Circuit board with anti-interference structure

Abstract

The utility model relates to the technical field of mobile phone main boards, and discloses a circuit board with an anti-interference structure, which comprises a base and an anti-interference block arranged on one side of the top surface of the base. Through the arrangement of the base, the mounting groove, the mobile phone mainboard, the blocking mechanism, the positioning mechanism and the auxiliary mechanism, the mobile phone mainboard is firstly mounted in the mounting groove, the movable plate is moved to drive the positioning rod to move, then the mounting plate is moved onto the mobile phone mainboard, the positioning plate is moved into the positioning groove, and the movable plate is loosened, so that the mobile phone mainboard is positioned. When the mobile phone mainboard needs to be taken out, the movable plate is moved, the positioning plate is separated from the positioning rod, the positioning plate is ejected out through the ejection spring, and therefore the mobile phone mainboard is taken out, and the problems that in the prior art, the mobile phone mainboard is inconvenient to install on a mobile phone, and the mobile phone mainboard is inconvenient to install are solved. Other tools need to be matched for installation, the process operation is complex, and the installation efficiency is reduced.

Description

Technical Field

[0001] This utility model relates to the field of mobile phone motherboard technology, and in particular to a circuit board with an anti-interference structure. Background Technology

[0002] The mobile phone circuit board is the core part of the mobile phone. Its importance lies in the integration of hardware components and the realization of functions. Through the cooperation of key components such as processor, memory, power management module, and radio frequency module, it provides users with a stable and efficient smartphone experience.

[0003] The applicant discovered through a search that a Chinese patent, "A High-Precision Anti-Interference Circuit Board for Mobile Phones," with publication number "CN213521963U," discloses a casing. The casing includes an impedance plate fixedly mounted on its top and bottom, an impedance-embedded block fixedly mounted on its inner wall, a fixing block fixedly mounted inside the casing, and a circuit board body fixedly mounted inside the fixing block. Heat dissipation fins are fixedly sleeved inside the impedance plate. This high-precision anti-interference circuit board for mobile phones, by incorporating the impedance plate and impedance-embedded block, utilizes ferrite material, which has excellent anti-interference properties, to reduce high-intensity magnetic field interference generated by electronic components during operation. This ensures a good working environment for the circuit board body, improves its operating speed and lifespan, and thus increases the practicality of the mobile phone circuit board.

[0004] The motherboard is a crucial core component of a mobile phone. The problem with the aforementioned technology is that, in the current technology, the motherboard is not easy to install on the phone and requires the use of other tools for installation, which is complicated and reduces installation efficiency. Utility Model Content

[0005] The purpose of this utility model is to provide a circuit board with an anti-interference structure to solve the problem mentioned in the background art that mobile phone motherboards need to be installed with the help of other tools, which is complicated and reduces installation efficiency.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a circuit board with an anti-interference structure, including a base and an anti-interference block provided on one side of the top surface of the base. The top of the base has a mounting groove, and a mobile phone motherboard is installed in the inner cavity of the mounting groove. A blocking mechanism is installed on the opposite sides of the inner wall of the mounting groove. A positioning mechanism is installed on the top surface of the inner wall of the mounting groove. An auxiliary mechanism is installed on the top of the base. The surface of the mobile phone motherboard is movably mounted on the inner wall of the mounting groove.

[0007] Preferably, the blocking mechanism includes a mounting plate, a connecting plate, and a mounting rod. One end of the mounting rod is fixedly mounted to one side of the inner wall of the mounting groove. The middle part of the connecting plate is mounted on the surface of the mounting rod. The bottom of the mounting plate is movably mounted to the top of the mounting groove. The bottom of the mounting plate is movably mounted to the top of the mobile phone motherboard. The rear side of the connecting plate is movably connected to the surface of the mounting plate via a rotating shaft.

[0008] Preferably, the positioning mechanism includes a positioning groove, a positioning rod, and a positioning spring. The bottom of the positioning groove is fixedly installed on the top surface of the inner wall of the mounting groove. The surface of the positioning rod is movably installed in the middle of the positioning groove. One end of the positioning spring is fixedly installed on the right side of the positioning groove, and the other end of the positioning spring is fixedly installed on the right side of the positioning rod. The positioning spring is sleeved on the surface of the positioning rod.

[0009] Preferably, the auxiliary mechanism includes a support plate, a movable rod, and a movable plate. The bottom of the support plate is fixedly installed on one side of the top surface of the inner wall of the mounting groove. The left side of the movable rod is fixedly installed on the right side of the positioning rod. The surface of the movable rod is movably installed in the middle of the support plate. The left side of the movable plate is fixedly installed on the right side of the movable rod.

[0010] Preferably, an ejector plate is installed in the inner cavity of the positioning groove, an ejector spring is installed at the bottom of the ejector plate, the bottom of the ejector spring is fixedly installed at the top of the mounting groove, and the surface of the ejector plate is movably installed on the inner wall of the positioning groove.

[0011] Preferably, a positioning plate is mounted on the surface of the mounting plate, the surface of the positioning plate is movably mounted on the inner wall of the positioning groove, the bottom of the positioning plate is movably mounted on the top of the ejector plate, and the left side of the positioning rod is movably mounted in the inner cavity of the positioning plate.

[0012] Preferably, the connecting plate has a groove in the middle, and the surface of the mounting rod is movably mounted on the inner wall of the groove.

[0013] The technical effects and advantages of this utility model are as follows: This utility model, by setting a base, mounting slot, mobile phone motherboard, blocking mechanism, positioning mechanism, and auxiliary mechanism, first installs the mobile phone motherboard inside the mounting slot. A displacement moving plate moves the positioning rod, then the mounting plate moves onto the mobile phone motherboard, and the positioning plate moves into the positioning slot. The moving plate is released, and the positioning rod moves onto the positioning plate, thus installing the mobile phone motherboard. When it is necessary to remove the mobile phone motherboard, the moving plate is moved, the positioning plate separates from the positioning rod, and a push-out spring pushes the positioning plate out, thus removing the mobile phone motherboard. This solves the problem in the prior art where the mobile phone motherboard is inconvenient to install on the phone, requiring the use of other tools for installation, resulting in a complex process and reduced installation efficiency. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall three-dimensional structure provided in an embodiment of the present utility model;

[0015] Figure 2 This is a three-dimensional structural diagram of the blocking mechanism provided in an embodiment of the present utility model;

[0016] Figure 3 This is a three-dimensional structural diagram of the auxiliary mechanism provided in an embodiment of the present utility model;

[0017] Figure 4 This is a three-dimensional structural diagram of the positioning mechanism provided in an embodiment of the present utility model.

[0018] In the diagram: 1. Base; 2. Mounting slot; 3. Mobile phone motherboard; 4. Blocking mechanism; 401. Mounting plate; 402. Connecting plate; 403. Mounting rod; 5. Positioning mechanism; 501. Positioning slot; 502. Positioning rod; 503. Positioning spring; 6. Auxiliary mechanism; 601. Support plate; 602. Moving rod; 603. Moving plate; 7. Ejection plate; 8. Ejection spring; 9. Positioning plate; 10. Slide groove. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] This utility model provides, for example Figure 1-4The circuit board shown includes a base 1 and an anti-interference block 11 on one side of the top surface of the base 1. A mounting groove 2 is formed on the top of the base 1. A mobile phone motherboard 3 is installed inside the cavity of the mounting groove 2. A blocking mechanism 4 is installed on opposite sides of the inner wall of the mounting groove 2. A positioning mechanism 5 is installed on the top surface of the inner wall of the mounting groove 2. An auxiliary mechanism 6 is installed on the top of the base 1. The surface of the mobile phone motherboard 3 is movably mounted on the inner wall of the mounting groove 2. First, the mobile phone motherboard 3 is installed inside the mounting groove 2. A displacement plate 603 is used to move the positioning rod 502. Move the mounting plate 401 to the phone motherboard 3, move the positioning plate 9 into the positioning slot 501, release the moving plate 603, and move the positioning rod 502 onto the positioning plate 9, thereby installing the phone motherboard 3. When it is necessary to remove the phone motherboard 3, move the moving plate 603, separate the positioning plate 9 from the positioning rod 502, and push the positioning plate 9 out through the ejection spring 8, thereby removing the phone motherboard 3. This solves the problem in the existing technology that the phone motherboard 3 is not convenient to install on the phone, requires the use of other tools for installation, and the process is complicated and reduces installation efficiency.

[0021] like Figure 2-3 As shown, the blocking mechanism 4 includes a mounting plate 401, a connecting plate 402, and a mounting rod 403. One end of the mounting rod 403 is fixedly installed on one side of the inner wall of the mounting groove 2. The middle part of the connecting plate 402 is installed on the surface of the mounting rod 403. The bottom of the mounting plate 401 is movably installed on the top of the mounting groove 2. The bottom of the mounting plate 401 is movably installed on the top of the mobile phone motherboard 3. The rear side of the connecting plate 402 is movably connected to the surface of the mounting plate 401 via a rotating shaft. The positioning mechanism 5 includes a positioning groove 501, a positioning rod 502, and a positioning spring 503. The bottom of the positioning groove 501 is fixedly installed on the top surface of the inner wall of the mounting groove 2. The surface of the positioning rod 502 is movably installed in the middle of the positioning groove 501. One end of the positioning spring 503 is fixedly installed on the right side of the positioning groove 501. The other end of the positioning spring 503 is fixedly installed on the right side of the positioning rod 502. The positioning spring 503 is sleeved on the surface of the positioning rod 502.

[0022] like Figure 2As shown, the auxiliary mechanism 6 includes a support plate 601, a moving rod 602, and a moving plate 603. The bottom of the support plate 601 is fixedly installed on one side of the top surface of the inner wall of the mounting groove 2. The left side of the moving rod 602 is fixedly installed on the right side of the positioning rod 502, and the surface of the moving rod 602 is movably installed in the middle of the support plate 601. The left side of the moving plate 603 is fixedly installed on the right side of the moving rod 602. An ejector plate 7 is installed in the inner cavity of the positioning groove 501, and an ejector spring 8 is installed at the bottom of the ejector plate 7. The bottom of the ejector spring 8 is fixedly installed at the top of the mounting groove 2. The surface of the ejector plate 7 is movably mounted on the inner wall of the positioning groove 501. The surface of the mounting plate 401 is equipped with a positioning plate 9, the surface of the positioning plate 9 is movably mounted on the inner wall of the positioning groove 501, the bottom of the positioning plate 9 is movably mounted on the top of the ejector plate 7, and the left side of the positioning rod 502 is movably mounted in the inner cavity of the positioning plate 9.

[0023] The working principle of this utility model is as follows: In use, the mobile phone motherboard 3 is first placed inside the mounting slot 2. The displacement moving plate 603 moves the moving rod 602, which in turn moves the positioning rod 502. Then, the mounting plate 401 is installed on the mobile phone motherboard 3. While the mounting plate 401 is located at the top of the mobile phone motherboard 3 to achieve a pre-pressing effect, the positioning plate 9 is installed in the positioning slot 501. The moving plate 603 is released, and the positioning rod 502 moves onto the positioning plate 9, thereby fixing the mobile phone motherboard 3 so that it will not shift. At the same time, while the mobile phone motherboard 3 is installed inside the mounting slot 2, the bottom surface of the mounting slot 2 has four sides with matching embedding slots on the four sides of the surface of the mobile phone motherboard 3. When the mobile phone motherboard 3 is clamped and installed, it can be stably connected through the embedding slots.

[0024] However, when it is necessary to remove the mobile phone motherboard 3, the displacement plate 603 moves the moving rod 602, which in turn moves the positioning rod 502. The positioning rod 502 separates from the positioning plate 9. With the cooperation of the ejection spring 8, the ejection spring 8 moves the ejection plate 7, which pushes out the positioning plate 9, thus facilitating the removal of the mobile phone motherboard 3.

[0025] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A circuit board with an anti-interference structure, comprising a base (1) and an anti-interference block (11) disposed on one side of the top surface of the base (1), characterized in that: The top of the base (1) is provided with an installation groove (2), the inner cavity of the installation groove (2) is provided with a mobile phone motherboard (3), the opposite sides of the inner wall of the installation groove (2) are jointly provided with a blocking mechanism (4), the top surface of the inner wall of the installation groove (2) is provided with a positioning mechanism (5), the top of the base (1) is provided with an auxiliary mechanism (6), and the surface of the mobile phone motherboard (3) is movably installed on the inner wall of the installation groove (2).

2. The circuit board with an anti-interference structure as described in claim 1, characterized in that: The blocking mechanism (4) includes a mounting plate (401), a connecting plate (402), and a mounting rod (403). One end of the mounting rod (403) is fixedly installed on one side of the inner wall of the mounting groove (2). The middle part of the connecting plate (402) is installed on the surface of the mounting rod (403). The bottom of the mounting plate (401) is movably installed on the top of the mounting groove (2). The bottom of the mounting plate (401) is movably installed on the top of the mobile phone motherboard (3). The rear side of the connecting plate (402) is movably connected to the surface of the mounting plate (401) through a rotating shaft.

3. A circuit board with an anti-interference structure as described in claim 2, characterized in that: The positioning mechanism (5) includes a positioning groove (501), a positioning rod (502), and a positioning spring (503). The bottom of the positioning groove (501) is fixedly installed on the top surface of the inner wall of the mounting groove (2). The surface of the positioning rod (502) is movably installed in the middle of the positioning groove (501). One end of the positioning spring (503) is fixedly installed on the right side of the positioning groove (501), and the other end of the positioning spring (503) is fixedly installed on the right side of the positioning rod (502). The positioning spring (503) is sleeved on the surface of the positioning rod (502).

4. A circuit board with an anti-interference structure as described in claim 3, characterized in that: The auxiliary mechanism (6) includes a support plate (601), a moving rod (602), and a moving plate (603). The bottom of the support plate (601) is fixedly installed on one side of the top surface of the inner wall of the mounting groove (2). The left side of the moving rod (602) is fixedly installed on the right side of the positioning rod (502). The surface of the moving rod (602) is movably installed on the middle part of the support plate (601). The left side of the moving plate (603) is fixedly installed on the right side of the moving rod (602).

5. A circuit board with an anti-interference structure as described in claim 3, characterized in that: The inner cavity of the positioning groove (501) is equipped with an ejector plate (7), and the bottom of the ejector plate (7) is equipped with an ejector spring (8). The bottom of the ejector spring (8) is fixedly installed on the top of the mounting groove (2), and the surface of the ejector plate (7) is movably installed on the inner wall of the positioning groove (501).

6. A circuit board with an anti-interference structure as described in claim 4, characterized in that: The mounting plate (401) is equipped with a positioning plate (9), the surface of the positioning plate (9) is movably mounted on the inner wall of the positioning groove (501), the bottom of the positioning plate (9) is movably mounted on the top of the ejector plate (7), and the left side of the positioning rod (502) is movably mounted in the inner cavity of the positioning plate (9).

7. A circuit board with an anti-interference structure as described in claim 2, characterized in that: The connecting plate (402) has a groove (10) in the middle, and the surface of the mounting rod (403) is movably mounted on the inner wall of the groove (10).

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