Improved silicon wafer bearing dry basket

Abstract

The utility model provides an improved silicon wafer bearing dry flower basket, which comprises a flower basket frame, a plurality of clamping teeth are correspondingly arranged on two sides of the flower basket frame, a clamping groove for bearing a silicon wafer is formed in an area between two adjacent clamping teeth, the upper groove wall of the clamping groove is of a continuous multi-section wave-shaped structure and comprises a plurality of sections of wave-shaped units, each waveform unit sequentially comprises a gliding wave band, a smooth wave band and an upgliding wave band, and the lower groove wall of the clamping groove is of a three-section structure and comprises a rear arc section, a middle flat section and a front slope section. By using the basket, the smoothness of inserting and taking out the silicon wafer can be improved, the safety of placing the silicon wafer is enhanced, and the surface damage of the silicon wafer is reduced.

Description

Technical Field

[0001] This utility model relates to the field of solar cell technology, and in particular to an improved silicon wafer-supported dry flower basket. Background Technology

[0002] During the production, processing, and transportation of solar cell silicon wafers, the wafers need to be properly supported and secured. While existing linear slotted wafer-carrying baskets can generally meet the placement requirements for high-speed automatic wafer insertion (≥1500 wafers / hour), they also have some problems. For example, during the insertion and removal of wafers from the baskets, friction with the slot walls can easily occur, leading to scratches and abrasions on the wafer surface. Furthermore, during transportation or processing, the wafers may wobble due to poor slot design, and the stability of the wafers within the baskets needs improvement to prevent displacement or drop during handling, which could affect the wafer's performance, quality, and precision. Therefore, to meet the higher requirements of manufacturing processes for wafer support, existing wafer-carrying baskets need to be improved. Utility Model Content

[0003] The purpose of this invention is to provide an improved silicon wafer drying basket, which can improve the smoothness of silicon wafer insertion and removal, enhance the safety of silicon wafer placement, and reduce damage to the silicon wafer surface.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: an improved silicon wafer-supported dry flower basket, comprising a basket frame, with multiple teeth corresponding to both sides of the basket frame, and a slot for supporting the silicon wafer formed between two adjacent teeth. The upper wall of the slot is a continuous multi-segment waveform structure, including multiple waveform units, each waveform unit sequentially including a sliding wave segment, a smooth wave segment, and an upward sliding wave segment. The lower wall of the slot is a three-segment structure, including a rear arc segment, a middle flat segment, and a front slope segment.

[0005] As a further improved technical solution, the edge of the port where the silicon wafer enters on the basket frame corresponds to the front slope section of the lower trench wall and the upper slope section of the upper trench wall.

[0006] As a further improved technical solution, the multiple waveform units are connected end to end, with the upward sliding band in the previous waveform unit connected to the downward sliding band in the next waveform unit.

[0007] As a further improved technical solution, the waveform unit has 3-5 segments.

[0008] As a further improved technical solution, the glide band and the up-glide band are arc-shaped curves with opposite directions.

[0009] As a further improved technical solution, the slope of the rear arc segment is greater than the slope of the front slope segment.

[0010] As a further improved technical solution, the rear arc segment and the front slope segment are arc-shaped curves.

[0011] As a further improved technical solution, the front slope section of the lower tank wall is set to correspond vertically with the downward slope section of the first waveform unit of the upper tank wall.

[0012] As can be seen from the above technical solutions, the improved silicon wafer-supported dried flower basket of this utility model has at least the following beneficial effects:

[0013] 1. In this technical solution, the upper slot wall adopts a continuous multi-segment waveform structure. Each waveform unit includes a sliding segment, a smooth segment, and an upward sliding segment. The lower slot wall has a three-segment structure, including a rear arc segment, a middle flat segment, and a front slope segment. The front slope segment of the lower slot wall and the upward sliding segment of the upper slot wall at the silicon wafer inlet end are both arc-shaped contact surfaces. This design makes the contact between the silicon wafer and the slot wall smoother when the wafer is inserted into the basket, reducing frictional resistance and allowing the wafer to be inserted into the slot more smoothly, thus improving the wafer insertion efficiency. Similarly, when removing the silicon wafer, it also reduces the friction between the wafer and the slot wall, facilitating wafer removal.

[0014] 2. The slope of the rear arc section of the lower slot wall is greater than that of the front slope section, creating a backward-sloping, forward-sloping trend. Furthermore, the front slope section of the lower slot wall corresponds vertically to the downward-sloping segment of the first waveform unit of the upper slot wall. This structure provides better support and positioning for the silicon wafer after insertion into the basket, allowing it to be placed more stably in the slot. The larger slope of the rear arc section prevents the silicon wafer from sliding backward during transportation or processing, while the lower slope of the front slope facilitates smooth insertion and provides a degree of forward fixation. Combined with the waveform structure of the upper slot wall, this structure works together to keep the silicon wafer stable within the slot, reducing shaking and minimizing the risk of displacement or falling during handling and processing. This effectively improves the stability and processing accuracy of the silicon wafer during transportation or processing.

[0015] 3. Since the upper and lower walls of the slot are arc-shaped and contact the silicon wafer, rigid contact between the silicon wafer and the slot wall is avoided, reducing the possibility of scratches and abrasions on the silicon wafer surface, thereby improving the yield of silicon wafers. This is of great significance for high-precision silicon wafer processing and use. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the improved silicon wafer-supported dry flower basket structure of this application.

[0017] Figure 2 This is a cross-sectional schematic diagram of this application.

[0018] Figure 3 This is a schematic diagram of the card slot in this application. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments. It should also be noted that, for ease of description, only the parts relevant to this utility model are shown in the drawings, not the entire structure.

[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "set up" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood through the specific circumstances.

[0021] Reference Figures 1-3 The improved silicon wafer-supported dry flower basket of this embodiment includes a flower basket frame 1. Multiple teeth 2 are provided parallel to each other on both sides of the flower basket frame 1. The depth of the teeth 2 is preferably 2cm, meaning the thickness of the teeth 2 protruding from the side of the flower basket frame 1 is preferably 2cm. The length of the teeth 2 can be determined according to the size of the flower basket frame, and the length of the teeth 2 is the depth of the flower basket frame 1. Specifically, a slot 3 for supporting the silicon wafer is formed between two adjacent teeth 2. The upper wall 4 of the slot is a continuous multi-segment waveform structure, including multiple waveform units 41. Each waveform unit 41 sequentially includes a sliding wave segment 411, a smooth wave segment 412, and an upward sliding wave segment 413. The multiple waveform units 41 are connected end-to-end. The upward sliding wave segment 413 in the previous waveform unit 41 connects to the sliding wave segment 411 of the next waveform unit 41. The waveform unit 41 can specifically have 3-5 segments; in this embodiment, five waveform units are preferred. The number of waveform units can be selected according to the depth of the flower basket frame. The glide band 411 and the glide band 413 are arc-shaped curves with opposite directions.

[0022] Furthermore, the lower wall 5 of the slot 3 has a three-section structure, including a rear arc section 51, a middle flat section 52, and a front slope section 53. Both the rear arc section 51 and the front slope section 53 are arc curves. The slope of the rear arc section 51 is greater than that of the front slope section 53, forming a trend of being slightly lower at the back and slightly higher at the entrance of the silicon wafer 100 and slightly higher at the end that extends into the basket frame 1.

[0023] Furthermore, the edge of the port where the silicon wafer 100 enters the basket frame 1 corresponds to the front slope section 53 of the lower groove wall 5 and the upper sliding section 413 of the upper groove wall 4. That is, when the silicon wafer 100 is inserted into the basket, the first port edge it contacts is arc-shaped. Since the front slope section 53 of the lower groove wall 5 and the upper sliding section 413 of the upper groove wall 4 are both arc-shaped contact surfaces, the silicon wafer 100 is inserted into the basket more smoothly and safely, and is less likely to be scratched or damaged.

[0024] In addition, the front slope section 53 of the lower groove wall 5 is set vertically and vertically corresponding to the downward slope section 411 of the first waveform unit of the upper groove wall 4 deep in the basket frame 1. The solution of this application improves the upper and lower side walls of the card tooth 2 and optimizes the structure of the card slot 3 area that carries the silicon wafer. The upper and lower contact surfaces of the card slot 3 are both set as multi-segment structures. Compared with the existing dry basket, the process of inserting and removing the silicon wafer from the basket is smoother and safer, effectively improving process efficiency and increasing OEE (Operational Efficiency) by 1%. For example, the frequency of high-frequency fragmentation in the coating process is reduced from 3 times / shift per machine to 1.2 times / shift.

[0025] The above embodiments are only used to illustrate the present utility model and are not intended to limit the technical solutions described in the present utility model. The understanding of this specification should be based on those skilled in the art. Although the present utility model has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still make modifications or equivalent substitutions to the present utility model. All technical solutions and improvements that do not depart from the spirit and scope of the present utility model should be covered within the scope of the claims of the present utility model.

Claims

1. An improved silicon wafer-supported dried flower basket, comprising a basket frame, wherein multiple retaining teeth are provided on both sides of the basket frame, characterized in that: The area between two adjacent teeth forms a slot for carrying silicon wafers. The upper wall of the slot is a continuous multi-segment waveform structure, including multiple waveform units. Each waveform unit sequentially includes a sliding wave segment, a smooth wave segment, and an upward sliding wave segment. The lower wall of the slot is a three-segment structure, including a rear arc segment, a middle flat segment, and a front slope segment.

2. The improved silicon wafer-supported dried flower basket as described in claim 1, characterized in that: The edge of the port where the silicon wafer enters on the basket frame corresponds to the front slope section of the lower trench wall and the upper slope section of the upper trench wall.

3. The improved silicon wafer-supported dried flower basket as described in claim 1, characterized in that: The multiple waveform units are connected end to end, with the upward sliding band in the previous waveform unit connected to the downward sliding band in the next waveform unit.

4. The improved silicon wafer-supported dried flower basket as described in claim 1, characterized in that: The waveform unit has 3-5 segments.

5. The improved silicon wafer-supported dried flower basket as described in claim 1, characterized in that: The glide band and the glide band are arc-shaped curves with opposite directions.

6. The improved silicon wafer-supported dried flower basket as described in claim 1, characterized in that: The slope of the rear arc segment is greater than the slope of the front arc segment.

7. The improved silicon wafer-supported dried flower basket as described in claim 6, characterized in that: The rear arc segment and the front slope segment are arc-shaped curves.

8. The improved silicon wafer-supported dried flower basket as described in claim 1, characterized in that: The front slope section of the lower trench wall is set to correspond vertically with the downward slope section of the first waveform unit of the upper trench wall.

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