A filter splitting device

Abstract

This utility model discloses a filter dicing device, comprising an immersion chamber with an immersion cavity and several sets of wafer rings. The immersion chamber contains an immersion cavity, and a fixing cavity for fixing a filter wafer is located at the center of each wafer ring. The immersion chamber includes a first fixed inner wall and a second fixed inner wall. Several sets of first positioning slides and second positioning slides are longitudinally arranged at intervals on the first and second fixed inner walls, respectively. Each first positioning slide is opposite to a set of second positioning slides to form a positioning cavity between them. First and second guiding positioning edges are respectively provided at the left and right ends of each wafer ring. The first and second guiding positioning edges are inserted along the first and second positioning slides, respectively, to confine the wafer ring within the positioning cavity, thereby ensuring that the fixing cavity is placed within the immersion chamber. This utility model effectively solves the problem of uncontrollable dicing force and direction in traditional dicing methods.

Description

Technical Field

[0001] This utility model relates to the field of optical filter manufacturing technology, specifically to an optical filter splitting device. Background Technology

[0002] In the filter manufacturing process, it is usually necessary to split the laser-cut and engraved filter middle sheet to obtain filter smaller pieces. Since the filter middle sheet cannot be completely cut during the laser cutting process, the filter smaller pieces are usually separated by manual splitting. However, this method is not controllable in terms of the splitting force and direction, which can easily lead to problems such as incomplete splitting, edge chipping, and corner chipping. The product yield is low, and the splitting efficiency is low, making it unsuitable for high-precision, high-volume production operations. Utility Model Content

[0003] To overcome the above-mentioned technical problems, this utility model discloses a filter splitting device.

[0004] The technical solution adopted by this utility model to achieve the above objectives is as follows:

[0005] A filter dicing device includes an immersion chamber with an immersion cavity and a plurality of wafer rings. The immersion chamber is provided inside the immersion chamber, and a fixing cavity for fixing the filter middle piece is provided at the center of the wafer ring.

[0006] The soaking tank includes a first fixed inner wall and a second fixed inner wall arranged opposite to each other. Several sets of first positioning slides and second positioning slides are longitudinally arranged at intervals on the first fixed inner wall and the second fixed inner wall, respectively. Each first positioning slide is arranged opposite to a set of second positioning slides so that a positioning cavity is formed between them.

[0007] The wafer ring has a first guide positioning edge and a second guide positioning edge at its left and right ends, respectively. The first guide positioning edge and the second guide positioning edge are inserted along the first positioning slide and the second positioning slide, respectively, so that the wafer ring is confined in the positioning cavity, thereby ensuring that the fixing cavity is placed in the immersion cavity.

[0008] In the aforementioned filter slicing device, the length of the first positioning slide is greater than the length of the first guide positioning edge, and the length of the second positioning slide is greater than the length of the second guide positioning edge.

[0009] In the aforementioned filter slicing device, the depth of the first positioning slide is less than the width of the first guide positioning edge, and the depth of the second positioning slide is less than the width of the second guide positioning edge.

[0010] In the aforementioned filter slicing device, the depth of the first positioning slide is less than the thickness of the first fixed inner wall, and the depth of the second positioning slide is less than the thickness of the second fixed inner wall.

[0011] In the above-described filter dicing device, the spacing between adjacent positioning cavities is greater than the thickness of the wafer ring.

[0012] In the above-mentioned filter slicing device, adjacent first positioning slides are parallel, and adjacent second positioning slides are parallel.

[0013] In the aforementioned filter dicing device, the depth of the immersion chamber is greater than the height of the fixing chamber.

[0014] In the aforementioned filter dicing device, the upper end of the wafer ring is provided with a picking edge.

[0015] In the aforementioned filter dicing device, the lower end of the wafer ring is provided with a flat edge for abutting against the bottom of the immersion tank.

[0016] The aforementioned filter dicing device comprises 21 sets of positioning cavities.

[0017] The beneficial effects of this utility model are as follows: This utility model has a reasonable and ingenious design. Several sets of wafer rings are arranged at intervals in the immersion tank to achieve heat treatment immersion of the filter middle sheet in hot water at 85-90℃ to separate the filter. This effectively solves the problem of uncontrollable cleaving force and direction of the filter in the traditional cleaving method, reduces the impact of human factors on the product yield, and improves the product qualification rate and efficiency. Among them, the wafer rings are guided and inserted along the first positioning slide and the second positioning slide respectively through the first guide positioning edge and the second guide positioning edge, so that the wafer rings are confined in the positioning cavity, ensuring that the filter middle sheet in the fixed cavity is stably placed in the immersion cavity, effectively avoiding uneven immersion or failure to separate or damage to the filter due to improper stacking. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0019] Figure 1 This is a three-dimensional structural schematic diagram of the present invention. Detailed Implementation

[0020] The present invention will be further described below through specific embodiments, so as to make the technical solution of the present invention easier to understand and master, rather than to limit the present invention.

[0021] Example: See Figure 1This embodiment provides a filter dicing device, which includes an immersion tank 1 with an immersion chamber and several sets of wafer rings 2. The immersion tank 1 has an immersion chamber inside, and the wafer rings 2 have a fixing chamber at the center for fixing the filter middle piece.

[0022] The soaking tank 1 includes a first fixed inner wall and a second fixed inner wall arranged opposite to each other. Several sets of first positioning slides 3 and second positioning slides 4 are longitudinally arranged at intervals on the first fixed inner wall and the second fixed inner wall, respectively. Each first positioning slide 3 is arranged opposite to a set of second positioning slides 4 so that a positioning cavity is formed between them.

[0023] The wafer ring 2 is provided with a first guide positioning edge and a second guide positioning edge at its left and right ends, respectively. The first guide positioning edge and the second guide positioning edge are respectively guided and inserted along the first positioning slide 3 and the second positioning slide 4, so that the wafer ring 2 is confined in the positioning cavity, thereby ensuring that the fixing cavity is placed in the immersion cavity.

[0024] Specifically, several sets of wafer rings 2 are arranged at intervals in the immersion tank 1 to achieve heat treatment immersion of the filter middle sheet in hot water at 85-90℃ to separate the filter. This effectively solves the problem of uncontrollable cleaving force and direction of the filter in the traditional cleaving method, reduces the impact of human factors on the product yield, and improves the product qualification rate and efficiency. The wafer rings 2 are guided and inserted along the first positioning slide 3 and the second positioning slide 4 by the first guide positioning edge and the second guide positioning edge, respectively, so that the wafer rings 2 are confined in the positioning cavity. This ensures that the filter middle sheet in the fixed cavity is stably placed in the immersion cavity, effectively avoiding uneven immersion or damage to the filter due to improper stacking.

[0025] Preferably, the length of the first positioning slide 3 is greater than the length of the first guide positioning edge, and the length of the second positioning slide 4 is greater than the length of the second guide positioning edge, to ensure that the wafer ring 2 is fully placed in the immersion tank 1.

[0026] Preferably, the depth of the first positioning slide 3 is less than the width of the first guide positioning edge, and the depth of the second positioning slide 4 is less than the width of the second guide positioning edge, to ensure that the filter middle sheet is fully immersed in the immersion cavity and to increase the effective immersion area.

[0027] Preferably, the depth of the first positioning slide 3 is less than the thickness of the first fixed inner wall, and the depth of the second positioning slide 4 is less than the thickness of the second fixed inner wall.

[0028] Preferably, the spacing between adjacent positioning cavities is greater than the thickness of the wafer ring 2, effectively ensuring that the filter wafer is fully immersed, thus improving the sufficiency and comprehensiveness of the immersion.

[0029] Preferably, the adjacent first positioning slides 3 are parallel to each other, and the adjacent second positioning slides 4 are parallel to each other, which facilitates the stable placement or removal of the wafer ring 2.

[0030] Preferably, the depth of the immersion chamber is greater than the height of the fixing chamber, to ensure that the filter film is fully immersed in the immersion chamber.

[0031] Preferably, the upper end of the wafer ring 2 is provided with a picking edge, which helps to pick up, place or remove the wafer ring 2.

[0032] Preferably, the lower end of the wafer ring 2 is provided with a flat edge for abutting against the bottom of the immersion tank 1, ensuring that the wafer ring 2 is placed stably in the immersion tank 1 and avoiding shaking or displacement.

[0033] In this embodiment, a total of 21 sets of positioning cavities are provided.

[0034] When this utility model is in operation, it includes the following steps:

[0035] Step 1: Fill the soaking tank 1 with water and heat it to 85-90°C;

[0036] Step 2: Place several sets of wafer rings 2 with filter media fixed thereon at intervals in the immersion tank 1 to ensure that the filter media are fully immersed in hot water;

[0037] Step 3: The filter medium is immersed in hot water at 85-90℃ to separate the filter.

[0038] This utility model features a reasonable and ingenious design. Several sets of wafer rings are arranged at intervals within the immersion chamber to allow the filter wafers to be heat-treated and immersed in hot water at 85-90°C for separation. This effectively solves the problem of uncontrollable cleaving force and direction in traditional cleaving methods, reducing the impact of human factors on product yield and improving production qualification rate and efficiency. The wafer rings are guided and inserted along the first and second positioning slides via the first and second guiding positioning edges, respectively, ensuring that the wafer rings are confined within the positioning cavity. This guarantees that the filter wafers in the fixed cavity are stably placed in the immersion chamber, effectively preventing uneven immersion or damage to the filters due to improper stacking.

[0039] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any way. Any person skilled in the art can make many possible variations and modifications to the technical solution of this utility model using the disclosed technical means and content, or modify it into equivalent embodiments with equivalent changes, without departing from the scope of the technical solution of this utility model. Therefore, all equivalent changes made based on the shape, structure, and principle of this utility model without departing from its technical solution should be covered within the protection scope of this utility model.

Claims

1. A filter dicing device, characterized in that, It includes an immersion chamber with an immersion cavity and several sets of wafer rings. The immersion chamber is provided with an immersion cavity, and the center of each wafer ring is provided with a fixing cavity for fixing the middle sheet of the filter. The soaking tank includes a first fixed inner wall and a second fixed inner wall arranged opposite to each other. Several sets of first positioning slides and second positioning slides are longitudinally arranged at intervals on the first fixed inner wall and the second fixed inner wall, respectively. Each first positioning slide is arranged opposite to a set of second positioning slides so that a positioning cavity is formed between them. The wafer ring has a first guide positioning edge and a second guide positioning edge at its left and right ends, respectively. The first guide positioning edge and the second guide positioning edge are inserted along the first positioning slide and the second positioning slide, respectively, so that the wafer ring is confined in the positioning cavity, thereby ensuring that the fixing cavity is placed in the immersion cavity.

2. The filter dicing device according to claim 1, characterized in that, The length of the first positioning slide is greater than the length of the first guide positioning edge, and the length of the second positioning slide is greater than the length of the second guide positioning edge.

3. The filter dicing device according to claim 2, characterized in that, The depth of the first positioning slide is less than the width of the first guide positioning edge, and the depth of the second positioning slide is less than the width of the second guide positioning edge.

4. The filter dicing device according to claim 3, characterized in that, The depth of the first positioning slide is less than the thickness of the first fixed inner wall, and the depth of the second positioning slide is less than the thickness of the second fixed inner wall.

5. The filter dicing device according to claim 4, characterized in that, The distance between adjacent positioning cavities is greater than the thickness of the wafer ring.

6. The filter dicing apparatus according to claim 5, characterized in that, The adjacent first positioning slides are parallel, and the adjacent second positioning slides are parallel.

7. The filter dicing apparatus according to claim 6, characterized in that, The depth of the soaking chamber is greater than the height of the fixing chamber.

8. The filter dicing apparatus according to claim 7, characterized in that, The upper end of the wafer ring is provided with a picking edge.

9. The filter dicing apparatus according to claim 8, characterized in that, The lower end of the wafer ring is provided with a flat edge for abutting against the bottom of the immersion tank.

10. The filter dicing apparatus according to claim 9, characterized in that, There are a total of 21 positioning cavities.

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