Integrated circuit experiment test equipment
By integrating multiple instruments and a high-efficiency heat dissipation design, this integrated circuit experimental testing equipment solves the problems of large space occupation, complex operation, limited functions, poor heat dissipation, and poor portability of existing equipment. It achieves compact size, simplified operation, multi-functionality, and good heat dissipation, making it suitable for rapid testing and teaching of integrated circuits.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHONGSHAN CHENGJUN TECH CO LTD
- Filing Date
- 2025-05-28
- Publication Date
- 2026-05-19
AI Technical Summary
Existing integrated circuit experimental testing equipment suffers from problems such as large space occupation, complex operation, limited testing functions, poor heat dissipation, poor portability, and poor integration, making it difficult to meet the needs of rapid testing in limited spaces.
Design an integrated circuit experimental testing device that integrates multiple instruments into one unit. It adopts a microcontroller and a high-efficiency heat dissipation design, including a digital oscilloscope, function generator, digital logic analyzer, etc. Combined with a modular structure and a high-efficiency heat dissipation system, it is suitable for desktop use and testing in different locations.
The device features a compact size, simplified operation, multi-functionality, good heat dissipation, and portability, making it suitable for rapid testing in confined spaces and meeting the needs of integrated circuit design, simulation, manufacturing, testing, and teaching.
Smart Images

Figure CN224263333U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of integrated circuit testing technology, and in particular to an integrated circuit experimental testing device. Background Technology
[0002] An integrated circuit is a miniature electronic device or component. It is made by using certain processes to interconnect the transistors, resistors, capacitors, inductors and other components required for a circuit, and fabricate them on a small piece or several small pieces of semiconductor wafers or dielectric substrates. Then, it is packaged in a package to become a miniature structure with the required circuit function.
[0003] With the continuous advancement of information technology, integrated circuit technology, as the cornerstone of modern electronics, has permeated all sectors of the national economy. The rapid development of integrated circuit technology has placed new demands on talent cultivation. Higher education institutions, vocational schools, and other educational organizations need to train a group of professionals skilled in integrated circuit design, manufacturing, and testing. Therefore, integrated circuit experiments have become an important part of the curriculum for electronic engineering and related majors.
[0004] Integrated circuit experimental testing equipment is mainly used for functional testing, performance testing, and reliability testing of integrated circuit chips. Existing technical solutions typically include the following hardware components: test fixtures, test sockets, test boards, multimeters, power supplies, and other instruments. In practice, multiple instruments often need to work together, and wires, clamps, and other tools are used to connect the instruments, computers, displays, and other components.
[0005] like Figure 1 As shown, existing integrated circuit experimental testing equipment builds circuits by connecting simple wires, connecting computer hosts, displays, etc. to various circuit modules, connecting the circuits to testing instruments after they are built, and feeding the test results back to the computer. At the same time, the connected instruments are used to perform voltage, current monitoring, and other tests.
[0006] However, existing integrated circuit experimental testing equipment has the following limitations:
[0007] 1. Large space occupation: Some existing testing equipment is large in size and not suitable for desktop use, occupying a lot of workspace, which is not conducive to conducting experiments and tests on multiple devices in a limited space;
[0008] 2. Complex operation: Some devices are not user-friendly, and the wiring is too messy during testing, which increases the difficulty of operation and time cost;
[0009] 3. Limited testing functions: Some testing equipment may only provide basic power supply and fixed functions, lacking other testing functions such as automatic testing and fault diagnosis;
[0010] 4. Poor heat dissipation: Due to equipment size limitations or unreasonable heat dissipation design, the circuit board may overheat during long-term testing, affecting the accuracy of test results;
[0011] 5. Poor portability: Some testing equipment is heavy and bulky, making it difficult to move and unsuitable for situations where testing needs to be conducted in different locations;
[0012] 6. Poor integration: Some existing equipment is not integrated or has a low degree of integration. Multiple instruments are used separately, the testing functions are not centralized, and the equipment adaptability is not high. Utility Model Content
[0013] The technical problem to be solved by this utility model is to provide an integrated circuit experimental testing device that addresses the above-mentioned deficiencies of the prior art. By integrating multiple instruments into one unit for experimental testing, it is easy to operate and maintain. The device is more compact, occupies less space, has good heat dissipation, and is multifunctional, meeting the needs of rapid testing in a limited space. It is suitable for integrated circuit design, simulation, manufacturing, testing, and related experimental teaching and scientific research activities.
[0014] To solve the above-mentioned technical problems, the technical solution of this utility model is as follows:
[0015] An integrated circuit experimental testing device includes a housing. Inside the housing are a microcontroller and a digital oscilloscope, a function generator, a digital logic analyzer, a graphics generator, a virtual digital I / O interface, a front PCB panel, and several test interfaces electrically connected to the microcontroller. The front end of the housing has a voltage acquisition interface, a current acquisition interface, a display screen, and several voltage output ports electrically connected to the front PCB panel. An air inlet is provided at the bottom of the housing, a cooling fan is provided above the air inlet, a central air outlet is provided in the middle of the housing, and a heat dissipation vent is provided at the top of the housing. The central air outlet is connected to both the air inlet and the heat dissipation vent.
[0016] Preferably, the back of the housing is provided with a power interface and several peripheral interfaces that are electrically connected to the microcontroller.
[0017] Preferably, the housing is provided with a plurality of test rails, and the side of the housing is provided with a board slot.
[0018] Preferably, the microcontroller is electrically connected to a PXIe resource module or a PXI resource module.
[0019] Preferably, the outer casing includes a bottom plate, a middle cover plate, and a top cover plate, the middle cover plate being connected to the bottom plate and the top cover plate respectively, and the air inlet, the middle air outlet, and the heat dissipation outlet being respectively opened on the bottom plate, the middle cover plate, and the top cover plate.
[0020] Preferably, the housing contains a plurality of DC power supplies, which are electrically connected to the power interface and the microcontroller, respectively.
[0021] By adopting the above technical solution, the integrated circuit experimental testing equipment provided by this utility model has the following beneficial effects:
[0022] 1. Space optimization: The equipment is compact and suitable for desktop use, enabling integrated circuit experiments and tests in limited workspaces, reducing floor space requirements; the equipment is highly integrated, allowing for board selection and matching under different testing requirements, and integrates multiple instruments for experimental testing, facilitating operation and maintenance; it meets the need for rapid testing in limited spaces, and is suitable for integrated circuit design, simulation, manufacturing, testing, and related experimental teaching and research activities.
[0023] 2. Improved testing performance: Modular integration with a microcomputer controller and optional expansion cards is adopted. All resources are brought onto the PCB, and further development is carried out on top of that according to experimental requirements, improving the comprehensiveness and accuracy of the experiments.
[0024] 3. Improved heat dissipation: Adopting a highly efficient heat dissipation design, it ensures that the temperature of the test board remains within a safe range during long-term testing, avoiding test errors caused by overheating, and has a good heat dissipation effect.
[0025] 4. Improve portability: Design lightweight and portable chassis to meet the needs of testing in different locations.
[0026] 5. Simpler operation: The equipment has fewer physical connecting wires, making it easier to conduct experiments and connect wires. The wiring is clear and simple, and the operation is simple and convenient. Attached Figure Description
[0027] Figure 1 This is a schematic diagram of the structure of existing integrated circuit experimental testing equipment;
[0028] Figure 2 This is an exploded view of the present invention;
[0029] Figure 3 This is a perspective view of the present utility model;
[0030] Figure 4 This is a side view of the present invention;
[0031] Figure 5 This is a rear view of the present invention;
[0032] In the diagram, 1-casing, 2-microcontroller, 3-digital oscilloscope, 4-function generator, 5-digital logic analyzer, 6-graphics generator, 7-virtual digital I / O interface, 8-front PCB panel, 9-test interface, 10-voltage acquisition interface, 11-current acquisition interface, 12-display screen, 13-voltage output port, 14-air inlet, 15-cooling fan, 16-middle air outlet, 17-heat dissipation vent, 18-power interface, 19-peripheral interface, 20-test rail, 21-board slot, 22-base plate, 23-middle cover plate, 24-top cover plate, 25-DC power supply. Detailed Implementation
[0033] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings. It should be noted that these descriptions are for the purpose of aiding understanding of this utility model, but do not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.
[0034] like Figure 2-5 As shown, the integrated circuit experimental testing equipment includes a housing 1. Inside the housing 1 are a microcontroller 2 and a digital oscilloscope 3, a function generator 4, a digital logic analyzer 5, a graphics generator 6, a virtual digital I / O interface 7, a front PCB panel 8, and several test interfaces 9, all electrically connected to the microcontroller 2. The front end of the housing 1 is provided with a voltage acquisition interface 10, a current acquisition interface 11, a display screen 12, and several voltage output ports 13, all electrically connected to the front PCB panel 8. An air inlet 14 is provided at the bottom of the housing 1, and a cooling fan 15 is provided above the air inlet 14. A central air outlet 16 is provided in the middle of the housing 1, and a heat dissipation vent 17 is provided at the top of the housing 1. The central air outlet 16 is connected to the air inlet 14 and the heat dissipation vent 17, respectively. Understandably, the digital oscilloscope 3 is a dual-channel USB digital oscilloscope (1MΩ, ±25V, differential, 14-bit, 100M samples / second); the function generator 4 is a dual-channel arbitrary function generator (±5V, 14-bit, 100M samples / second); the digital logic analyzer 5 is a 16-channel digital logic analyzer (3.3V CMOS, 100M samples / second); the graphics generator 6 is a 16-channel graphics generator (3.3V CMOS, 100M samples / second); the virtual digital I / O interface 7 is a 16-channel virtual digital I / O, including buttons, switches, and LEDs, which is very suitable for logic training applications; the voltage acquisition interface 10 is a four-channel 12-bit ±12V voltage acquisition interface; and the current acquisition interface 11 is a four-channel 12-bit ±500mA current acquisition interface.
[0035] Specifically, the back of the housing 1 is provided with a power interface 18 electrically connected to the microcontroller 2 and several peripheral interfaces 19. Several test rails 20 are provided inside the housing 1. Board slots 21 are provided on the side of the housing 1. The microcontroller 2 is electrically connected to a PXIe resource module or a PXI resource module. The housing 1 includes a base plate 22, a middle cover plate 23 and a top cover plate 24. The middle cover plate 23 is connected to the base plate 22 and the top cover plate 24 respectively. The air inlet 14, the middle air outlet 16 and the heat dissipation vent 17 are respectively opened on the base plate 22, the middle cover plate 23 and the top cover plate 24. Several DC power supplies 25 are provided inside the housing 1. The DC power supplies 25 are electrically connected to the power interface 18 and the microcontroller 2 respectively. Working Principle: 1. The casing has 8 slots. Slot 1 is for a microcontroller computer. Slots 2-8 are for optional PXIe or PXI resource modules. Insert the modules into the slots and use standard cables to lead the module information to the PCB panel. 2. Connect the display, keyboard, and mouse, then connect the power supply and press the power switch. The device will start automatically. 3. Before the experiment, connect all resources to the front PCB panel (slot 8). Develop the necessary components according to the experimental requirements, including: a dual-channel USB digital oscilloscope (1MΩ, ±25V, differential, 14-bit, 100M samples / second); a dual-channel arbitrary function generator (±5V, 14-bit, 100M samples / second); a 16-channel digital logic analyzer (3.3V CMOS, 100M samples / second); and a 16-channel graphics generator (3.3V...). CMOS sensor, 100M sampling / second; 16-channel virtual digital I / O, including buttons, switches, and LEDs, ideal for logic training applications. 4. The device's function panel features four 12-bit ±12V voltage acquisition channels; four 12-bit ±500mA current acquisition channels; ±5V DC power supply with a maximum output current of 2A; ±15V DC power supply with a maximum output current of 500mA; -12-0V adjustable DC power supply with a maximum output current of 500mA; and 0-12V adjustable DC power supply with a maximum output current of 500mA. 5. Experiments can be performed using the above functions according to experimental requirements. 6. During testing, the device will draw air in from the bottom, exhaust it from the middle, and finally dissipate heat at the top for heat dissipation. The heat dissipation design is concealed and operates quietly. 7. After testing, turn off the device power.
[0036] Understandably, this utility model has a reasonable design and unique structure, and has the following advantages:
[0037] 1. Space Optimization: The equipment is compact and suitable for desktop use, enabling integrated circuit experiments and tests in limited workspaces, reducing floor space requirements; the equipment is highly integrated, allowing for board selection and matching under different testing requirements, and integrates multiple instruments for experimental testing, facilitating operation and maintenance; it meets the need for rapid testing in limited spaces, and is suitable for integrated circuit design, simulation, manufacturing, testing, and related experimental teaching and research activities, covering multiple disciplines such as electronic engineering, microelectronics, semiconductor technology, materials science, and automation control.
[0038] 2. Improved testing performance: Modular integration with a microcomputer controller and optional expansion cards is adopted. All resources are brought onto the PCB, and further development is carried out on top of that according to experimental requirements, improving the comprehensiveness and accuracy of the experiments.
[0039] 3. Improved heat dissipation: Adopting a highly efficient heat dissipation design, it ensures that the temperature of the test board remains within a safe range during long-term testing, avoiding test errors caused by overheating, and has a good heat dissipation effect.
[0040] 4. Improve portability: Design lightweight and portable chassis to meet the needs of testing in different locations.
[0041] 5. Simpler operation: The equipment has fewer physical connecting wires, making it easier to conduct experiments and connect wires. The wiring is clear and simple, and the operation is simple and convenient.
[0042] The embodiments of this utility model have been described in detail above with reference to the accompanying drawings, but this utility model is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of this utility model, and these variations still fall within the protection scope of this utility model.
Claims
1. An integrated circuit experimental testing device, comprising a housing, characterized in that: The housing contains a microcontroller and, electrically connected to the microcontroller, a digital oscilloscope, a function generator, a digital logic analyzer, a graphics generator, a virtual digital I / O interface, a front PCB panel, and several test interfaces. The front end of the housing has a voltage acquisition interface, a current acquisition interface, a display screen, and several voltage output ports, all electrically connected to the front PCB panel. The bottom of the housing has an air inlet, above which is a cooling fan. The middle of the housing has a central air outlet, and the top of the housing has a heat dissipation vent. The central air outlet is connected to both the air inlet and the heat dissipation vent.
2. The integrated circuit experimental testing equipment according to claim 1, characterized in that: The back of the housing is provided with a power interface and several peripheral interfaces that are electrically connected to the microcontroller.
3. The integrated circuit experimental testing equipment according to claim 1, characterized in that: The housing contains several test rails, and the side of the housing has a card slot.
4. The integrated circuit experimental testing equipment according to claim 1, characterized in that: The microcontroller is electrically connected to a PXIe resource module or a PXI resource module.
5. The integrated circuit experimental testing equipment according to claim 1, characterized in that: The outer casing includes a bottom plate, a middle cover plate, and a top cover plate. The middle cover plate is connected to the bottom plate and the top cover plate respectively. The air inlet, the middle air outlet, and the heat dissipation vent are respectively opened on the bottom plate, the middle cover plate, and the top cover plate.
6. The integrated circuit experimental testing equipment according to claim 2, characterized in that: The housing contains several DC power supplies, which are electrically connected to the power interface and the microcontroller, respectively.