High-frequency transmission flexible circuit board for communication equipment
By incorporating shielding and heat dissipation mechanisms on the flexible circuit board, the problems of signal loss and heat accumulation in high-frequency environments are solved, thereby improving signal quality and extending the lifespan of the circuit board.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN JIARUIJUN NEW MATERIAL TECH CO LTD
- Filing Date
- 2025-05-24
- Publication Date
- 2026-05-15
AI Technical Summary
In high-frequency environments, the skin effect of flexible circuit boards causes current to concentrate on the conductor surface, increasing conductor resistance, leading to increased signal loss and reduced communication quality.
A shielding mechanism and a heat dissipation mechanism are set on the flexible circuit board. The shielding mechanism blocks electromagnetic interference through components such as positioning plates, limit rods and copper foil, while the heat dissipation mechanism increases the heat dissipation area through heat dissipation copper pillars and heat dissipation fins, thereby solving the problems of signal loss and heat accumulation respectively.
It effectively reduces signal loss, ensures communication quality, and extends the lifespan of the circuit board by increasing the heat dissipation area.
Smart Images
Figure CN224249896U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of flexible circuit board technology, specifically a flexible circuit board for high-frequency transmission in communication equipment. Background Technology
[0002] Flexible printed circuit boards (FPCs), also known as "flexible boards," are printed circuits made of flexible insulating substrates. Due to their unique advantages of being flexible, thin, and having high wiring density, FPCs have been widely used in drones and aircraft data loggers.
[0003] The electromagnetic environment in which drones and aircraft data loggers operate is extremely complex, with numerous sources of electromagnetic interference. In high-frequency environments, the skin effect causes current to concentrate primarily on the conductor surface, increasing conductor resistance, exacerbating signal loss, and reducing communication quality. Utility Model Content
[0004] The purpose of this invention is to provide a flexible circuit board for high-frequency transmission in communication equipment, in order to solve the problem mentioned in the background art that, in a high-frequency environment, the skin effect of the flexible circuit board causes the current to mainly concentrate on the conductor surface, which increases the conductor resistance, aggravates signal loss, and reduces communication quality.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a flexible circuit board for high-frequency transmission in communication equipment, comprising a circuit board body, a shielding mechanism disposed on the surface of the circuit board body, the shielding mechanism comprising a positioning plate, the positioning plate being fixedly connected to the bottom of the circuit board body, a first spring being fixedly connected to the surface of the positioning plate, a first limiting rod being fixedly connected to the surface of the first spring, the first limiting rod being slidably connected to the surface of the positioning plate, a limiting block being inserted into the positioning plate, a copper foil being fixedly connected to the surface of the limiting block, a paddle being fixedly connected to the bottom of the limiting block, and the copper foil covering the surface of the circuit board body.
[0006] Preferably, a heat dissipation mechanism is provided at the bottom of the circuit board body. The heat dissipation mechanism includes a heat dissipation groove, which is formed at the bottom of the circuit board body. A heat dissipation copper pillar is inserted into the surface of the heat dissipation groove. A heat dissipation fin is fixedly connected to the bottom of the heat dissipation copper pillar. A guide block is fixedly connected to the bottom of the circuit board body. A second spring is fixedly connected to the surface of the guide block. A second limiting rod is fixedly connected to the surface of the second spring. The second limiting rod is slidably connected to the surface of the guide block.
[0007] Preferably, the positioning plates are provided in multiple sets and are arranged linearly and evenly on both sides of the bottom of the circuit board body, and the limiting blocks are provided in multiple sets and are arranged linearly and evenly on both sides of the copper foil. The positioning plates have grooves on their surfaces, and the limiting blocks are inserted into the grooves of the positioning plates.
[0008] Preferably, guide holes are provided on both sides of the groove of the positioning plate, the first limiting rod slides on the guide holes of the positioning plate, and the elastic force of the first spring acts on the first limiting rod.
[0009] Preferably, a limiting hole is formed on the surface of the limiting block, and the first limiting rod passes through the limiting hole of the limiting block in the groove of the positioning plate. The first limiting rod restricts the position of the copper foil on the circuit board body through the limiting block.
[0010] Preferably, the heat dissipation grooves are provided in multiple sets, and the heat dissipation copper pillars restrict the installation position of the heat dissipation fins on the bottom of the circuit board body through the heat dissipation grooves. A limiting groove is provided on one side of the heat dissipation copper pillars.
[0011] Preferably, a guide hole is formed on the surface of the guide block, the elastic force of the second spring acts on the second limiting rod, the second limiting rod slides on the guide hole of the guide block, and the second limiting rod is inserted into the limiting groove of the heat dissipation copper pillar.
[0012] Compared with the prior art, the beneficial effects of this utility model are:
[0013] 1. In this flexible circuit board, the limiting block is inserted into the groove of the positioning plate, and the first limiting rod is slid into the groove of the positioning plate by the elastic force of the first spring, and the first limiting rod passes through the limiting hole of the limiting block. At this time, the first limiting rod restricts the position of the limiting block at the bottom of the circuit board body, and restricts multiple sets of limiting blocks on the copper foil. The multiple sets of limiting blocks stably restrict the copper foil on the surface of the circuit board body, effectively blocking external electromagnetic interference from the back of the circuit board body, reducing signal loss, and ensuring communication quality.
[0014] 2. In this flexible circuit board, heat dissipation copper pillars are inserted into the heat dissipation groove. The limiting groove of the heat dissipation copper pillar is aligned with one side of the second limiting rod. The second spring causes the second limiting rod to slide on the guide hole of the guide block to the limiting groove of the heat dissipation copper pillar. At this time, the second limiting rod restricts the heat dissipation copper pillar on the heat dissipation groove, thereby restricting the heat dissipation fins to the bottom of the heat dissipation groove. The heat dissipation fins expand the heat dissipation range of the heat dissipation groove at the bottom of the circuit board body, avoiding the circuit board body temperature from being too high due to heat accumulation, thus extending the service life of the circuit board body. Attached Figure Description
[0015] Figure 1 This is a three-dimensional front view of the structure of this utility model;
[0016] Figure 2 This is a three-dimensional structural diagram of the present invention, viewed from the front and from below.
[0017] Figure 3 This utility model Figure 2 Enlarged structural diagram at point A;
[0018] Figure 4 This is a rear cross-sectional exploded view of the connection structure of the shielding mechanism of this utility model;
[0019] Figure 5 This is a frontal cross-sectional exploded view of the heat dissipation mechanism of this utility model.
[0020] In the diagram: 1. Circuit board body; 2. Positioning plate; 21. First spring; 22. First limiting rod; 23. Limiting block; 24. Copper foil; 25. Paddle; 3. Heat sink; 31. Heat dissipation copper pillar; 32. Heat dissipation fins; 33. Guide block; 34. Second spring; 35. Second limiting rod. Detailed Implementation
[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0022] Please see Figure 1-5 One embodiment provided by this utility model:
[0023] A flexible circuit board for high-frequency transmission in communication equipment includes a circuit board body 1. A shielding mechanism is provided on the surface of the circuit board body 1. The shielding mechanism includes a positioning plate 2, which is fixedly connected to the bottom of the circuit board body 1. A first spring 21 is fixedly connected to the surface of the positioning plate 2. A first limiting rod 22 is fixedly connected to the surface of the first spring 21. The first limiting rod 22 is slidably connected to the surface of the positioning plate 2. A limiting block 23 is inserted into the positioning plate 2. A copper foil 24 is fixedly connected to the surface of the limiting block 23. A paddle 25 is fixedly connected to the bottom of the limiting block 23. The copper foil 24 covers the surface of the circuit board body 1. This shielding mechanism installs the copper foil 24 on the opposite side of the conductor circuit layer. It can effectively block external electromagnetic interference from the back of the circuit board body 1 without affecting the circuit layout and connection on the front side of the circuit board body 1, thereby reducing signal loss and ensuring communication quality.
[0024] Furthermore, a heat dissipation mechanism is provided at the bottom of the circuit board body 1. The heat dissipation mechanism includes heat dissipation grooves 3, which are formed at the bottom of the circuit board body 1. Heat dissipation copper pillars 31 are inserted into the surface of the heat dissipation grooves 3. Heat dissipation fins 32 are fixedly connected to the bottom of the heat dissipation copper pillars 31. A guide block 33 is fixedly connected to the bottom of the circuit board body 1. A second spring 34 is fixedly connected to the surface of the guide block 33. A second limiting rod 35 is fixedly connected to the surface of the second spring 34. The second limiting rod 35 is slidably connected to the surface of the guide block 33. This heat dissipation mechanism dissipates heat from the circuit board body 1 through multiple sets of heat dissipation grooves 3. It can also install heat dissipation fins 32 on the heat dissipation grooves 3 in a sufficient position on the circuit board body 1, thereby increasing the heat dissipation area and preventing the circuit board body 1 from overheating due to heat accumulation, thus extending the service life of the circuit board body 1.
[0025] Furthermore, multiple sets of positioning plates 2 are arranged linearly and evenly on both sides of the bottom of the circuit board body 1, and multiple sets of limiting blocks 23 are arranged linearly and evenly on both sides of the copper foil 24. Grooves are formed on the surface of the positioning plates 2, and the limiting blocks 23 are inserted into the grooves of the positioning plates 2. The positioning plates 2 and the limiting blocks 23 cooperate to limit the position of the copper foil 24 on the circuit board body 1. Multiple sets of positioning plates 2 and limiting blocks 23 can ensure the installation position of the copper foil 24 on the circuit board body 1, thereby ensuring the shielding effect of the copper foil 24 on the circuit board body 1.
[0026] Furthermore, guide holes are provided on both sides of the groove of the positioning plate 2. The first limiting rod 22 slides on the guide hole of the positioning plate 2. The elastic force of the first spring 21 acts on the first limiting rod 22, so that the first limiting rod 22 is always kept in the position on the groove of the positioning plate 2, thereby stably limiting the limiting block 23.
[0027] Furthermore, a limiting hole is formed on the surface of the limiting block 23, and the first limiting rod 22 passes through the limiting hole of the limiting block 23 in the groove of the positioning plate 2. The first limiting rod 22 restricts the position of the copper foil 24 on the circuit board body 1 through the limiting block 23. By restricting the position of multiple sets of limiting blocks 23, the position of the entire copper foil 24 on the circuit board body 1 is restricted. The copper foil 24 can be moved out of the groove of the positioning plate 2 by the pry bar 25, which facilitates the disassembly of the copper foil 24.
[0028] Furthermore, multiple sets of heat dissipation slots 3 are provided. The heat dissipation slots 3 dissipate heat from the circuit board body 1. The heat dissipation slots 3 without heat dissipation fins 32 are provided with heat dissipation mesh on their surface for heat dissipation. However, the area of this heat dissipation method is limited. The heat dissipation copper pillars 31 restrict the installation position of the heat dissipation fins 32 at the bottom of the circuit board body 1 through the heat dissipation slots 3. A limiting groove is opened on one side of the heat dissipation copper pillars 31. The limiting groove of the heat dissipation copper pillars 31 is aligned with one side of the second limiting rod 35 to facilitate the connection of the heat dissipation copper pillars 31.
[0029] Furthermore, a guide hole is provided on the surface of the guide block 33, and the elastic force of the second spring 34 acts on the second limiting rod 35. The second limiting rod 35 slides on the guide hole of the guide block 33 and is inserted into the limiting groove of the heat dissipation copper pillar 31. The second limiting rod 35 restricts the heat dissipation copper pillar 31 to the heat dissipation groove 3. The heat dissipation fins 32 expand the heat dissipation area of the heat dissipation groove 3, thereby improving the heat dissipation effect.
[0030] Working principle: The limiting block 23 is inserted into the groove of the positioning plate 2, and the first limiting rod 22 slides on the groove of the positioning plate 2 by the elastic force of the first spring 21, and the first limiting rod 22 passes through the limiting hole of the limiting block 23. At this time, the first limiting rod 22 restricts the position of the limiting block 23 at the bottom of the circuit board body 1, and restricts the multiple sets of limiting blocks 23 on the copper foil 24. The multiple sets of limiting blocks 23 stably restrict the copper foil 24 on the surface of the circuit board body 1, effectively blocking external electromagnetic interference from the back of the circuit board body 1, reducing signal loss and ensuring communication quality.
[0031] The heat dissipation copper pillar 31 is inserted into the heat dissipation groove 3, and the limiting groove of the heat dissipation copper pillar 31 is aligned with one side of the second limiting rod 35. The second spring 34 causes the second limiting rod 35 to slide on the guide hole of the guide block 33 to the limiting groove of the heat dissipation copper pillar 31 through the elastic force. At this time, the second limiting rod 35 restricts the heat dissipation copper pillar 31 on the heat dissipation groove 3, thereby restricting the heat dissipation fins 32 to the bottom of the heat dissipation groove 3. The heat dissipation fins 32 expand the heat dissipation range of the heat dissipation groove 3 at the bottom of the circuit board body 1, avoiding the circuit board body 1 from overheating due to heat accumulation, and extending the service life of the circuit board body 1.
[0032] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. A flexible circuit board for high-frequency transmission in communication equipment, characterized in that: The circuit board includes a circuit board body (1), and a shielding mechanism is provided on the surface of the circuit board body (1). The shielding mechanism includes a positioning plate (2), which is fixedly connected to the bottom of the circuit board body (1). A first spring (21) is fixedly connected to the surface of the positioning plate (2), and a first limiting rod (22) is fixedly connected to the surface of the first spring (21). The first limiting rod (22) is slidably connected to the surface of the positioning plate (2). A limiting block (23) is inserted into the positioning plate (2), and a copper foil (24) is fixedly connected to the surface of the limiting block (23). A paddle (25) is fixedly connected to the bottom of the limiting block (23), and the copper foil (24) covers the surface of the circuit board body (1).
2. The flexible circuit board for high-frequency transmission in communication equipment according to claim 1, characterized in that: The bottom of the circuit board body (1) is provided with a heat dissipation mechanism, which includes a heat dissipation groove (3). The heat dissipation groove (3) is opened at the bottom of the circuit board body (1). A heat dissipation copper pillar (31) is inserted into the surface of the heat dissipation groove (3). A heat dissipation fin (32) is fixedly connected to the bottom of the heat dissipation copper pillar (31). A guide block (33) is fixedly connected to the bottom of the circuit board body (1). A second spring (34) is fixedly connected to the surface of the guide block (33). A second limiting rod (35) is fixedly connected to the surface of the second spring (34). The second limiting rod (35) is slidably connected to the surface of the guide block (33).
3. The flexible circuit board for high-frequency transmission in communication equipment according to claim 1, characterized in that: The positioning plates (2) are provided in multiple sets and are arranged linearly and evenly on both sides of the bottom of the circuit board body (1). The limiting blocks (23) are provided in multiple sets and are arranged linearly and evenly on both sides of the copper foil (24). The positioning plates (2) have grooves on their surfaces and the limiting blocks (23) are inserted into the grooves of the positioning plates (2).
4. The flexible circuit board for high-frequency transmission in communication equipment according to claim 3, characterized in that: The positioning plate (2) has guide holes on both sides of the groove. The first limiting rod (22) slides on the guide hole of the positioning plate (2). The elastic force of the first spring (21) acts on the first limiting rod (22).
5. The flexible circuit board for high-frequency transmission in communication equipment according to claim 4, characterized in that: The limiting block (23) has a limiting hole on its surface. The first limiting rod (22) passes through the limiting hole of the limiting block (23) in the groove of the positioning plate (2). The first limiting rod (22) restricts the position of the copper foil (24) on the circuit board body (1) through the limiting block (23).
6. The flexible circuit board for high-frequency transmission in communication equipment according to claim 2, characterized in that: The heat dissipation groove (3) is provided in multiple sets. The heat dissipation copper pillar (31) restricts the installation position of the heat dissipation fins (32) at the bottom of the circuit board body (1) through the heat dissipation groove (3). A limiting groove is opened on one side of the heat dissipation copper pillar (31).
7. A flexible circuit board for high-frequency transmission in a communication device according to claim 6, characterized in that: The guide block (33) has a guide hole on its surface. The elastic force of the second spring (34) acts on the second limiting rod (35). The second limiting rod (35) slides on the guide hole of the guide block (33) and is inserted into the limiting groove of the heat dissipation copper pillar (31).