Super-high-altitude DALI Bluetooth intelligent control device

Abstract

The utility model relates to a super-high-altitude DALI Bluetooth intelligent control device, which is arranged in a control box and comprises an alternating current input circuit, a switching power supply circuit electrically connected with the alternating current input circuit, a direct current power supply circuit electrically connected with the switching power supply circuit and a Bluetooth chip circuit electrically connected with the direct current power supply circuit. The control box comprises a control box upper cover, a Bluetooth chip circuit electrically connected with the control box upper cover, a super-high-altitude infrared induction circuit and / or a super-high-altitude microwave induction circuit electrically connected with the Bluetooth chip circuit, and a DALI output circuit electrically connected with the Bluetooth chip circuit, the DC power supply circuit is electrically connected with the DALI output circuit, the super-high-altitude infrared induction circuit and / or the super-high-altitude microwave induction circuit, and the control box upper cover is a super-high-altitude infrared lens. A blind area and a high-sensitivity area which are alternately changed are generated in front of the lens. According to the scheme, the problem that an existing infrared sensor and an existing microwave sensor are prone to being affected by environmental factors and consequently are poor in sensing sensitivity or fail in the superaltitude environment is solved. The whole control box is compact in structural design and does not occupy space.

Description

Technical Field

[0001] This utility model relates to the field of lighting products, and in particular to an ultra-high altitude DALI Bluetooth intelligent control device. Background Technology

[0002] The lighting products on the market are usually equipped with a lighting box. For energy-saving considerations, the lighting box has a sensor function. The sensor usually includes an infrared sensor and a microwave sensor. Under normal circumstances, the height of the place where the lighting fixture is installed will not exceed 8m. The sensing sensitivity of the existing infrared sensor and microwave sensor can meet the needs of the product. However, when the height of the place where the lighting fixture is installed exceeds 8m, such as when it is installed at a very high altitude (above 20 meters), the existing infrared sensor and microwave sensor have the following defects: (1) A single infrared sensor (i.e., PIR) is easily affected by heat sources (PIR is a pyroelectric infrared sensor that detects changes in infrared radiation. It is mainly used to detect heat sources other than the human body or changes and movements of temperature without heat sources). In some cases, such as when the temperature change and movement of the heat source are not obvious, PIR may not be able to detect effectively. Therefore, it is easily affected by factors such as changes in ambient temperature, humidity and wind source. There is a detection blind zone when installed at a very high altitude (above 20 meters). (2) Microwave sensors have strong penetrability to non-metallic materials such as plastic and glass, which may cause the detection range to exceed the expected range and easily lead to false detection of objects in the surrounding environment, resulting in false triggering. At the same time, weather conditions such as rain, snow, and fog may absorb or scatter microwave signals, reducing the detection distance and sensitivity. Existing microwave sensors usually rely on the Doppler effect to detect moving objects, and are not sensitive to stationary or slowly moving targets.

[0003] To overcome the above shortcomings, this solution proposes an ultra-high altitude DALI Bluetooth intelligent control device. Utility Model Content

[0004] The purpose of this invention is to solve the problems of existing infrared sensors being susceptible to heat interference when used at ultra-high altitudes. When the temperature change or movement of the heat source is not significant, effective detection is impossible. They are also easily affected by environmental factors, resulting in detection blind spots when installed at ultra-high altitudes. Existing microwave sensors have strong penetrability to non-metallic materials, causing the detection range to exceed the expected range and easily leading to false detections of surrounding objects and false triggering. Furthermore, rain, snow, fog, and other weather conditions may absorb or scatter microwave signals, reducing detection distance and sensitivity, and causing insensitivity to stationary or slowly moving targets. The specific solutions are as follows:

[0005] An ultra-high altitude DALI Bluetooth smart control device, housed inside a control box, includes an AC input circuit, a switching power supply circuit electrically connected to the AC input circuit, a DC power supply circuit electrically connected to the switching power supply circuit, a Bluetooth chip circuit electrically connected to the DC power supply circuit, an ultra-high altitude infrared sensing circuit and / or an ultra-high altitude microwave sensing circuit electrically connected to the Bluetooth chip circuit, and a DALI output circuit electrically connected to the Bluetooth chip circuit. The DC power supply circuit is electrically connected to the DALI output circuit, the ultra-high altitude infrared sensing circuit, and / or the ultra-high altitude microwave sensing circuit. The top cover of the control box is an ultra-high altitude infrared lens, which generates an alternating blind zone and a high-sensitivity zone in front of it.

[0006] Furthermore, the ultra-high altitude infrared sensing circuit includes: an infrared sensor PIR, pin 1 of the infrared sensor PIR is electrically connected to one end of resistors R32, R33, R43 and capacitor C43, pins 2 and 4 of the infrared sensor PIR are electrically connected to one end of resistor R31 and capacitor C42 and the other end of resistor R32, the other end of resistor R31 is connected to the +3.3V power supply terminal of the DC power supply circuit, pin 5 of the infrared sensor PIR is electrically connected to one end of resistors R34 and R35, pins 3 and 6 of the infrared sensor PIR are grounded, the other end of capacitors C42 and C43 is grounded, the other end of resistors R33 and R34 is grounded, the other end of resistor R43 is electrically connected to pin 23 of the Bluetooth chip circuit U6 (SENSOR interface), and the other end of resistor R35 is electrically connected to pin 22 of the Bluetooth chip circuit U6 (PIR interface).

[0007] Furthermore, the infrared sensor PIR model is JP906B.

[0008] Furthermore, the ultra-high altitude microwave induction circuit includes a microwave chip U11 and a microwave board assembly.

[0009] Furthermore, the microwave chip U11 is model AT58MP1T1RS32A.

[0010] Furthermore, pin 16 of the microwave chip U11 is electrically connected to one end of inductor L2 and capacitor C1, the other end of capacitor C1 is connected to the TX_ANT transmitting antenna, and the other end of inductor L2 is grounded. Pin 25 of the microwave chip U11 is electrically connected to one end of inductor L1 and capacitor C2, the other end of capacitor C2 is connected to the RX_ANT receiving antenna, and the other end of inductor L1 is grounded. Pins 1 and 32 of the microwave chip U11 are connected to the +3.3V power supply terminal of the DC power supply circuit. Pins 4, 5, and 6 of the microwave chip U11 are electrically connected to pins 12, 13, and 25 of the Bluetooth chip circuit U6 in sequence for communication and data transmission.

[0011] Further, the DALI output circuit includes: a resistor R11 connected between the gate and source of MOSFET Q2; the drain of MOSFET Q2 electrically connected to one end of resistor R10; the other end of resistor R10 electrically connected to both the collector of transistor Q1 and the base of transistor Q3; a resistor R7 connected between the emitter and base of transistor Q1; the base of transistor Q1 electrically connected to the emitter of Q3 and one end of capacitor C26; the collector of transistor Q3 electrically connected to the other end of capacitor C26, one end of capacitor C22, and the positive terminal of diode D7; the other end of capacitor C22 and the negative terminal of diode D7 electrically connected to one end of capacitor C25, the negative terminal of Zener diode, and the drain of MOSFET Q5; a capacitor C27 connected between the drain and source of MOSFET Q5; and the source of MOSFET Q5... A resistor R9 is connected between the gate and the electrode. The other end of capacitor C25 and the positive terminal of the Zener diode are electrically connected to one end of resistor R18. The other end of resistor R18 is electrically connected to one end of resistors R12 and R13. The other end of resistor R13 and the source of MOSFETs Q2 and Q5 are grounded. The emitter of transistor Q1 is connected to the +16V power supply terminal of the DC power supply circuit. The cathode of diode D7 is the DALI+ output terminal. The ground terminal of resistor R13 is the DALI- output terminal. The gate of MOSFET Q2 is electrically connected to the POWER interface (pin 21) of the Bluetooth chip circuit U6. The gate of MOSFET Q5 is electrically connected to the DALITX interface (pin 4) of the Bluetooth chip circuit U6 through resistor R8. The other end of resistor R12 is electrically connected to the DALIRX interface (pin 2) of the Bluetooth chip circuit U6.

[0012] Furthermore, the longitudinal section of the ultra-high altitude infrared lens is an isosceles trapezoid, the waist of which is formed by connecting multiple smaller isosceles trapezoids, and the obtuse angle formed by the waist and the lower base of the isosceles trapezoid is 155°.

[0013] Furthermore, the AC input circuit, switching power supply circuit, DC power supply circuit, Bluetooth chip circuit, ultra-high altitude infrared sensing circuit, and DALI output circuit are mounted on a large PCB board, while the ultra-high altitude microwave sensing circuit is mounted on top of the large PCB board via pin headers.

[0014] Optionally, the large PCB board is also provided with a light-sensing dimming circuit, which is electrically connected to the Bluetooth chip circuit and the DC power supply circuit respectively.

[0015] In summary, the technical solution of this utility model has the following beneficial effects:

[0016] This invention addresses the shortcomings of existing technologies by developing an ultra-high-altitude DALI Bluetooth intelligent control device. It solves the problem of poor sensitivity or malfunction in existing infrared and microwave sensors at ultra-high altitudes, which are easily affected by environmental factors. This solution combines data from multiple sensing sources (such as ultra-high-altitude microwave and infrared sensing circuits) with Bluetooth chip algorithms to solve the reliability problem of detection in complex ultra-high-altitude scenarios. It also provides an ultra-high-altitude DALI Bluetooth intelligent control device that can intelligently adjust the brightness and color temperature of lighting output to adapt to environmental changes, allowing for the setting of multiple lighting scenarios. It can be widely used in large-space lighting scenarios such as stadiums, industrial plants, and transportation hubs. The ultra-high-altitude microwave sensing circuit uses a microwave radar sensor chip (microwave chip U11) and its surrounding resistor-capacitor-inductor circuitry. This microwave radar sensor chip uses mature CMOS technology and integrates a microwave transceiver, radar intermediate frequency amplifier circuit, and MCU processor, making it a fully integrated SOC (system-on-a-chip). Compared with traditional radar sensing modules, it has better consistency and anti-interference capabilities. The microwave radar sensor chip operates by default in the 5.8GHz band, with flexible frequency configuration. It features fixed frequency and high sensitivity, and integrates an adaptive calibration algorithm on-chip, effectively solving problems such as co-channel interference, out-of-band blocking, and environmental interference, greatly improving the reliability and practicality of the sensor. The chip integrates an MCU, which can directly output sensing control signals. With a few external components, a complete microwave sensing sensor can be formed. The ultra-high-altitude infrared sensing circuit uses a high-sensitivity digital infrared sensor, which integrates a digital intelligent control circuit and a human detection sensing element within an electromagnetic shield (i.e., the JP906B type infrared sensor PIR). This sensor couples human movement signals to the digital intelligent integrated circuit chip through a high-impedance differential input circuit, converting them into ADC digital signals. When the pyroelectric infrared (PIR) signal exceeds a preset digital threshold, the sensor will generate a timed high-level output. This scheme employs an ultra-high-altitude infrared lens, specifically a Fresnel lens (Φ88*9.6mm). The Fresnel lens utilizes the special optical principles of lenses to create an alternating "blind zone" and "high-sensitivity zone" in front of the detector, thereby enhancing its detection and reception sensitivity. When a person or object with changing heat passes beneath the lens, the infrared radiation emitted by the person or object continuously and alternately moves from the "blind zone" to the "high-sensitivity zone." This causes the received infrared signal to be input to the surface of the infrared sensor (PIR) in a pulsed manner, thus amplifying its energy amplitude. Through the focusing effect of the Fresnel lens, the pyroelectric infrared signal is refracted (reflected) onto the infrared sensor (PIR), enabling moving objects entering the detection area to generate varying pyroelectric infrared signals on the PIR sensor in the form of temperature changes.The DALI output circuit of this solution, paired with the Bluetooth chip circuit U6, intelligently controls the DALI output through the DAL ITX interface, sending various DALI commands and sequences, thereby providing multiple settings and scene selections. Through the DAL IRX interface of the Bluetooth chip circuit U6, various information such as power consumption, usage time, and power consumption of the driver can be read. The Bluetooth chip circuit U6 of this solution has a preset program that can be used with a mobile APP to set multiple trigger modes: (1) Microwave (HF) sensing mode: can only be triggered by microwave sensing; (2) Infrared (PIR) sensing mode: can only be triggered by infrared sensor sensing; (3) Microwave and infrared (HF+PIR) sensing mode: both microwave triggering and infrared triggering must be satisfied to be judged as a valid sensing signal; (4) Microwave or infrared (HF / PIR) sensing mode: either microwave triggering or infrared triggering is satisfied as a valid sensing signal. Both microwave and infrared sensing can be set to 100%, 75%, 50%, and 10% sensitivity through the slider. The sensing distance range and sensing sensitivity will be proportional to the set value. It can intelligently select and set the optimal usage mode according to different usage environments to achieve the best user experience. The light-sensing dimming circuit in this solution can bypass scene modes and automatically adjust the brightness of the lamps in real time according to the actual ambient light conditions, achieving energy saving. The entire control box of this solution has a compact and space-saving design. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 This is a structural diagram of the ultra-high altitude DALI Bluetooth intelligent control device of this utility model;

[0019] Figure 2 This is a schematic diagram illustrating the use of the ultra-high altitude DALI Bluetooth intelligent control device of this utility model in conjunction with an LED lighting driver;

[0020] Figure 3 This is a longitudinal cross-sectional view of the ultra-high altitude infrared lens of this utility model;

[0021] Figure 4 This is a block diagram of the ultra-high altitude DALI Bluetooth intelligent control device of this utility model;

[0022] Figure 5 This is a circuit diagram of the Bluetooth chip of this utility model;

[0023] Figure 6 This is a circuit diagram of the ultra-high altitude infrared sensing circuit of this utility model;

[0024] Figure 7 This is a circuit diagram of the ultra-high altitude microwave induction circuit of this utility model;

[0025] Figure 8 This is a DALI output circuit diagram of this utility model;

[0026] Figure 9 This is a circuit diagram of the photosensitive dimming circuit of this utility model.

[0027] Explanation of reference numerals in the attached figures:

[0028] 1-Control box, 2-AC input circuit, 3-Switching power supply circuit, 4-DC power supply circuit, 5-Bluetooth chip circuit, 6-Ultra-high altitude infrared sensing circuit, 7-Ultra-high altitude microwave sensing circuit, 8-DALI output circuit, 9-Light-sensing dimming circuit, 10-Ultra-high altitude infrared lens, 101-Small isosceles trapezoid, 20-LED lamp driver. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0030] DALI is an abbreviation for "Digital Addressable Lighting Interface". It is a digital transmission and control protocol specifically designed for lighting control. It defines the digital communication method between lighting appliances (driving circuits of various lamps) and system equipment controllers (such as lighting controllers, sensors, etc.).

[0031] like Figures 1 to 9As shown, the ultra-high altitude DALI Bluetooth smart control device is housed inside the control box 1. It includes an AC input circuit 2, a switching power supply circuit 3 electrically connected to the AC input circuit 2, a DC power supply circuit 4 electrically connected to the switching power supply circuit 3, a Bluetooth chip circuit 5 electrically connected to the DC power supply circuit 4, an ultra-high altitude infrared sensing circuit 6 and / or an ultra-high altitude microwave sensing circuit 7 electrically connected to the Bluetooth chip circuit 5, and a DALI output circuit 8 electrically connected to the Bluetooth chip circuit 5. The DC power supply circuit 4 is electrically connected to the DALI output circuit 8, the ultra-high altitude infrared sensing circuit 6, and / or the ultra-high altitude microwave sensing circuit 7. The top cover of the control box 1 is an ultra-high altitude infrared lens 10, which generates an alternating blind zone and a high-sensitivity zone in front of it. This device is used in conjunction with an LED lighting driver 20, see... Figure 2 The control box 1 and the ultra-high altitude infrared lens 10 are installed at a high altitude, with the front of the ultra-high altitude infrared lens 10 facing downwards, for sensing people moving on the ground. The LED light driver 20 has four wiring ports: DA+ (electrically connected to the DALI+ output terminal of the DALI output circuit 8), DA- (electrically connected to the DALI- output terminal of the DALI output circuit 8), L (electrically connected to the AC live wire), and N (electrically connected to the AC neutral wire). The control box 1 has four leads: L (preferably brown, electrically connected to the AC live wire), N (preferably blue, electrically connected to the AC neutral wire), DALI- (preferably white, the DALI- output terminal of the DALI output circuit 8), and DALI+ (preferably red, the DALI+ output terminal of the DALI output circuit 8).

[0032] Specifically, the ultra-high altitude infrared sensing circuit 6 includes: an infrared sensor PIR; pin 1 (SENS pin) of the infrared sensor PIR is electrically connected to one end of resistors R32, R33, R43, and capacitor C43; pin 2 (OEN pin, enabling the infrared sensor chip to enter the working state) and pin 4 (VDD pin, supplying power to the infrared sensor) of the infrared sensor PIR are electrically connected to one end of resistor R31 and capacitor C42, and the other end of resistor R32; the other end of resistor R31 is connected to the +3.3V power supply terminal of the DC power supply circuit 4; and pin 5 (VOU... The T pin (which outputs a signal to the Bluetooth chip circuit via resistor R35) is electrically connected to one end of resistors R34 and R35. Pins 3 (GROUND pin, ground pin) and 6 (ONTIME pin, used for time adjustment, not used in this embodiment) of the infrared sensor PIR are simultaneously grounded. The other ends of capacitors C42 and C43 are grounded, as are the other ends of resistors R33 and R34. The other end of resistor R43 is electrically connected to pin 23 (SENSOR interface) of Bluetooth chip circuit U6 in circuit 5. The other end of resistor R35 is electrically connected to pin 22 (PIR interface) of Bluetooth chip circuit U6. A brief description of the working principle of the ultra-high altitude infrared sensing circuit 6: +3.3V is connected to the sensor's SENS pin via resistor R31 and resistor R32. The SENS pin is connected to ground via resistor R33. Resistor R33 is connected to resistor R43 and then to the Bluetooth chip module's SENSOR interface. The Bluetooth chip sends a PWM signal with a fixed frequency and different duty cycles through resistor R43 to the infrared sensor's SENS pin, thereby generating different voltages on the SENS pin. The voltage input to the SENS pin is used to set the sensitivity threshold, which is used to detect the strength of the PIR signal at the input. When grounded, the voltage reaches the minimum threshold, resulting in the highest sensitivity. Any voltage exceeding VDD / 2 will select the maximum threshold, which corresponds to the lowest sensitivity for PIR signal detection, i.e., the shortest possible sensing distance. The sensing distance of the infrared sensor is not linearly related to the SENS input voltage; its actual sensing distance is affected by a combination of factors, including the sensor's own signal-to-noise ratio, the imaging object distance of the Fresnel lens, the background temperature of a moving human body, ambient temperature, ambient humidity, and electromagnetic interference. The VOUT pin is connected to ground via resistor R34 and to the PIR pin of the Bluetooth chip via resistor R35. When a sensing trigger signal is received, a high-level signal is output and passed through resistor R35 to the PIR pin of the Bluetooth chip.

[0033] Specifically, the preferred PIR sensor model is JP906B.

[0034] Specifically, the ultra-high altitude microwave induction circuit 7 includes: a microwave chip U11 and a microwave board assembly. The microwave board assembly houses the electronic components surrounding the microwave chip U11, see... Figure 7 .

[0035] Specifically, the model number of the microwave chip U11 is AT58MP1T1RS32A.

[0036] Specifically, pin 16 of microwave chip U11 is electrically connected to one end of inductor L2 and capacitor C1. The other end of capacitor C1 is connected to the TX_ANT transmitting antenna, and the other end of inductor L2 is grounded. Inductor L2 and capacitor C1 form the TX_ANT transmitting antenna matching circuit. Pin 25 of microwave chip U11 is electrically connected to one end of inductor L1 and capacitor C2. The other end of capacitor C2 is connected to the RX_ANT receiving antenna, and the other end of inductor L1 is grounded. Inductor L1 and capacitor C2 form the RX_ANT receiving antenna matching circuit. Pins 1 and 32 of microwave chip U11 are connected to the +3.3V power supply terminal of the DC power supply circuit. Pins 4 (RX0), 5 (TX0), and 6 (OUT) of microwave chip U11 are electrically connected to pins 12 (RX), 13 (TX), and 25 (DATA) of Bluetooth chip circuit U6 in sequence for communication and data transmission (i.e., digital signals in the following text).

[0037] The U11 microwave chip, using mature CMOS technology, integrates a microwave transceiver, radar intermediate frequency amplifier circuit, and MCU processor, making it a fully integrated SOC. Compared to traditional radar sensing modules, it offers superior consistency and anti-interference capabilities. The U11 operates by default in the 5.8GHz band, with flexible frequency configuration, featuring fixed frequency and high sensitivity. An on-chip adaptive calibration algorithm effectively solves problems such as co-channel interference, out-of-band blocking, and environmental interference, significantly improving the sensor's reliability and practicality. The chip integrates an MCU, allowing direct output of sensing control signals; a few external components are all that's needed to form a complete microwave sensor. Specifically, the microwave signal generated by the internal phase-locked loop is amplified by a power amplifier and radiated through an antenna. When the microwave signal encounters an object (including a moving person), it is reflected, resulting in a frequency difference between the reflected and transmitted signals—the Doppler shift effect. By analyzing the mixing result of the received reflected and transmitted signals, the MCU obtains the corresponding intermediate frequency information, thereby calculating information such as the object's speed and distance. The output signal is a digital signal (i.e., OUT sensor output) processed by the chip, which is output to the Bluetooth chip (i.e., Bluetooth chip circuit U6) to trigger microwave sensing. In this solution, the microwave chip U11 uses a dual-antenna design to adapt to ultra-high altitude applications. RX_ANT and TX_ANT are antenna pins, while RX0 and TX0 pins are led out from the microwave radar sensor chip (i.e., microwave chip U11) and connected to an external Bluetooth chip (i.e., Bluetooth chip circuit U6) for communication with an external serial port and output of an intermediate frequency signal. The OUT pin outputs high and low levels to the Bluetooth chip to determine whether sensing is triggered.

[0038] Specifically, the DALI output circuit 8 includes: a resistor R11 connected between the gate and source of MOSFET Q2; the drain of MOSFET Q2 electrically connected to one end of resistor R10; the other end of resistor R10 electrically connected to both the collector of transistor Q1 and the base of transistor Q3; a resistor R7 connected between the emitter and base of transistor Q1; the base of transistor Q1 electrically connected to the emitter of Q3 and one end of capacitor C26; the collector of transistor Q3 electrically connected to the other end of capacitor C26, one end of capacitor C22, and the positive terminal of diode D7; the other end of capacitor C22 and the negative terminal of diode D7 electrically connected to one end of capacitor C25, the negative terminal of the Zener diode, and the drain of MOSFET Q5; a capacitor C27 connected between the drain and source of MOSFET Q5; and the... A resistor R9 is connected between the source and the gate. The other end of capacitor C25 and the positive terminal of the Zener diode are electrically connected to one end of resistor R18. The other end of resistor R18 is electrically connected to one end of resistors R12 and R13. The other end of resistor R13 and the source of MOSFETs Q2 and Q5 are grounded. The emitter of transistor Q1 is connected to the +16V power supply terminal of DC power supply circuit 4. The cathode of diode D7 is the DALI+ output terminal. The ground terminal of resistor R13 is the DALI- output terminal. The gate of MOSFET Q2 is electrically connected to the POWER interface of pin 21 of Bluetooth chip circuit U6. The gate of MOSFET Q5 is electrically connected to the DALITX interface of pin 4 of Bluetooth chip circuit U6 through resistor R8. The other end of resistor R12 is electrically connected to the DALIRX interface of pin 2 of Bluetooth chip circuit U6.

[0039] A brief description of the operation of DALI output circuit 8: The gate of MOSFET Q2 is connected to the POWER interface of the Bluetooth chip (i.e., Bluetooth chip circuit U6). The Bluetooth chip outputs a high or low level signal to control whether the DALI circuit is powered by 16V BUS (the default is high level, i.e., powered). The +16V power supply passes through transistors Q1 and Q3 to form a current limiting circuit, limiting the maximum load current of the DALI circuit. Diode D7 is the DALI+ output terminal, outputting a DALI signal to control the brightness, color temperature, and switching time of the power driver (i.e., LED lighting driver 20), etc. Simultaneously, diode D7 is connected to the collector of transistor Q5, the emitter of transistor Q5 is grounded, and the base of transistor Q5 is connected to resistor R8 and connected to the DALITX interface of the Bluetooth chip. The Bluetooth chip intelligently controls the DALI output, sending various DALI commands and sequences, thereby providing multiple settings and scene selections for the LED lighting. The other end of resistor R12 is connected to the DALIRX interface of the Bluetooth chip, which can read various information of the driver, such as power consumption, usage time, and power consumption.

[0040] Specifically, the longitudinal section of the ultra-high-altitude infrared lens 10 is an isosceles trapezoid. The legs of this isosceles trapezoid are formed by connecting multiple smaller isosceles trapezoids 101 (which refract and reflect infrared light). The obtuse angle formed by the legs and the lower base of the isosceles trapezoid is 155°. This lens is a Fresnel lens (size Φ88*9.6mm). The Fresnel lens utilizes the special optical principle of lenses to create an alternating "blind zone" and "high-sensitivity zone" in front of the detector to improve its detection and reception sensitivity. When a person or object with changing heat passes under the lens, the infrared rays emitted by the person or object continuously and alternately enter the "high-sensitivity zone" from the "blind zone." This causes the received infrared signal to be input to the surface of the infrared sensor PIR in the form of pulses with varying strengths, thereby enhancing its energy amplitude. Through the focusing effect of this Fresnel lens, the pyroelectric infrared signal is refracted (reflected) onto the infrared sensor PIR, so that moving objects entering the detection area can generate changing pyroelectric infrared signals on the infrared sensor PIR in the form of temperature changes.

[0041] Specifically, the AC input circuit 2, switching power supply circuit 3, DC power supply circuit 4, Bluetooth chip circuit 5, ultra-high altitude infrared sensing circuit 6, and DALI output circuit 8 are mounted on a large PCB board. The ultra-high altitude microwave sensing circuit 7 is mounted on top of the large PCB board (not shown in the figure) via pin headers. The large PCB board forms a core assembly, which is installed inside the control box 1. The AC input circuit 2, switching power supply circuit 3, DC power supply circuit 4, and Bluetooth chip circuit 5 are all existing technologies, and their specific circuits and working principles will not be detailed here.

[0042] Optionally, depending on product requirements, the large PCB board is also equipped with a light-sensing dimming circuit 9, which is electrically connected to the Bluetooth chip circuit 5 and the DC power supply circuit 4 respectively. Specifically, the light-sensing dimming circuit 9 includes: a light sensor GD, the positive terminal of which is electrically connected to pin 3 of operational amplifier U9, one end of resistors R36 and R37, and capacitors C38 and C40; the negative terminal of which is electrically connected to pin 4 of operational amplifier U9, the other end of capacitor C40, and one end of capacitor C39 and resistor R38; the other end of capacitor C39 and resistor R38 is electrically connected to pin 1 of operational amplifier U9 and one end of resistor R39; the other end of resistor R39 is electrically connected to one end of resistors R41 and R40 and capacitor C41; the other end of resistors R37 and R40, capacitors C38 and C41, and pin 2 of operational amplifier U9 are grounded; the other end of resistor R36 and pin 5 of operational amplifier U9 are connected to the +3.3V power supply terminal of DC power supply circuit 4; and the other end of resistor R41 is electrically connected to pin 24 (PD interface) of Bluetooth chip circuit U6. The Bluetooth chip circuit U6 receives changes in the electrical signal generated by the light sensor GD. After processing these signal changes, the Bluetooth chip derives different light sensitivity values. The Bluetooth chip then uses an algorithm to calculate and send a DALI command to adjust the output of the LED driver circuit 20. Capacitor C38 and resistor R37 are connected to form a feedback circuit, which determines the minimum light sensitivity value of the light-sensing dimming circuit 9. Preferably, the light sensor GD is a silicon photovoltaic cell, and the operational amplifier U9 is an RS6331. The Bluetooth chip circuit U6 is an NRF52832.

[0043] The Bluetooth chip circuit U6 in this solution has a preset program that can be used with a mobile APP to set multiple trigger modes:

[0044] (1) Microwave (HF) induction mode: can only be triggered by microwave induction;

[0045] (2) Infrared (PIR) sensing mode: can only be triggered by an infrared sensor;

[0046] (3) Microwave and infrared (HF+PIR) sensing mode: Both microwave triggering and infrared triggering must be satisfied at the same time for it to be judged as a valid sensing signal;

[0047] (4) Microwave or Infrared (HF / PIR) Sensing Mode: Either microwave triggering or infrared triggering can be used as a valid sensing signal. Both microwave and infrared sensing can be set to 100%, 75%, 50%, and 10% sensitivity via a slider. The sensing distance range and sensitivity will proportionally adjust to the set value. Furthermore, the system can intelligently select the appropriate mode for optimal user experience based on different usage environments.

[0048] Application examples:

[0049] The application is in a large warehouse. During summer, the warehouse temperature is high, requiring air conditioning to lower it. Large venues are equipped with large air conditioners, resulting in varying temperatures and airflow within different spaces. If infrared sensing is selected as the trigger mode, false triggering can easily occur, causing the lights to malfunction and turn on / off abnormally. Therefore, a microwave and infrared sensing mode is selected: both microwave and infrared triggering must be satisfied simultaneously for a valid sensing signal. This effectively solves the false triggering problem. The sensing conditions require the simultaneous detection of a temperature change and a moving object to trigger the light, which matches the actual usage scenario and provides multiple options. When the sensing range needs to be adjusted, the sensing distance and sensitivity of this intelligent control device will proportionally adjust according to the set values, achieving the purpose of adjusting the warehouse sensing range and thus realizing intelligent on / off switching of the lights.

[0050] In summary, the technical solution of this utility model has the following beneficial effects:

[0051] This invention addresses the shortcomings of existing technologies by developing an ultra-high-altitude DALI Bluetooth intelligent control device. It solves the problem of poor sensitivity or malfunction in existing infrared and microwave sensors at ultra-high altitudes, which are easily affected by environmental factors. This solution combines data from multiple sensing sources (such as ultra-high-altitude microwave and infrared sensing circuits) with Bluetooth chip algorithms to solve the reliability problem of detection in complex ultra-high-altitude scenarios. It also provides an ultra-high-altitude DALI Bluetooth intelligent control device that can intelligently adjust the brightness and color temperature of lighting output to adapt to environmental changes, allowing for the setting of multiple lighting scenarios. It can be widely used in large-space lighting scenarios such as stadiums, industrial plants, and transportation hubs. The ultra-high-altitude microwave sensing circuit uses a microwave radar sensor chip (microwave chip U11) and its surrounding resistor-capacitor-inductor circuitry. This microwave radar sensor chip uses mature CMOS technology and integrates a microwave transceiver, radar intermediate frequency amplifier circuit, and MCU processor, making it a fully integrated SOC (system-on-a-chip). Compared with traditional radar sensing modules, it has better consistency and anti-interference capabilities. The microwave radar sensor chip operates by default in the 5.8GHz band, with flexible frequency configuration. It features fixed frequency and high sensitivity, and integrates an adaptive calibration algorithm on-chip, effectively solving problems such as co-channel interference, out-of-band blocking, and environmental interference, greatly improving the reliability and practicality of the sensor. The chip integrates an MCU, which can directly output sensing control signals. With a few external components, a complete microwave sensing sensor can be formed. The ultra-high-altitude infrared sensing circuit uses a high-sensitivity digital infrared sensor, which integrates a digital intelligent control circuit and a human detection sensing element within an electromagnetic shield (i.e., the JP906B type infrared sensor PIR). This sensor couples human movement signals to the digital intelligent integrated circuit chip through a high-impedance differential input circuit, converting them into ADC digital signals. When the pyroelectric infrared (PIR) signal exceeds a preset digital threshold, the sensor will generate a timed high-level output. This scheme employs an ultra-high-altitude infrared lens, specifically a Fresnel lens (Φ88*9.6mm). The Fresnel lens utilizes the special optical principles of lenses to create an alternating "blind zone" and "high-sensitivity zone" in front of the detector, thereby enhancing its detection and reception sensitivity. When a person or object with changing heat passes beneath the lens, the infrared radiation emitted by the person or object continuously and alternately moves from the "blind zone" to the "high-sensitivity zone." This causes the received infrared signal to be input to the surface of the infrared sensor (PIR) in a pulsed manner, thus amplifying its energy amplitude. Through the focusing effect of the Fresnel lens, the pyroelectric infrared signal is refracted (reflected) onto the infrared sensor (PIR), enabling moving objects entering the detection area to generate varying pyroelectric infrared signals on the PIR sensor in the form of temperature changes.The DALI output circuit of this solution, paired with the Bluetooth chip circuit U6, intelligently controls the DALI output through the DALITX interface, sending various DALI commands and sequences, thereby providing multiple settings and scene selections. Through the DALIRX interface of the Bluetooth chip circuit U6, various information such as power consumption, usage time, and power consumption of the driver can be read. The Bluetooth chip circuit U6 of this solution has a preset program that can be used with a mobile APP to set multiple trigger modes: (1) Microwave (HF) sensing mode: can only be triggered by microwave sensing; (2) Infrared (PIR) sensing mode: can only be triggered by infrared sensor sensing; (3) Microwave and infrared (HF+PIR) sensing mode: both microwave triggering and infrared triggering must be satisfied to be judged as a valid sensing signal; (4) Microwave or infrared (HF / PIR) sensing mode: either microwave triggering or infrared triggering is satisfied as a valid sensing signal. Both microwave and infrared sensing can be set to 100%, 75%, 50%, and 10% sensitivity through the slider. The sensing distance range and sensing sensitivity will be proportional to the set value. It can intelligently select and set the optimal usage mode according to different usage environments to achieve the best user experience. The light-sensing dimming circuit in this solution can bypass scene modes and automatically adjust the brightness of the lamps in real time according to the actual ambient light conditions, achieving energy saving. The entire control box of this solution has a compact and space-saving design.

[0052] The embodiments described above do not constitute a limitation on the scope of protection of this technical solution. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the above embodiments should be included within the scope of protection of this technical solution.

Claims

1. A high-altitude DALI Bluetooth intelligent control device, installed inside a control box, characterized in that: The control box includes an AC input circuit, a switching power supply circuit electrically connected to the AC input circuit, a DC power supply circuit electrically connected to the switching power supply circuit, a Bluetooth chip circuit electrically connected to the DC power supply circuit, an ultra-high altitude infrared sensing circuit and / or an ultra-high altitude microwave sensing circuit electrically connected to the Bluetooth chip circuit, and a DALI output circuit electrically connected to the Bluetooth chip circuit. The DC power supply circuit is electrically connected to the DALI output circuit, the ultra-high altitude infrared sensing circuit and / or the ultra-high altitude microwave sensing circuit, respectively. The top cover of the control box is an ultra-high altitude infrared lens, which generates an alternating blind zone and a high-sensitivity zone in front of it.

2. The ultra-high altitude DALI Bluetooth intelligent control device according to claim 1, characterized in that, The ultra-high altitude infrared sensing circuit includes: an infrared sensor PIR; pin 1 of the infrared sensor PIR is electrically connected to one end of resistors R32, R33, R43, and capacitor C43; pins 2 and 4 of the infrared sensor PIR are electrically connected to one end of resistor R31 and capacitor C42, and the other end of resistor R32; the other end of resistor R31 is connected to the +3.3V power supply terminal of the DC power supply circuit; pin 5 of the infrared sensor PIR is electrically connected to one end of resistors R34 and R35; pins 3 and 6 of the infrared sensor PIR are simultaneously grounded; the other ends of capacitors C42 and C43 are grounded; the other ends of resistors R33 and R34 are grounded; the other end of resistor R43 is electrically connected to pin 23 (SENSOR interface) of the Bluetooth chip circuit U6; and the other end of resistor R35 is electrically connected to pin 22 (PIR interface) of the Bluetooth chip circuit U6.

3. The ultra-high altitude DALI Bluetooth intelligent control device according to claim 2, characterized in that: The infrared sensor is a PIR model JP906B.

4. The ultra-high altitude DALI Bluetooth intelligent control device according to claim 1, characterized in that, The ultra-high altitude microwave induction circuit includes: microwave chip U11 and microwave board assembly.

5. The ultra-high altitude DALI Bluetooth intelligent control device according to claim 4, characterized in that: The microwave chip U11 is model AT58MP1T1RS32A.

6. The ultra-high altitude DALI Bluetooth intelligent control device according to claim 5, characterized in that: Pin 16 of the microwave chip U11 is electrically connected to one end of inductor L2 and capacitor C1. The other end of capacitor C1 is connected to the TX_ANT transmitting antenna, and the other end of inductor L2 is grounded. Pin 25 of the microwave chip U11 is electrically connected to one end of inductor L1 and capacitor C2. The other end of capacitor C2 is connected to the RX_ANT receiving antenna, and the other end of inductor L1 is grounded. Pins 1 and 32 of the microwave chip U11 are connected to the +3.3V power supply terminal of the DC power supply circuit. Pins 4, 5, and 6 of the microwave chip U11 are electrically connected to pins 12, 13, and 25 of the Bluetooth chip circuit U6 in sequence for communication and data transmission.

7. The ultra-high altitude DALI Bluetooth intelligent control device according to claim 1, characterized in that, The DALI output circuit includes: a resistor R11 connected between the gate and source of MOSFET Q2; the drain of MOSFET Q2 electrically connected to one end of resistor R10; the other end of resistor R10 electrically connected to both the collector of transistor Q1 and the base of transistor Q3; a resistor R7 connected between the emitter and base of transistor Q1; the base of transistor Q1 electrically connected to the emitter of Q3 and one end of capacitor C26; the collector of transistor Q3 electrically connected to the other end of capacitor C26, one end of capacitor C22, and the anode of diode D7; the other end of capacitor C22 and the cathode of diode D7 electrically connected to one end of capacitor C25, the cathode of the Zener diode, and the drain of MOSFET Q5; a capacitor C27 connected between the drain and source of MOSFET Q5; and the source of MOSFET Q5 electrically connected to... A resistor R9 is connected between the gates. The other end of capacitor C25 and the positive terminal of the Zener diode are electrically connected to one end of resistor R18. The other end of resistor R18 is electrically connected to one end of resistors R12 and R13. The other end of resistor R13 and the source of MOSFETs Q2 and Q5 are grounded. The emitter of transistor Q1 is connected to the +16V power supply terminal of the DC power supply circuit. The cathode of diode D7 is the DALI+ output terminal. The ground terminal of resistor R13 is the DALI- output terminal. The gate of MOSFET Q2 is electrically connected to the POWER interface (pin 21) of the Bluetooth chip circuit U6. The gate of MOSFET Q5 is electrically connected to the DALITX interface (pin 4) of the Bluetooth chip circuit U6 through resistor R8. The other end of resistor R12 is electrically connected to the DALIRX interface (pin 2) of the Bluetooth chip circuit U6.

8. The ultra-high altitude DALI Bluetooth intelligent control device according to claim 1, characterized in that: The longitudinal section of the ultra-high altitude infrared lens is an isosceles trapezoid, the waist of which is formed by connecting multiple smaller isosceles trapezoids, and the obtuse angle formed by the waist and the lower base of the isosceles trapezoid is 155°.

9. The ultra-high altitude DALI Bluetooth intelligent control device according to claim 1, characterized in that: The AC input circuit, switching power supply circuit, DC power supply circuit, Bluetooth chip circuit, ultra-high altitude infrared sensing circuit, and DALI output circuit are mounted on a large PCB board, while the ultra-high altitude microwave sensing circuit is mounted on the top of the large PCB board via pin headers.

10. The ultra-high altitude DALI Bluetooth intelligent control device according to claim 9, characterized in that: The large PCB board is also equipped with a light-sensing dimming circuit, which is electrically connected to the Bluetooth chip circuit and the DC power supply circuit respectively.

Images