Area array ultrasonic transducer assembly, transesophageal ultrasonic probe and transvascular ultrasonic probe

Abstract

The utility model relates to area array ultrasonic equipment, in particular to an area array ultrasonic transducer assembly, a transesophageal ultrasonic probe and a transvascular ultrasonic probe. The area array ultrasonic transducer assembly comprises a sound head assembly, an application-specific integrated circuit chip, a circuit board and a backing which are arranged in a stacked mode, and the application-specific integrated circuit chip, the circuit board and the backing are all located on the same side of the sound head assembly. The sound head assembly comprises a piezoelectric layer, and the piezoelectric layer comprises array elements arranged in an array; the application-specific integrated circuit chip comprises a first electric connection part and a second electric connection part, the first electric connection part is electrically connected with the array element, and the second electric connection part is electrically connected with the circuit board; the circuit board comprises a rigid board and a flexible board which are connected with each other, the application-specific integrated circuit chip and the rigid board are arranged in a stacked mode, and the flexible board comprises a leading-out circuit which is used for transmitting signals of the array elements. The utility model mainly solves the technical problem of how to arrange a leading-out circuit in a small space in the area array ultrasonic transducer assembly.

Description

Technical Field

[0001] This application relates to area array ultrasound equipment, and more particularly to area array ultrasound transducer assemblies and transesophageal ultrasound probes and transvascular ultrasound probes. Background Technology

[0002] The array elements of the area array ultrasonic probe are not arranged in a traditional line, but in a matrix, which allows the area array ultrasonic probe to transmit and receive data in different directions in three-dimensional space, thereby enabling rapid data acquisition.

[0003] For example, transesophageal echocardiography (TEE) with an area array is of great clinical significance, serving as an important means of achieving real-time three-dimensional imaging of the heart. It is crucial for the diagnosis of cardiac diseases and intraoperative observation. Because the esophagus is located close to the back of the heart, the area array TEE probe can be inserted through the esophagus to reach a position close to the heart. This allows for close observation of the heart's anatomical structure and function from behind, avoiding interference from the chest wall, lungs, and other tissues, resulting in clearer and more accurate images. Due to the need for insertion into the esophagus, the diameter of the area array TEE probe is very small; for example, the probe suitable for adults has a diameter of approximately 9 mm and a tip diameter of 14 mm, while some probes suitable for children have a diameter of less than 7 mm.

[0004] The core component of an area array ultrasonic probe is the area array ultrasonic transducer assembly, which consists of four key modules: the head assembly, the ASIC (Application-Specific Integrated Circuit) chip, the circuit board, and the backing. Since area array TEE probes often require thousands of array elements, and the circuit board needs to accommodate a large number of leads, requiring ample space, it is necessary to consider how to arrange the leads within a limited space. Utility Model Content

[0005] This application mainly addresses the technical problem of how to arrange lead-out lines in a small space for an array ultrasonic transducer assembly.

[0006] In one aspect, one embodiment provides a planar ultrasonic transducer assembly.

[0007] An array ultrasonic transducer assembly includes a stacked acoustic head assembly, a dedicated integrated circuit chip, a circuit board, and a backing, wherein the dedicated integrated circuit chip, the circuit board, and the backing are all located on the same side of the acoustic head assembly.

[0008] The sound head assembly includes a piezoelectric layer, which includes array elements arranged in an array;

[0009] The dedicated integrated circuit chip includes a first electrical connection portion and a second electrical connection portion, wherein the first electrical connection portion is electrically connected to the array element, and the second electrical connection portion is electrically connected to the circuit board;

[0010] The circuit board includes a rigid plate and a flexible plate connected to each other. The application-specific integrated circuit chip is stacked with the rigid plate. The flexible plate includes lead-out lines for transmitting signals of the array elements.

[0011] The backing is used to attenuate the ultrasonic waves on the side of the head assembly closest to the backing.

[0012] In one embodiment, at least a portion of the flexible plate is stacked with the rigid plate and located on the side of the rigid plate away from the sound head assembly, and electronic components are provided on the portion of the flexible plate that is stacked with the rigid plate.

[0013] In one embodiment, the flexible plate includes a first flexible plate body and a second flexible plate body, the first flexible plate body and the second flexible plate body being connected to the edges of different sides of the rigid plate.

[0014] In one embodiment, the first flexible plate includes a first lead-out end and a first lead-out line, and the second flexible plate includes a second lead-out end and a second lead-out line. The first lead-out end is connected to the first lead-out line for transmitting signals from the first lead-out line, and the second lead-out end is connected to the second lead-out line for transmitting signals from the second lead-out line. The first lead-out end and the second lead-out end are located on the outer side of the same edge of the rigid plate.

[0015] In one embodiment, at least a portion of the flexible plate is located on the side of the backing away from the head assembly and is stacked with the backing.

[0016] In one embodiment, the application-specific integrated circuit chip is fixedly connected to the rigid plate, and the area array ultrasonic transducer assembly includes a housing, with the rigid plate fixedly connected to the housing.

[0017] In one embodiment, the application-specific integrated circuit chip includes pads, and the first electrical connection portion and the second electrical connection portion are formed by the pads.

[0018] In one embodiment, the head assembly, the application-specific integrated circuit (ASIC) chip, the circuit board, and the backing are stacked sequentially; or, the head assembly, the circuit board, the ASIC chip, and the backing are stacked sequentially; or, the head assembly, the backing, the circuit board, and the ASIC chip are stacked sequentially.

[0019] Secondly, one embodiment provides a transesophageal ultrasound probe, comprising:

[0020] The array ultrasonic transducer assembly, the insertion tube assembly, and the handle assembly are connected sequentially from the distal end to the proximal end; the array ultrasonic transducer assembly is any one of the array ultrasonic transducer assemblies described above.

[0021] In one embodiment, the handle assembly includes a handle circuit board; the transesophageal ultrasound probe further includes a cable passing through the insertion tube assembly, the cable connecting the handle circuit board and the lead-out line for signal transmission between the lead-out line and the handle circuit board; or, the flexible plate further includes a transmission portion penetrating the insertion tube assembly, the transmission portion being connected to the handle circuit board for signal transmission between the lead-out line and the handle circuit board.

[0022] Thirdly, one embodiment provides a transvascular ultrasound probe, comprising:

[0023] A planar ultrasonic transducer assembly, a conduit assembly, and a handle assembly are connected sequentially from distal to proximal; the planar ultrasonic transducer assembly is any one of the planar ultrasonic transducer assemblies described above.

[0024] In one embodiment, the handle assembly includes a handle circuit board; the transvascular ultrasound probe further includes a cable passing through the catheter assembly, the cable connecting the handle circuit board and the lead-out line for signal transmission between the lead-out line and the handle circuit board; or, the flexible plate further includes a transmission portion penetrating the catheter assembly, the transmission portion being connected to the handle circuit board for signal transmission between the lead-out line and the handle circuit board.

[0025] The beneficial effects of this application are:

[0026] According to the area array ultrasonic transducer assembly in the embodiments of this application, the circuit board includes a rigid plate and a flexible plate. The flexible plate includes lead-out lines that can transmit signals from the array elements. Due to the deformable nature of the flexible plate, the position of the lead-out lines can be arranged more conveniently, making full use of the limited space within the area array ultrasonic transducer assembly. Furthermore, the dedicated integrated circuit chip is stacked with the rigid plate, so that the rigid plate can provide stable support for the integrated circuit chip, thereby facilitating wiring while ensuring the structural stability of the area array ultrasonic transducer assembly. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the structure of one embodiment of the transesophageal ultrasound probe in this application;

[0028] Figure 2 yes Figure 1 A three-dimensional view of the stacked structure of a mid-area ultrasonic transducer assembly;

[0029] Figure 3 yes Figure 1 Cross-sectional view of a mid-area ultrasonic transducer assembly;

[0030] Figure 4 yes Figure 2 A simplified diagram of the stacked structure of a mid-area ultrasonic transducer assembly;

[0031] Figure 5 yes Figure 2 Simplified structural diagram of a medium-rigidity flexible plate;

[0032] Figure 6 This is a cross-sectional view of another embodiment of a transesophageal ultrasound probe;

[0033] Figure 7 This is a simplified diagram of the stacked structure of another embodiment of the area array ultrasonic transducer assembly;

[0034] Figure 8 This is a simplified diagram of the stacked structure of another embodiment of the area array ultrasonic transducer assembly.

[0035] List of feature names corresponding to the labels in the figure:

[0036] 100. Area array ultrasonic transducer assembly;

[0037] 110. Housing; 120. Acoustic head assembly; 121. Acoustic lens; 130. Dedicated integrated circuit chip;

[0038] 140. Circuit board; 141. Rigid board; 142. Flexible board;

[0039] 1421. First flexible plate; 1422. Second flexible plate;

[0040] 150. Backing;

[0041] 200. Insertion tube assembly;

[0042] 300. Handle assembly. Detailed Implementation

[0043] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0044] The embodiments described in the detailed implementation can be combined in any suitable manner without contradiction. For example, different implementation methods can be formed by combining different embodiments. In order to avoid unnecessary repetition, the various possible combinations of the embodiments will not be described separately.

[0045] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0046] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0047] In the embodiments of this application, the circuit board of the area array ultrasonic transducer assembly includes a rigid plate and a flexible plate. The rigid plate is stacked with the dedicated integrated circuit chip, which can provide better support and structural rigidity for the dedicated integrated circuit chip. The flexible plate is connected to the rigid plate, and the flexible plate can provide better bending performance, so as to facilitate the layout of components and the routing of the area array ultrasonic transducer assembly.

[0048] Examples of transesophageal ultrasound probes in this application:

[0049] In some embodiments, such as Figure 1As shown, the transesophageal ultrasound probe is a transesophageal echocardiography (TEE) probe, which includes a transesophageal ultrasound transducer assembly 100, an insertion tube assembly 200, and a handpiece assembly 300. The transesophageal ultrasound transducer assembly 100, the insertion tube assembly 200, and the handpiece assembly 300 are connected sequentially from the distal end to the proximal end of the transesophageal ultrasound probe.

[0050] Examples of transvascular ultrasound probes in this application:

[0051] In some embodiments, such as Figure 1 As shown, the transvascular ultrasound probe includes an array ultrasound transducer assembly 100, a catheter assembly 200, and a handpiece assembly 300, which are connected sequentially from the distal end to the proximal end of the transvascular ultrasound probe.

[0052] It should be noted that those skilled in the art should understand that the terms "proximal" and "distal" used in this article are conventional medical terms. For the instrument to be operated on, the proximal end is the end closer to the operator, and the distal end is the end farther from the operator. Taking the insertion tube assembly 200 of the transesophageal ultrasound probe as an example, the insertion tube assembly 200 is usually the end that first enters the patient's body during use; the proximal and distal ends can be referred to the orientation shown in the figure.

[0053] The area array ultrasound transducer assembly 100 can be the core functional component of a transesophageal ultrasound probe or a transvascular ultrasound probe. It is used to transmit and receive ultrasound waves, and to convert the received ultrasound waves into electrical signals for output. The transvascular ultrasound probe can be an intravascular ultrasound (IVUS) probe or an intracardiac echocardiography (ICE) probe. The specific structure of the area array ultrasound transducer assembly 100 will be described in detail below.

[0054] The insertion tube assembly 200 is typically made of flexible materials and has an internal cavity that can accommodate cables and other necessary components. The area array ultrasound transducer assembly 100 can be connected to the handle assembly 300 via cables within the insertion tube assembly 200 to enable signal transmission from the transesophageal ultrasound probe.

[0055] The handle assembly 300 includes a housing 110, a handle circuit board, and a control device for controlling the array ultrasound transducer assembly 100 and the insertion tube assembly 200. The control device may include, but is not limited to, physical buttons, levers, knobs, touch modules, and other control structures. The user can use this control device to control the bending angle of the insertion tube assembly 200 and the position and orientation of the array ultrasound transducer assembly 100. A connecting cable may be provided at the proximal end of the handle assembly 300, allowing the transesophageal ultrasound probe to be connected to the ultrasound host.

[0056] In addition, the transesophageal ultrasound probe may also include other necessary components. The specific structures of these other necessary components, as well as the insertion tube assembly 200 and the handle assembly 300, can be referred to existing structures in related technologies. Considering that they are not directly related to the innovative content of this application and the technical problem to be solved, they will not be described in detail here.

[0057] The above is an introduction to the main structure of the transesophageal ultrasound probe. The following section will elaborate on the array ultrasound transducer assembly 100.

[0058] Please refer to Figure 2 and Figure 3 In some embodiments, the area array ultrasonic transducer assembly 100 includes a housing 110, a transducer assembly 120, a dedicated integrated circuit chip 130, a circuit board 140, and a backing 150. The housing 110 has an inner cavity, and the transducer assembly 120, the dedicated integrated circuit chip 130, the circuit board 140, and the backing 150 are sequentially stacked to form a configuration such that... Figure 4 The stacked structure is shown. The application-specific integrated circuit chip 130, the circuit board 140, and the backing 150 are all located on the same side of the head assembly 120.

[0059] Those skilled in the art will understand that the acoustic head assembly 120 includes a piezoelectric layer, and may also include one or more of an acoustic reflection layer, an acoustic matching layer, and an acoustic lens 121.

[0060] The piezoelectric layer, also known as the piezoelectric crystal layer, comprises thousands of array elements arranged in an array for area-array TEEs. The piezoelectric layer can convert electrical signals into ultrasonic waves through the inverse piezoelectric effect (transmission phase) or convert returning ultrasonic waves into electrical signals through the direct piezoelectric effect (reception phase). The acoustic reflection layer reflects the emitted acoustic energy, reducing unnecessary vibrations and shortening pulse duration, thereby improving axial resolution. The acoustic matching layer addresses the impedance mismatch between the piezoelectric material (high acoustic impedance) and human tissue (low acoustic impedance), reducing sound wave reflection loss. For example, one to three layers can be used, with each layer's impedance falling between that of the piezoelectric material and the tissue, achieving broadband matching through a multi-layered structure. The acoustic lens 121 focuses the ultrasonic beam, improving lateral resolution (similar to an optical lens) while protecting the internal structure of the target side away from the probe. The piezoelectric layer, acoustic reflection layer, acoustic matching layer, and acoustic lens 121 can be bonded together to better prevent acoustic energy loss.

[0061] The application-specific integrated circuit (ASIC) chip 130 plays a crucial role in the area array ultrasonic probe, primarily optimizing the probe's performance, efficiency, and integration. Area array probes often contain thousands of arrayed elements. The ASIC chip efficiently drives these elements, controlling the emission of ultrasonic waves, including timing, frequency, and amplitude, ensuring accurate signal generation. Furthermore, the ASIC chip supports multi-channel parallel reception, processing signals from a large number of elements to achieve high-speed data acquisition. The specific functions of the ASIC chip 130 can be designed according to the operational requirements of the area array ultrasonic transducer assembly 100, and will not be elaborated here.

[0062] To achieve the corresponding functions, the application-specific integrated circuit (ASIC) chip 130 includes a first electrical connection portion and a second electrical connection portion (not shown in the figure). The first electrical connection portion is electrically connected to the array element, and the second electrical connection portion is electrically connected to the circuit board 140. The positions of the first and second electrical connection portions can be set according to the position of the connected objects. For example, the first electrical connection portion can be located on the side of the ASIC chip 130 near the sound head assembly 120, while the second electrical connection portion can be located on the side of the ASIC chip 130 away from the sound head assembly 120, or on the end face of the ASIC chip 130, which is the surface at the edge of the ASIC chip 130 that connects the two sides of the ASIC chip 130 in the thickness direction.

[0063] The application-specific integrated circuit (ASIC) chip 130 includes pads, and a first electrical connection portion and a second electrical connection portion are formed by the pads. The first electrical connection portion can be fixed to an array element by soldering, while the second electrical connection portion can be fixed to a corresponding pad on the circuit board 140 by soldering. Those skilled in the art will understand that the specific structural form of the first and second electrical connection portions is not limited. In addition to using pads, in some other embodiments, for example, connections to other circuits can also be achieved through pins.

[0064] Piezoelectric materials generate ultrasonic waves when excited by an electrical signal. However, the sound waves not only propagate forward (towards the human body) but also radiate backward (away from the body). The backing 150 is used to attenuate the ultrasonic waves on the back side of the head assembly 120. By absorbing the acoustic energy radiated backward by the piezoelectric layer, the residual vibration of the piezoelectric material is suppressed, thereby optimizing the pulse characteristics of the probe and improving the resolution and sensitivity of ultrasonic imaging.

[0065] It should be noted that the specific structural design of the backing 150 can adopt existing structures in the prior art. For example, it can adopt a single-layer structure or a multi-layer structure. The acoustic impedance gradually decreases from the piezoelectric layer to the back side to reduce reflection and optimize energy absorption.

[0066] The circuit board 140 is used to carry the electronic components required for the operation of the area array ultrasonic transducer assembly 100, and to realize the connection and lead-out of the circuit. In this application, the circuit board 140 is a rigid-flex board, including a rigid board 141 and a flexible board 142 that are interconnected. The application-specific integrated circuit chip 130 is stacked with the rigid board 141. The flexible board 142 includes lead-out lines for transmitting signals of the array elements, such as signals transmitted from the handle assembly to the array elements and signals transmitted from the array elements to the handle assembly.

[0067] Those skilled in the art will understand that the rigid plate 141 of the rigid-flex board can be in the form of a PCB, for example, using epoxy resin or a metal plate as the substrate, and is not bendable, while the flexible plate 142 can be in the form of an FPC, for example, using flexible materials such as polyimide (PI) or polyester (PET) as the substrate, and can be repeatedly bent. The specific molding process of the rigid-flex board can refer to existing structures in related technologies; for example, the rigid and flexible parts can be seamlessly connected through a lamination process. Considering that the specific molding process of the rigid-flex board is not directly related to the innovative content and the technical problem to be solved in this application, it will not be elaborated here. Furthermore, the molding method of the lead lines on the circuit board 140 is not limited; it can be formed using existing processes in related technologies, such as etching, mechanical engraving, laser ablation, conductive ink printing, etc. Considering that it is not directly related to the innovative content and the technical problem to be solved in this application, it will not be elaborated here.

[0068] It should be noted that the flexible plate 142 can be extended from any side of the rigid plate 141 in the thickness direction, i.e., connected to the surface of the rigid plate 141, or it can be extended from the end face of the rigid plate 141 located between the two sides in the thickness direction, i.e., connected to the end face of the rigid plate 141. The connection between the flexible plate 142 and the rigid plate 141 can be located at one edge of the rigid plate 141 or at different edges of the rigid plate 141; the specific structural form can be set according to needs. Please refer to... Figures 2 to 5 In one specific embodiment, the flexible plate 142 includes a first flexible plate body 1421 and a second flexible plate body 1422, which are connected to the edges of different sides of the rigid plate 141, specifically the edges of opposite sides. In some other embodiments, the first flexible plate body 1421 and the second flexible plate body 1422 may also be connected to two adjacent sides of the rigid plate 141, respectively. For some other embodiments, please refer to... Figure 6 The flexible plate 142 may also include only the first flexible plate body 1421.

[0069] Please refer to Figure 3 In some embodiments, at least a portion of the flexible plate 142 is stacked with the rigid plate 141 and located on the side of the rigid plate 141 away from the sound head assembly 120, and electronic components are provided on the portion of the flexible plate 142 that is stacked with the rigid plate 141. For example Figure 3 As shown, the second flexible plate 1422 is bent and stacked with the rigid plate 141, located on the side of the rigid plate 141 away from the acoustic head assembly 120. This stacked arrangement structure can realize three-dimensional utilization of space, thereby meeting the arrangement requirements of more electronic components even with limited space within the housing 110 of the area array ultrasonic transducer assembly 100.

[0070] In some embodiments, the first flexible plate 1421 includes a first lead-out terminal and a first lead-out line. The first lead-out line is used to transmit signals of all or part of the array elements. The first lead-out terminal is connected to the first lead-out line and is used to transmit signals of the first lead-out line. The second flexible plate 1422 includes a second lead-out terminal and a second lead-out line. The second lead-out line is used to transmit signals of all or part of the array elements. The second lead-out terminal is connected to the second lead-out line and is used to transmit signals of the second lead-out line. The first lead-out terminal can be referenced... Figure 3 The second lead-out end can be referenced at the left end of the first flexible plate 1421. Figure 3The left end of the second flexible plate 1422. The first lead-out end and the second lead-out end are located on the outer side of the same edge of the rigid plate 141. With this structure, the circuits on the first flexible plate 1421 and the second flexible plate 1422 can both extend towards the proximal side of the array ultrasonic transducer assembly 100, which facilitates wiring on the same side of the array ultrasonic transducer assembly 100 and makes operation more convenient.

[0071] Of course, in some other embodiments, the first lead-out end and the second lead-out end may also be located on the right side of the rigid plate 141, or the first lead-out end and the second lead-out end may be located on opposite sides of the rigid plate 141 respectively. By changing the position of the cable end in the insertion tube assembly 200, the position of the lead-out end of the circuit board 140 can be matched.

[0072] Additionally, in some other embodiments, the flexible plate 142 may include a transmission portion that extends into the insertion tube assembly 200, for example, [the portion may be used to insert the insertion tube assembly 200]. Figure 3 The first flexible plate 1421 and the second flexible plate 1422 are extended outward from the housing 110 to form a transmission section. The transmission section passes through the insertion tube assembly 200 and enters the handle assembly 300, so that the flexible plate 142 can be connected to the handle circuit board in the handle assembly 300 through the transmission section to realize signal transmission between the lead-out line and the handle circuit board, such as the transmit and receive control signals of the array element, the ultrasonic echo signals received by the array element, etc. At this time, the cables arranged in the insertion tube assembly 200 can be eliminated.

[0073] It should be noted that when using a cable to connect the handle circuit board and the flexible board 142, the cable passes through the insertion tube assembly 200 and connects the lead-out lines of the handle circuit board and the flexible board 142. The connection method between the cable and the flexible board 142 is not limited. For example, the flexible board 142 may include pads connected to the lead-out lines, and the cable can be soldered to these pads. Alternatively, the flexible board 142 may include electrical connectors connected to the lead-out lines, and the cable end can be equipped with a matching electrical connector, which allows the lead-out lines to be connected to the cable. The cable can be a single bundle, including multiple wire cores; when the number of wire cores in the cable is large, the cable can also be divided into at least two bundles.

[0074] The above explanation uses a transesophageal ultrasound probe as an example. For transvascular probes, the insertion tube assembly 200 can be replaced with a catheter assembly with higher process requirements. Please refer to the relevant instructions on the internal circuit connection and signal control of the transesophageal ultrasound probe for further understanding.

[0075] To make better use of space, in some embodiments, at least a portion of the flexible plate 142 may be located on the side of the backing 150 away from the head assembly 120 and stacked with the backing 150, compared to the flexible plate 142 being located only with the rigid plate 141. Figure 3The partial stacking on the right side of the backing 150 allows the flexible board 142 to have a larger size and accommodate more electronic components. In some other embodiments, the flexible board 142 may also be stacked only with the rigid board 141, but this avoids occupying space on the back side of the backing 150.

[0076] The rigid plate 141 has high structural strength, providing stable support for the dedicated integrated circuit chip 130, backing 150, and acoustic head assembly 120. This helps prevent deformation of the circuit chip, backing 150, and acoustic head assembly 120, thus ensuring the stable operation of the array TEE. The acoustic head assembly 120 can be positioned on the housing 110 of the array ultrasonic transducer assembly 100. In some embodiments, the dedicated integrated circuit chip 130 is fixedly connected to the rigid plate 141, and the rigid plate 141 is fixedly connected to the housing 110 of the array ultrasonic transducer assembly 100. Compared to the acoustic head assembly 120 relying solely on its own positioning, the rigid plate 141, fixed to the housing 110, provides cooperative positioning, better preventing the acoustic head assembly 120 from being subjected to external forces, resulting in better stability and reliability.

[0077] Regarding the fixing method between the application-specific integrated circuit (ASIC) chip 130 and the rigid plate 141, it can be selected based on factors such as the specific stacking structure of the ASIC chip 130 and the rigid plate 141, and the circuit lead-out structure of the ASIC chip 130. For example, the ASIC chip 130 can be bonded to the rigid plate 141, and additional connection lines can be provided to achieve circuit connection; alternatively, the ASIC chip 130 can be soldered to the rigid plate 141 to achieve circuit connection and simultaneously achieve a fixed connection with the rigid plate 141.

[0078] Regarding the fixing method between the rigid plate 141 and the housing 110, for example, the rigid plate 141 can be provided with a through hole for screws to pass through, and a fixing post can be provided on the inner wall of the housing 110. The top of the fixing post is provided with a fixing hole. By passing the screw through the through hole and threading it to the fixing hole on the fixing post, the rigid plate 141 can be positioned and fixed. Of course, those skilled in the art will understand that the fixing structure between the rigid plate 141 and the housing 110 can also be replaced with other forms, such as a snap-fit ​​structure.

[0079] In the above embodiments, the sound head assembly 120, the dedicated integrated circuit chip 130, the circuit board 140, and the backing 150 are stacked sequentially. It should be noted that in some other embodiments, the sound head assembly 120, the dedicated integrated circuit chip 130, the circuit board 140, and the backing 150 can be replaced with other stacking orders; for example, please refer to... Figure 7The sound head assembly 120, circuit board 140, dedicated integrated circuit chip 130, and backing 150 are stacked sequentially, and the rigid plate 141 can simultaneously support the sound head assembly 120 and the dedicated integrated circuit chip 130; for example, please refer to Figure 8 The sound head assembly 120, backing 150, circuit board 140, and dedicated integrated circuit chip 130 are stacked in sequence, which makes it more conducive for the backing 150 to absorb reverse sound energy.

[0080] When the aforementioned area array ultrasonic transducer assembly 100 is in operation, the rigid area formed by the rigid plate 141 of the circuit board 140 is used for the stacking of the acoustic head assembly 120. Due to the rigidity of the rigid plate 141, it can provide good support for key structures such as the acoustic head assembly 120, the dedicated integrated circuit chip 130, and the backing 150, which is conducive to ensuring the stable performance of the area array ultrasonic transducer assembly 100. The flexible area formed by the flexible plate 142 of the circuit board 140 is used to carry the outgoing signal lines, and electronic components can also be placed on its surface. Due to the flexibility of the flexible plate 142, it can be bent more compactly, which is convenient for the layout of electronic components and the wiring of the area array ultrasonic transducer assembly 100, which is conducive to realizing the miniaturized integration of the area array ultrasonic transducer assembly 100.

[0081] Embodiments of the area array ultrasonic transducer assembly in this application:

[0082] The structure of the area array ultrasound transducer assembly is the same as that of the area array ultrasound transducer assembly 100 in any embodiment of the transesophageal ultrasound probe described above, and will not be described again here.

[0083] Of course, in some other embodiments, the area array ultrasonic transducer assembly 100 can also be used in ultrasonic probes other than TEE probes.

[0084] The above examples illustrate this application only to aid understanding and are not intended to limit its scope. Those skilled in the art to which this application pertains can make various simple deductions, modifications, or substitutions based on the ideas presented.

Claims

1. A planar array ultrasonic transducer assembly, characterized in that, It includes a stacked head assembly, a dedicated integrated circuit chip, a circuit board, and a backing, all of which are located on the same side of the head assembly; The sound head assembly includes a piezoelectric layer, which includes array elements arranged in an array; The dedicated integrated circuit chip includes a first electrical connection portion and a second electrical connection portion, wherein the first electrical connection portion is electrically connected to the array element, and the second electrical connection portion is electrically connected to the circuit board; The circuit board includes a rigid plate and a flexible plate connected to each other. The application-specific integrated circuit chip is stacked with the rigid plate. The flexible plate includes lead-out lines for transmitting signals of the array elements. The backing is used to attenuate the ultrasonic waves emitted by the head assembly on the side closest to the backing.

2. The area array ultrasonic transducer assembly as described in claim 1, characterized in that, At least a portion of the flexible plate is stacked with the rigid plate and located on the side of the rigid plate away from the sound head assembly, and electronic components are provided on the portion of the flexible plate that is stacked with the rigid plate.

3. The area array ultrasonic transducer assembly as described in claim 2, characterized in that, The flexible plate includes a first flexible plate body and a second flexible plate body, which are connected to the edges of different sides of the rigid plate.

4. The area array ultrasonic transducer assembly as described in claim 3, characterized in that, The first flexible plate includes a first lead-out end and a first lead-out line, and the second flexible plate includes a second lead-out end and a second lead-out line; The first lead-out end is connected to the first lead-out line and is used to transmit the signal of the first lead-out line. The second lead-out end is connected to the second lead-out line and is used to transmit the signal of the second lead-out line. The first lead-out end and the second lead-out end are located on the outer side of the same edge of the rigid plate.

5. The area array ultrasonic transducer assembly as described in any one of claims 1 to 4, characterized in that, At least a portion of the flexible plate is located on the side of the backing away from the head assembly and is stacked with the backing.

6. The area array ultrasonic transducer assembly as described in any one of claims 1 to 4, characterized in that, The dedicated integrated circuit chip is fixedly connected to the rigid plate, and the area array ultrasonic transducer assembly includes a housing, with the rigid plate fixedly connected to the housing.

7. The area array ultrasonic transducer assembly as described in any one of claims 1 to 4, characterized in that, The application-specific integrated circuit chip includes pads, and the first electrical connection portion and the second electrical connection portion are formed by the pads.

8. The area array ultrasonic transducer assembly as described in any one of claims 1 to 4, characterized in that, The sound head assembly, the dedicated integrated circuit chip, the circuit board, and the backing are stacked sequentially; or, the sound head assembly, the circuit board, the dedicated integrated circuit chip, and the backing are stacked sequentially; or, the sound head assembly, the backing, the circuit board, and the dedicated integrated circuit chip are stacked sequentially.

9. A transesophageal ultrasound probe, characterized in that, include: The array ultrasonic transducer assembly, the insertion tube assembly, and the handle assembly are connected sequentially from the distal end to the proximal end; the array ultrasonic transducer assembly is the array ultrasonic transducer assembly according to any one of claims 1 to 8.

10. The transesophageal ultrasound probe as described in claim 9, characterized in that, The handle assembly includes a handle circuit board; The transesophageal ultrasound probe also includes a cable passing through the insertion tube assembly, the cable connecting the handle circuit board and the lead-out line for signal transmission between the lead-out line and the handle circuit board; or, the flexible plate also includes a transmission portion passing through the insertion tube assembly, the transmission portion being connected to the handle circuit board for signal transmission between the lead-out line and the handle circuit board.

11. A transvascular ultrasound probe, characterized in that, include: A planar ultrasonic transducer assembly, a conduit assembly, and a handle assembly are connected sequentially from the distal end to the proximal end; the planar ultrasonic transducer assembly is the planar ultrasonic transducer assembly according to any one of claims 1 to 8.

12. The transvascular ultrasound probe as described in claim 11, characterized in that, The handle assembly includes a handle circuit board; The transvascular ultrasound probe further includes a cable passing through the catheter assembly, the cable connecting the handle circuit board and the lead-out line for signal transmission between the lead-out line and the handle circuit board; or, the flexible plate further includes a transmission portion penetrating the catheter assembly, the transmission portion being connected to the handle circuit board for signal transmission between the lead-out line and the handle circuit board.

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