Adapter plate and equipment suitable for chip CP test

Abstract

The utility model relates to the field of semiconductor testing, and particularly discloses an adapter plate and equipment suitable for chip CP testing. The adapter plate comprises a plate body, one side of the plate body is a gas distribution face, the other side of the plate body is an adsorption face, and the gas distribution face and the adsorption face are both planes. A gas distribution groove is formed in the gas distribution surface, adsorption holes are distributed in the bottom of the gas distribution groove, and the adsorption holes penetrate through the plate body and are communicated with the adsorption surface. The chip is clamped and transferred by the adapter plate in a direct negative pressure adsorption mode, so that the operation efficiency and the detection precision are effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing, specifically to an adapter board and device suitable for chip CP testing. Background Technology

[0002] Chip Probe Test (CP), also known as wafer-level test or probe test, is a critical testing step in the semiconductor manufacturing process. CP testing typically targets bare dies and is primarily used to inspect the electrical performance of chips at the wafer level, ensuring that only qualified dies proceed to the packaging stage. However, since the bare die is separated from the finished chip by a packaging process, even after passing CP testing, factors that could affect the chip's electrical performance can still occur during the packaging process. In production practice, there have indeed been instances where chips that pass CP testing on the bare die fail after packaging. Therefore, the purpose of this application is to provide a device suitable for CP testing of packaged chips.

[0003] In semiconductor manufacturing, QFN (Quad Flat No-lead) packaging is widely used in various integrated circuit products. Due to the special design of QFN packaging, one of the problems it faces is that the packaged chip often exhibits a certain degree of warpage.

[0004] In traditional CP testing, the chip is usually glued to the adapter board. When the chip warpage is too large, the reliability of the adhesive clamping and transfer clamping is insufficient, which leads to many unstable factors during the testing process and affects the detection accuracy and efficiency. Summary of the Invention

[0005] The technical problem to be solved by this utility model is to provide an adapter board and device suitable for chip CP testing, which clamps and transports the chip by direct negative pressure adsorption, effectively improving the operation efficiency and testing accuracy.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution: an adapter board suitable for chip CP testing, comprising a board body, one side of the board body being a gas distribution surface and the other side being an adsorption surface, both the gas distribution surface and the adsorption surface being planar; the gas distribution surface having a gas distribution groove, the bottom of the gas distribution groove having adsorption holes distributed thereon, the adsorption holes being disposed through the board body and communicating with the adsorption surface.

[0007] During CP testing, the gas distribution surface of the adapter plate corresponds to the matching negative pressure generating unit, and the gas distribution groove is connected to the negative pressure source, while the adsorption surface contacts the chip. The adapter plate functions as a negative pressure distribution device for chip adsorption and clamping, adsorbing and clamping the chip in the form of negative pressure adsorption. Even if the chip has some warping, it can be reliably clamped. At the same time, compared with adhesive methods, the clamping convenience of negative pressure adsorption is greatly improved, effectively improving operational efficiency and testing accuracy.

[0008] Preferably, the plate is made of stainless steel, ceramic, aluminum, or copper. The plate material has good stability and good processing performance.

[0009] Preferably, the thickness of the plate is 0.5~2mm.

[0010] Preferably, there are no fewer than three gas distribution slots, and each gas distribution slot extends radially from the center of the gas distribution surface.

[0011] Preferably, each air distribution groove is evenly distributed in a ring around the center of the air distribution surface, and each air distribution groove is not connected to the edge of the air distribution surface.

[0012] This ensures an effective clamping area on the adsorption surface, improving the reliability of chip clamping.

[0013] A device for chip CP testing includes a base and a negative pressure generating unit, and also includes an adapter plate as described above. The base is provided with a test mounting surface and a vacuum channel. The vacuum channel is connected to the negative pressure generating unit and extends to the test mounting surface. During testing, the gas distribution surface contacts the test mounting surface, and the vacuum channel is connected to the gas distribution groove.

[0014] Preferably, a vacuum groove is provided on the test mounting surface, the vacuum groove is arranged in a ring around the center of the test mounting surface, and the opening of the vacuum channel is located in the vacuum groove.

[0015] The vacuum chamber allows for further negative pressure distribution on the test mounting surface, thereby improving the reliability of the fit between the base and the adapter plate. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the device used for chip CP testing in this embodiment;

[0017] Figure 2 This is an exploded view of the device applicable to chip CP testing in this embodiment;

[0018] Figure 3 This is a cross-sectional view of the equipment applicable to chip CP testing in this embodiment;

[0019] Figure 4 for Figure 3 A magnified view of a section at point A in the middle;

[0020] Figure 5 This is a first-view structural diagram of the adapter board in the device used for chip CP testing in this embodiment;

[0021] Figure 6 This is a schematic diagram of the adapter board in the device used for chip CP testing in this embodiment, viewed from a second perspective.

[0022] Figure 7 This is a schematic diagram of the base structure in the device used for chip CP testing in this embodiment. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model. Example

[0024] like Figures 1-3 As shown, a device suitable for chip CP testing includes a base 1, a negative pressure generating unit, and an adapter board 2. The base 1 is provided with a test mounting surface 11 and a vacuum channel 12. The vacuum channel 12 is connected to the negative pressure generating unit and extends to the test mounting surface 11.

[0025] like Figure 5 and Figure 6 As shown, the adapter plate 2 includes a plate body, one side of which is a gas distribution surface 23 and the other side is an adsorption surface 21. Both the gas distribution surface 23 and the adsorption surface 21 are planar. The gas distribution surface 23 has a gas distribution groove 24, and adsorption holes 22 are distributed at the bottom of the gas distribution groove 24. The adsorption holes 22 penetrate the plate body and communicate with the adsorption surface 21. During testing, the gas distribution surface 23 is in contact with the test mounting surface 11, and the vacuum channel 12 is connected to the gas distribution groove 24.

[0026] Specifically, the plate is made of stainless steel, ceramic, aluminum, or copper. The plate has good material stability and good processing performance. The thickness of the plate is 0.5~2mm, and the depth of the air distribution groove 24 is 1 / 3~2 / 3 of the plate thickness.

[0027] like Figure 4As shown, during the CP test, the gas distribution surface 23 of the adapter plate 2 corresponds to the matching negative pressure generating unit, and the gas distribution groove 24 is connected to the negative pressure source, while the adsorption surface 21 contacts the chip 3. The adapter plate 2 functions as a negative pressure distribution device for adsorbing and holding the chip 3, adsorbing and holding the chip in the form of negative pressure adsorption. Even if the chip 3 has some warping, it can be reliably held. At the same time, compared with the adhesive method, the clamping convenience of the negative pressure adsorption method is greatly improved, effectively improving the operating efficiency and detection accuracy.

[0028] Furthermore, such as Figure 5 As shown, there are at least three gas distribution grooves 24, each extending radially outward from the center of the gas distribution surface 23. The gas distribution grooves 24 are evenly distributed in a ring around the center of the gas distribution surface 23, and none of the gas distribution grooves 24 are connected to the edge of the gas distribution surface 23. This ensures an effective clamping area for the adsorption surface 21 and improves the reliability of chip clamping.

[0029] Furthermore, such as Figure 7 As shown, a vacuum groove 13 is provided on the test mounting surface 11. The vacuum groove 13 is arranged in a ring around the center of the test mounting surface, and the opening of the vacuum channel 12 is located in the vacuum groove 13. The vacuum groove 13 can further distribute negative pressure on the test mounting surface 11 to improve the reliability of the fit between the base 1 and the adapter plate 2.

[0030] In summary, the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An adapter board suitable for chip CP testing, characterized in that: The plate includes a plate body, one side of which is a gas distribution surface and the other side is an adsorption surface. Both the gas distribution surface and the adsorption surface are planar. The gas distribution surface has a gas distribution groove, and the bottom of the gas distribution groove has adsorption holes. The adsorption holes penetrate the plate body and are connected to the adsorption surface.

2. The adapter board according to claim 1, characterized in that: The plate is made of stainless steel, ceramic, aluminum or copper.

3. The adapter board according to claim 1, characterized in that: The thickness of the plate is 0.5~2mm.

4. The adapter plate according to any one of claims 1-3, characterized in that: The number of gas distribution slots shall be no less than three, and each gas distribution slot extends radially from the center of the gas distribution surface as the origin.

5. The adapter board according to claim 4, characterized in that: Each gas distribution slot is evenly distributed in a ring around the center of the gas distribution surface, and each gas distribution slot is not connected to the edge of the gas distribution surface.

6. A device suitable for chip CP testing, comprising a base and a negative pressure generating unit, characterized in that: It also includes an adapter plate as described in any one of claims 1-5, wherein the base is provided with a test mounting surface and a vacuum channel, the vacuum channel is connected to a negative pressure generating unit, and the vacuum channel extends to the test mounting surface; during testing, the gas distribution surface contacts the test mounting surface, and the vacuum channel is connected to the gas distribution groove.

7. The device according to claim 6, characterized in that: A vacuum groove is provided on the test mounting surface, and the vacuum groove is arranged in a ring around the center of the test mounting surface. The opening of the vacuum channel is located in the vacuum groove.

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