Six-inch centrifugal chuck for wafer

Abstract

The utility model discloses a six inch centrifugal clamping chuck for wafer relates to the chuck field for wafer, including Chuck disc, the outer wall mounting of Chuck disc has the mounting seat, the mounting seat installs the limit PIN, the top PIN and the pendulum bob, the top of Chuck disc is provided with wafer body, the top of top PIN is the milling round surface, the top of top PIN is through the milling round surface and is pasted in the bottom of wafer body, the outer wall of limit PIN is pasted in the outer wall of wafer body, the side of pendulum bob close to wafer body is the inclined plane, the clearance is left between limit PIN and wafer body, is used for when making wafer body can smoothly fall to the top of top PIN to the wafer body of putting the film. A six inch centrifugal clamping chuck for wafer, the design can guarantee that wafer does not displace under lower work rotational speed, to ensure that the subsequent mechanical hand can smoothly take the film.

Description

Technical Field

[0001] This utility model relates to the field of wafer chucks, and in particular to a six-inch centrifugal clamping chuck for wafers. Background Technology

[0002] In existing single-wafer wafer chucks, the wafer must be rotated during operation to ensure more uniform wetting of the wafer surface with the chemical solution. Wafer rotation requires limiting, and centrifugal clamping is a very common limiting method. Existing 6-inch centrifugal clamping chucks typically include a chuck disk, a pendulum, limiting pins, and support pins. After the robotic arm picks up the wafer, it places it in the designated position on the centrifugal clamping Chuck. The machine then starts working, with the spindle rotating the Chuck disk. The rotation starts slowly at the beginning and then becomes a constant speed at the end. Because the speed is very slow at the beginning and the centrifugal force is small, the pendulum cannot hold the wafer down. However, because the speed is slow, the centrifugal force on the wafer is also small, and the friction between the wafer and the top pin keeps the wafer relatively still. When the rotation speed increases to a certain extent, the centrifugal force of the pendulum increases, and the lower part of the pendulum will tilt up and the upper part will press down on the wafer. At this time, the wafer can be fixed and kept relatively still with the Chuck disk. The faster the speed, the greater the downward force of the pendulum and the more securely the wafer is clamped. In addition, the conventional Chuck pendulums are evenly distributed around the wafer.

[0003] However, different processes require different rotation speeds. When the machine speed is low, the downward pressure of the pendulum is insufficient, and the friction between it and the wafer is small, which will cause relative displacement between the wafer and the Chuck disk. When the machine stops operating, the change in the relative position of the wafer will cause a series of problems such as misalignment when the robot picks up the wafer.

[0004] Therefore, it is necessary to propose a six-inch centrifugal clamping chuck for wafers to solve the above problems. Utility Model Content

[0005] The main purpose of this invention is to provide a six-inch centrifugal clamping chuck for wafers, which can effectively solve the problems in the background art.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0007] A six-inch centrifugal clamping chuck for wafers includes a chuck disk, a mounting base is mounted on the outer wall of the chuck disk, a limit pin, a top pin and a pendulum are mounted on the mounting base, and a wafer body is disposed on the top of the chuck disk.

[0008] Preferably, the top of the top PIN is a milled circular surface, and the top of the top PIN is attached to the bottom of the wafer body through the milled circular surface. The outer wall of the limiting PIN is attached to the outer wall of the wafer body. The side of the pendulum close to the wafer body is an inclined plane. A gap is left between the limiting PIN and the wafer body to allow the wafer body to fall smoothly onto the top of the top PIN when placing the wafer body.

[0009] Preferably, the milled circular surface at the top of the top PIN is used to ensure that there is sufficient friction between the wafer body and the Chuck disk when the wafer body is driven to rotate slowly and before it is pressed down by the pendulum. The milled circular surface at the top of the top PIN is cylindrical to prevent contamination caused by excessive contact area with the wafer body. The inclined plane is used to generate friction when it contacts the wafer body when it is driven to rotate, so that the wafer body remains relatively stationary at a relatively low rotation speed.

[0010] Preferably, the top of the mounting base has a mounting groove, and the side of the mounting base has a pin groove. The pin groove and the inner cavity of the mounting groove are connected, and the pin groove is used to install a positioning pin.

[0011] Preferably, the bottoms of the limiting PIN and the top PIN are installed in the inner cavity of the mounting base through mounting grooves, the outer wall of the positioning pin is attached to the outer wall of the limiting PIN and the top PIN, the pendulum is installed on the outer wall of the mounting base through a pin groove, and a connecting piece is installed at the bottom of the pendulum.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] This wafer uses a 6-inch centrifugal clamping chuck. Its difference from a typical centrifugal chuck lies in the modification of the pendulum. In a typical centrifugal chuck, the surface of the pendulum that contacts the wafer is cylindrical, while in this design, the pendulum is an angled plane. Furthermore, while typical pendulums are evenly distributed around the wafer, this design only has two pendulums at the wafer's tangent edge. The pendulum, limit pins, top pins, and connecting tabs are all mounted on the chuck. The contact points between the pendulums and the wafer are two angled planes, which allows for excellent downward pressure on the wafer. The tangential direction of the wafer body contacts the pendulum on one surface. In a typical centrifugal Chuck, the contact surface between the pendulum and the wafer body is a single line. However, in this design, the contact surface between the pendulum and the wafer body is two surfaces, and the tangential direction of the wafer is where the tangential edge contacts the pendulum. This means that the friction between the pendulum and the wafer body is very large. This friction can effectively ensure that the wafer body does not undergo relative displacement at low operating speeds. Compared with existing technologies, this design can ensure that the wafer does not shift at low operating speeds, thus ensuring that the robot can smoothly pick up the wafer.

[0014] The wafer uses a six-inch centrifugal clamping chuck. By rotating the mounting post, the threaded rod can be rotated, allowing the limiting post and the milling cylinder to be threadedly connected to the threaded rod at its bottom. Based on this, the position of the milling cylinder and the limiting post can be adjusted according to the size of the wafer body, thus achieving a compatibility effect and being able to clamp wafer bodies of various thicknesses. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is an exploded view of this utility model;

[0017] Figure 3 This is a utility model Figure 2 A magnified structural diagram of A in the diagram.

[0018] In the diagram: 1. Chuck disk; 2. Pendulum; 3. Connecting piece; 4. Limiting pin; 5. Top pin; 6. Wafer body; 7. Tilt plane; 10. Mounting base; 11. Pin groove; 12. Mounting slot. Detailed Implementation

[0019] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0020] Example 1:

[0021] like Figure 1-3As shown in the figure, a six-inch centrifugal chuck for wafers includes a chuck 1. A mounting base 10 is installed on the outer wall of the chuck 1. A limiting pin 4, a top pin 5, and a pendulum 2 are installed on the mounting base 10. A wafer body 6 is positioned on the top of the chuck 1. The top of the top pin 5 has a milled circular surface, which adheres to the bottom of the wafer body 6. The outer wall of the limiting pin 4 adheres to the outer wall of the wafer body 6. The side of the pendulum 2 closest to the wafer body 6 has an inclined plane 7. A gap is left between the limiting pin 4 and the wafer body 6 to allow the wafer body 6 to smoothly fall onto the top of the top pin 5 during wafer placement. The milled circular surface on the top of the top pin 5 ensures sufficient friction for the wafer body 6 when it is slowly rotated and before being pressed down by the pendulum 2. Force ensures that there is no relative displacement between the wafer body 6 and the Chuck disk 1. The milled surface of the top PIN 5 is cylindrical to prevent contamination caused by excessive contact area with the wafer body 6. The inclined plane 7 is used to generate friction when the wafer body 6 is rotated, so that the wafer body 6 remains relatively stationary at a relatively low speed. The top of the mounting base 10 is provided with a mounting groove 12, and the side of the mounting base 10 is provided with a pin groove 11. The inner cavity of the pin groove 11 and the mounting groove 12 are connected. The pin groove 11 is used to install the positioning pin. The bottom of the limiting PIN 4 and the top PIN 5 are installed in the inner cavity of the mounting base 10 through the mounting groove 12. The outer wall of the positioning pin is attached to the outer wall of the limiting PIN 4 and the top PIN 5. The pendulum 2 is installed on the outer wall of the mounting base 10 through the pin groove 11. The bottom of the pendulum 2 is equipped with a connecting piece 3.

[0022] The difference between this and a typical centrifugal Chuck lies in the modification of the pendulum 2. In a typical Chuck, the surface of the pendulum 2 that contacts the wafer body 6 is cylindrical, while in this design, the pendulum 2 is an inclined plane 7 with a tilt angle. Furthermore, while typical Chucks 2 are evenly distributed around the wafer body 6, this design only has two pendulums 2 at the wafer edge. The pendulum 2, limiting PIN 4, top PIN 5, and connecting piece 3 are all mounted on the Chuck disk 1. The contact points between the pendulum 2 and the wafer body 6 are two inclined planes 7, which allows for a very good downward pressure on the wafer body 6. The tangential direction of wafer 6 contacts the pendulum 2 on one surface. In a typical centrifugal Chuck, the contact surface between the pendulum 2 and the wafer body 6 is a single line. However, in this design, the contact surface between the pendulum 2 and the wafer body 6 is two surfaces, and the tangential direction of wafer 6 is the edge position that contacts the pendulum 2. This means that the friction between the pendulum 2 and the wafer body 6 is very large. This friction can effectively ensure that the wafer body 6 does not undergo relative displacement at low operating speeds. Compared with existing technologies, this design can ensure that the wafer does not shift at low operating speeds, thus ensuring that the robot can smoothly pick up the wafer later.

[0023] Example 2:

[0024] A 6-inch centrifugal clamping Chuck has a limiting PIN4 mounted on the Chuck disk 1. There is a small distance between the limiting PIN4 and the wafer 6. Its function is to allow the wafer 6 to fall smoothly onto the milled circular surface on top of the top PIN5 when the robot arm places the wafer. The milled circular surface that contacts the wafer 6 is a small circular surface with a very small diameter. The purpose of the milled circular surface is to ensure that the wafer 6 has sufficient friction before it is pressed down by the pendulum 2 during the slow start-up, so that there is no relative displacement between the wafer 6 and the Chuck disk 1. At the same time, it can prevent the wafer 6 from being contaminated by an excessively large contact surface. The pendulum 2 is mounted on the Chuck disk, and the connecting piece 3 is mounted on the bottom of the two pendulums 2.

[0025] When the equipment is started, the wafer 6 begins to rotate. At this time, due to the slow rotation speed, the friction between the wafer 6 and the milled surface keeps the wafer body 6 relatively stationary. When the worktable rotates at a low speed, the two inclined planes 7 of the pendulum 2 come into contact with the wafer 6 and generate friction, so that the wafer 6 remains relatively stationary at a relatively low rotation speed.

[0026] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A six-inch centrifugal clamping chuck for wafers, comprising a chuck disk (1), characterized in that: The outer wall of the Chuck disk (1) is fitted with a mounting base (10), and a limit pin (4), a top pin (5) and a pendulum (2) are installed at the mounting base (10). A wafer body (6) is provided on the top of the Chuck disk (1). The top of the top PIN (5) is a milled circular surface. The top of the top PIN (5) is attached to the bottom of the wafer body (6) through the milled circular surface. The outer wall of the limiting PIN (4) is attached to the outer wall of the wafer body (6). The side of the pendulum (2) near the wafer body (6) is an inclined plane (7). There is a gap between the limiting PIN (4) and the wafer body (6) so that the wafer body (6) can fall smoothly onto the top of the top PIN (5) when the wafer body (6) is placed. The milled circular surface at the top of the top PIN (5) is used to ensure that the wafer body (6) has sufficient friction when it is driven to rotate slowly and is not pressed by the pendulum (2) to ensure that there is no relative displacement between the wafer body (6) and the Chuck disk (1). The milled circular surface at the top of the top PIN (5) is cylindrical to prevent excessive contact area with the wafer body (6) and thus prevent contamination. The inclined plane (7) is used to generate friction when the wafer body (6) is driven to rotate, so that the wafer body (6) remains relatively stationary at a relatively low rotation speed. The top of the mounting base (10) is provided with a mounting groove (12), and the side of the mounting base (10) is provided with a pin groove (11). The inner cavity of the pin groove (11) and the mounting groove (12) are connected. The pin groove (11) is used to install a positioning pin. The bottom of the limiting PIN (4) and the top PIN (5) are installed in the inner cavity of the mounting base (10) through the mounting groove (12). The outer wall of the positioning pin is attached to the outer wall of the limiting PIN (4) and the top PIN (5). The pendulum (2) is installed on the outer wall of the mounting base (10) through the pin groove (11). A connecting piece (3) is installed at the bottom of the pendulum (2).

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