Etching tank system

Abstract

This utility model relates to an etching tank system, belonging to the field of semiconductor fabrication technology. The etching tank system includes an etching tank body and multiple adjusting devices. The etching tank body holds the etching solution. The adjusting devices are located outside the etching tank body and connected to its sidewalls to adjust the levelness of the etching tank body. At least two adjusting devices are arranged opposite each other, allowing adjustment of the etching tank body in opposite directions to ensure its levelness. Each adjusting device includes a detection component and an adjustment component. The adjustment component adjusts the etching tank body based on the levelness detected by the detection component to maintain its levelness. The adjusting devices in this etching tank system can adjust the levelness of the etching tank body in real time, ensuring the etching uniformity and stability of the etching tank system, further improving product quality.

Description

Technical Field

[0001] This application relates to the field of semiconductor fabrication technology, and in particular to an etching trench system. Background Technology

[0002] Wet etching is a process that uses an etching solution to react chemically with the material being etched, forming soluble or volatile products, thereby removing the material from the wafer surface. Wet etching equipment is widely used in the field of semiconductor fabrication technology.

[0003] After prolonged use, wet etching equipment may experience etching tank misalignment, which alters the flow field within the etching tank. The levelness of the etching tank affects the uniformity and stability of the reaction, potentially leading to excessively high local concentrations of reactants or incomplete reactions, thus impacting product quality and even causing safety accidents. Utility Model Content

[0004] Therefore, it is necessary to provide an etching groove system for etching groove offset.

[0005] To achieve the above objectives, on the one hand, this utility model provides an etching groove system, comprising:

[0006] Etching tank, used to hold etching solution;

[0007] Multiple adjustment devices are located outside the etching tank and connected to the sidewall of the etching tank, with at least two adjustment devices arranged opposite to each other.

[0008] The adjustment device includes a detection component and an adjustment component. The detection component is used to detect the levelness of the etching tank, and the adjustment component is used to adjust the levelness of the etching tank based on the levelness information of the etching tank.

[0009] In one embodiment, the adjusting device further includes:

[0010] A first control device is electrically connected to the detection component and the adjustment component respectively. The first control device is used to transmit an adjustment signal to the adjustment component based on the levelness information of the etching tank detected by the detection component.

[0011] In one embodiment, the adjusting device further includes:

[0012] An amplification component, wherein a first end of the amplification component is electrically connected to the first control device, and a second end of the amplification component is electrically connected to the adjustment component; the amplification component is used to amplify the adjustment signal and send instructions to the adjustment component.

[0013] In one embodiment, the adjustment component includes:

[0014] A lead screw, the first end of which abuts against the detection component, and the second end of which is connected to a servo motor;

[0015] The servo motor is electrically connected to the first control device and is used to adjust the lead screw based on the adjustment signal to adjust the levelness of the etching groove.

[0016] In one embodiment, the adjustment component further includes:

[0017] A coupling is used to connect the servo motor and the lead screw.

[0018] In one embodiment, the etching trench system further includes:

[0019] A second control device, electrically connected to a plurality of the first control devices, is used to receive the levelness information of the etching tank sent by the first control devices.

[0020] In one embodiment, the etching trench system further includes:

[0021] An alarm component, electrically connected to the second control device, is used to issue an alarm when the levelness of the etching tank is abnormal.

[0022] In one embodiment, the alarm component includes an audible alarm or a photoelectric alarm.

[0023] In one embodiment, the detection component includes:

[0024] A sensor is used to convert the detected levelness information of the etched groove into an adjustment signal.

[0025] In one embodiment, the sensor includes a level sensor and a pressure sensor.

[0026] Compared with existing technologies, the above technical solution has the following unexpected technical effects:

[0027] This application provides an etching tank system, including an etching tank body and multiple adjusting devices. The etching tank body holds the etching solution, and the adjusting devices are located outside the etching tank body and connected to its sidewalls to adjust the levelness of the etching tank body. At least two adjusting devices are arranged opposite to each other, allowing adjustment of the etching tank body in opposite directions to ensure its levelness. Each adjusting device includes a detection component and an adjusting component, wherein the adjusting component adjusts the etching tank body based on the levelness detected by the detection component to maintain its levelness. The adjusting devices in this etching tank system can adjust the levelness of the etching tank body in real time, ensuring the etching uniformity and stability of the etching tank system, further improving product quality. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This application provides a schematic diagram of the structure of an etching trench system.

[0030] Figure 2 This application provides a schematic diagram of another etching trench system.

[0031] Figure 3 This application provides a schematic diagram of the structure of another etching groove system.

[0032] Explanation of reference numerals in the attached drawings: 01-Etching tank; 02-Adjusting device; 021-Detection component; 022-Adjusting component; 0221-Lead screw; 0222-Servo motor; 0223-Coupling; 023-First control device; 024-Amplification component; 03-Second control device. Detailed Implementation

[0033] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0035] It should be understood that when a layer is referred to as "on," "adjacent to," or "connected to" other layers, it can be directly on, adjacent to, or connected to other layers, or there can be intervening layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," or "directly connected to" other layers, there are no intervening layers.

[0036] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising,” “including,” or “having,” etc., specify the presence of the stated feature, whole, step, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.

[0037] Based on the content in the background art, the existing solution is to perform a level check on the etching tank when a non-compliance is found during routine inspection, and to stop the machine for adjustment after confirming the abnormality.

[0038] However, by the time adjustments were made after the problem was discovered, the actual offset of the etching tank had already occurred for some time, during which the quality of the etched products could not be guaranteed. Furthermore, the tilt direction needed to be confirmed during shutdown adjustments, increasing the adjustment time.

[0039] Based on this, this application provides an etching tank system, including an etching tank body and multiple adjusting devices. The etching tank body is used to hold the etching solution, and the adjusting devices are located outside the etching tank body and connected to its sidewalls to adjust the levelness of the etching tank body. At least two adjusting devices are arranged opposite to each other, allowing adjustment of the etching tank body in opposite directions to ensure its levelness. Each adjusting device includes a detection component and an adjusting component, wherein the adjusting component adjusts the etching tank body based on the levelness detected by the detection component to maintain its levelness. The adjusting devices in this etching tank system can adjust the levelness of the etching tank body in real time, ensuring the etching uniformity and stability of the etching tank system, further improving product quality.

[0040] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, this application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0041] refer to Figure 1 , Figure 1 This application provides a schematic diagram of an etching trench system; see reference. Figure 2 , Figure 2 This application provides a schematic diagram of another etching trench system; the etching trench system includes:

[0042] Etching tank 01 is used to hold etching solution;

[0043] Multiple adjustment devices 02 are located outside the etching tank 01 and connected to the side wall of the etching tank 01, with at least two adjustment devices 02 arranged opposite to each other;

[0044] The adjustment device 02 includes a detection component 021 and an adjustment component 022. The detection component 021 is used to detect the levelness of the etching tank 01, and the adjustment component 022 is used to adjust the levelness of the etching tank 01 based on the levelness information of the etching tank 01.

[0045] Specifically, etching solution is placed in etching tank 01. When the wafer needs to be etched, the wafer is placed in etching tank 01. The etching solution in etching tank 01 forms a certain flow field, thereby ensuring the uniformity of wafer etching.

[0046] Multiple adjustment devices 02 are provided on the outside of the etching tank 01. Each adjustment device 02 includes a detection component 021 and an adjustment component 022. The detection component 021 is located on the side wall of the etching tank 01. When the levelness of the etching tank 01 changes, the detection component 021 can detect the change in levelness in real time. The adjustment component 022 can adjust the etching tank 01 based on the levelness information detected by the detection component 021 when the levelness change is detected, ensuring that the etching tank 01 is level. This, in turn, ensures that the flow field of the etching solution within the etching tank 01 remains unchanged, thus ensuring the uniformity of the etching process.

[0047] It should be noted that at least two adjusting devices 02 are arranged opposite to each other, so that the etching tank 01 can be adjusted to remain horizontal in the direction in which at least one adjusting device 02 points to the other adjusting device 02. For example, in some embodiments, the etching tank 01 can be a cube or a cuboid (e.g., Figure 2 As shown in the figure, at this time, adjustment devices 02 are provided on all four side walls of the etching tank 01, and the adjustment devices 02 on the opposite side walls are arranged opposite to each other.

[0048] In this embodiment, the adjustment device 02 is provided, which can adjust the level of the etching tank 01 in real time, ensuring the etching uniformity and stability of the etching tank system, and further improving the quality of the product.

[0049] In another embodiment of this application, such as Figure 1 As shown, the adjustment device 02 also includes:

[0050] The first control device 023 is electrically connected to the detection component 021 and the adjustment component 022 respectively. The first control device 023 is used to transmit an adjustment signal to the adjustment component 022 based on the levelness information of the etching tank 01 detected by the detection component 021.

[0051] Specifically, the first control device 023 is connected to the electrical detection component 021 and the adjustment component 022 respectively. The detection component 021 transmits the detected levelness information to the first control device 023. The first control device 023 integrates the levelness information, for example, by calculating the tilt degree, adjustment direction, and amplitude of the etching tank, and transmits the adjustment signal to the adjustment component 022 to adjust the levelness of the etching tank 01. It should be noted that the detection device can detect multiple levelness information. After the first control device 023 integrates and processes the multiple levelness information, it then transmits the adjustment signal to the adjustment component 022.

[0052] In this embodiment, the first control device 023 can collect, process and judge the levelness information, making the adjustment signal more accurate and allowing for real-time adjustment to ensure etching uniformity.

[0053] In another embodiment of this application, reference is made to Figure 3 , Figure 3 This application provides a schematic diagram of another etching trench system; the adjustment device 02 further includes:

[0054] Amplification component 024, the first end of which is electrically connected to the first control device 023, and the second end of which is electrically connected to the adjustment component 022; amplification component 024 is used to amplify the adjustment signal and send instructions to adjustment component 022.

[0055] Specifically, the amplification component 024 can be a servo amplifier. The input terminal of the servo amplifier is electrically connected to the first control device 023. When the adjustment signal passes through the servo amplifier, the signal is amplified, making the adjustment signal received by the adjustment component 022 larger, so as to drive the operation of the adjustment component 022. Furthermore, the adjustment signal amplified by the servo amplifier can more precisely control the adjustment component 022. The servo amplifier can also provide overvoltage protection and overcurrent protection to prevent damage to the adjustment component 022.

[0056] In another embodiment of this application, such as Figure 3 As shown, the adjustment component 022 includes:

[0057] Lead screw 0221, the first end of lead screw 0221 abuts against detection component 021, and the second end of lead screw 0221 is connected to servo motor 0222;

[0058] The servo motor 0222 is electrically connected to the first control device 023 and is used to adjust the lead screw 0221 based on the adjustment signal to adjust the level of the etching tank 01.

[0059] Specifically, the first end of the lead screw 0221 abuts against the detection component 021. Since the lead screw 0221 is made of a relatively hard material, it may damage the side wall of the etching tank 01. Therefore, the material of the detection component 021 is designed to be polyvinylidene fluoride (PVDF), which has good strength and toughness. The abutment between the lead screw 0221 and the detection component 021 can adjust the level of the etching tank 01 and avoid damage to the side wall of the etching tank 01.

[0060] The second end of the lead screw 0221 is mechanically connected to the servo motor 0222. The servo motor 0222 is electrically connected to the first control device 023. After the adjustment signal of the first control device 023 is transmitted to the servo motor 0222, the servo motor 0222 turns the lead screw 0221, thereby adjusting the level of the etching tank 01.

[0061] It should be noted that in some embodiments, the servo motor 0222 is electrically connected to the first control device 023 through the amplification component 024, and the amplified adjustment signal can be more precise. The amplification component 024 can control the servo motor 0222 to rotate quantitatively according to the instructions of the first control device 023, so as to adjust the levelness of the etching tank 01.

[0062] In this embodiment, the levelness of the etching tank 01 is adjusted by a servo motor 0222 and a lead screw 0221. Since the servo motor 0222 can precisely control its rotational speed and angle, in conjunction with the lead screw 0221, the rotational motion of the motor can be accurately converted into linear motion, achieving high-precision position adjustment. Furthermore, the servo motor 0222 has excellent dynamic response characteristics, enabling rapid start-up, stopping, and reversal, resulting in a faster adjustment response speed. This improves the reliability and stability of the adjustment device 02.

[0063] In another embodiment of this application, the adjustment component 022 further includes:

[0064] Coupling 0223 is used to connect servo motor 0222 and lead screw 0221.

[0065] Specifically, since the servo motor 0222 and the lead screw 0221 cannot be guaranteed to be coaxial, a coupling 0223 can be used for mechanical connection. Coupling 0223 ensures that the servo motor 0222 and the lead screw 0221 are coaxial, avoiding additional stress and wear caused by misalignment and ensuring reliable rotation. Furthermore, coupling 0223 has a certain degree of elasticity, which can buffer the impact and vibration generated during the starting, stopping, or load changes of the servo motor 0222, reducing damage to both the servo motor 0222 and the lead screw 0221, extending the equipment's service life, and also helping to reduce noise.

[0066] In another embodiment of this application, such as Figure 2As shown, the etching trench system also includes:

[0067] The second control device 03 is electrically connected to multiple first control devices 023 and is used to receive the levelness information of the etching tank 01 sent by the first control devices 023.

[0068] Specifically, the second control device 03 can be a programmable logic controller (PLC) on the host computer. It receives the level information of the etching tank 01 sent by the first control device 023 among the multiple adjustment devices 02. The second control device 03 can ensure that the multiple adjustment devices 02 cooperate with each other to ensure the level of the etching tank 01.

[0069] In another embodiment of this application, the etching trench system further includes:

[0070] An alarm component (not shown) is electrically connected to the second control device 03 and is used to trigger an alarm when the levelness of the etching tank 01 is abnormal.

[0071] Specifically, the alarm component is electrically connected to the first control device 023. The detection component 021 transmits the levelness information of the etched tank 01 to the first control device 023. The first control device 023 determines that the levelness is abnormal and transmits the abnormality information to the second control device 03. The second control device 03 is electrically connected to the alarm component and controls the alarm component to issue an alarm to remind the operator to handle the situation.

[0072] In another embodiment of this application, the alarm component includes an audible alarm or a photoelectric alarm.

[0073] Specifically, audible alarms can include speakers or buzzers, which can effectively alert operators in noisy environments. Photoelectric alarms can include light-emitting diodes (LEDs) or flashlights, allowing operators to promptly see abnormal conditions in the dark.

[0074] In another embodiment of this application, the detection component 021 includes:

[0075] A sensor is used to convert the detected levelness information of the etched groove 01 into an adjustment signal.

[0076] Specifically, this sensor can be a composite sensor, capable of simultaneously measuring multiple different pieces of information to comprehensively determine the levelness of the etching tank 01. It should be noted that the sensor's housing can be made of PVDF material, which possesses good strength and toughness, high tensile strength, and good heat resistance, maintaining good physical properties even at high temperatures. The PVDF sensor can be connected to the sidewall of the etching tank 01 via welding or bonding. Using this sensor, the levelness of the etching tank can be monitored in real time, converting the detected data into digital signals.

[0077] In another embodiment of this application, the sensor includes a level sensor and a pressure sensor.

[0078] Specifically, the sensors can include a level sensor and a pressure sensor. The level sensor offers high measurement accuracy, precisely detecting minute tilt angles. It has a fast response speed, reflecting real-time changes in the horizontal state of the etching tank 01's sidewalls, and exhibits good stability, maintaining reliable performance under various environmental conditions. The pressure sensor detects the pressure between the lead screw 0221 and the sidewall of the etching tank 01, thereby determining whether the pressure is consistent at different sidewall locations and thus judging the levelness of the etching tank 01.

[0079] It should be noted that the level sensor and pressure sensor can be designed separately, in which case they are electrically connected. Alternatively, they can be a composite sensor; there is no specific limitation.

[0080] In this embodiment, by comprehensively judging the pressure between the lead screw 0221 and the side wall of the etching tank 01 and the tilt angle of the side wall of the etching tank 01, the levelness detection can be more accurate.

[0081] The etching tank system of this application ensures uniform distribution of the etching solution within the etching tank, stabilizes the process, improves production instructions and efficiency, increases yield, and enhances product quality. Furthermore, this application eliminates the need for frequent manual inspections and adjustments, saving manpower, increasing automation, making production more efficient, and reducing labor costs. Additionally, this application ensures uniform stress distribution on the tank and related equipment, reducing wear and deformation caused by uneven stress, extending equipment lifespan, and lowering maintenance costs.

[0082] In the description of this specification, references to terms such as "some embodiments," "another embodiment," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0083] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0084] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An etch cell system, characterized by, include: Etching tank, used to hold etching solution; Multiple adjustment devices are located outside the etching tank and connected to the sidewall of the etching tank, with at least two adjustment devices arranged opposite to each other. The adjustment device includes a detection component and an adjustment component. The detection component is used to detect the levelness of the etching tank, and the adjustment component is used to adjust the levelness of the etching tank based on the levelness information of the etching tank.

2. The etch slot system of claim 1, wherein, The regulating device further includes: A first control device is electrically connected to the detection component and the adjustment component respectively. The first control device is used to transmit an adjustment signal to the adjustment component based on the levelness information of the etching tank detected by the detection component.

3. The etching trench system according to claim 2, characterized in that, The regulating device further includes: An amplification component, wherein a first end of the amplification component is electrically connected to the first control device, and a second end of the amplification component is electrically connected to the adjustment component; the amplification component is used to amplify the adjustment signal and send instructions to the adjustment component.

4. The etching trench system according to claim 2, characterized in that, The adjustment component includes: A lead screw, the first end of which abuts against the detection component, and the second end of which is connected to a servo motor; The servo motor is electrically connected to the first control device and is used to adjust the lead screw based on the adjustment signal to adjust the levelness of the etching groove.

5. The etching trench system according to claim 4, characterized in that, The adjustment component further includes: A coupling is used to connect the servo motor and the lead screw.

6. The etching trench system according to claim 2, characterized in that, The etching groove system also includes: A second control device, electrically connected to a plurality of the first control devices, is used to receive the levelness information of the etching tank sent by the first control devices.

7. The etching trench system according to claim 6, characterized in that, The etching groove system also includes: An alarm component, electrically connected to the second control device, is used to issue an alarm when the levelness of the etching tank is abnormal.

8. The etching trench system according to claim 7, characterized in that, The alarm components include audible alarms or photoelectric alarms.

9. The etching trench system according to claim 1, characterized in that, The detection component includes: A sensor is used to convert the detected levelness information of the etched groove into an adjustment signal.

10. The etching trench system according to claim 9, characterized in that, The sensors include a level sensor and a pressure sensor.

Images