Chip exposure equipment

Abstract

This application provides a chip exposure device, including an exposure light source module, a conveying module, and a control module. The exposure light source module is used to expose the chip under the control of the control module. The control module receives signals from the conveying module and the exposure light source module, and sends signals to the conveying module and the exposure light source module to drive them to perform set actions. The conveying module is used to drive the chip to be exposed to move along a first direction and a second direction under the control of the control module. This solution completes the automatic exposure operation of the chip by only setting up a control module, a conveying module, and an exposure light source module. The conveying module is used to realize wafer feeding and receiving, and the programmable controller in the control module supports custom programming. When using the chip exposure device provided by this application, the operator only needs to touch the start button after placing the wafer to achieve full exposure of the entire basket of chips, without the cumbersome steps of other lithography machines. Compared with step exposure, full exposure is more efficient.

Description

Technical Field

[0001] This application relates to the field of chip manufacturing technology, and more specifically, to a chip exposure device. Background Technology

[0002] In existing technologies, the chip resist stripping process typically uses a lithography machine for a single exposure operation. When performing the resist stripping procedure, the current wafer must first be removed, and subsequent processing of other chips requires recalibration. This process is cumbersome and can impact the production capacity of other chip types due to frequent adjustments. Most lithography machines use a step-through exposure mode in the resist stripping operation, completing exposure by scanning area by area, resulting in a long single-chip exposure processing time and low overall production efficiency. Furthermore, using a lithography machine for the resist stripping process increases the equipment load, raises the probability of equipment failure, and increases the maintenance pressure and workload for operators. Utility Model Content

[0003] In order to at least overcome the above-mentioned deficiencies in the prior art, the purpose of this application is to provide a chip exposure device, the chip exposure device including an exposure light source module, a transmission module and a control module;

[0004] The exposure light source module is used to perform exposure processing on the chip to be exposed under the control of the control module;

[0005] The control module includes a programmable controller, a signal input module, and a signal output module; the signal input module is used to receive signals from the transmission module and the exposure light source module, and the signal output module is used to send signals to the transmission module and the exposure light source module to drive them to perform the set actions;

[0006] The transmission module is used to drive the chip to be exposed to move along a first direction and a second direction under the control of the control module; wherein the first direction and the second direction are perpendicular to each other.

[0007] In one possible implementation, the transfer module includes a film feeding submodule, a film receiving submodule, and an exposure submodule;

[0008] The wafer feeding submodule is used to transfer the chip to be exposed to the exposure submodule; the exposure submodule is used to transfer the chip exposed by the exposure light source module to the wafer receiving submodule.

[0009] In one possible implementation, the wafer feeding submodule includes a first wafer stage, a first conveyor belt, a first sensor, a second sensor, a first motor, and a second motor.

[0010] The first sensor and the second sensor are electrically connected to the signal input module; the first motor and the second motor are electrically connected to the signal output module.

[0011] The first wafer stage is connected to the first motor; the control module is used to receive the first chip position signal from the first sensor, and control the first motor to drive the first wafer stage to move along the first direction according to the first chip position signal, so as to move the chip to be exposed to the first set position on the first conveyor belt.

[0012] The first conveyor belt is connected to the second motor; the control module is used to receive the second chip position signal from the second sensor, and control the second motor to drive the first conveyor belt to move along the second direction according to the second chip position signal, so as to move the chip to be exposed from the first set position to the exposure submodule.

[0013] In one possible implementation, the exposure submodule includes a second conveyor belt, a third sensor, and a third motor;

[0014] The second conveyor belt is connected to the third motor; the control module is used to receive the third chip position signal from the third sensor, and control the third motor to drive the second conveyor belt to move along the second direction according to the third chip position signal, so as to move the chip to be exposed along the second direction to the second set position and expose it.

[0015] The control module controls the third motor to drive the second conveyor belt to move along the second direction according to the exposure signal of the exposure light source module, so as to move the chip to be exposed along the second direction to the receiving sub-module.

[0016] In one possible implementation, the receiving submodule includes a second wafer stage, a third conveyor belt, a fourth sensor, a fifth sensor, a fourth motor, and a fifth motor.

[0017] The fourth sensor and the fifth sensor are electrically connected to the signal input module; the fourth motor and the fifth motor are electrically connected to the signal output module.

[0018] The third conveyor belt is connected to the fourth motor; the control module is used to receive the fourth chip position signal of the fourth sensor, and control the fourth motor to drive the third conveyor belt to move along the second direction according to the fourth chip position signal, so as to move the chip from the exposure submodule to the third set position of the third conveyor belt.

[0019] The second wafer carrier is connected to the fifth motor; the control module is used to receive the fifth chip position signal from the fifth sensor, and control the fifth motor to drive the second wafer carrier to move along the first direction according to the fifth chip position signal, so as to move the chip from the third set position to the wafer receiving basket.

[0020] In one possible implementation, the first conveyor belt, the second conveyor belt, and the third conveyor belt are arranged sequentially along the second direction.

[0021] In one possible implementation, the exposure light source module includes an ultraviolet curing lamp.

[0022] In one possible implementation, the exposure light source module is used to perform full exposure processing on the chip to be exposed.

[0023] In one possible implementation, the first sensor, the second sensor, the third sensor, the fourth sensor, and the fifth sensor include capacitive sensors.

[0024] In one possible implementation, the chip exposure apparatus further includes a programmable touchscreen electrically connected to the programmable controller.

[0025] Compared with the prior art, this application has the following beneficial effects:

[0026] This solution achieves automatic chip exposure by only setting up a control module, a conveyor module, and an exposure light source module. The conveyor module is used for wafer feeding and receiving, and the programmable controller in the control module supports custom programming. When using the chip exposure equipment provided in this application, the operator only needs to place the wafer and touch the start button to achieve full exposure of the entire basket of chips, eliminating the cumbersome steps of other lithography machines. Compared with step exposure, full exposure is more efficient. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings required in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a three-dimensional structural diagram of the chip exposure equipment provided in this embodiment;

[0029] Figure 2 This is a schematic diagram of the circuit module of the chip exposure equipment provided in this embodiment;

[0030] Figure 3 This is a three-dimensional structural diagram of the chip exposure equipment provided in this embodiment;

[0031] Figure 4 This is a top view of the internal structure of the chip exposure equipment provided in this embodiment;

[0032] Figure 5 This is a front view of the internal structure of the chip exposure equipment provided in this embodiment.

[0033] Icons: Chip Exposure Equipment - 10; Exposure Light Source Module - 100; Conveyor Module - 200; Control Module - 300; Film Feed Module - 210; Film Receiving Module - 220; Exposure Sub-Module - 230; First Film Carrying Stage - 211; First Conveyor Belt - 212; First Sensor - 213; Second Sensor - 214; First Motor - 215; Second Motor - 216; First Lead Screw - 217; Second Conveyor Belt - 221; Third Sensor - 222; Third Motor - 223; Second Film Carrying Stage - 231; Third Conveyor Belt - 232; Fourth Sensor - 233; Fifth Sensor - 234; Fourth Motor - 235; Fifth Motor - 236; Second Lead Screw - 237; Overall Frame - 400. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0036] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0037] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0038] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0039] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0040] The inventors' investigation revealed that in existing technologies, the chip resist stripping process typically uses a lithography machine for a single exposure operation. When performing the resist stripping procedure in a lithography machine, the current wafer must first be removed, and subsequent processing of other chips requires recalibration. This process is cumbersome and can impact the production capacity of other chip types due to frequent adjustments. Most lithography machines use a step-through exposure mode in the resist stripping operation, completing exposure by scanning area by area, resulting in a long single-chip exposure processing time and low overall production efficiency. Furthermore, using a lithography machine for the resist stripping process increases the equipment load, raises the probability of equipment failure, and increases the maintenance pressure and workload for operators.

[0041] In view of this, this application provides a chip exposure device 10, which includes an exposure light source module 100, a transmission module 200 and a control module 300.

[0042] In this embodiment, automatic exposure of the chip is achieved by setting only the control module 300, the conveying module 200, and the exposure light source module 100. When using the chip exposure equipment 10 provided in this application to perform the chip resist removal process, the operator only needs to touch the start button after placing the wafer to achieve full exposure of the entire basket of chips. There is no need for the cumbersome steps of other lithography machines. Compared with step exposure, full exposure is more efficient.

[0043] The exposure light source module 100 is used to perform exposure processing on the chip to be exposed under the control of the control module 300.

[0044] When using the chip exposure apparatus 10 provided in this embodiment, when the control module 300 receives a signal that the chip to be exposed has been placed in a suitable exposure position, it controls the transmission module 200 to stop transmission and controls the exposure light source module 100 to expose the chip. After receiving a signal that the exposure light source module 100 has completed exposure, the control module 300 controls the transmission module 200 to transmit the chip to the receiving position.

[0045] The control module 300 includes a programmable controller, a signal input module, and a signal output module; the signal input module is used to receive signals from the transmission module 200 and the exposure light source module 100, and the signal output module is used to send signals to the transmission module 200 and the exposure light source module 100 to drive them to perform the set actions.

[0046] In this embodiment, the programmable controller supports custom programming, enabling the chip exposure equipment 10 to operate fully automatically. Specifically, the transmission module 200 may include multiple sensors and multiple motors. After receiving multiple signals from the multiple sensors, the programmable controller outputs multiple pulse signals to the multiple motors through the signal output module to control the operation of the multiple motors, thereby driving the chip to move.

[0047] The transmission module 200 is used to drive the chip to be exposed to move along a first direction and a second direction under the control of the control module 300; wherein the first direction and the second direction are perpendicular to each other.

[0048] In this embodiment, the conveying module 200 moves along the second direction when feeding wafers to the exposure light source module 100 and removing exposed chips; when moving the chip basket, the conveying module 200 moves it along the first direction. The chip basket includes an opening extending through the first direction and a plurality of evenly arranged receiving slots, which are used to respectively accommodate a plurality of parallel chips, with one side of the chips facing the opening.

[0049] For example, during wafer feeding, the wafers to be exposed are transferred one by one from the wafer basket to the exposure position for exposure by moving the wafer basket along the first direction; during wafer receiving, the exposed wafers are collected one by one by moving the receiving basket, which has the same structure as the wafer basket, along the first direction.

[0050] Thus, when using the chip exposure device 10 provided in this embodiment, once the operator sets the start, the entire basket of chips can be automatically exposed.

[0051] In one possible implementation, the transfer module 200 includes a film feeding submodule 210, a film receiving submodule 220, and an exposure submodule 230.

[0052] The chip delivery module 210 is used to deliver the chip to be exposed to the exposure module 230; the exposure module 230 is used to deliver the chip exposed by the exposure light source module 100 to the chip receiving module 220.

[0053] In one possible implementation, the wafer feeding submodule 210 includes a first wafer stage 211, a first conveyor belt 212, a first sensor 213, a second sensor 214, a first motor 215, and a second motor 216.

[0054] The first sensor 213 and the second sensor 214 are electrically connected to the signal input module; the first motor 215 and the second motor 216 are electrically connected to the signal output module.

[0055] The first wafer stage 211 is connected to the first motor 215; the control module 300 is used to receive the first chip position signal from the first sensor 213, and control the first motor 215 to drive the first wafer stage 211 to move along the first direction according to the first chip position signal, so as to move the chip to be exposed to the first set position on the first conveyor belt 212.

[0056] Specifically, when using the chip exposure apparatus 10 provided in this embodiment, a chip basket filled with chips is placed on a first wafer stage 211. The first wafer stage 211 is connected to a first motor 215 via a first lead screw 217. A first sensor 213 is used to detect whether there is a chip in the receiving slot closest to the first sensor 213 in the chip basket. If no chip is detected, a first chip position signal is sent to the control module 300. The control module 300 controls the first motor 215 to drive the first wafer stage 211 to move a set distance closer to the first motor 215 in a first direction via the first lead screw 217. The set distance can be the shortest distance between the two receiving slots of the chip basket in the first direction. Finally, the chip to be exposed is moved to a first set position on the first conveyor belt 212.

[0057] The first conveyor belt 212 is connected to the second motor 216; the control module 300 is used to receive the second chip position signal of the second sensor 214, and control the second motor 216 to drive the first conveyor belt 212 to move along the second direction according to the second chip position signal, so as to move the chip to be exposed from the first set position to the exposure submodule 230.

[0058] Specifically, when using the chip exposure apparatus 10 provided in this embodiment, the second sensor 214 is used to detect whether there is a chip at the first set position. If a chip is detected, a second chip position signal is sent to the control module 300. The control module 300 controls the second motor 216 to drive the first conveyor belt 212 to move in the second direction. Finally, the chip to be exposed is moved to the exposure submodule 230.

[0059] In one possible implementation, the exposure submodule 230 includes a second conveyor belt 221, a third sensor 222, and a third motor 223.

[0060] The second conveyor belt 221 is connected to the third motor 223; the control module 300 is used to receive the third chip position signal from the third sensor 222, and control the third motor 223 to drive the second conveyor belt 221 to move along the second direction according to the third chip position signal, so as to move the chip to be exposed along the second direction to the second set position and expose it.

[0061] Specifically, when using the chip exposure device 10 provided in this embodiment, the third sensor 222 is used to detect whether there is a chip at the second set position. If a chip is detected, a third chip position signal is sent to the control module 300, and the control module 300 controls the exposure light source module 100 to expose the chip.

[0062] It should be noted that the chip's exposure time can be set in advance as needed.

[0063] The control module 300 controls the third motor 223 to drive the second conveyor belt 221 to move along the second direction according to the exposure signal of the exposure light source module 100, so as to move the chip to be exposed along the second direction to the receiving sub-module 220.

[0064] In this embodiment, the exposure signal includes a signal indicating the end of chip exposure. After receiving the signal indicating the end of exposure, the control system controls the third motor 223 to drive the second conveyor belt 221 to move along the second direction.

[0065] In one possible implementation, the receiving submodule 220 includes a second wafer stage 231, a third conveyor belt 232, a fourth sensor 233, a fifth sensor 234, a fourth motor 235, and a fifth motor 236.

[0066] The fourth sensor 233 and the fifth sensor 234 are electrically connected to the signal input module; the fourth motor 235 and the fifth motor 236 are electrically connected to the signal output module.

[0067] The third conveyor belt 232 is connected to the fourth motor 235; the control module 300 is used to receive the fourth chip position signal from the fourth sensor 233, and control the fourth motor 235 to drive the third conveyor belt 232 to move along the second direction according to the fourth chip position signal, so as to move the chip from the exposure submodule 230 to the third set position of the third conveyor belt 232.

[0068] Specifically, when using the chip exposure equipment 10 provided in this embodiment, the fourth sensor 233 is used to detect whether there is a chip at the third set position. If no chip is detected, a fourth chip position signal is sent to the control module 300. The control module 300 controls the fourth motor 235 to drive the third conveyor belt 232 to move in the second direction. Finally, the chip is moved to the third set position.

[0069] The second wafer carrier stage 231 is connected to the fifth motor 236; the control module 300 is used to receive the fifth chip position signal from the fifth sensor 234, and control the fifth motor 236 to drive the second wafer carrier stage 231 to move along the first direction according to the fifth chip position signal, so as to move the chip from the third set position to the wafer receiving basket.

[0070] Specifically, when using the chip exposure equipment 10 provided in this embodiment, the receiving basket is placed on the second wafer stage 231. The second wafer stage 231 is connected to the fifth motor 236 via the second lead screw 237. The fifth sensor 234 is used to detect whether there is a chip in the receiving slot closest to the fifth sensor 234 in the receiving basket. If a chip is detected, a fifth chip position signal is sent to the control module 300. The control module 300 controls the fifth motor 236 to drive the second wafer stage 231 to move a set distance away from the fifth motor 236 in the first direction via the second lead screw 237. The set distance can be the shortest distance between the two receiving slots of the chip basket in the first direction. Finally, the exposed chips are collected in the receiving basket.

[0071] In this embodiment, the chip exposure device 10 can automatically expose all the chips to be exposed in the chip basket filled with chips and collect them all in the receiving basket. After all the actions are completed, the program of the chip exposure device 10 automatically ends.

[0072] In one possible implementation, the first conveyor belt 212, the second conveyor belt 221 and the third conveyor belt 232 are arranged sequentially along the second direction.

[0073] In this way, the chip can be transported from the first set position to the second set position along the second direction, exposed at the second set position, and then transported from the second set position to the third set position. Finally, the chip that has moved to the third set position is collected by the receiving basket.

[0074] In one possible implementation, the exposure light source module 100 includes an ultraviolet curing lamp.

[0075] In this embodiment, an ultraviolet curing lamp is selected as the exposure light source, which can meet the full exposure requirements of the chip. The ultraviolet light performs an optical reaction on the photoresist on the chip surface, thereby realizing the photoresist removal process.

[0076] It should be noted that, in addition to ultraviolet curing lamps, other types of exposure light sources can be selected in other implementations of this embodiment, and no limitation is made here.

[0077] In one possible implementation, the exposure light source module 100 is used to perform full exposure processing on the chip to be exposed.

[0078] Since the chip exposure equipment 10 in this embodiment is designed for large-area exposure of the chip and does not require extremely fine line resolution, it performs full exposure on the chip in this embodiment. Compared to the step-out exposure of a lithography machine, full exposure of the chip can shorten production time and increase throughput. At the same time, full exposure technology has relatively lower requirements for line precision, which can reduce exposure costs.

[0079] In one possible implementation, the first sensor 213, the second sensor 214, the third sensor 222, the fourth sensor 233, and the fifth sensor 234 include capacitive sensors.

[0080] Capacitive sensors have advantages such as high sensitivity and simple structure. In this embodiment, a capacitive sensor is used to quickly capture changes in the chip position and transmit signals to the control module 300 in a timely manner.

[0081] It should be noted that, in addition to the capacitive sensor type, other types of sensors can also be selected as the first sensor 213, the second sensor 214, the third sensor 222, the fourth sensor 233, and the fifth sensor 234 in other implementations of this embodiment, without specific limitations here.

[0082] In one possible implementation, the chip exposure apparatus 10 further includes a programmable touchscreen, which is electrically connected to the programmable controller.

[0083] In this embodiment, a programmable touch screen connected to a programmable controller is provided on the chip exposure equipment 10 to facilitate daily monitoring and manual / automatic operation switching, while reserving functions such as adjusting exposure time and resetting operation.

[0084] For example, when using the chip exposure apparatus 10 provided in this application, pressing the start button on the programmable touchscreen starts the apparatus into automatic operation. Pressing the reset button on the programmable touchscreen automatically resets the apparatus.

[0085] In addition, the exposed time and target exposure time of the chip can be set on the programmable touch screen so as to monitor the exposure progress of the chip when the chip exposure device 10 is running. A running status button can be set on the programmable touch screen. After pressing the running status button, the screen display switches to the device running status interface. The running status of the components of the exposure light source module 100, the conveying module 200 and the control module 300 can be viewed through the device running status interface, which is convenient for viewing and maintenance.

[0086] In one possible implementation, the chip exposure device 10, which has an exposure light source module 100, a transmission module 200 and a control module 300, can use an aluminum bracket as the overall frame 400 of the device. The aluminum bracket has a simple and beautiful appearance. The overall frame 400 can also include electrical components such as relays, circuit breakers, and terminals that are electrically connected to the control module 300.

[0087] In summary, this application provides a chip exposure device 10, including an exposure light source module 100, a conveying module 200, and a control module 300. The exposure light source module 100 is used to expose the chip under the control of the control module 300. The control module 300 is used to receive signals from the conveying module 200 and the exposure light source module 100, and send signals to the conveying module 200 and the exposure light source module 100 to drive them to perform set actions. The conveying module 200 is used to drive the chip to be exposed to move along a first direction and a second direction under the control of the control module 300. This solution completes the automatic exposure operation of the chip by only setting the control module 300, the conveying module 200, and the exposure light source module 100. The conveying module 200 is used to feed and receive the wafer, and the programmable controller in the control module 300 supports custom programming. When using the chip exposure device 10 provided by this application, the operator only needs to place the wafer and touch the start button to achieve full exposure of the entire basket of chips, without the cumbersome steps of other lithography machines. Compared with step exposure, full exposure is more efficient.

[0088] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0089] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A chip exposure apparatus, characterized in that, The chip exposure equipment includes an exposure light source module, a transmission module, and a control module; The exposure light source module is used to perform exposure processing on the chip to be exposed under the control of the control module; The control module includes a programmable controller, a signal input module, and a signal output module; the signal input module is used to receive signals from the transmission module and the exposure light source module, and the signal output module is used to send signals to the transmission module and the exposure light source module to drive them to perform the set actions; The transmission module is used to drive the chip to be exposed to move along a first direction and a second direction under the control of the control module; wherein the first direction and the second direction are perpendicular to each other.

2. The chip exposure apparatus according to claim 1, characterized in that, The transmission module includes a film feeding module, a film receiving module, and an exposure submodule; The wafer feeding submodule is used to transfer the chip to be exposed to the exposure submodule; the exposure submodule is used to transfer the chip exposed by the exposure light source module to the wafer receiving submodule.

3. The chip exposure apparatus according to claim 2, characterized in that, The wafer feeding submodule includes a first wafer stage, a first conveyor belt, a first sensor, a second sensor, a first motor, and a second motor; The first sensor and the second sensor are electrically connected to the signal input module; the first motor and the second motor are electrically connected to the signal output module. The first wafer stage is connected to the first motor; the control module is used to receive the first chip position signal from the first sensor, and control the first motor to drive the first wafer stage to move along the first direction according to the first chip position signal, so as to move the chip to be exposed to the first set position on the first conveyor belt. The first conveyor belt is connected to the second motor; the control module is used to receive the second chip position signal from the second sensor, and control the second motor to drive the first conveyor belt to move along the second direction according to the second chip position signal, so as to move the chip to be exposed from the first set position to the exposure submodule.

4. The chip exposure apparatus according to claim 3, characterized in that, The exposure submodule includes a second conveyor belt, a third sensor, and a third motor; The second conveyor belt is connected to the third motor; the control module is used to receive the third chip position signal from the third sensor, and control the third motor to drive the second conveyor belt to move along the second direction according to the third chip position signal, so as to move the chip to be exposed along the second direction to the second set position and expose it. The control module controls the third motor to drive the second conveyor belt to move along the second direction according to the exposure signal of the exposure light source module, so as to move the chip to be exposed along the second direction to the receiving sub-module.

5. The chip exposure apparatus according to claim 4, characterized in that, The receiving submodule includes a second wafer stage, a third conveyor belt, a fourth sensor, a fifth sensor, a fourth motor, and a fifth motor; The fourth sensor and the fifth sensor are electrically connected to the signal input module; the fourth motor and the fifth motor are electrically connected to the signal output module. The third conveyor belt is connected to the fourth motor; the control module is used to receive the fourth chip position signal of the fourth sensor, and control the fourth motor to drive the third conveyor belt to move along the second direction according to the fourth chip position signal, so as to move the chip from the exposure submodule to the third set position of the third conveyor belt. The second wafer carrier is connected to the fifth motor; the control module is used to receive the fifth chip position signal from the fifth sensor, and control the fifth motor to drive the second wafer carrier to move along the first direction according to the fifth chip position signal, so as to move the chip from the third set position to the wafer receiving basket.

6. The chip exposure apparatus according to claim 5, characterized in that, The first conveyor belt, the second conveyor belt, and the third conveyor belt are arranged sequentially along the second direction.

7. The chip exposure apparatus according to claim 1, characterized in that, The exposure light source module includes an ultraviolet curing lamp.

8. The chip exposure apparatus according to claim 1, characterized in that, The exposure light source module is used to perform full exposure processing on the chip to be exposed.

9. The chip exposure apparatus according to claim 5, characterized in that, The first sensor, the second sensor, the third sensor, the fourth sensor, and the fifth sensor include capacitive sensors.

10. The chip exposure apparatus according to claim 1, characterized in that, The chip exposure equipment also includes a programmable touch screen, which is electrically connected to the programmable controller.

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