A submerged injection mold for molding vehicle-mounted busbar electronically controlled magnetic ring assembly

Abstract

The present invention provides an injection molding die for molding an electronically controlled magnetic ring assembly for a vehicle-mounted busbar copper bus. The die includes a first die and a second die spaced apart from the first die. The first die has a first groove, a first semi-annular groove, a first flow channel, a second semi-annular groove, and a second flow channel. The second die has a second groove, a third semi-annular groove, a third flow channel, and a fourth semi-annular groove. By perpendicularly connecting the first groove and the first semi-annular groove, and by connecting the first flow channel and the first groove, the inner wall of the first annular cavity formed after the first and second semi-annular grooves are molded together fits against the outer wall of the magnetic ring. This allows the first die to form a plastic retainer between the inner wall of the magnetic ring and the busbar. By perpendicularly connecting the second groove and the third semi-annular groove, and by connecting the third flow channel and the second groove, the inner wall of the second annular cavity formed after the third and fourth semi-annular grooves are molded together is spaced apart from the outer wall of the magnetic ring. This allows the second die to form a coating layer on the outer wall of the magnetic ring and the busbar.

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