Magnetic type silica gel bottom pad for electronic device
By integrating a cooling fan and a semiconductor cooling chip into a magnetic silicone base, the problem of poor heat dissipation of traditional bases is solved, achieving efficient and flexible heat dissipation and stable adsorption, which is suitable for the heat dissipation needs of electronic devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN POWER FEIYANG TECH CO LTD
- Filing Date
- 2025-06-10
- Publication Date
- 2026-05-19
AI Technical Summary
Traditional electronic device heat dissipation pads have limited heat dissipation effects, especially for high-load equipment, and the fan position is fixed and cannot be flexibly adjusted.
A magnetic silicone base pad integrating a cooling fan and a semiconductor cooling chip was designed. It enables quick installation through a snap-fit mechanism. Combined with cross-shaped micro-convex rubber strips and symmetrically distributed magnetic strips, it provides a strong and uniform magnetic field to ensure stable adsorption. The fan and cooling chip are powered by a power supply component.
It achieves efficient active heat dissipation, and can flexibly adjust the position of the heat dissipation module according to the hot spots of the device, significantly improving heat dissipation efficiency, while ensuring that the device is stable and not easy to slide or move.
Smart Images

Figure CN224265354U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of electronic device accessories technology, specifically relating to a magnetic silicone pad for electronic devices. Background Technology
[0002] Electronic devices, such as mobile phones, tablets, and small digital cameras, often need to be placed on various surfaces, such as desktops and metal panels. Rigid flat surface supports lack cushioning, making the devices susceptible to damage from impacts or vibrations. Therefore, magnetic silicone pads can be placed on desktops or metal panels before placing the devices on them. As the performance of electronic devices improves, the heat they generate increases significantly, making effective heat dissipation crucial for ensuring device stability and lifespan.
[0003] Traditional electronic device mounting pads often have the following problems: relying solely on the thermal conductivity of the silicone material itself and raising the bottom of the device to increase airflow space for heat dissipation has limited effectiveness, especially for high-load devices. Some mounting pads with built-in fans are bulky and difficult to carry, and the fan position is fixed, making it impossible to flexibly adjust them to address device hotspots. Utility Model Content
[0004] To address the aforementioned problems, this utility model proposes a magnetic silicone pad for electronic devices, thereby resolving the issues present in the prior art.
[0005] To achieve the above objectives, the present invention provides a magnetic silicone pad for electronic devices, comprising:
[0006] Silicone pad body;
[0007] A fixing plate is fixedly connected to the lower part of the silicone pad body.
[0008] A rubber frame is fixedly connected to the underside of the fixing plate.
[0009] A magnetic strip is embedded in the bottom of the fixing plate and located inside the rubber frame;
[0010] The surface of the fixing plate is provided with a square groove, and a locking protrusion is fixedly connected to the inner wall of the square groove;
[0011] A cooling fan, wherein a slot is fixedly connected to the surface of the cooling fan, and the cooling fan is snapped into the surface of a protrusion through the slot.
[0012] A semiconductor cooling chip is fixedly mounted on the upper surface of the cooling fan.
[0013] Preferably, the fixing plate has a second slot on its side and a second protrusion fixedly connected to its side. The second slot and the second protrusion are arranged in a horizontal array and are respectively left-right and top-bottom corresponding to each other.
[0014] Preferably, a micro-convex rubber strip is fixedly connected to the lower surface of the rubber frame, and the micro-convex rubber strip is in a cross shape.
[0015] Preferably, the magnetic strips are divided into two groups, long and short, with two long magnetic strips and two short magnetic strips, which are symmetrically distributed.
[0016] Preferably, a fixing sleeve is fixedly connected inside the rubber frame, and a magnetic block is installed inside the fixing sleeve.
[0017] Preferably, the lower surface of the fixing plate is provided with a groove, the lower surface of the fixing plate is provided with a wire groove, and the power supply component is installed inside the groove.
[0018] Preferably, the power supply component includes:
[0019] Battery box;
[0020] A lithium battery, wherein the lithium battery is movably installed within the battery box;
[0021] Wire 1, one end of which is electrically connected to the battery box;
[0022] The connectors are arranged in a horizontal array of three in a group, and the wire is electrically connected to the connector.
[0023] Charging port.
[0024] Preferably, the cooling fan includes:
[0025] The second wire is electrically connected to the drive motor of the cooling fan, and the other end of the wire is fixedly connected to a plug that can be inserted into a socket.
[0026] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0027] 1. The magnetic silicone pad used for electronic devices integrates a cooling fan and a thermoelectric cooler. During use, the cooling fan forces airflow to circulate, while the thermoelectric cooler directly cools the hot spots of the electronic devices in contact with the silicone pad, significantly improving heat dissipation efficiency, which is far superior to passive heat dissipation pads.
[0028] 2. The cooling fan is designed for quick installation and removal through the snap-fit mechanism of slot 1 and protrusion 1. Users can flexibly choose the number and position of the cooling modules according to the heat-generating area and heat dissipation requirements of electronic components to achieve precise heat dissipation. The bottom is embedded with symmetrically distributed long and short magnetic strips, which, together with the magnetic blocks in the fixing sleeve inside the rubber frame, form a strong and evenly distributed magnetic attraction field to ensure that the bottom pad is firmly attached to the metal surface. The cross-shaped micro-protruding rubber strips at the bottom of the rubber frame greatly increase the friction, providing double protection for the stable placement of the equipment and preventing it from sliding or shifting.
[0029] To better understand and implement this invention, the following detailed description is provided in conjunction with the accompanying drawings. Attached Figure Description
[0030] Figure 1 This is a complete structural schematic diagram of the present invention;
[0031] Figure 2 This is a top view structural diagram of the present invention;
[0032] Figure 3 This is a top view of the present invention;
[0033] Figure 4 This is a bottom view of the present invention;
[0034] Figure 5 This is a partial cross-sectional view of the present invention;
[0035] Figure 6 This utility model Figure 5 Enlarged view of point A in the middle.
[0036] In the diagram: 1. Silicone pad body; 2. Fixing plate; 3. Rubber frame; 4. Magnetic strip; 5. First protrusion; 6. Cooling fan; 601. Second wire; 602. Plug; 7. First slot; 8. Semiconductor cooling chip; 9. Second slot; 10. Second protrusion; 11. Micro-protruding rubber strip; 12. Fixing sleeve; 13. Magnetic block; 14. Groove; 15. Wire groove; 16. Power supply component; 161. Battery box; 162. Lithium battery; 163. First wire; 164. Plug interface; 165. Charging port; 17. Square groove. Detailed Implementation
[0037] To provide a clearer understanding of the technical features, objectives, and effects of this utility model, specific embodiments of this utility model are now described with reference to the accompanying drawings. However, the scope of protection of this utility model is not limited to the following description.
[0038] Reference Figure 1-6 As shown, a magnetic silicone pad for electronic devices includes: a silicone pad body 1;
[0039] Fixing plate 2; fixedly connected to the bottom of silicone pad body 1;
[0040] Rubber frame 3; fixedly connected to the bottom of fixed plate 2;
[0041] Magnetic strip 4 is embedded in the bottom of fixing plate 2 and located inside rubber frame 3;
[0042] A square groove 17 is provided on the surface of the fixing plate 2, and a locking protrusion 5 is fixedly connected to the inner wall of the square groove 17.
[0043] Cooling fan 6, the surface of cooling fan 6 is fixedly connected with a slot 7, cooling fan 6 is snapped into the surface of protrusion 5 through slot 7;
[0044] A semiconductor cooling chip 8 is fixedly mounted on the upper surface of the cooling fan 6.
[0045] Furthermore, a slot 9 is provided on the side of the fixing plate 2, and a protrusion 10 is fixedly connected to the side of the fixing plate 2. The slot 9 and the protrusion 10 are arranged in a horizontal array, and the slot 9 and the protrusion 10 correspond to each other on the left and right, and on the top and bottom, respectively.
[0046] Furthermore, a micro-convex rubber strip 11 is fixedly connected to the lower surface of the rubber frame 3, and the micro-convex rubber strip 11 is in a cross shape.
[0047] Furthermore, the magnetic strip 4 is divided into two groups, long and short, with two long magnetic strips and two short magnetic strips, which are symmetrically distributed.
[0048] Furthermore, a fixing sleeve 12 is fixedly connected inside the rubber frame 3, and a magnetic block 13 is installed inside the fixing sleeve 12.
[0049] The present invention provides a technical solution that, during use, integrates a cooling fan 6 and a semiconductor cooling chip 8. The cooling fan 6 forces airflow circulation, while the semiconductor cooling chip 8 directly and actively cools the hot spots of electronic devices in contact with the silicone pad body 1, significantly improving heat dissipation efficiency, far superior to passive heat dissipation pads. The cooling fan 6 is quickly installed and removed through the snap-fit design of the slot 7 and the protrusion 5. Users can flexibly select the number and position of the heat dissipation modules according to the heat-generating areas and heat dissipation requirements of electronic devices to achieve precise heat dissipation. The bottom is embedded with symmetrically distributed long and short magnetic strips 4, which, together with the magnetic blocks 13 in the fixing sleeve 12 inside the rubber frame 3, form a strong and evenly distributed magnetic attraction field, ensuring that the bottom pad is firmly attached to the metal surface. The cross-shaped micro-protruding rubber strips 11 at the bottom of the rubber frame 3 greatly increase the friction, providing double protection for the stable placement of the equipment, making it difficult to slide or shift.
[0050] Furthermore, a groove 14 is provided on the lower surface of the fixing plate 2, a wire groove 15 is provided on the lower surface of the fixing plate 2, and a power supply component 16 is installed inside the groove 14.
[0051] Furthermore, the power supply component 16 includes:
[0052] Battery box 161;
[0053] Lithium battery 162 is movably installed inside battery box 161;
[0054] Wire 163, one end of which is electrically connected to battery box 161;
[0055] The connector 164 is arranged in a horizontal array of three connectors 164, and the wire 163 is electrically connected to the connector 164.
[0056] Charging port 165.
[0057] Furthermore, the cooling fan 6 includes:
[0058] Wire 2 601 is electrically connected to the drive motor of the cooling fan 6, and the other end is fixedly connected to a plug 602, which can be inserted into the plug interface 164.
[0059] Specifically, the power supply component 16 is installed in the groove 14 on the lower surface of the fixing plate 2, including a battery box 161, a lithium battery 162 movably installed in the battery box 161, a wire 163 electrically connected to the battery box 161 at one end, a set of three horizontally arranged plug interfaces 164 electrically connected to the wire 163, and a charging port 165 (which can be a Micro USB or Type-C charging port). The semiconductor cooling chip 8 is electrically connected to the cooling fan 6. The lithium battery 162 can provide power to the cooling fan 6 and the semiconductor cooling chip 8. The lower surface of the fixing plate 2 also has a wire groove 15 for the wiring of the second wire 601. The plug 602 of the cooling fan 6 can be plugged into the plug interface 164 of the power supply component 16 to draw power. The charging port 165 is used to charge the lithium battery 162, which facilitates the reuse of the base pad.
[0060] This electronic device integrates support, magnetic attraction, heat dissipation, cooling, and power supply functions into a slim and lightweight structure using a magnetic silicone base pad. The cable is built-in (with a cable channel design), resulting in a neat appearance and easy portability and use.
[0061] The above-disclosed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Therefore, any equivalent variations made in accordance with the claims of the present utility model shall still fall within the scope of the present utility model.
Claims
1. A magnetic silicone pad for electronic devices, characterized in that, include: Silicone pad body (1); Fixing plate (2); fixedly connected to the lower part of the silicone pad body (1); Rubber frame (3); fixedly connected to the underside of the fixing plate (2); The magnetic strip (4) is embedded in the bottom of the fixing plate (2) and located inside the rubber frame (3); The surface of the fixing plate (2) is provided with a square groove (17), and the inner wall of the square groove (17) is fixedly connected with a locking protrusion (5); Cooling fan (6), the surface of the cooling fan (6) is fixedly connected to a slot (7), the cooling fan (6) is snapped onto the surface of the protrusion (5) through the slot (7); A semiconductor cooling chip (8) is fixedly mounted on the upper surface of the cooling fan (6).
2. The magnetic silicone pad for electronic devices according to claim 1, characterized in that: The fixing plate (2) has a slot 2 (9) on its side and a protrusion 2 (10) fixedly connected to its side. The slot 2 (9) and the protrusion 2 (10) are arranged in a horizontal array and are respectively left-right and top-bottom corresponding to each other.
3. The magnetic silicone pad for electronic devices according to claim 1, characterized in that: The lower surface of the rubber frame (3) is fixedly connected with a micro-convex rubber strip (11), which is in a cross shape.
4. The magnetic silicone pad for electronic devices according to claim 1, characterized in that: The magnetic strips (4) are divided into two groups, long and short, with two long magnetic strips and two short magnetic strips, which are symmetrically distributed.
5. The magnetic silicone pad for electronic devices according to claim 1, characterized in that: The rubber frame (3) is fixedly connected to a fixing sleeve (12), and a magnetic block (13) is installed inside the fixing sleeve (12).
6. The magnetic silicone pad for electronic devices according to claim 1, characterized in that: The lower surface of the fixing plate (2) is provided with a groove (14) and a wire groove (15). The power supply component (16) is installed inside the groove (14).
7. A magnetic silicone pad for electronic devices according to claim 6, characterized in that: The power supply component (16) includes: Battery box (161); A lithium battery (162) is movably installed inside the battery box (161); Wire 1 (163), one end of which is electrically connected to battery box (161); The plug interface (164) is arranged in a horizontal array of three groups, and the first wire (163) is electrically connected to the plug interface (164). Charging port (165).
8. The magnetic silicone pad for electronic devices according to claim 7, characterized in that: The cooling fan (6) includes: The second wire (601) is electrically connected to the drive motor of the cooling fan (6), and the other end is fixedly connected to a plug (602), which can be inserted into the plug interface (164).