Power supply device with heat dissipation and dust prevention functions

Abstract

The utility model belongs to the technical field of power supply heat dissipation, and relates to a power supply device with heat dissipation and dust prevention functions. In order to solve the problems of heat dissipation and dust prevention of a power supply device in a dusty environment in the prior art and solve the technical problems of dust accumulation, short circuit or faults, reduction of the stability of a power supply and reduction of the service life of the power supply due to the fact that external dust easily enters a power supply main body in a traditional heat dissipation mode, the utility model provides a power supply device with heat dissipation and dust prevention functions. Comprising a device body, an air inlet is formed in one side wall of the device body, and a heat dissipation area far away from the air inlet is arranged on the other side wall and / or the top wall of the device body; the heat dissipation area is provided with heat dissipation holes which are connected with an exhaust hose. Purified gas is introduced through the gas inlet hole, passes through the circuit board in the power supply and then is discharged from the heat dissipation holes, heat is taken away, and efficient heat dissipation is achieved.

Description

Technical Field

[0001] This utility model relates to the field of power supply heat dissipation technology, specifically to a power supply device that combines heat dissipation and dust prevention. Background Technology

[0002] With the widespread application of electronic devices in industrial and civilian fields, power supply units, as one of their core components, face increasingly stringent operating environment challenges. This is especially true in dusty, high-humidity, or complex industrial environments (such as factory workshops), where power supply units (such as…) face even greater challenges. Figure 4 The heat dissipation and dustproof performance (as shown) are key factors affecting the stability and service life of power supplies. Traditional power supply devices typically use fans for heat dissipation. For example, the Chinese Utility Model Authorization Announcement No. CN221043623U, filed on September 18, 2023, entitled "An Internal Cooling Device for a Power Supply," discloses a solution including a base plate, a power supply body mounted on the upper surface of the base plate, a housing fixedly connected to the upper part of the base plate, fans on both sides of the housing, and sliding grooves on both sides of the fans, with filters inserted on the side of the two sets of sliding grooves that are close to each other; a liquid cooling heat dissipation component is mounted on the upper part of the power supply body and fixedly connected to the middle part of the inner side of the housing; a cover plate is mounted on the upper part of the housing; and a semiconductor heat dissipation component is mounted on the lower part of the base plate. This solution has the following problems: although the fan can meet the basic heat dissipation requirements, the fan will inevitably bring outside air, along with dust and particulate matter, into the device during operation. These impurities are prone to accumulate on the circuit board, leading to decreased heat dissipation efficiency, increased short-circuit risk, and even equipment failure, seriously affecting the reliability and service life of the power supply device. In addition, the mechanical structure of the fan is prone to failure due to long-term operation, which further increases maintenance costs.

[0003] Other improvements attempt to reduce dust ingress by optimizing heat dissipation channels or adding filtration devices. For example, Chinese Utility Model Authorization Announcement No. CN218276466U, filed on August 1, 2022, entitled "A Dustproof and Heat-Dissipating DC Wide Voltage Input Step-Down Power Supply Device," discloses a housing and a power module. The power module is fixedly installed inside the bottom of the housing. Ventilation openings are located at both ends of the housing, and sieve plates with evenly distributed through holes are fixedly installed within the vents. A fan is fixedly installed at one end of the housing. This solution suffers from the following problems: insufficient heat dissipation efficiency, limited filtration effect, or complex structure. Simple filtration devices may become clogged, affecting airflow and significantly reducing heat dissipation; while complex structural designs increase manufacturing costs and maintenance difficulty.

[0004] Therefore, there is an urgent need in the market for a power supply device that can simultaneously address both heat dissipation and dust prevention to meet the requirements for stable operation in complex environments. This device should be able to achieve efficient heat dissipation without introducing external contaminants, while simplifying structural design and reducing maintenance costs, thereby significantly improving the reliability and lifespan of the power supply. Summary of the Invention

[0005] 1. The problem to be solved

[0006] To address the challenges of heat dissipation and dust prevention in existing power supply devices in dusty environments, traditional heat dissipation methods can easily lead to external dust entering the power supply body, causing dust accumulation, short circuits, or malfunctions, thus reducing the stability and lifespan of the power supply. This invention provides a power supply device that combines heat dissipation and dust prevention.

[0007] 2. Technical Solution

[0008] To solve the above problems, the technical solution provided by this utility model is as follows:

[0009] Based on the purpose of this utility model, this utility model provides a power supply device that combines heat dissipation and dust prevention, including a device body, an air inlet provided on one side wall of the device body, and a heat dissipation area provided on the other side wall and / or top wall of the device body away from the air inlet.

[0010] The heat dissipation area is provided with heat dissipation holes, and the heat dissipation holes are connected to exhaust hoses.

[0011] Preferably, the outer wall of the exhaust hose is connected to the inner wall of the heat dissipation hole; or the diameter of the inner wall of the exhaust hose is the same as the diameter of the heat dissipation hole.

[0012] According to any embodiment of the present invention, a power supply device that combines heat dissipation and dust prevention has multiple heat dissipation holes, and each heat dissipation hole is connected to an exhaust hose.

[0013] The design features multiple heat dissipation holes, each connected to an exhaust hose, which significantly improves heat dissipation efficiency and dust prevention performance.

[0014] According to any embodiment of the present invention, the power supply device that combines heat dissipation and dust prevention has an elliptical or circular cross-section for the exhaust hose.

[0015] The exhaust hose is designed with an elliptical or circular cross-section, which can significantly improve heat dissipation efficiency and overall performance.

[0016] According to any embodiment of the present invention, the power supply device that combines heat dissipation and dust prevention is made of silicone or thermoplastic elastomer; when there is no airflow through the exhaust hose, the exhaust hose closes naturally due to the elasticity of the material; when there is airflow through the exhaust hose, the airflow causes the exhaust hose to open.

[0017] The power supply device according to any embodiment of the present invention, which combines heat dissipation and dust prevention, further includes a connector; the connector is provided with a through hole for use with the heat dissipation hole; the connector is disposed on the outer wall or inner wall of the heat dissipation area. The connection structure between the exhaust hose and the heat dissipation hole is optimized so that the outer wall of the exhaust hose is tightly connected to the inner wall of the heat dissipation hole, or the inner wall diameter of the exhaust hose is the same as the diameter of the heat dissipation hole.

[0018] According to any embodiment of the present invention, a power supply device that combines heat dissipation and dust prevention is provided, wherein the connector is disposed on the inner wall of the heat dissipation area, and the exhaust hose is connected to the through hole; the exhaust hose passes through the heat dissipation hole.

[0019] By placing the connector on the inner wall of the heat dissipation area and allowing the exhaust hose to pass through the heat dissipation hole and connect to the through hole, efficient sealing and connection of the heat dissipation channel are achieved. The design of the connector also allows the exhaust hose at one end of the device body to always remain open, without requiring excessive positive pressure within the device body to open.

[0020] According to any embodiment of the present invention, a power supply device that combines heat dissipation and dust prevention includes a connector disposed on the outer wall of the heat dissipation area, and an exhaust hose connected to the through hole. This outer wall connection ensures smoother airflow within the heat dissipation area, further improving heat dissipation efficiency. Furthermore, this structure enhances the overall sealing of the device, preventing external dust from entering through the connection point, thereby better protecting the internal circuitry of the power supply device in complex environments and improving its dustproof performance and reliability.

[0021] According to any embodiment of the present invention, the power supply device that combines heat dissipation and dust prevention has multiple air inlets, which are disposed on one side wall of the main body of the device.

[0022] The device has multiple air inlets located on one side wall of the main body, which significantly improves heat dissipation efficiency and uniformity.

[0023] According to any embodiment of the present invention, a power supply device that combines heat dissipation and dust prevention is provided, wherein a circuit board is provided inside the power supply device; the heat dissipation area and the air inlet are located at both ends of the circuit board inside the device body, so that the gas entering from the air inlet can pass through the circuit board and then through the heat dissipation area. By setting the heat dissipation area and the air inlet at both ends of the circuit board inside the device body, the airflow path is optimized.

[0024] According to any embodiment of the present invention, a power supply device that combines heat dissipation and dust prevention is provided, wherein the air inlet is connected to a gas purification device.

[0025] 3. Beneficial effects

[0026] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0027] This utility model discloses a power supply device that combines heat dissipation and dust prevention. It includes a main body with an air inlet on one side wall and a heat dissipation area located on the other side wall and / or top wall of the main body, away from the air inlet. The heat dissipation area has ventilation holes connected to exhaust hoses. Purified gas is introduced through the air inlet, passes through the internal circuit board, and is discharged through the ventilation holes, carrying away heat and achieving efficient heat dissipation. Maintaining a slight positive pressure inside the device prevents external dust from entering, protecting the circuit board from contamination and extending the lifespan of the power supply. The elimination of an additional cooling fan reduces the use of mechanical parts, lowers the failure rate, and simplifies the device's structure and maintenance costs. It is suitable for dusty environments, especially complex environments such as industrial workshops, ensuring stable operation of the power supply. Attached Figure Description

[0028] Figure 1 This is a first-view structural diagram of the power supply device that combines heat dissipation and dust prevention in the embodiment.

[0029] Figure 2 This is a second-view structural cross-sectional diagram of the power supply device that combines heat dissipation and dust prevention in the embodiment.

[0030] Figure 3 A schematic diagram of the structure when connecting the exhaust hose to the connector;

[0031] Figure 4 This is a schematic diagram of a DC power supply structure in the prior art.

[0032] In the picture:

[0033] 1: Main body of the device; 2: Heat dissipation area; 3: Air inlet; 4: Connecting parts; 5: Exhaust hose. Detailed Implementation

[0034] The present invention will be further described below with reference to specific embodiments.

[0035] The technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0036] Example

[0037] The power supply device in this embodiment combines heat dissipation and dust protection, such as... Figure 1 As shown, the device includes a main body 1, with an air inlet 3 on one side wall and a heat dissipation area 2 located away from the air inlet 3 on the other side wall and top wall of the main body 1. The heat dissipation area 2 has heat dissipation holes connected to exhaust hoses 5. In some embodiments, the heat dissipation area 2 may be located only on the other side wall or the top wall. Depending on the heat dissipation scenario, it is preferred to be located on the other side wall to allow airflow to pass through in a straight line and increase heat dissipation efficiency.

[0038] The device has multiple heat dissipation holes, each connected to an exhaust hose 5. This independent connection between the multiple heat dissipation holes and exhaust hoses 5 allows for more even heat distribution, preventing localized overheating and ensuring unobstructed heat dissipation channels, further enhancing the device's airtightness. This design not only optimizes the heat dissipation path but also reduces the time heat remains within the device through independent exhaust channels, thereby improving heat dissipation efficiency. Furthermore, the layout of the multiple heat dissipation holes can be flexibly adjusted according to the heat distribution within the power supply unit, further enhancing the targeted and effective nature of heat dissipation.

[0039] In this embodiment, the exhaust hose 5 has an elliptical cross-section. In other embodiments, it can also be circular. Elliptical and circular cross-sections offer lower flow resistance and more uniform velocity distribution in fluid dynamics, effectively reducing energy loss during heat dissipation. Furthermore, a circular cross-section has a smaller perimeter for the same cross-sectional area, thereby reducing frictional resistance at the connection between the heat dissipation vent and the exhaust hose, further improving heat dissipation efficiency. An elliptical cross-section can better adapt to spatial layouts in certain situations, while avoiding heat dissipation dead zones, further optimizing the heat dissipation effect. This design not only improves heat dissipation efficiency but also enhances the dustproof performance of the device, ensuring stable operation of the power supply unit in complex environments.

[0040] In this embodiment, the exhaust hose 5 is made of silicone. In other embodiments, it can also be a thermoplastic elastomer. When no airflow passes through the exhaust hose 5, the exhaust hose 5 closes naturally due to the elasticity of the material; when airflow passes through the exhaust hose 5, the airflow causes the exhaust hose 5 to open. When no airflow passes through the exhaust hose 5, the elasticity of the material causes it to close naturally, effectively preventing external dust and impurities from entering the power supply device; while when airflow passes through, the hose can automatically open, ensuring smooth exhaust of heat dissipation airflow. This characteristic not only improves the dustproof performance of the device but also optimizes heat dissipation efficiency, while reducing the decrease in heat dissipation effect caused by airflow leakage.

[0041] It also includes a connector 4; the connector 4 has a through hole that mates with the heat dissipation hole; the connector 4 is disposed on the outer or inner wall of the heat dissipation area 2. This design ensures smooth gas discharge, avoids gas leakage or accumulation between the heat dissipation hole and the exhaust hose 5, thereby improving heat dissipation efficiency, while further enhancing the sealing and dustproof performance of the device, ensuring stable operation of the power supply device in complex environments, and extending its service life.

[0042] In this embodiment, the connector 4 is disposed on the inner wall of the heat dissipation area 2, such as... Figure 2 and Figure 3 As shown, the exhaust hose 5 connects to the through hole; the exhaust hose 5 passes through the heat dissipation hole. This design ensures that airflow can be smoothly and stably discharged through the heat dissipation hole during the heat dissipation process, avoiding a decrease in heat dissipation efficiency due to loose connections or leaks. At the same time, the tight connection structure further enhances the dustproof performance of the device, effectively preventing external dust from entering the power supply unit from the connection between the heat dissipation hole and the exhaust hose 5, thereby maintaining the stable operation of the power supply unit in complex environments and extending its service life.

[0043] In other embodiments, the connector 4 is disposed on the outer wall of the heat dissipation area 2, and the exhaust hose 5 is connected to the through hole. This design ensures that airflow can be smoothly and stably discharged through the heat dissipation hole during heat dissipation, avoiding reduced heat dissipation efficiency due to loose connections or leaks. Simultaneously, the tight connection structure further enhances the dustproof performance of the device, effectively preventing external dust from entering the power supply unit from the connection between the heat dissipation hole and the exhaust hose 5, thereby maintaining stable operation of the power supply unit in complex environments and extending its service life. Placing the connector on the outer wall of the heat dissipation area and connecting the exhaust hose to the through hole effectively simplifies the internal structure of the heat dissipation area, reduces internal space occupation, and facilitates the installation and maintenance of the exhaust hose.

[0044] In this embodiment, multiple air inlets 3 are disposed on one side wall of the main body 1. Multiple air inlets 3 increase the air intake volume and ensure uniform airflow distribution, thereby more effectively removing heat from the inside of the power supply device. Simultaneously, the concentrated placement of the air inlets 3 on one side wall of the main body 1 optimizes the airflow path, reduces heat dissipation dead zones, and further improves the heat dissipation effect. Furthermore, this layout can maintain a slight positive pressure while enhancing the device's dustproof performance, effectively preventing external dust from entering the power supply device and ensuring its stable operation in complex environments.

[0045] The power supply device described in this embodiment, which combines heat dissipation and dust prevention, has an internal circuit board. This layout ensures that air entering through the air inlet passes through the circuit board first, carrying away heat, before being expelled through the heat dissipation area. This design not only improves heat dissipation efficiency, ensuring the circuit board maintains good heat dissipation during operation, but also reduces the time heat remains in the device through reasonable airflow organization, further enhancing overall heat dissipation performance. Simultaneously, the optimized airflow path helps maintain a slightly positive pressure environment inside the device, enhancing dust prevention performance and ensuring stable operation and reliability of the power supply device in complex environments.

[0046] In this embodiment, the air inlet 3 is connected to a gas purification device. This design ensures that the gas entering the power supply unit is pre-purified, effectively removing impurities and particulate matter. This not only prevents external dust and contaminants from entering the unit, reducing the risk of circuit board failures due to dust accumulation, but also maintains a clean environment inside the power supply unit during heat dissipation, further enhancing its stability and reliability in complex environments.

Claims

1. A power supply device that combines heat dissipation and dust prevention, comprising a main body (1), characterized in that: An air inlet (3) is provided on one side wall of the main body (1) of the device, and a heat dissipation area (2) is provided on the other side wall and / or top wall of the main body (1) away from the air inlet (3); The heat dissipation area (2) is provided with heat dissipation holes, and the heat dissipation holes are connected to exhaust hoses (5).

2. The power supply device with both heat dissipation and dust prevention as described in claim 1, characterized in that: There are multiple heat dissipation holes, and each heat dissipation hole is connected to an exhaust hose (5).

3. The power supply device with both heat dissipation and dust prevention according to claim 2, characterized in that: The cross-section of the exhaust hose (5) is elliptical or circular.

4. The power supply device with both heat dissipation and dust prevention according to claim 2, characterized in that: The exhaust hose (5) is made of silicone or thermoplastic elastomer. When there is no airflow through the exhaust hose (5), the exhaust hose (5) closes naturally due to the elasticity of the material. When there is airflow through the exhaust hose (5), the airflow causes the exhaust hose (5) to open.

5. The power supply device with both heat dissipation and dust prevention according to claim 1, characterized in that: It also includes a connector (4); the connector (4) is provided with a through hole that works in conjunction with the heat dissipation hole; the connector (4) is disposed on the outer wall or inner wall of the heat dissipation area (2).

6. The power supply device with both heat dissipation and dust prevention according to claim 5, characterized in that: The connector (4) is disposed on the inner wall of the heat dissipation area (2), and the exhaust hose (5) is connected to the through hole; the exhaust hose (5) passes through the heat dissipation hole.

7. The power supply device with both heat dissipation and dust prevention according to claim 5, characterized in that: The connector (4) is disposed on the outer wall of the heat dissipation area (2), and the exhaust hose (5) is connected to the through hole.

8. The power supply device with both heat dissipation and dust prevention according to claim 1, characterized in that: There are multiple air inlets (3), which are located on one side wall of the main body (1) of the device.

9. The power supply device with both heat dissipation and dust prevention according to claims 1-8, characterized in that: The power supply device, which combines heat dissipation and dust prevention, has a circuit board inside; the heat dissipation area (2) and the air inlet (3) are located at both ends of the circuit board inside the main body (1) of the device, so that the gas entering from the air inlet (3) can pass through the circuit board and then through the heat dissipation area (2).

10. The power supply device with both heat dissipation and dust prevention according to claim 9, characterized in that: The air inlet (3) is connected to a gas purification device.

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