Screens and electronic devices

Abstract

This application provides a screen and an electronic device, relating to the technical field of electronic devices. The screen includes multiple pixels, each pixel including three sub-pixels. Each sub-pixel includes an electrically isolated light-emitting area and a foreign object area. The light-emitting area includes a first anode layer, a first light-emitting layer, and a first cathode layer arranged along a first direction. The first light-emitting layer is located between the first anode layer and the first cathode layer, and emits light under the action of the first anode layer and the first cathode layer. The foreign object area includes a second anode layer, a second cathode layer, a second light-emitting layer, and a foreign object structure. The foreign object structure is used to short-circuit a portion of the second anode layer and the second cathode layer. The screen provided by this application enables sub-pixels with foreign object structures to emit light, thereby reducing the scrap rate of the screen and improving the screen yield and finished product yield.

Description

Technical Field

[0001] This application relates to the technical field of electronic devices, and particularly to a screen and an electronic device. Background Technology

[0002] OLEDs are mainly driven by an electric field, and organic semiconductor materials and light-emitting materials emit light through overcarrier injection and recombination.

[0003] OLED screens can be composed of multiple pixels, each of which can include three subpixels: red, green, and blue. During the manufacturing process of subpixels, foreign objects may inevitably fall into the subpixel, causing a short circuit between the cathode and anode. This prevents the subpixel from emitting light, leading to display deviations in pixels containing that subpixel. For example, the pixel may not display colors correctly after being lit, resulting in display problems and rendering the OLED screen unusable. This negatively impacts the yield and production efficiency of OLED screens.

[0004] Therefore, there is an urgent need for a solution that can allow pixels with foreign objects to emit light normally, reduce the scrap rate of the screen, and improve the yield and output rate of the screen. Utility Model Content

[0005] This application provides a screen and electronic device that enables pixels with foreign objects to emit light normally, reduces the scrap rate of the screen, and improves the yield and productivity of the screen, thereby improving the display effect of the electronic device.

[0006] A first aspect of this application provides a screen including a plurality of pixels, each pixel including three sub-pixels;

[0007] The sub-pixel includes an electrically isolated light-emitting area and a foreign object area;

[0008] The light-emitting area includes a first anode layer, a first light-emitting layer and a first cathode layer arranged along a first direction. The first light-emitting layer is located between the first anode layer and the first cathode layer, and the first light-emitting layer emits light under the action of the first anode layer and the first cathode layer.

[0009] The foreign object region includes a second anode layer, a second cathode layer, a second light-emitting layer, and a foreign object structure, wherein the foreign object structure is used to short-circuit a portion of the second anode layer and the second cathode layer.

[0010] This application provides a screen comprising multiple pixels, each pixel including three sub-pixels. At least one sub-pixel of one or more pixels may include an electrically isolated light-emitting area and a foreign object area. The foreign object area includes a foreign object structure that can short-circuit the second anode layer and the second cathode layer. Because the foreign object structure short-circuits a portion of the second anode layer and the second cathode layer, forming a short circuit, the second light-emitting layer cannot emit light normally. This application electrically isolates the foreign object area from the light-emitting area, thereby preventing the short circuit between the second anode layer and the second cathode layer in the foreign object area from causing a short circuit between the first anode layer and the first cathode layer in the light-emitting area. This allows the first light-emitting layer to emit light normally, and consequently, allows the sub-pixel containing the foreign object structure to light up normally. This achieves the effect of normal lighting even when a foreign object structure exists in the sub-pixel and causes a short circuit between the cathode and anode, thereby reducing the scrap rate of the screen and improving the screen yield and production rate.

[0011] In one possible implementation, the sub-pixels are cut by a laser around the outer contour of the foreign object structure along the first direction to form the light-emitting area and the foreign object area that are electrically isolated from each other.

[0012] In this way, since laser cutting technology can accurately separate faulty areas with foreign structures, and the cutting path is designed around the projected contour of the foreign structure, it can ensure that the area of ​​the foreign area is minimized while maintaining the functional integrity of the light-emitting area.

[0013] In one possible implementation, the second anode layer and the first anode layer are electrically isolated from each other, and the second cathode layer and the first cathode layer are electrically isolated from each other;

[0014] The second light-emitting layer is located between the second cathode layer and the second anode layer, and the second light-emitting layer is electrically isolated from the first light-emitting layer.

[0015] This allows for electrical isolation between the foreign object region and the light-emitting region. The current in the foreign object region does not pass through the second light-emitting layer but goes directly from the second anode layer to the second cathode layer, so the foreign object region does not emit light. The current in the light-emitting region can be transported from the first anode layer through the first light-emitting layer to the first cathode layer, so that the cathode layer and anode layer of the sub-pixel are independently isolated. This enables a dual electrical isolation design, completely limiting the short-circuit current within the foreign object region, preventing reverse current from affecting the light-emitting region, and enabling the repair and normal light emission of the sub-pixel.

[0016] In one possible implementation, the foreign object structure is located between the second anode layer and the second cathode layer, and along the first direction, the orthographic projection of the foreign object structure is located within the outer contour of the foreign object region;

[0017] Along the first direction, the shorting portion is located within the outer contour of the foreign object area.

[0018] Furthermore, by placing the orthographic projection of the foreign object structure within the outer contour of the foreign object region, the projection of the foreign object structure is strictly limited to the outer contour of the orthographic projection of the foreign object region. This avoids the foreign object structure causing a short circuit between the first anode layer and the first cathode layer in the light-emitting area, thereby ensuring the normal light emission of the light-emitting area in the sub-pixel.

[0019] Furthermore, by limiting the orthographic projection of the shorting portion to the outer contour of the foreign object area, it is possible to prevent the shorting portion from causing a short circuit between the first anode layer and the first cathode layer in the light-emitting area, thereby ensuring the normal light emission of the light-emitting area of ​​the sub-pixel.

[0020] In one possible implementation, a portion of the foreign object structure is spaced from the second anode layer along the direction from the foreign object structure to the second anode layer.

[0021] The second cathode layer is located within the interval, and the second cathode layer is in direct short-circuit contact with the second anode layer.

[0022] In this way, by using laser cutting technology to isolate and separate the foreign structure and the shorting part to form the foreign part, the influence of the foreign structure and the shorting part on the sub-pixel can be eliminated, so that the light-emitting area on the sub-pixel can emit light normally.

[0023] In one possible implementation, the second light-emitting layer and the first light-emitting layer are electrically isolated from each other;

[0024] The foreign object structure penetrates the second cathode layer and the second light-emitting layer, so that the portion of the second cathode layer near the outer periphery of the foreign object structure directly contacts and short-circuits the second anode layer.

[0025] In one possible implementation, the light-emitting region further includes a first organic transport layer;

[0026] Along the first direction, the first organic transport layer is disposed between the first anode layer and the first light-emitting layer;

[0027] The foreign matter region also includes a second organic transport layer;

[0028] Along the first direction, the organic transport layer is disposed between the second anode layer and the second light-emitting layer;

[0029] The first organic transport layer and the second organic transport layer are electrically isolated from each other.

[0030] In this way, by setting a first organic transport layer in the light-emitting region, the first organic transport layer reduces the energy barrier for hole injection by matching the energy levels of the anode and the light-emitting layer, ensuring that holes are efficiently transported from the first anode layer to the first light-emitting layer.

[0031] The energy band of the first organic transport layer can prevent electrons from migrating backward from the first light-emitting layer to the first anode layer, reducing leakage current and forcing electrons and holes to recombine fully within the first light-emitting layer, thereby improving the efficiency of the light-emitting region of the sub-pixel.

[0032] Furthermore, by electrically isolating the first organic transport layer and the second organic transport layer from each other, it is possible to prevent the lateral diffusion of charge carriers, maintain the hole injection efficiency of the light-emitting region, and improve the working efficiency of the light-emitting region.

[0033] In one possible implementation, the light-emitting region further includes a third organic transport layer;

[0034] Along the first direction, the third organic transport layer is disposed between the first light-emitting layer and the first cathode layer;

[0035] The foreign matter region includes a fourth organic transport layer;

[0036] Along the first direction, the fourth organic transport layer is disposed between the second light-emitting layer and the second cathode layer, and the fourth organic transport layer is electrically isolated from the third organic transport layer.

[0037] In this way, by setting a third organic transport layer in the light-emitting region, the third organic transport layer lowers the energy barrier for electron injection by matching the energy levels of the anode and the light-emitting layer, ensuring that electrons are efficiently transported from the first cathode layer to the first light-emitting layer.

[0038] The energy band of the third organic transport layer can prevent holes from migrating backward from the first light-emitting layer to the first cathode layer, and can force electrons and holes to recombine fully in the first light-emitting layer, thereby improving the efficiency of the light-emitting region of the sub-pixel.

[0039] In some embodiments, the hole mobility of the first organic transport layer can be coordinated with the electron mobility of the third transport layer, so that the recombination rates of electrons and holes within the light-emitting layer are matched. This avoids carrier accumulation near the electrodes, ensures that the recombination region is located at the center of the second light-emitting layer, and improves luminescence efficiency.

[0040] In one possible implementation, the light-emitting region further includes a first charge-generating layer and a third light-emitting layer;

[0041] Along the first direction, the first charge generation layer is disposed on the side of the first light-emitting layer facing the first cathode layer, and the third light-emitting layer is disposed on the side of the first charge generation layer facing the first cathode layer;

[0042] The foreign matter region also includes a second charge generation layer and a fourth light-emitting layer;

[0043] Along the first direction, the second charge generation layer is disposed on the side of the second light-emitting layer facing the second cathode layer, and the fourth light-emitting layer is disposed on the side of the second charge generation layer facing the second cathode layer;

[0044] The first charge generation layer and the second charge generation layer are electrically isolated from each other, and the third light-emitting layer and the fourth light-emitting layer are electrically isolated from each other.

[0045] In this way, by setting a third light-emitting layer in the light-emitting region, the light-emitting region can have a double-layer light-emitting layer stacked along the first direction. The first and third light-emitting layers are connected in series through a first charge generation layer. Under the same driving current, charge carriers (electrons and holes) can recombine and emit light in the two light-emitting layers respectively, realizing the superposition of light output. The double-layer structure setting of the first and third light-emitting layers can disperse the current to the first and third light-emitting layers, and can reduce the aging rate of a single-layer light-emitting layer.

[0046] In one possible implementation, the screen further includes a driving backplane;

[0047] Along the first direction, the drive backplate is disposed on the side of the first anode layer facing away from the first cathode layer.

[0048] In some embodiments, the driving backplane integrates a thin-film transistor array, with each sub-pixel corresponding to an independent thin-film transistor circuit. The gate signal controls the on / off state of the anode voltage to achieve grayscale adjustment, improve response speed, and avoid motion blur in dynamic images. Furthermore, by designing a driving backplane with uniform source-drain circuitry, the current density fluctuation of each sub-pixel can be ensured to be small, preventing screen blemishes.

[0049] When the driving backplate is located on the side of the first anode layer facing away from the first cathode layer, the first anode layer in the light-emitting area serves as the whole-surface electrode, which can provide a uniform lateral electric field distribution and avoid brightness decay of edge pixels.

[0050] In one possible implementation, the screen further includes an encapsulation layer; along the first direction, the encapsulation layer is disposed on the side of the first cathode layer opposite to the first anode layer.

[0051] In some embodiments, by providing an encapsulation layer, water and oxygen penetration can be prevented, thereby preventing sub-pixels from being damaged by water and oxygen erosion, and thus improving the screen's protective performance and lifespan.

[0052] By setting an encapsulation layer, the encapsulation layer has better scratch and impact resistance, which can reduce the probability of damage to the first cathode layer and the second cathode layer, improve the structural strength of the sub-pixels, and improve the structural strength of the screen.

[0053] In one possible implementation, the screen further includes a cover layer; along the first direction, the cover layer is located between the encapsulation layer and the first cathode layer, and the cover layer is used to adjust the interface refractive index between the encapsulation layer and the first cathode layer.

[0054] In this way, by setting a cover layer between the encapsulation layer and the first cathode layer, and by adjusting the refractive index matching at the interface between the encapsulation layer and the first cathode layer through the cover layer, the reflection loss of light at the interface between the encapsulation layer and the first cathode layer can be reduced, and the effective light output can be increased.

[0055] Furthermore, the cover layer can serve as a buffer layer between the encapsulation layer and the first cathode layer, preventing damage to the first cathode layer during the encapsulation layer application process.

[0056] In one possible implementation, the three sub-pixels in each pixel have different colors.

[0057] In this way, by making the sub-pixels with foreign structures emit light, the brightness of the three sub-pixels can be adjusted, and by adjusting the brightness ratio of the three sub-pixels, multiple colors of light can be mixed, thereby enabling a pixel with three sub-pixels of different colors to emit multiple colors of light.

[0058] A second aspect of this application provides an electronic device that includes a screen as described above. Attached Figure Description

[0059] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0060] Figure 2 A cross-sectional view of a sub-pixel containing foreign objects in a related technology;

[0061] Figure 3 for Figure 1 A schematic diagram of the partial structure at point M in the middle screen;

[0062] Figure 4 for Figure 3 A cross-sectional view of a sub-pixel containing a foreign object structure;

[0063] Figure 5 for Figure 2 A top view of a sub-pixel containing a foreign object structure;

[0064] Figure 6 for Figure 3 Another cross-sectional schematic diagram of a sub-pixel containing a foreign object structure;

[0065] Figure 7 for Figure 3 Another cross-sectional schematic diagram of a sub-pixel containing a foreign object structure.

[0066] Explanation of reference numerals in the attached figures:

[0067] 1-Electronic devices;

[0068] 10-Screen; 20-Back cover; 11-Pixel; 30-Sub-pixel; 31-Anode; 32-Cathode; 33-Organic light-emitting layer; 34-Foreign object;

[0069] 100-subpixel;

[0070] 110 - Light-emitting area; 120 - Foreign object area; 130 - Shorting part;

[0071] 111 - First anode layer; 112 - First light-emitting layer; 113 - First cathode layer; 114 - First organic transport layer;

[0072] 115 - Third organic transport layer; 116 - First charge generation layer; 117 - Third light-emitting layer;

[0073] 121-Second anode layer; 122-Second cathode layer; 123-Second light-emitting layer; 124-Foreign structure; 125-Second organic transport layer;

[0074] 126 - Fourth organic transport layer; 127 - Second charge generation layer; 128 - Fourth luminescent layer;

[0075] 200-Drive Backplane;

[0076] 300-Encapsulation layer;

[0077] 400 - Covering layer;

[0078] 500-Substrate. Detailed Implementation

[0079] refer to Figure 1This application provides an electronic device 1. The electronic device 1 can be an electronic device 1 with an organic light-emitting diode (OLED) screen 10. The electronic device 1 with the screen 10 can include, but is not limited to, mobile phones (such as candybar phones or foldable phones), tablet computers, laptops, ultra-mobile personal computers (UMPCs), handheld computers, walkie-talkies, netbooks, POS machines, personal digital assistants (PDAs), wearable devices (such as smartwatches, smart wristbands, pedometers, virtual reality devices, etc., mobile or fixed terminals with circuit board assemblies).

[0080] refer to Figure 1 In some embodiments, the electronic device 1 may include a screen 10, which may include a plurality of pixels 11, each pixel 11 may include three sub-pixels 100, and each sub-pixel 100 has a different color. The electronic device 1 may also include a back cover 20, and the screen 10 and the back cover 20 are connected.

[0081] refer to Figure 2 , Figure 2 This is a cross-sectional schematic diagram of a sub-pixel within a pixel in a screen according to related technologies. The sub-pixel 30 may include an anode 31, a cathode 32, and an organic light-emitting layer 33. The organic light-emitting layer 33 is disposed between the anode 31 and the cathode 32 and is illuminated by the anode 31 and the cathode 32. If a foreign object 34 is present in one of the sub-pixels 30, this foreign object 34 will cause a short circuit between the anode 31 and the cathode 32 in the sub-pixel 30. This will prevent the entire sub-pixel 30 from illuminating due to the short circuit. Since the screen cannot be repaired after the short circuit, the screen will be scrapped, increasing the scrap rate and reducing the yield and production rate of the screen.

[0082] refer to Figure 1 , Figure 3 , Figure 4To address the aforementioned technical problems, this application provides a screen 10 and an electronic device 1. The screen 10 includes a plurality of pixels 11, and each pixel 11 includes three sub-pixels 100. At least one sub-pixel 100 in a certain pixel 11 may include an electrically isolated light-emitting area 110 and a foreign object area 120. The foreign object area 120 includes a foreign object structure 124 that can short-circuit the second anode layer 121 and the second cathode layer 122. Because the foreign object structure 124 short-circuits a portion of the second anode layer 121 and the second cathode layer 122 and forms a short-circuit portion 130, the second light-emitting layer 123 cannot emit light normally. This application electrically isolates the foreign object area 120 from the light-emitting area 110, thereby preventing the short circuit between the second anode layer 121 and the second cathode layer 122 in the foreign object area 120 from causing a short circuit between the first anode layer 111 and the first cathode layer 113 in the light-emitting area 110. This allows the first light-emitting layer 112 to emit light normally, and consequently, allows the sub-pixel 100 containing the foreign object structure 124 to light up normally. This achieves the effect of normal lighting even when the sub-pixel 100 contains the foreign object structure 124 and causes a short circuit between the cathode and anode, thereby reducing the scrap rate of the screen 10 and improving the yield and production rate of the screen 10.

[0083] Furthermore, by using the screen 10 in the above-described embodiments of this application, the scrap rate of the electronic device 1 can be reduced, the probability of the electronic device 1 being returned by the user can be reduced, the product quality of the electronic device 1 can be improved, and the user's experience with the electronic device 1 can be enhanced.

[0084] To make the above-mentioned objectives, features, and advantages of the embodiments of this application more apparent and understandable, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0085] refer to Figure 3 , Figure 4 and Figure 5 This application provides a screen 10, which may include a plurality of pixels 11, and each pixel 11 may include three sub-pixels 100. Sub-pixels 100 may include a light-emitting area 110 and a foreign object area 120 that are electrically isolated from each other, and the light-emitting area 110 and the foreign object area 120 are not electrically conductive to each other.

[0086] refer to Figure 3In some embodiments, the three sub-pixels 100 in each pixel 11 are of different colors. For example, the colors of each of the three sub-pixels 100 can be red, green, and blue, respectively. By making the sub-pixels 100 with the foreign object structure 124 emit light, the brightness of the three sub-pixels 100 can be adjusted, and by adjusting the brightness ratio of the three sub-pixels 100, multiple colors of light can be mixed, thereby enabling the pixel 11 with three sub-pixels 100 of different colors to emit multiple different colors of light.

[0087] In some embodiments, a sub-pixel 100 may have a light-emitting area 110 and at least one foreign object area 120, and each foreign object area 120 is electrically isolated from the light-emitting area 110.

[0088] In some embodiments, at least one of the three sub-pixels 100 in a pixel 11 may include an electrically isolated light-emitting area 110 and a foreign object area 120.

[0089] refer to Figure 4 The light-emitting area 110 can emit light normally, and the light-emitting area 110 can include light emitted along a first direction (such as...). Figure 4 The first anode layer 111, the first light-emitting layer 112, and the first cathode layer 113 are arranged in the Y direction. The first light-emitting layer 112 is located between the first anode layer 111 and the first cathode layer 113, and emits light under the action of the first anode layer 111 and the first cathode layer 113. Therefore, the light-emitting area 110 can ensure the normal light emission of the sub-pixel 100 where the foreign object area 120 exists.

[0090] Foreign object region 120 cannot be illuminated. Foreign object region 120 may include a second anode layer 121, a second cathode layer 122, a second light-emitting layer 123, and a foreign object structure 124. The foreign object structure 124 is used to short-circuit a portion of the second anode layer 121 and the second cathode layer 122. Because the portion of the second anode layer 121 and the second cathode layer 122 in foreign object region 120 is short-circuited, foreign object region 120 cannot emit light normally. When the sub-pixel 100 with foreign object structure 124 is powered on, the light-emitting area 110 in the sub-pixel 100 can emit light normally, and the inability of foreign object region 120 to emit light will form a dark spot.

[0091] In some embodiments, the foreign object structure 124 may exist in at least one sub-pixel 100 of a pixel 11, or the foreign object structure 124 may exist in at least one sub-pixel 100 of multiple pixels 11. When the foreign object structure 124 is present in the sub-pixel 100, the foreign object structure 124 may cause a short circuit between the second cathode layer 122 and the second anode layer 121, thereby preventing the sub-pixel 100 with the foreign object structure 124 from being lit. In order to light up the sub-pixel 100 with the foreign object structure 124, without removing the foreign object structure 124, the second cathode layer 122 and the second anode layer 121 that are shorted near the foreign object structure 124 are electrically isolated from the rest of the sub-pixel 100, so that a foreign object region 120 is formed at the foreign object structure 124 on the sub-pixel 100, and the remaining part that can emit light normally is the light-emitting region 110, thereby achieving the repair of the sub-pixel 100 with the foreign object structure 124.

[0092] In some embodiments, the foreign object structure 124 may be located between the second anode layer 121 and the second cathode layer 122, or the foreign object structure 124 may pierce the second anode layer 121 and the second cathode layer 122 and short-circuit the second anode layer 121 and the second cathode layer 122. Alternatively, the foreign object structure 124 may be made of metal, and when the foreign object structure 124 pierces the second anode layer 121 and the second cathode layer 122, the metal foreign object structure 124 will cause the second anode layer 121 and the second cathode layer 122 to short-circuit.

[0093] This application provides a screen 10 and an electronic device 1. The screen 10 includes a plurality of pixels 11, and each pixel 11 includes three sub-pixels 100. At least one sub-pixel 100 in a certain pixel 11 may include an electrically isolated light-emitting area 110 and a foreign object area 120. The foreign object area 120 includes a foreign object structure 124 that can short-circuit the second anode layer 121 and the second cathode layer 122. Because the foreign object structure 124 short-circuits a portion of the second anode layer 121 and the second cathode layer 122, the second light-emitting layer 123 cannot emit light normally. This application electrically isolates the foreign object area 120 from the light-emitting area 110, thereby preventing the short circuit between the second anode layer 121 and the second cathode layer 122 in the foreign object area 120 from causing a short circuit between the first anode layer 111 and the first cathode layer 113 in the light-emitting area 110. This allows the first light-emitting layer 112 to emit light normally, enabling the light-emitting area 110 to operate independently. Consequently, the sub-pixel 100 containing the foreign object structure 124 can be lit normally, achieving the effect of normal lighting even when the foreign object structure 124 causes a short circuit between the cathode and anode in the sub-pixel 100. This reduces the probability of the entire sub-pixel 100 failing due to the foreign object structure 124, allowing the screen 10 containing the foreign object structure 124 to display normally, thereby reducing the scrap rate of the screen 10 and improving the yield and production rate of the screen 10.

[0094] Furthermore, by using the aforementioned screen 10, the electronic device 1 can reduce its scrap rate and the likelihood of it being returned by users, thereby improving its product quality and enhancing the user experience.

[0095] refer to Figure 4 and Figure 5 In some embodiments, sub-pixels 100 are used to be cut by a laser around the outer contour of the foreign object structure 124 along the orthographic projection of a first direction to form mutually electrically isolated light-emitting areas 110 and foreign object areas 120.

[0096] In some embodiments, before being laser-cut, the first cathode layer 113 and the second cathode layer 122 can be a single complete cathode layer, the first anode layer 111 and the second anode layer 121 can also be a single complete anode layer, and the first light-emitting layer 112 and the second light-emitting layer 123 can also be a single complete light-emitting layer. In this case, the entire sub-pixel 100 points containing the foreign object structure 124 cannot emit light due to the short circuit between the cathode layer and the anode layer. By using a laser to perform a circular cut around the outer periphery of the foreign object structure 124 in the direction from the second cathode layer 122 to the second anode layer 121, a light-emitting area 110 and a foreign object area 120 containing the foreign object structure 124 can be formed. After laser cutting, the complete cathode layer can be divided into a first cathode layer 113 and a second cathode layer 122, the complete anode layer can be divided into a first anode layer 111 and a second anode layer 121, and the complete light-emitting layer can be divided into a first light-emitting layer 112 and a second light-emitting layer 123, forming a light-emitting area 110 and a foreign matter area 120 respectively. The short-circuit between the separated cathode layer and anode layer is located in the foreign matter area 120, and forms a short-circuit between the second cathode layer 122 and the second anode layer 121.

[0097] The light-emitting area 110 and the foreign object area 120 are electrically isolated. Therefore, the problem of the second cathode layer 122 and the second anode layer 121 in the foreign object area 120 being short-circuited will not affect the first cathode layer 113 and the first anode layer 111 in the light-emitting area 110. Thus, the sub-pixel 100 with the foreign object structure 124 can achieve normal light emission.

[0098] In this way, since laser cutting technology can accurately separate the fault area containing the foreign object structure 124, and the cutting path is designed around the projected contour of the foreign object structure 124, it can ensure that the area of ​​the foreign object area 120 is minimized while maintaining the functional integrity of the light-emitting area 110.

[0099] In a specific implementation, the step of using a laser to cut the sub-pixel 100 containing the foreign object structure 124 may include: using a tool to locate the sub-pixel 100 containing the foreign object structure 124; using a laser emitting device to emit a laser towards the sub-pixel 100 and cut around the outer periphery of the foreign object structure 124; controlling the laser to penetrate to the positions of the first anode layer 111 and the second anode layer 121 along a first direction; and forming a physical gap between the outer periphery of the foreign object area 120 and the light-emitting area 110, thereby achieving electrical isolation between the foreign object area 120 and the light-emitting area 110.

[0100] refer to Figure 4 and Figure 5In some embodiments, by using laser cutting technology to cut the sub-pixel 100 with foreign object structure 124, the second anode layer 121 and the first anode layer 111 can be electrically isolated from each other, the second cathode layer 122 and the first cathode layer 113 can be electrically isolated from each other, the second light-emitting layer 123 is located between the second cathode layer 122 and the second anode layer 121, and the second light-emitting layer 123 is electrically isolated from the first light-emitting layer 112.

[0101] In this way, the foreign object region 120 and the light-emitting region 110 can be electrically isolated. The current in the foreign object region 120 does not pass through the second light-emitting layer 123 but goes directly from the second anode layer 121 to the second cathode layer 122. The foreign object region 120 does not emit light. The current in the light-emitting region 110 can be transported from the first anode layer 111 through the first light-emitting layer 112 to the first cathode layer 113, so that the cathode layer and anode layer of the sub-pixel 100 are independently isolated. This achieves a dual electrical isolation design, and the short-circuit current is completely limited within the foreign object region 120, preventing the reverse current from affecting the light-emitting region 110, and enabling the repair and normal light emission of the sub-pixel 100.

[0102] It is understandable that by using laser cutting technology, a physical gap is created between the second cathode layer 122 and the first cathode layer 113 to achieve electrical isolation between them. Similarly, a physical gap also exists between the second light-emitting layer 123 and the first light-emitting layer 112 to achieve electrical isolation between them. Based on the above, a physical gap can also exist between the second anode layer 121 and the first anode layer 111 to achieve electrical isolation between them.

[0103] refer to Figure 4 and Figure 5 In some embodiments, the foreign object structure 124 is located between the second anode layer 121 and the second cathode layer 122, and along a first direction, the orthographic projection of the foreign object structure 124 lies within the outer contour of the foreign object region 120. Along the first direction, the shorting portion 130 is located within the outer contour of the foreign object region 120.

[0104] Thus, when the foreign object structure 124 is located between the second anode layer 121 and the second cathode layer 122, the foreign object structure 124 can be located between the second anode layer 121 and the second cathode layer 122 during the fabrication of the sub-pixel 100. For example, after the second anode layer 121 and the first anode layer 111 are fabricated, and before the first light-emitting layer 112 and the second light-emitting layer 123 are fabricated, the foreign object structure 124 is located on the second anode layer 121.

[0105] Furthermore, by placing the orthographic projection of the foreign object structure 124 within the outer contour of the foreign object region 120, the projection of the foreign object structure 124 is strictly limited to the outer contour of the orthographic projection of the foreign object region 120. This avoids the foreign object structure 124 causing a short circuit between the first anode layer 111 and the first cathode layer 113 in the light-emitting region 110, thereby ensuring the normal light emission of the light-emitting region 110 in the sub-pixel 100.

[0106] Furthermore, by limiting the orthographic projection of the shorting portion 130 to within the outer contour of the foreign object area 120, it is possible to prevent the shorting portion 130 from causing a short circuit between the first anode layer 111 and the first cathode layer 113 in the light-emitting area 110, thereby ensuring the normal light emission of the light-emitting area 110 of the sub-pixel 100.

[0107] refer to Figure 4 and Figure 5 In some embodiments, along the direction from the foreign object structure 124 to the second anode layer 121, a portion of the foreign object structure 124 is spaced from the second anode layer 121, the second cathode layer 122 is located within the space, and the second cathode layer 122 is in direct short-circuit contact with the second anode layer 121.

[0108] When the foreign object structure 124 is located between the second anode layer 121 and the second cathode layer 122, and there is a gap between the foreign object structure 124 and the second anode layer 121, since the formation method of the second light-emitting layer 123 is different from that of the second cathode layer 122, the material of the second light-emitting layer 123 cannot be completely formed on the surface of the second anode layer 121 within the gap. Therefore, when the second cathode layer 122 is formed later, the second cathode layer 122 will be directly formed on the surface of the second anode layer 121 within the gap, so that the second cathode layer 122 and the second anode layer 121 are shorted and a shorting portion 130 is formed.

[0109] In this way, by using laser cutting technology, the foreign object structure 124 and the shorting part 130 are isolated and separated to form a foreign object part, thereby eliminating the influence of the foreign object structure 124 and the shorting part 130 on the sub-pixel 100, so that the light-emitting area 110 on the sub-pixel 100 can emit light normally.

[0110] refer to Figure 6 In some embodiments, the second light-emitting layer 123 and the first light-emitting layer 112 are electrically isolated from each other, and the foreign object structure 124 penetrates the second cathode layer 122 and the second light-emitting layer 123, so that the portion of the second cathode layer 122 near the outer periphery of the foreign object structure 124 directly contacts and short-circuits the second anode layer 121.

[0111] In some embodiments, while the foreign object structure 124 penetrates the second cathode layer 122 and the second anode layer 121, the foreign object structure 124 also penetrates the second light-emitting layer 123.

[0112] In some embodiments, the process of the foreign object structure 124 penetrating the second anode layer 121 and the second cathode layer 122 can be as follows: before penetrating the second anode layer 121 and the second cathode layer 122, the foreign object structure 124 can be on the outside of the second anode layer 121 facing away from the second light-emitting layer 123, or the foreign object structure 124 can also be on the outside of the second cathode layer 122 facing away from the second light-emitting layer 123. When the screen 10 is subjected to pressure, the foreign object structure 124 will penetrate the second anode layer 121 and the second cathode layer 122 under the action of external pressure. During the penetration process, the foreign object structure 124 will carry the second cathode layer 122 at the edge of the foreign object structure 124 along the moving direction of the foreign object structure 124 toward the second anode layer 121 under the action of frictional resistance, so that the second cathode layer 122 and the second anode layer 121 are short-circuited and form a short-circuit portion 130.

[0113] refer to Figure 6 In other embodiments, the foreign object structure 124 can be a metallic foreign object structure 124. When the foreign object structure 124 penetrates the second anode layer 121 and the second cathode layer 122, even if the second anode layer 121 and the second cathode layer 122 are not in direct contact, the second anode layer 121 can directly short-circuit with the second cathode layer 122 through the metallic foreign object structure 124, thereby allowing the current to bypass the second light-emitting layer 123 and preventing the second light-emitting layer 123 from emitting light.

[0114] refer to Figure 7 In some embodiments, the light-emitting region 110 may further include a first organic transport layer 114, which is disposed between the first anode layer 111 and the first light-emitting layer 112 along a first direction. The foreign matter region 120 may further include a second organic transport layer 125, which is disposed between the second anode layer 121 and the second light-emitting layer 123 along the first direction. The first organic transport layer 114 and the second organic transport layer 125 are electrically isolated from each other.

[0115] In some embodiments, before the sub-pixel 100 is cut by laser cutting technology, the first organic transport layer 114 and the second organic transport layer 125 can be a complete organic transport layer. After laser cutting, a physical gap is formed between the first organic transport layer 114 and the second organic transport layer 125 so that the first organic transport layer 114 and the second organic transport layer 125 are electrically isolated from each other.

[0116] In this way, by setting a first organic transport layer 114 in the light-emitting region 110, the first organic transport layer 114 reduces the energy barrier for hole injection by matching the energy levels of the anode and the light-emitting layer, ensuring that holes are efficiently transported from the first anode layer 111 to the first light-emitting layer 112.

[0117] The energy band of the first organic transport layer 114 can prevent electrons from migrating in the reverse direction from the first light-emitting layer 112 to the first anode layer 111, reducing leakage current and forcing electrons and holes to fully recombine in the first light-emitting layer 112, thereby improving the efficiency of the light-emitting region 110 of the sub-pixel 100.

[0118] Furthermore, by electrically isolating the first organic transport layer 114 and the second organic transport layer 125 from each other, it is possible to prevent the lateral diffusion of charge carriers, maintain the hole injection efficiency of the light-emitting region 110, and improve the working efficiency of the light-emitting region 110.

[0119] refer to Figure 7 In some embodiments, the light-emitting region 110 may further include a third organic transport layer 115, which is disposed between the first light-emitting layer 112 and the first cathode layer 113 along the first direction. The foreign matter region 120 may include a fourth organic transport layer 126, which is disposed between the second light-emitting layer 123 and the second cathode layer 122 along the first direction, and the fourth organic transport layer 126 is electrically isolated from the third organic transport layer 115.

[0120] In some embodiments, before the sub-pixel 100 is cut by laser cutting technology, the third organic transport layer 115 and the fourth organic transport layer 126 can be a complete organic transport layer. After laser cutting, a physical gap is formed between the third organic transport layer 115 and the fourth organic transport layer 126 so that the first organic transport layer 114 and the second organic transport layer 125 are electrically isolated from each other.

[0121] In this way, by setting a third organic transport layer 115 in the light-emitting region 110, the third organic transport layer 115 reduces the energy barrier of electron injection by matching the energy levels of the anode and the light-emitting layer, ensuring that electrons are efficiently transported from the first cathode layer 113 to the first light-emitting layer 112.

[0122] The energy band of the third organic transport layer 115 can prevent holes from migrating in the reverse direction from the first light-emitting layer 112 to the first cathode layer 113, and can force electrons and holes to fully recombine in the first light-emitting layer 112, thereby improving the efficiency of the light-emitting area 110 of the sub-pixel 100.

[0123] In some embodiments, the hole mobility of the first organic transport layer 114 can be coordinated with the electron mobility of the third transport layer, so that the recombination rates of electrons and holes within the light-emitting layer are matched. This avoids carrier accumulation near the electrodes, ensures that the recombination region is located at the center of the second light-emitting layer 123, and improves luminous efficiency.

[0124] refer to Figure 7In some embodiments, the light-emitting region 110 may further include a first charge-generating layer 116 and a third light-emitting layer 117. Along the first direction, the first charge-generating layer 116 is disposed on the side of the first light-emitting layer 112 facing the first cathode layer 113, and the third light-emitting layer 117 is disposed on the side of the first charge-generating layer 116 facing the first cathode layer 113.

[0125] The foreign matter region 120 may also include a second charge generation layer 127 and a fourth light-emitting layer 128. Along the first direction, the second charge generation layer 127 is disposed on the side of the second light-emitting layer 123 facing the second cathode layer 122, and the fourth light-emitting layer 128 is disposed on the side of the second charge generation layer 127 facing the second cathode layer 122.

[0126] The first charge generation layer 116 and the second charge generation layer 127 are electrically isolated from each other, and the third light-emitting layer 117 and the fourth light-emitting layer 128 are electrically isolated from each other.

[0127] In some embodiments, before laser cutting, the first charge generation layer 116 and the second charge generation layer 127 of the sub-pixel 100 can be a single integral charge generation layer. After laser cutting, the charge generation layer is separated into the first charge generation layer 116 and the second charge generation layer 127, and the first charge generation layer 116 and the second charge generation layer 127 are electrically isolated from each other. Similarly, before laser cutting, the third light-emitting layer 117 and the fourth light-emitting layer 128 of the sub-pixel 100 can be a single integral light-emitting layer. After laser cutting, the light-emitting layer is separated into the third light-emitting layer 117 and the fourth light-emitting layer 128, and the third light-emitting layer 117 and the second light-emitting layer 128 are electrically isolated from each other.

[0128] In some embodiments, if the light-emitting region 110 further includes a first organic transport layer 114 and a third organic transport layer 115, then the first charge-generating layer 116 and the third light-emitting layer 117 can be located between the third organic transport layer 115 and the first light-emitting layer 112. If the foreign matter region 120 further includes a second organic transport layer 125 and a fourth organic transport layer 126, then the second charge-generating layer 127 and the fourth light-emitting layer 128 can be located between the fourth organic transport layer 126 and the second light-emitting layer 123.

[0129] Thus, by providing a third light-emitting layer 117 in the light-emitting region 110, the light-emitting region 110 can have a double-layer light-emitting layer stacked along the first direction. The first light-emitting layer 112 and the third light-emitting layer 117 are connected in series through the first charge generation layer 116. Under the same driving current, charge carriers (electrons and holes) can recombine and emit light in the two light-emitting layers respectively, realizing the superposition of light output. The double-layer structure of the first light-emitting layer 112 and the third light-emitting layer 117 can disperse the current to the first light-emitting layer 112 and the third light-emitting layer 117, which can reduce the aging rate of a single-layer light-emitting layer.

[0130] refer to Figure 7 In some embodiments, the screen 10 may further include a drive backplate 200. Along a first direction, the drive backplate 200 is disposed on the side of the first anode layer 111 facing away from the first cathode layer 113.

[0131] In some embodiments, the driving backplane 200 integrates a thin-film transistor array, with each sub-pixel 100 corresponding to an independent thin-film transistor circuit. The gate signal controls the on / off state of the anode voltage to achieve grayscale adjustment, improve response speed, and avoid motion blur in dynamic images. Furthermore, by setting the driving backplane 200, a uniform source-drain circuit can be designed to ensure that the current density fluctuation of each sub-pixel 100 is small, thus preventing mottled phenomena on the screen 10.

[0132] When the driving backplate 200 is located on the side of the first anode facing away from the first cathode layer 113, the first anode layer 111 in the light-emitting area 110 serves as the whole-surface electrode, which can provide a uniform lateral electric field distribution and avoid brightness decay of the edge pixels 11.

[0133] In some embodiments, in order to ensure that the light-emitting area 110 of the sub-pixel 100 can emit light normally, when using laser cutting technology, the laser does not cut the driving backplate 200, thereby ensuring that the driving backplate 200 drives the first anode layer 111 and the first cathode layer 113 so that the first light-emitting layer 112 emits light normally.

[0134] refer to Figure 7 In some embodiments, the screen 10 may further include an encapsulation layer 300 disposed on the side of the first cathode layer 113 facing away from the first anode layer 111 along a first direction. The encapsulation layer 300 may also simultaneously cover the second cathode layer 122.

[0135] In some embodiments, by providing an encapsulation layer 300, water and oxygen penetration can be isolated, thereby preventing the sub-pixels 100 from being damaged by water and oxygen erosion, and thus improving the protective performance and service life of the screen 10.

[0136] By setting the encapsulation layer 300, the encapsulation layer 300 has better scratch resistance and impact resistance, which can reduce the probability of damage to the first cathode layer 113 and the second cathode layer 122, improve the structural strength of the sub-pixel 100, and improve the structural strength of the screen 10.

[0137] In some embodiments, the encapsulation layer 300 is a layered structure made of non-conductive material. When the sub-pixel 100 with foreign structure 124 is cut using laser cutting technology, the laser can pass through the encapsulation layer 300 and directly cut the cathode layer, light-emitting layer and anode layer located below the encapsulation layer 300, so as not to damage the encapsulation layer 300.

[0138] refer to Figure 7 In some embodiments, the screen 10 may further include a cover layer 400 located between the encapsulation layer 300 and the first cathode layer 113 along a first direction. The cover layer 400 is used to adjust the interface refractive index between the encapsulation layer 300 and the first cathode layer 113.

[0139] In this way, by providing a cover layer 400 between the encapsulation layer 300 and the first cathode layer 113, and by adjusting the refractive index matching at the interface between the encapsulation layer 300 and the first cathode layer 113 through the cover layer 400, the reflection loss of light at the interface between the encapsulation layer 300 and the first cathode layer 113 can be reduced, and the effective light output can be increased.

[0140] Furthermore, the cover layer 400 can serve as a buffer layer between the encapsulation layer 300 and the first cathode layer 113, preventing damage to the first cathode layer 113 during the process of setting the encapsulation layer 300.

[0141] In some embodiments, the cover layer 400 is a layered structure made of non-conductive material. When the sub-pixel 100 with foreign structure 124 is cut using laser cutting technology, the laser can pass through the cover layer 400 and directly cut the cathode layer, light-emitting layer and anode layer located below the cover layer 400, so as not to damage the cover layer 400.

[0142] refer to Figure 7 In some embodiments, pixel 11 may also include substrate 500, with driving back plate 200 disposed on substrate 500, and substrate 500 used to support structures including driving back plate 200.

[0143] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0144] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "a" or "the" can also be understood to convey either singular or plural usage.

[0145] It should be readily understood that the terms “on,” “above,” and “on top of” in this disclosure should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on top of something” but also “on top of something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0146] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation other than those shown in the figures. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0147] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A screen (10), characterized in that, It includes multiple pixels (11), each of the pixels (11) including three sub-pixels (100); The sub-pixel (100) includes an electrically isolated light-emitting area (110) and a foreign object area (120); The light-emitting area (110) includes a first anode layer (111), a first light-emitting layer (112), and a first cathode layer (113) arranged along a first direction. The first light-emitting layer (112) is located between the first anode layer (111) and the first cathode layer (113), and the first light-emitting layer (112) emits light under the action of the first anode layer (111) and the first cathode layer (113). The foreign object region (120) includes a second anode layer (121), a second cathode layer (122), a second light-emitting layer (123), and a foreign object structure (124). The foreign object structure (124) is used to short-circuit a portion of the second anode layer (121) and the second cathode layer (122) to form a short-circuit section (130).

2. The screen (10) according to claim 1, characterized in that, The sub-pixel (100) is cut by a laser around the outer contour of the foreign object structure (124) along the first direction to form the light-emitting area (110) and the foreign object area (120) that are electrically isolated from each other.

3. The screen (10) according to claim 2, characterized in that, The second anode layer (121) and the first anode layer (111) are electrically isolated from each other, and the second cathode layer (122) and the first cathode layer (113) are electrically isolated from each other; The second light-emitting layer (123) is located between the second cathode layer (122) and the second anode layer (121), and the second light-emitting layer (123) is electrically isolated from the first light-emitting layer (112).

4. The screen (10) according to claim 1, characterized in that, The foreign object structure (124) is located between the second anode layer (121) and the second cathode layer (122), and along the first direction, the orthographic projection of the foreign object structure (124) is located within the outer contour of the foreign object region (120); Along the first direction, the shorting portion (130) is located within the outer contour of the foreign object area (120).

5. The screen (10) according to claim 4, characterized in that, Along the direction from the foreign object structure (124) to the second anode layer (121), a portion of the foreign object structure (124) is spaced from the second anode layer (121); The second cathode layer (122) is located within the interval, and the second cathode layer (122) is in direct short-circuit contact with the second anode layer (121).

6. The screen (10) according to claim 1, characterized in that, The second light-emitting layer (123) and the first light-emitting layer (112) are electrically isolated from each other; The foreign object structure (124) penetrates the second cathode layer (122) and the second light-emitting layer (123) so that the portion of the second cathode layer (122) near the outer periphery of the foreign object structure (124) directly contacts and short-circuits the second anode layer (121).

7. The screen (10) according to claim 1, characterized in that, The light-emitting region (110) also includes a first organic transport layer (114); Along the first direction, the first organic transport layer (114) is disposed between the first anode layer (111) and the first light-emitting layer (112); The foreign matter region (120) also includes a second organic transport layer (125); Along the first direction, the organic transport layer is disposed between the second anode layer (121) and the second light-emitting layer (123); The first organic transport layer (114) and the second organic transport layer (125) are electrically isolated from each other.

8. The screen (10) according to claim 7, characterized in that, The light-emitting region (110) also includes a third organic transport layer (115); Along the first direction, the third organic transport layer (115) is disposed between the first light-emitting layer (112) and the first cathode layer (113); The foreign matter region (120) includes a fourth organic transport layer (126); Along the first direction, the fourth organic transport layer (126) is disposed between the second light-emitting layer (123) and the second cathode layer (122), and the fourth organic transport layer (126) is electrically isolated from the third organic transport layer (115).

9. The screen (10) according to claim 1, characterized in that, The light-emitting region (110) further includes a first charge generation layer (116) and a third light-emitting layer (117); Along the first direction, the first charge generation layer (116) is disposed on the side of the first light-emitting layer (112) facing the first cathode layer (113), and the third light-emitting layer (117) is disposed on the side of the first charge generation layer (116) facing the first cathode layer (113). The foreign matter region (120) further includes a second charge generation layer (127) and a fourth light-emitting layer (128); Along the first direction, the second charge generation layer (127) is disposed on the side of the second light-emitting layer (123) facing the second cathode layer (122), and the fourth light-emitting layer (128) is disposed on the side of the second charge generation layer (127) facing the second cathode layer (122); The first charge generation layer (116) and the second charge generation layer (127) are electrically isolated from each other, and the third light-emitting layer (117) and the fourth light-emitting layer (128) are electrically isolated from each other.

10. The screen (10) according to claim 1, characterized in that, The screen (10) also includes a driving backplate (200); Along the first direction, the drive backplate (200) is disposed on the side of the first anode layer (111) facing away from the first cathode layer (113).

11. The screen (10) according to claim 1, characterized in that, The screen (10) further includes an encapsulation layer (300); along the first direction, the encapsulation layer (300) is disposed on the side of the first cathode layer (113) facing away from the first anode layer (111).

12. The screen (10) according to claim 11, characterized in that, The screen (10) further includes a cover layer (400); along the first direction, the cover layer (400) is located between the encapsulation layer (300) and the first cathode layer (113), and the cover layer (400) is used to adjust the interface refractive index between the encapsulation layer (300) and the first cathode layer (113).

13. The screen (10) according to claim 1, characterized in that, The three sub-pixels (100) in each pixel (11) have different colors.

14. An electronic device (1), characterized in that, Includes the screen (10) as described in any one of claims 1 to 13.

Images