Integrated circuit cooling fin capable of rapidly dissipating heat

Abstract

The utility model relates to the technical field of integrated circuits, in particular to an integrated circuit radiating fin capable of quickly radiating, which comprises an upper radiating fin and a lower radiating fin, the upper radiating fin is connected with the lower radiating fin in a clamping manner, and raised lines are fixedly arranged on one side of the bottom end of the upper radiating fin and one side of the top end of the lower radiating fin. Clamping grooves are formed in the other side of the bottom end of the upper cooling fin and the other side of the top end of the lower cooling fin; through design of mutual cooperation of structures such as movable plates, first sliding grooves, third springs, pin rods, pin holes, second springs, convex rods and grooves, the multiple movable plates are pulled out, then every two adjacent movable plates are connected through the pin rods and the pin holes, and then the multiple movable plates are stored in the multiple first sliding grooves through the multiple third springs; therefore, a plurality of cooling fins can be assembled conveniently, and the assembled connecting structure can be stored, so that the plurality of cooling fins are attached more tightly, and a good cooling effect of the cooling fins is kept.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit technology, and in particular to a heat sink for integrated circuits that provides rapid heat dissipation. Background Technology

[0002] Integrated circuits are made by fabricating transistors, diodes, resistors, capacitors, and other components required for a circuit onto a small silicon wafer, glass, or ceramic substrate using specific processes. They are then interconnected using appropriate processes and packaged in a casing, which greatly reduces the size of the entire circuit and the number of leads and solder joints. During application, integrated circuits require heat sinks to improve their heat dissipation capacity and ensure their lifespan.

[0003] Patent specification CN201621287387.4 discloses a heat sink, which "comprising: a substrate, a plurality of heat dissipation fins arranged on the substrate, and a top plate respectively connected to the plurality of heat dissipation fins; wherein the substrate and the top plate are respectively located at opposite ends of the plurality of heat dissipation fins, and two adjacent heat dissipation fins cooperate with the substrate and the top plate to form a heat dissipation channel. This utility model designs a novel heat sink structure, in which a top plate is provided at the top of the heat dissipation fins, increasing the strength of the heat dissipation fins and improving the overall strength of the heat sink, thereby improving the processability of the heat sink."

[0004] However, in implementing the relevant technology, the following problems were found with the heat sinks mentioned above: Since the number of heat sinks for integrated circuits depends on various factors, including the type, power, packaging form, working environment, and size and performance of the heat sinks, the greater the heat generated by the integrated circuit, the more heat sinks are required; conversely, the fewer heat sinks are required. Traditional integrated circuit heat sinks have a simple structure and cannot be assembled or snapped together by their own structure. They need to be connected by external materials such as glue, which can easily affect the tightness between the heat sinks and reduce the heat dissipation effect. In view of this, a heat sink for integrated circuits with fast heat dissipation is provided to overcome the above defects. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a heat sink for rapid heat dissipation in integrated circuits.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a heat sink for rapid heat dissipation of an integrated circuit, comprising an upper heat sink and a lower heat sink, characterized in that: the upper heat sink and the lower heat sink are engaged and connected; a protruding strip is fixedly provided on one side of the bottom end of the upper heat sink and one side of the top end of the lower heat sink; a slot is provided on the other side of the bottom end of the upper heat sink and the other side of the top end of the lower heat sink; a plurality of the protruding strips respectively match a plurality of slots; a fastening assembly is provided between the upper heat sink and the lower heat sink; and splicing assemblies are provided on the inner walls of both the upper heat sink and the lower heat sink.

[0007] As a further description of the above technical solution: the fastening assembly includes several flip plates, several first sliding holes, several sliding discs, several first springs, several connecting rods, several buckles, and several protruding discs. The flip plates are rotatably connected to the front and back sides of the upper heat sink and the front and back sides of the lower heat sink, respectively. The inner walls of the flip plates are provided with first sliding holes. The inner walls of the first sliding holes are slidably connected to sliding discs. One end of the inner wall of each first sliding hole is fixedly provided with a first spring. One end of each first spring is fixedly connected to each sliding disc. The surfaces of each sliding disc are fixedly provided with connecting rods. One end of each connecting rod is fixedly provided with a buckle. The protruding discs are fixedly provided on the surfaces of the upper and lower heat sinks, respectively. By rotating the flip plates and pulling the buckles, the buckles can be locked onto the surfaces of the protruding discs. At the same time, the elasticity of the first springs when they return to their original position can increase the pressure between the buckles and the protruding discs, thereby improving the stability of the heat sink during fastening.

[0008] As a further description of the above technical solution: Both of the splicing components include two first sliding grooves, two movable plates, two horizontal plates, two pin holes, and pins. Several first sliding grooves are respectively opened on the inner walls of both sides of the upper heat sink and the inner walls of both sides of the lower heat sink. Movable plates are slidably connected to the inner walls of several first sliding grooves. A horizontal plate is fixedly provided on one side of several movable plates. Pin holes are opened on the surface of several horizontal plates. Pins are fitted on the inner walls of two pin holes. By pulling out several movable plates of the two heat sinks, and then inserting pins between every two opposite pin holes on the same side, the assembly of multiple heat sinks can be completed quickly.

[0009] As a further description of the above technical solution: a second sliding hole is provided on the inner wall of both sides of a plurality of first sliding grooves, a protruding rod is slidably connected to the inner wall of two second sliding holes, a second spring is fixedly provided at one end of the two second sliding holes, one end of a plurality of second springs is fixedly connected to a plurality of protruding rods respectively, and a groove is provided on the inner wall of both sides of a plurality of movable plates, and a plurality of grooves are respectively matched with a plurality of protruding rods.

[0010] As a further description of the above technical solution: a circular hole is provided in the middle of one side of several first sliding grooves, and a third spring is fixedly provided on one side of the inner wall of several circular holes. One end of several third springs is fixedly connected to several movable plates. By resetting several third springs, several movable plates are slid into several first sliding grooves respectively. When several protruding rods are engaged with several grooves, several movable plates are stored in several first sliding grooves respectively. In this way, the connection structure of the heat sink can be hidden, which facilitates the close contact and heat dissipation of multiple heat sinks, and at the same time makes the integrated circuit heat sink more aesthetically pleasing.

[0011] As a further description of the above technical solution: both the interior of the upper heat sink and the interior of the lower heat sink are provided with a number of heat dissipation slots.

[0012] As a further description of the above technical solution: a limiting frame is fixedly provided on the other side of each of the first slides.

[0013] This utility model has the following beneficial effects:

[0014] This invention relates to a rapid heat dissipation integrated circuit heat sink. Through the design of movable plates, first sliding grooves, third springs, pins, pin holes, second springs, protruding rods, and grooves, a series of interconnected structures are used. Several movable plates are pulled out, and then each pair of adjacent movable plates is connected by pins and pin holes. Several third springs then allow the multiple movable plates to be retracted into several first sliding grooves. This facilitates the assembly of multiple heat sinks, and the retractable connection structure ensures a tighter fit between the heat sinks, maintaining excellent heat dissipation.

[0015] This invention relates to a rapid heat dissipation integrated circuit heat sink. The design incorporates a series of interconnected structures, including protrusions, slots, clips, sliding plates, first sliding holes, first springs, connecting rods, flip plates, protrusions, and heat dissipation grooves. By stretching and rotating several flip plates, several clips can be engaged with the surfaces of several protrusions. Several first springs then reset the upper and lower heat sinks, ensuring a tight fit. Furthermore, the interconnectedness of each pair of opposing heat dissipation grooves increases the contact area between the heat sink and the air, thereby improving the connection stability and enhancing its heat dissipation effect. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a cross-sectional structural diagram of the present invention;

[0018] Figure 3 This is a schematic diagram of the structure of the heat sink of this utility model;

[0019] Figure 4 This is a cross-sectional structural diagram of the fastening assembly of this utility model;

[0020] Figure 5 This utility model Figure 2 A magnified structural diagram at point A;

[0021] Figure 6 This is a schematic diagram of the structure of the movable plate of this utility model.

[0022] Legend:

[0023] 1. Upper heat sink; 2. Lower heat sink; 3. Raised strip; 4. Slot; 5. Fastening assembly; 6. Splicing assembly; 7. Second sliding hole; 8. Raised rod; 9. Second spring; 10. Groove; 11. Round hole; 12. Third spring; 13. Heat dissipation groove; 14. Limiting frame; 51. Flip plate; 52. First sliding hole; 53. Sliding plate; 54. First spring; 55. Connecting rod; 56. Buckle; 57. Raised plate; 61. First sliding groove; 62. Movable plate; 63. Horizontal plate; 64. Pin hole; 65. Pin rod. Detailed Implementation

[0024] Reference Figure 1-6 This utility model provides a fast heat dissipation integrated circuit heat sink: including an upper heat sink 1 and a lower heat sink 2, the upper heat sink 1 and the lower heat sink 2 are snapped together, a protrusion 3 is fixedly provided on one side of the bottom end of the upper heat sink 1 and one side of the top end of the lower heat sink 2, and a slot 4 is provided on the other side of the bottom end of the upper heat sink 1 and the other side of the top end of the lower heat sink 2, a plurality of protrusions 3 respectively match a plurality of slots 4, a fastening assembly 5 is provided between the upper heat sink 1 and the lower heat sink 2, and splicing assemblies 6 are provided on the inner wall of the upper heat sink 1 and the inner wall of the lower heat sink 2.

[0025] As a further implementation of the above technical solution: the fastening assembly 5 includes several flip plates 51, several first sliding holes 52, several sliding plates 53, several first springs 54, several connecting rods 55, several buckles 56, and several protruding plates 57. The flip plates 51 are rotatably connected to the front and back of the upper heat sink 1 and the front and back of the lower heat sink 2, respectively. The inner walls of the flip plates 51 are provided with first sliding holes 52. The inner walls of the first sliding holes 52 are slidably connected to sliding plates 53. One end of the inner wall of the first sliding holes 52 is fixedly provided with a first spring 54. One end of the first spring 54 is fixedly connected to the sliding plates 53. The surfaces of the sliding plates 53 are fixedly provided with connecting rods 55. One end of each connecting rod 55 is fixedly provided with a buckle 56. Several protrusions 57 are respectively fixedly set on the surface of the upper heat sink 1 and the surface of the lower heat sink 2. Several protrusions 3 are respectively inserted into several slots 4. Then, several buckles 56 are pulled and rotated in sequence. At this time, several sliding discs 53 slide along the inner wall of several first sliding holes 52. Several first springs 54 are stretched to make several connecting rods 55 extend outward. Several flip plates 51 are rotated to make several buckles 56 respectively lock onto the surface of adjacent protrusions 57. At this time, several first springs 54 are reset to make several buckles 56 fit and fix several protrusions 57, thereby tightly fixing the upper heat sink 1 and the lower heat sink 2, effectively ensuring the heat dissipation effect of the heat sink.

[0026] As a further implementation of the above technical solution: both splicing components 6 include two first sliding grooves 61, two movable plates 62, two horizontal plates 63, two pin holes 64 and pin rods 65. Several first sliding grooves 61 are respectively opened on the inner walls of both sides of the upper heat sink 1 and the inner walls of both sides of the lower heat sink 2. The inner walls of several first sliding grooves 61 are slidably connected to movable plates 62. A horizontal plate 63 is fixedly provided on one side of several movable plates 62. Pin holes 64 are opened on the surface of several horizontal plates 63, and pin rods 65 are sleeved on the inner walls of two pin holes 64.

[0027] The inner walls on both sides of several first sliding grooves 61 are provided with second sliding holes 7. The inner walls of two second sliding holes 7 are slidably connected with protruding rods 8. One end of each of the two second sliding holes 7 is fixedly provided with a second spring 9. One end of several second springs 9 is fixedly connected to several protruding rods 8 respectively. The inner walls on both sides of several movable plates 62 are provided with grooves 10. Several grooves 10 are matched with several protruding rods 8 respectively.

[0028] A circular hole 11 is provided in the middle of one side of several first sliding grooves 61, and a third spring 12 is fixedly provided on one side of the inner wall of several circular holes 11. One end of several third springs 12 is fixedly connected to several movable plates 62 respectively.

[0029] Each of the first slide grooves 61 has a limiting frame 14 fixedly installed on the other side.

[0030] As a further implementation of the above technical solution: Several heat dissipation grooves 13 are provided inside both the upper heat sink 1 and the lower heat sink 2. Four movable plates 62 on the connecting side of the two heat sinks are pulled out from the inner walls of four first sliding grooves 61. At this time, several third springs 12 are stretched. Then, two pins 65 are inserted between two opposite pin holes 64 on the same side. After the two pins 65 complete the assembly between the two heat sinks, under the influence of the several third springs 12, several movable plates 62 slide towards the inside of several first sliding grooves 61. Simultaneously, the elasticity of several second springs 9 causes several protruding rods 8 to move towards several movable plates 62. When several protruding rods 8 engage with several grooves 10, several movable plates 62 are stored on one side inside several first sliding grooves 61, thereby achieving a tight fit between the two assembled heat sinks. Simultaneously, the connecting structure between the two heat sinks can be stored within several first sliding grooves 61, thus improving the overall aesthetics of the heat sink.

[0031] Working principle: When using this utility model, firstly, several protrusions 3 are respectively inserted into several slots 4. Then, several buckles 56 are pulled and rotated in sequence. At this time, several sliding discs 53 slide along the inner walls of several first sliding holes 52. Several first springs 54 are stretched, causing several connecting rods 55 to extend outward. Several flip plates 51 rotate, causing several buckles 56 to be locked onto the surfaces of adjacent protrusions 57. At this time, several first springs 54 return to their original positions, causing several buckles 56 to fit and fix with several protrusions 57. Thus, the upper heat sink 1 and the lower heat sink 2 can be tightly fixed, effectively ensuring the heat dissipation effect of the heat sink. When the heat generated by the integrated circuit is large, resulting in a large number of heat sinks required, the four movable plates 62 on the connecting side of the two heat sinks are all pulled out from four of the first... The inner wall of the slide groove 61 is pulled out, at which point several third springs 12 are stretched. Then, two pins 65 are inserted into the two opposite pin holes 64 on the same side. After the two pins 65 complete the assembly between the two heat sinks, under the influence of several third springs 12, several movable plates 62 slide toward the interior of several first slide grooves 61. At the same time, the elasticity of several second springs 9 causes several protruding rods 8 to move toward several movable plates 62. After several protruding rods 8 engage with several grooves 10, several movable plates 62 are stored in one side of several first slide grooves 61, thereby achieving a tight fit between the two assembled heat sinks. At the same time, the connection structure between the two heat sinks can be stored in several first slide grooves 61, thereby improving the overall aesthetics of the heat sink.

[0032] Finally, it should be noted that the above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat sink for rapid heat dissipation of an integrated circuit, comprising an upper heat sink (1) and a lower heat sink (2), characterized in that: The upper heat sink (1) and the lower heat sink (2) are engaged and connected. A protruding strip (3) is fixedly provided on one side of the bottom end of the upper heat sink (1) and one side of the top end of the lower heat sink (2). A slot (4) is provided on the other side of the bottom end of the upper heat sink (1) and the other side of the top end of the lower heat sink (2). Several protruding strips (3) are matched with several slots (4). A fastening assembly (5) is provided between the upper heat sink (1) and the lower heat sink (2). A splicing assembly (6) is provided on the inner wall of the upper heat sink (1) and the inner wall of the lower heat sink (2).

2. The integrated circuit heat sink for rapid heat dissipation according to claim 1, characterized in that: The fastening assembly (5) includes several flip plates (51), several first sliding holes (52), several sliding plates (53), several first springs (54), several connecting rods (55), several buckles (56), and several protruding plates (57). The flip plates (51) are rotatably connected to the front and back of the upper heat sink (1) and the front and back of the lower heat sink (2), respectively. The inner walls of the flip plates (51) are provided with first sliding holes (52). The inner walls of each slide are slidably connected to a slide plate (53). One end of the inner wall of each of the first slide holes (52) is fixedly provided with a first spring (54). One end of each of the first springs (54) is fixedly connected to each of the slide plates (53). A connecting rod (55) is fixedly provided on the surface of each of the slide plates (53). One end of each of the connecting rods (55) is fixedly provided with a buckle (56). A number of convex plates (57) are fixedly provided on the surface of the upper heat sink (1) and the surface of the lower heat sink (2).

3. The integrated circuit heat sink for rapid heat dissipation according to claim 1, characterized in that: Both splicing components (6) include two first sliding grooves (61), two movable plates (62), two horizontal plates (63), two pin holes (64), and pins (65). Several first sliding grooves (61) are respectively opened on the inner walls of the upper heat sink (1) and the inner walls of the lower heat sink (2). Movable plates (62) are slidably connected to the inner walls of several first sliding grooves (61). A horizontal plate (63) is fixedly provided on one side of several movable plates (62). Pin holes (64) are opened on the surface of several horizontal plates (63), and pins (65) are sleeved on the inner walls of two of the pin holes (64).

4. The integrated circuit heat sink for rapid heat dissipation according to claim 3, characterized in that: The inner walls of several first sliding grooves (61) are provided with second sliding holes (7), and the inner walls of two second sliding holes (7) are slidably connected with protruding rods (8). One end of each of the two second sliding holes (7) is fixedly provided with a second spring (9). One end of several second springs (9) is fixedly connected to several protruding rods (8). The inner walls of several movable plates (62) are provided with grooves (10), and several grooves (10) are matched with several protruding rods (8).

5. The integrated circuit heat sink for rapid heat dissipation according to claim 3, characterized in that: A circular hole (11) is provided in the middle of one side of several first sliding grooves (61), and a third spring (12) is fixedly provided on one side of the inner wall of several circular holes (11), and one end of several third springs (12) is fixedly connected to several movable plates (62).

6. The integrated circuit heat sink for rapid heat dissipation according to claim 1, characterized in that: Both the upper heat sink (1) and the lower heat sink (2) have several heat dissipation slots (13) inside.

7. The integrated circuit heat sink for rapid heat dissipation according to claim 3, characterized in that: Each of the first slide grooves (61) is fixedly provided with a limiting frame (14) on the other side.

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