elastic member is sleeved on the connecting rod, the connecting rod extends along a first direction, and the connecting rod moves relative to the support frame along the first direction when the elastic member elastically deforms.
[0009] In some embodiments, the pick-and-place device further includes a gripping assembly, which includes a second clamping member and a third clamping member both disposed on the bracket. The second clamping member is configured to clamp the first workpiece, and the third clamping member is configured to clamp the product after injection molding in the mold.
[0010] In some embodiments, the gripping assembly further includes a sensor disposed on the second clamping member, the sensor being configured to sense that the second clamping member is gripping the first workpiece.
[0011] In some embodiments, the support is provided with a first alignment member configured to insert into the mold, such that a first workpiece and a second workpiece in the implanted assembly correspond to the injection cavity of the mold.
[0012] In some embodiments, the bracket is provided with a first limiting member configured to abut against the mold to limit the distance between the bracket and the mold.
[0013] Embodiments of this application also provide a processing apparatus, including an injection molding machine, a mold, a positioning device, and a pick-and-place device as described in the previous embodiment. The positioning device is configured to position a first workpiece and a second workpiece to be processed. The mold is disposed in the injection molding machine and includes an injection cavity. The pick-and-place device can transfer the first workpiece and the second workpiece in the positioning device to the injection cavity. The injection molding machine performs injection molding into the injection cavity to obtain the desired product.
[0014] In this application, a pick-and-place device is used to pick up the first and second workpieces from the positioning device and transfer them to the injection cavity of the mold. The injection molding machine then injects the workpieces into the injection cavity to obtain the desired product. Finally, the pick-and-place device picks up the product. This process is highly automated, reduces the labor intensity of workers, and increases product output.
[0015] In some embodiments, the positioning device includes a carrier, a second alignment member, a second limiting member, and a plurality of limiting grooves. The second alignment member, the second limiting member, and the plurality of limiting grooves are all disposed on the carrier. The plurality of limiting grooves are configured to accommodate and position the first workpiece and the second workpiece. The second alignment member is configured to insert a bracket so that the limiting grooves can correspond to the implanted component. The second limiting member is configured to abut against the bracket to limit the distance between the carrier and the bracket. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of a processing device in one embodiment of this application.
[0017] Figure 2 yes Figure 1 Exploded view of the mold and product.
[0018] Figure 3 yes Figure 1 A schematic diagram of the positioning device and the pick-and-place device.
[0019] Figure 4 yes Figure 1 A schematic diagram of the pick-and-place device.
[0020] Figure 5 yes Figure 1 A schematic diagram of the pick-and-place device from another perspective.
[0021] Figure 6 yes Figure 4 A schematic diagram of the first clamping element clamping the first workpiece.
[0022] Figure 7 yes Figure 4 A schematic diagram of the gripping component holding the second workpiece and the material head.
[0023] Figure 8 yes Figure 4 A schematic diagram showing the connection between the middle pusher and the pressure plate.
[0024] Figure 9 yes Figure 4 A schematic diagram showing the connection between the adsorption component and the support frame.
[0025] Explanation of main component symbols
[0026] 100. Picking and placing device; 10. Bracket; 11. Support frame; 111. Connecting rod; 12. First alignment member; 13. First limiting member; 20. Implantation component; 21. First clamping member; 211. First driving member; 212. First gripper; 22. Adsorption member; 221. Main body; 222. Suction nozzle; 23. Pressing member; 231. Guide rod; 24. Pushing member; 25. Elastic member; 30. Transfer component; 40. Gripping component; 41. Second clamping member; 411, 421), second driving member; 412 (422), second gripper; 42. Third clamping member; 50. Sensing member; 200. Processing equipment; 210 2101. Positioning device; 2102. Bearing component; 2103. Limiting groove; 2104. Translation component; 2105. Linear drive module; 2106. Bearing platform; 2107. Clamping cylinder; 2108. Second alignment component; 2109. Second limiting component; 220. Mold; 2201. Third alignment component; 2202. Third limiting component; 2203. Injection cavity; 230. Injection molding machine; 240. Conveying component; 300. First workpiece; 310. Accessory; 320. Carrier; 3201. Groove; 3202. Protrusion; 3203. Guide hole; 400. Second workpiece; 500. Product; 510. Material head.
[0027] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation
[0028] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.
[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
[0030] In the description of the embodiments of this application, the technical terms "first", "second", etc. are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features.
[0031] In the description of the embodiments of this application, the term "perpendicular" is used to describe the ideal state between two components. In actual production or use, two components may be in a state that is approximately perpendicular. The term "parallel" is used to describe the ideal state between two components. In actual production or use, two components may be in a state that is approximately parallel.
[0032] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments.
[0033] In the processing and assembly of electronic products, injection molding is involved. This process involves workers manually placing multiple parts into a mold, which is then injection molded to form the desired product. However, manually placing parts into the mold results in high labor intensity for workers, low efficiency, and a high risk of part misalignment, leading to lower product yield and output.
[0034] Embodiments of this application provide a pick-and-place device, including a support, an implantation assembly, and a transfer assembly. The implantation assembly includes a first clamping member and an adsorption member. The first clamping member includes a first driving member and two first grippers. The first driving member is disposed on the support, and the two first grippers pass through the support. The first driving member is connected to the two first grippers and configured to drive the two first grippers to move relative to each other, causing the two first grippers to clamp or release a first workpiece. The adsorption member passes through the support and is configured to adsorb a second workpiece. The transfer assembly is connected to the support and is used to drive the support to move, enabling the implantation assembly to pick up the first and second workpieces and implant them into a mold.
[0035] In this application, the transfer component drives the support to move, enabling the implantation component to grip the first workpiece via the first clamping member and the suction member to pick up the second workpiece. The transfer component then drives the support to move, aligning the implantation component with the mold. At this point, the implantation component moves the first and second workpieces to the injection cavity of the mold. The first clamping member releases the first workpiece, and the suction member releases the second workpiece, allowing the implantation component to precisely implant the first and second workpieces into the mold, facilitating injection molding to obtain the desired product. Therefore, the aforementioned pick-and-place device can pick up the first and second workpieces and precisely implant them into the mold, exhibiting a high degree of automation. This reduces the labor intensity of workers, improves the implantation efficiency of the first and second workpieces, and increases product yield and productivity.
[0036] The embodiments of this application will be further described below with reference to the accompanying drawings. Unless otherwise specified, the various embodiments in this application can be combined with each other.
[0037] Please see Figure 1This application provides a processing apparatus 200, including a positioning device 210, a pick-and-place device 100, a mold 220, and an injection molding machine 230. The positioning device 210 is configured to position a first workpiece 300 and a second workpiece 400 to be processed. The pick-and-place device 100 is configured to pick up the first workpiece 300 and the second workpiece 400 from the positioning device 210 and move the first workpiece 300 and the second workpiece 400. See also... Figure 2 The mold 220 is located in the injection molding machine 230. The mold 220 includes an injection cavity 2203, which can accommodate and position the first workpiece 300 and the second workpiece 400. The injection molding machine 230 can perform injection molding into the injection cavity 2203. When the pick-and-place device 100 picks up the first workpiece 300 and the second workpiece 400 and transfers them into the injection cavity 2203, the desired product 500 can be obtained after injection molding by the injection molding machine 230.
[0038] In some embodiments, the injection molding machine 230 includes a lifting assembly (not shown) located below the mold 220, the lifting assembly being configured to eject the injection-molded product 500.
[0039] In some embodiments, the first workpiece 300 includes a component 310 and a carrier 320. The carrier 320 includes a groove 3201 for accommodating the component 310. During injection molding, the first workpiece 300 and the second workpiece 400 are placed in the injection cavity 2203 by the pick-and-place device 100. The sprue 510 is placed into the injection cavity 2203, and liquid material is injected into the injection cavity 2203 by the injection molding machine 230. After the liquid material in the injection cavity 2203 solidifies, the component 310 and the second workpiece 400 are both formed on the sprue 510, resulting in the desired product 500. That is, the product 500 includes the sprue 510, the component 310, and the second workpiece 400. In the illustrated embodiment, the product 500 includes one sprue 510, four components 310, and two second workpieces 400, with each carrier 320 accommodating one component 310.
[0040] The carrier 320 positions the accessory 310, preventing the accessory 310 from being too small to be easily gripped and moved. The carrier 320 is reusable, saving costs. The lifting assembly can eject the injection-molded product 500 and the carrier 320 separately.
[0041] In some embodiments, product 500 is an electronic product, including a voice call component in a smartwatch. Accessory 310 is a signal pin, and the second component 400 is a protective mesh.
[0042] Please see Figure 3In some embodiments, the processing equipment 200 further includes a conveyor 240, and the pick-and-place device 100 is capable of holding the product 500 ejected by the lifting assembly and transferring the product 500 to the conveyor 240, which is configured to output the product 500 to the next process.
[0043] In some embodiments, the positioning device 210 includes a carrier 2101 and a plurality of limiting grooves 2102. The plurality of limiting grooves 2102 are all disposed on the carrier 2101. Each limiting groove 2102 is configured to accommodate and position a first workpiece 300 or a second workpiece 400, so that the plurality of limiting grooves 2102 can accommodate and position the first workpiece 300 and the second workpiece 400, thereby fixing the first workpiece 300 and the second workpiece 400 relative to the carrier 2101.
[0044] In some embodiments, the positioning device 210 further includes a translation member 2103, which is connected to the side of the carrier 2101 facing away from the limiting groove 2102 and is configured to drive the carrier 2101 to move, thereby adjusting the position of the carrier 2101 so that the carrier 2101 can drive the first workpiece 300 and the second workpiece 400 to move closer to or away from the pick-and-place device 100.
[0045] In some embodiments, the translation component 2103 includes a linear drive module 21031 and a support platform 21032. The support platform 21032 is used to support and position the support component 2101. The linear drive module 21031 is fixedly connected to the support platform 21032 and drives the support component 2101 to move. The support platform 21032 is provided with two clamping cylinders 21033, which can clamp and fix the support component 2101. The linear drive module 21031 includes, but is not limited to, cylinders or linear guides.
[0046] Please combine Figure 1 and Figure 4 In some embodiments, the pick-and-place device 100 includes a support 10, an implantation component 20, and a transfer component 30. The implantation component 20 is disposed on the support 10 and is configured to pick up a first workpiece 300 and a second workpiece 400. The transfer component 30 is connected to the support 10 and drives the support 10 to move in three-dimensional space. When the transfer component 30 moves the support 10 to align the implantation component 20 with the positioning device 210, the implantation component 20 picks up the first workpiece 300 and the second workpiece 400 in the limiting groove 2102 of the positioning device 210; when the transfer component 30 moves the support 10 to align the implantation component 20 with the mold 220, the first workpiece 300 and the second workpiece 400 correspond to the injection cavity 2203 of the mold 220, at which point the implantation component 20 releases the first workpiece 300 and the second workpiece 400 so that the first workpiece 300 and the second workpiece 400 can be implanted into the injection cavity 2203.
[0047] In the illustrated embodiment, the transfer component 30 is a robotic arm. The robotic arm can move the support 10 in three-dimensional space, and it can also drive the support 10 to rotate.
[0048] Please see Figure 5 In some embodiments, the bracket 10 is provided with a first alignment member 12. A second alignment member 2104 is provided on the side of the bearing member 2101 facing away from the translation member 2103 (see [reference]). Figure 3 Mold 220 is provided with a third alignment member 2201 (see...) Figure 2 ).
[0049] When the implantation component 20 corresponds to the positioning device 210, the first alignment member 12 is inserted into the second alignment member 2104, and the implantation component 20 corresponds to the first workpiece 300 and the second workpiece 400, so that the implantation component 20 can accurately pick up the first workpiece 300 and the second workpiece 400.
[0050] When the implantation component 20 corresponds to the mold 220, the first alignment member 12 is inserted into the third alignment member 2201, so that the first workpiece 300 and the second workpiece 400 in the implantation component 20 correspond to the injection cavity 2203, thereby enabling the implantation component 20 to accurately implant the first workpiece 300 and the second workpiece 400 into the injection cavity 2203.
[0051] In some embodiments, the bracket 10 is provided with a first limiting member 13. A second limiting member 2105 is provided on the side of the support member 2101 facing away from the translation member 2103 (see figure). Figure 3 The mold 220 is equipped with a third limiting member 2202 (see...). Figure 2 ).
[0052] When the implanted module corresponds to the positioning device 210, the first limiting member 13 abuts against the second limiting member 2105 to prevent the distance between the bracket 10 and the bearing member 2101 from being too close and damaging the first workpiece 300 and the second workpiece 400.
[0053] When the implanted component 20 corresponds to the mold 220, the second alignment member 2104 abuts against the third alignment member 2201 to prevent the bracket 10 from being too close to the mold 220 and damaging the first workpiece 300 and the second workpiece 400.
[0054] In some embodiments, the first alignment member 12 is an alignment pin. The second alignment member 2104 and the third alignment member 2201 are alignment holes.
[0055] In some embodiments, the first limiting member 13 and the second limiting member 2105 are both limiting posts. The third limiting member 2202 is a limiting hole, and the second aligning member 2104 abuts against the inner bottom of the limiting hole.
[0056] Please combine Figures 4 to 6The implantation component 20 includes a first clamping member 21, which includes a first driving member 211 and two first grippers 212. The first driving member 211 is fixedly mounted on the bracket 10, and the two first grippers 212 pass through the bracket 10. The first driving member 211 connects to the two first grippers 212 and is configured to drive the two first grippers 212 to move relative to each other. When the first driving member 211 drives the two first grippers 212 to move closer to each other, the two first grippers 212 clamp the first workpiece 300 to pick up the material; when the first driving member 211 drives the two first grippers 212 to move away from each other, the two first grippers 212 release the first workpiece 300, allowing the first workpiece 300 to fall into the injection cavity 2203 under the action of gravity.
[0057] The implantation component 20 also includes an adsorption element 22. The adsorption element 22 passes through the support 10 and is configured to adsorb the second workpiece 400. The adsorption element 22 picks up the second workpiece 400, facilitating the transfer of the second workpiece 400 along with the support 10 to the injection cavity 2203.
[0058] When the implanted component 20 corresponds to the positioning device 210, the first clamping member 21 corresponds to the first workpiece 300, and the adsorption member 22 corresponds to the second workpiece 400.
[0059] Therefore, the above-mentioned pick-and-place device 100 can pick up the first workpiece 300 and the second workpiece 400, and accurately insert the first workpiece 300 and the second workpiece 400 into the injection cavity 2203 of the mold 220. It has a high degree of automation, which can reduce the labor intensity of workers, improve the insertion efficiency of the first workpiece 300 and the second workpiece 400, thereby increasing the output and yield of product 500.
[0060] Please combine Figure 4 , Figure 5 and Figure 7 In some embodiments, the pick-and-place device 100 further includes a gripping assembly 40, which includes a second clamping member 41 and a third clamping member 42. Both the second clamping member 41 and the third clamping member 42 are disposed on the bracket 10. The second clamping member 41 is configured to clamp the first workpiece 300. The third clamping member 42 is configured to clamp the material head 510.
[0061] By driving the support 10 to move via the transfer component 30, the gripping component 40 or the insertion component 20 can be selectively positioned to correspond to the mold 220. After the product 500 is injection molded and ejected, the gripping component 40 is positioned to correspond to the mold 220 via the transfer component 30. At this time, the second clamping member 41 can clamp the first workpiece 300, and the third clamping member 42 can clamp the material head 510. By driving the support 10 to move via the transfer component 30, the gripping component 40 moves the product 500 to the conveyor 240.
[0062] Therefore, the above-mentioned pick-and-place device 100 can also pick up the product 500 obtained after injection molding and transfer the product 500 to the conveyor 240. It has a high degree of automation, which can reduce the labor intensity of workers and improve the production efficiency of the product 500.
[0063] In some embodiments, both the second clamping member 41 and the third clamping member 42 include a second driving member 411 (421) and two second grippers 412 (422). The second driving member 411 (421) is fixedly disposed on the bracket 10, and the two second grippers 412 (422) pass through the bracket 10. The second driving member 411 (421) connects the two second grippers 412 (422) and is configured to drive the two second grippers 412 (422) to move relative to each other to clamp the product 500.
[0064] In some embodiments, the second drive member 411 (421) and the first drive member 211 are both slide cylinders.
[0065] Please see Figure 6 In some embodiments, the carrier 320 is provided with a protrusion 3202, which is located on the top of the carrier 320. When the first workpiece 300 is located in the injection cavity 2203, the protrusion 3202 is exposed in the injection cavity 2203; when the first workpiece 300 is located in the limiting groove 2102, the protrusion 3202 is exposed in the limiting groove 2102. The two first grippers 212 are configured to grip the protrusion 3202 when they are relatively close, thereby preventing the first gripper 21 from colliding with the positioning device 210 or the mold 220 when gripping or inserting the workpiece.
[0066] Please see Figure 7 In some embodiments, since the carrier 320 is ejected by the lifting assembly after injection molding, the second clamping member 41 can clamp the side wall of the carrier 320 more stably and move the carrier 320. Furthermore, the carrier 320 is prone to tilting during the ejection process by the lifting assembly, making it difficult to accurately clamp the protrusion 3202 using the second clamping member 41, which could lead to failure. Clamping the side wall of the carrier 320 using the second clamping member 41 is much easier.
[0067] Please combine Figure 4 and Figure 8 In some embodiments, the implantation component 20 further includes a pressure member 23 disposed on the lower surface of the support 10. When the transfer component 30 drives the support 10 to move to the position where the first clamping member 21 clamps the first workpiece 300, the pressure member 23 abuts against the upper surface of the first workpiece 300, that is, the pressure member 23 pushes the accessory 310 against the carrier 320, so that the accessory 310 is stably disposed in the groove 3201 to prevent the accessory 310 from falling out.
[0068] Driven by the transfer component 30, the bracket 10 can accurately push the first workpiece 300 into the injection cavity 2203 through the pressure member 23, which can prevent the first workpiece 300 from shifting during the process of falling into the injection cavity 2203 under the action of gravity.
[0069] Please see Figure 8 In some embodiments, a guide rod 231 is passed through the pressure member 23, and the guide rod 231 extends along a first direction X. The bracket 10 is provided with a pusher 24. The carrier 320 is provided with a guide hole 3203 (see...). Figure 2 Driven by the pusher 24, the guide rod 231 can pass through the guide hole 3203 to prevent the first workpiece 300 from shifting relative to the pressure member 23 when the first clamping member 21 clamps the first workpiece 300. The guide rod 231 moves along the guide hole 3203 when the pressure member 23 moves toward the injection cavity 2203 to prevent the first workpiece 300 from shifting relative to the pressure member 23 when the pressure member 23 pushes against the first workpiece 300.
[0070] In some embodiments, the pusher 24 is a slide cylinder.
[0071] In the illustrated embodiment, the first direction X is parallel to the extension direction of the guide rod 231. Specifically, the first direction X is parallel to the vertical direction, and the first direction X is the height direction of the limiting groove 2102 and the injection cavity 2203.
[0072] Please combine Figure 4 and Figure 9 In some embodiments, a support frame 11 is fixedly mounted on the bracket 10. An adsorption member 22 is connected to an elastic member 25. The elastic member 25 is elastically connected to the support frame 11. The elastic member 25 allows the adsorption member 22 to move elastically relative to the bracket 10 along a first direction X.
[0073] The elastic deformation of the elastic element 25 can adjust the distance between the adsorption element 22 and the mold 220 / positioning device 210 to accommodate different height differences, and can complete the suction and implantation of the second workpiece 400 even when there is an error in the distance between the adsorption element 22 and the mold 220 / positioning device 210.
[0074] When the adsorption member 22 picks up the second workpiece 400 in the positioning device 210, the transfer component 30 drives the bracket 10 to move along the first direction X, so that the adsorption member 22 abuts against the second workpiece 400 to the positioning component. At this time, the elastic member 25 is elastically compressed, and the adsorption member 22 can pick up the second workpiece 400.
[0075] When the second workpiece 400 is inserted into the mold 220, the adsorption member 22 drives the bracket 10 to move along the first direction X through the transfer component 30, so that the adsorption member 22 abuts against the second workpiece 400 to the mold 220. At this time, the elastic member 25 is elastically compressed, and the adsorption member 22 cancels the adsorption and can insert the second workpiece 400 into the injection cavity 2203 of the mold 220.
[0076] Therefore, the elastic element 25 can also provide elastic shock absorption when the adsorption element 22 abuts against the second workpiece 400 to the mold 220 / positioning assembly, so as to prevent the adsorption element 22, the second workpiece 400 and the mold 220 / positioning assembly from rigidly colliding and damaging the second workpiece 400.
[0077] Please see Figure 9 In some embodiments, the adsorption member 22 includes a main body 221 and a suction nozzle 222 connected together. The adsorption member 22 contacts and adsorbs the second workpiece 400 through the suction nozzle 222. A connecting rod 111 is slidably provided on the support frame 11, the connecting rod 111 is fixedly provided on the main body 221, and the connecting rod 111 extends along a first direction X. An elastic member 25 is sleeved on the connecting rod 111.
[0078] When the suction nozzle 222 abuts against the second workpiece 400 to the positioning assembly / mold 220, the connecting rod 111 moves away from the bracket 10 relative to the support frame 11, thereby elastically compressing the elastic element 25. The elastic element 25 rebounds, causing the connecting rod 111 to move towards the bracket 10 relative to the support frame 11, preparing for the next abutment against the second workpiece 400 to the positioning assembly / mold 220. By moving the connecting rod 111 relative to the support frame 11, the wobbling of the elastic element 25 during elastic deformation is prevented, allowing the suction nozzle 222 to more stably and accurately adsorb the second workpiece 400.
[0079] In some embodiments, the suction nozzle 222 is a long strip-shaped sheet structure to fit the second workpiece 400, thereby more stably adsorbing the second workpiece 400.
[0080] Please see Figure 7 In some embodiments, the gripping assembly 40 further includes a sensor 50. The sensor 50 is disposed on the second clamping member 41 and is configured to sense that the second clamping member 41 is gripping the first workpiece 300.
[0081] The sensor 50 senses whether the second clamping member 41 is clamping the first workpiece 300, so as to prevent the second clamping member 41 from missing the first workpiece 300, thereby preventing the carrier 320 from being left in the injection cavity 2203.
[0082] Please see Figure 8 In some embodiments, the pressure member 23 may also be connected to a sensor 50. The sensor 50 is configured to sense the presence of the first workpiece 300 within the limiting groove 2102. The sensor 50 senses whether the first workpiece 300 is present in the limiting groove 2102 to prevent the implantation assembly 20 from under-picking material.
[0083] In some embodiments, the sensing element 50 is a fiber optic sensor, which can use optical principles to detect the presence or absence of the first workpiece 300.
[0084] Furthermore, those skilled in the art should recognize that the above embodiments are merely illustrative of this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the essential spirit and scope of this application fall within the scope of this application's disclosure.
Claims
1. A pick-and-place device, characterized in that, include: support; An implantation component includes a first clamping member and an adsorption member. The first clamping member includes a first driving member and two first grippers. The first driving member is disposed on the support, and the two first grippers pass through the support. The first driving member is connected to the two first grippers and configured to drive the two first grippers to move relative to each other, so that the two first grippers clamp or release a first workpiece. The adsorption member passes through the support and is configured to adsorb a second workpiece. A transfer assembly is connected to the support and is used to move the support so that the implantation assembly can pick up the first workpiece and the second workpiece and implant the first workpiece and the second workpiece into the mold.
2. The pick-and-place device as described in claim 1, characterized in that, The implantation assembly further includes a pressure member disposed on the support, the pressure member being configured to abut against the first workpiece when the first clamping member clamps the first workpiece; The pressure member is provided with a guide rod, and the bracket is provided with a pushing member. The pushing member is configured to push the guide rod along a first direction, so that the guide rod passes through the first workpiece. The first direction is parallel to the extension direction of the guide rod.
3. The pick-and-place device as described in claim 1 or 2, characterized in that, The bracket is provided with a support frame, and the adsorption element is connected to an elastic element. The elastic element is elastically connected to the support frame, and the elastic element allows the adsorption element to move elastically relative to the bracket in a first direction.
4. The pick-and-place device as described in claim 3, characterized in that, The adsorption element includes a main body and a suction nozzle connected together, and the adsorption element adsorbs the second workpiece through the suction nozzle; The support frame is slidably provided with a connecting rod, the connecting rod is fixedly provided to the main body, the elastic element is sleeved on the connecting rod, the connecting rod extends along the first direction, and the connecting rod moves relative to the support frame along the first direction when the elastic element elastically deforms.
5. The pick-and-place device as described in claim 1, characterized in that, The pick-and-place device further includes a gripping assembly, which includes a second clamping member and a third clamping member both disposed on the bracket. The second clamping member is configured to clamp the first workpiece, and the third clamping member is configured to clamp the product after injection molding in the mold.
6. The pick-and-place device as described in claim 5, characterized in that, The gripping component further includes a sensor disposed on the second clamping member, the sensor being configured to sense the second clamping member gripping the first workpiece.
7. The pick-and-place device as described in claim 1, characterized in that, The bracket is provided with a first alignment member, which is configured to insert into the mold so that the first workpiece and the second workpiece in the implanted assembly correspond to the injection cavity of the mold.
8. The pick-and-place device as described in claim 1, characterized in that, The bracket is provided with a first limiting member, which is configured to abut against the mold to limit the distance between the bracket and the mold.
9. A processing device, characterized in that, The invention includes an injection molding machine, a mold, a positioning device, and a pick-and-place device as described in any one of claims 1 to 8, wherein the positioning device is configured to position a first workpiece and a second workpiece to be processed, the mold is disposed in the injection molding machine, the mold includes an injection cavity, the pick-and-place device is capable of transferring the first workpiece and the second workpiece in the positioning device to the injection cavity, and the injection molding machine performs injection molding into the injection cavity to obtain the desired product.
10. The processing equipment as described in claim 9, characterized in that, The positioning device includes a carrier, a second alignment member, a second limiting member, and a plurality of limiting grooves. The second alignment member, the second limiting member, and the plurality of limiting grooves are all disposed on the carrier. The plurality of limiting grooves are configured to accommodate and position the first workpiece and the second workpiece. The second alignment member is configured to insert into the bracket so that the limiting grooves correspond to the implanted component. The second limiting member is configured to abut against the bracket to limit the distance between the carrier and the bracket.