LED lamp bead patch structure

Abstract

The utility model discloses an LED lamp bead patch structure, and relates to the technical field of LED lamp beads. Comprising a lamp base, an LED lamp chip is installed on the top of the lamp base, a lampshade for shielding the LED lamp chip is installed on the top of the lamp base, a groove is formed in the bottom of the lamp base, protruding strips are fixedly connected to the bottom ends of the inner walls of the two sides of the groove, an inverted-U-shaped heat dissipation plate is arranged in the groove, and limiting strips located above the protruding strips are integrally connected to the tops of the two sides of the heat dissipation plate. Side plates attached to the bottom of the lamp base are integrally connected to the bottoms of the two sides of the heat dissipation plate, extension plates are fixedly connected to the sides, away from the heat dissipation plate, of the side plates, and lateral heat dissipation strips making contact with the side wall of the lamp base are arranged on the extension plates. According to the LED lamp bead patch structure, the lateral heat dissipation strips attached to the side faces of the lamp base are arranged on the two sides of the lamp base, and heat dissipation of the lamp base in the lateral height direction can be facilitated.

Description

Technical Field

[0001] This utility model relates to the field of LED lamp bead technology, specifically to an LED lamp bead patch structure. Background Technology

[0002] LED lights are solid-state lighting devices based on light-emitting diode technology. Their core principle is to directly convert electrical energy into light energy through the electroluminescence effect of semiconductor materials. They are characterized by high efficiency, energy saving, environmental friendliness, and long lifespan. Unlike traditional light sources (such as incandescent and fluorescent lamps), LEDs emit light through the recombination of electrons and holes in a semiconductor PN junction, eliminating the need to heat the filament or excite gas, making them a cold light source. LED lights represent the next generation of lighting technology. With their high efficiency, durability, and multifunctionality, they are comprehensively replacing traditional light sources and becoming the mainstream choice for green lighting. With technological advancements, LEDs are developing towards higher luminous efficacy and greater intelligence (such as adjustable color temperature and IoT control), showing enormous potential in sustainable energy and smart cities.

[0003] Surface mount LEDs are compact and lightweight, making them suitable for high-density installation. Surface mount LEDs produce pure, soft, and glare-free light, making them suitable for both decorative and lighting purposes. Surface mount LEDs are soldered onto the surface of a PCB circuit board, with the surface forming the circuitry. Because the LEDs are thinner and have narrow edges soldered onto the circuit board, they primarily dissipate heat by conducting it to the circuit board. However, the presence of dead zones at the top and bottom causes total internal reflection, resulting in poor heat dissipation in the vertical direction. Utility Model Content

[0004] This invention provides an LED chip structure to solve the problems in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an LED chip patch structure, including a lamp base with an LED chip mounted on top, a lamp cover covering the LED chip mounted on the top of the lamp base, a groove formed at the bottom of the lamp base, protrusions fixedly connected to the bottom ends of the inner walls on both sides of the groove, an inverted U-shaped heat sink plate provided in the groove, limiting strips integrally connected to the top of both sides of the heat sink plate above the protrusions, side plates integrally connected to the bottom of both sides of the heat sink plate and fitting against the bottom of the lamp base, an extension plate fixedly connected to the side of the side plate away from the heat sink plate, and a lateral heat dissipation strip on the extension plate that contacts the side wall of the lamp base.

[0006] Furthermore, notches are provided on both sides of the lamp base, and the lateral heat dissipation strip includes a connecting arm and a vertical heat dissipation fin. The bottom end of the connecting arm is bent and connected to an extension plate, and the top end of the connecting arm is inclined and integrally connected to the vertical heat dissipation fin. The vertical heat dissipation fin fits against the side of the lamp base.

[0007] Furthermore, a positioning groove extending along the height direction of the lamp base is provided on the notch, and the side of the vertical heat sink close to the lamp base is inserted into the positioning groove.

[0008] Furthermore, the top inner wall of the heat sink is uniformly provided with bottom heat sink fins.

[0009] Furthermore, pins are provided on both the front and rear sides of the lamp base.

[0010] Furthermore, the top of the heat sink is provided with a thermally conductive silicone sheet that fits against the inner wall of the groove.

[0011] Compared with the prior art, the present invention provides an LED chip structure with the following advantages:

[0012] 1. This LED chip structure, by setting lateral heat dissipation strips on both sides of the lamp base that are attached to its sides, can facilitate heat dissipation of the lamp base in the lateral height direction.

[0013] 2. The LED chip structure has a groove at the bottom of the lamp base, which allows airflow space to be formed at the bottom of the lamp base. Combined with the heat sink and bottom heat sink, it can facilitate heat dissipation at the bottom of the lamp base. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the structure of the heat sink of this utility model;

[0016] Figure 3 For the present utility model Figure 1 Enlarged diagram of point A in the diagram;

[0017] Figure 4 This is a side view of the structural diagram of this utility model.

[0018] In the diagram: 1. Lamp base; 2. Lamp cover; 3. Groove; 4. Raised strip; 5. Heat sink; 6. Side plate; 7. Limiting strip; 8. Extension plate; 9. Lateral heat sink; 10. Connecting arm; 11. Vertical heat sink; 12. Notch; 13. Positioning groove; 14. Bottom heat sink; 15. Pin; 16. Thermal conductive silicone pad. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-4 This utility model discloses an LED chip patch structure, including a lamp base 1 with an LED chip mounted on top, a lamp cover 2 covering the LED chip mounted on the top of the lamp base 1, a groove 3 at the bottom of the lamp base 1, and protrusions 4 fixedly connected to the bottom ends of the inner walls on both sides of the groove 3. An inverted U-shaped heat sink 5 is provided in the groove 3, and limiting strips 7 located above the protrusions 4 are integrally connected to the top of both sides of the heat sink 5. Side plates 6 that fit against the bottom of the lamp base 1 are integrally connected to the bottom of both sides of the heat sink 5. An extension plate 8 is fixedly connected to the side of the side plate 6 away from the heat sink 5, and a lateral heat dissipation strip 9 that contacts the side wall of the lamp base 1 is provided on the extension plate 8.

[0021] The protruding strips 4 at the bottom of the inner walls on both sides of the groove 3 make the cross-section of the groove 3 T-shaped, while the limiting strips 7 located above the protruding strips 4 and connected to the top of both sides of the heat sink 5 make it difficult for the heat sink 5 to detach from the groove 3 in the vertical direction.

[0022] Specifically, the lamp base 1 has notches 12 on both sides, and the side heat dissipation strip 9 includes a connecting arm 10 and a vertical heat dissipation fin 11. The bottom end of the connecting arm 10 is bent and connected to an extension plate 8. The top end of the connecting arm 10 is inclined and integrally connected to the vertical heat dissipation fin 11. The vertical heat dissipation fin 11 fits against the side of the lamp base 1.

[0023] The notch 12 has a positioning groove 13 extending along the height direction of the lamp base 1, and the side of the vertical heat sink 11 close to the lamp base 1 is inserted into the positioning groove 13.

[0024] In this embodiment, the connecting arm 10, the extension plate 8, and the vertical heat sink 11 are all made of aluminum alloy. The connecting arm 10 has elastic deformation capability, which allows one side of the vertical heat sink 11 to be inserted into the positioning groove 13 so as to fit against the side of the lamp base 1 and conduct and dissipate the heat on the lamp base 1.

[0025] Specifically, the top inner wall of the heat sink 5 is uniformly provided with bottom heat sink fins 14.

[0026] In this embodiment, the heat sink 5 and the bottom heat sink 14 are both made of aluminum alloy. The heat sink 5 is inverted U-shaped, so that the bottom of the lamp base 1 can form a space for air flow, so that the heat conducted from the lamp base 1 to the bottom heat sink 14 can be dissipated by the air flow.

[0027] Specifically, the top of the heat sink 5 is provided with a thermally conductive silicone sheet 16 that fits against the inner wall of the groove 3.

[0028] In this embodiment, the thermally conductive silicone sheet 16 is disposed on the top of the heat sink 5 to facilitate the top of the heat sink 5 to fit against the inner wall of the groove 3, so that the heat from the lamp base 1 can be conducted to the heat sink 5.

[0029] Specifically, the lamp base 1 is provided with pins 15 on both the front and rear sides.

[0030] In summary, this LED chip structure, by providing lateral heat dissipation strips 9 on both sides of the lamp base 1 that are attached to its sides, can facilitate heat dissipation of the lamp base 1 in the lateral height direction; by opening a groove 3 at the bottom of the lamp base 1, a space for airflow can be formed at the bottom of the lamp base 1, which, together with the heat dissipation plate 5 and the bottom heat dissipation fin 14, can facilitate heat dissipation at the bottom of the lamp base 1.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An LED chip surface mount structure, comprising a lamp base (1) on which LED chips are mounted on the top, characterized in that: The top of the lamp base (1) is equipped with a lamp cover (2) that covers the LED chip. The bottom of the lamp base (1) is provided with a groove (3). The bottom of the inner walls on both sides of the groove (3) is fixedly connected with a protrusion (4). The groove (3) is provided with an inverted U-shaped heat sink (5). The top of both sides of the heat sink (5) is integrally connected with a limiting strip (7) located above the protrusion (4). The bottom of both sides of the heat sink (5) is integrally connected with a side plate (6) that fits against the bottom of the lamp base (1). The side of the side plate (6) away from the heat sink (5) is fixedly connected with an extension plate (8). The extension plate (8) is provided with a lateral heat sink strip (9) that contacts the side wall of the lamp base (1).

2. The LED chip structure according to claim 1, characterized in that: The lamp base (1) has notches (12) on both sides. The side heat dissipation strip (9) includes a connecting arm (10) and a vertical heat dissipation plate (11). The bottom end of the connecting arm (10) is bent and connected to an extension plate (8). The top end of the connecting arm (10) is inclined and integrally connected to the vertical heat dissipation plate (11). The vertical heat dissipation plate (11) fits against the side of the lamp base (1).

3. The LED chip structure according to claim 2, characterized in that: The notch (12) has a positioning groove (13) extending along the height direction of the lamp base (1), and the vertical heat sink (11) is inserted into the positioning groove (13) on the side close to the lamp base (1).

4. The LED chip structure according to claim 1, characterized in that: The top inner wall of the heat sink (5) is uniformly provided with bottom heat sink fins (14).

5. The LED chip structure according to claim 1, characterized in that: The lamp base (1) is provided with pins (15) on both the front and rear sides.

6. The LED chip structure according to claim 1, characterized in that: The top of the heat sink (5) is provided with a thermally conductive silicone sheet (16) that fits against the inner wall of the groove (3).

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