Wafer baking device capable of precise temperature control
By designing an inward-tilting wafer clamp and transmission structure made of quartz material, the problem of uneven heat distribution in thick wafers was solved, achieving uniform heating and precise temperature control of the wafers and improving baking efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI HUATIAN INTEGRATED CIRCUIT CO LTD
- Filing Date
- 2025-05-27
- Publication Date
- 2026-05-29
AI Technical Summary
Existing wafer baking equipment struggles to penetrate heat quickly and evenly when processing thick wafers, resulting in low baking efficiency.
The transmission structure, consisting of an inward-tilting wafer clamp made of quartz material, a motor, a drive rod, a worm gear, a worm wheel, and a driven rod, enables the wafer to rotate synchronously during the baking process. Combined with the thermal radiation from the infrared heater, this achieves uniform heat radiation.
It enables uniform heating of thicker wafers, improving baking efficiency and temperature control precision.
Smart Images
Figure CN224302589U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor processing technology, specifically to a wafer baking device capable of precise temperature control. Background Technology
[0002] In the semiconductor manufacturing industry, wafer baking is an indispensable and crucial step that plays a decisive role in the performance and quality of chips.
[0003] The wafer baking apparatus disclosed in Publication No. CN220585199U has the following advantages: it bakes wafers by means of thermal radiation through an infrared heater. Thermal radiation has good directionality and penetrability, and can simultaneously and evenly heat the surface and interior of the wafer, thus avoiding wafer deformation caused by uneven heat. However, directly placing the wafer on the support plate for baking is suitable for thin wafers. However, when dealing with thick wafers, the baking effect of relying solely on thermal radiation is often unsatisfactory. Because thick wafers have low thermal conductivity, heat cannot penetrate into the interior quickly and evenly. It is necessary to extend the irradiation time to achieve the expected baking effect, thereby reducing production efficiency. Utility Model Content
[0004] The purpose of this invention is to provide a wafer baking device that can precisely control temperature, so as to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a wafer baking device capable of precise temperature control, comprising a baking oven and a hinged door on one side of the baking oven, wherein a temperature controller is provided on the outer wall of the baking oven;
[0006] An L-shaped mounting plate is installed in the middle of the outer wall of the switch door. A motor is installed at the bottom of the inner end of the mounting plate. A support plate is fixedly installed in the middle of the inner wall of the switch door. Two push-in slots are opened at the top edge of the support plate. A rotating groove is opened through the inner end of the push-in slot. A through hole is opened in the middle of the support plate wall. A drive rod extending through to the outer end of the switch door is rotatably connected to the inner side wall of the through hole, and the output end of the drive rod is connected to it. A worm gear is installed in the middle of the drive rod wall. A worm wheel is meshed with the worm gear wall. A driven rod is provided in the middle of the worm wheel and rotates through the two rotating grooves. A rotating support ring is located in the rotating groove of the driven rod wall. A wafer clamp is installed at the top of the rotating support ring.
[0007] Preferably, the inner wall of the baking oven is provided with an infrared heater electrically connected to the temperature controller, and the lower end of the inner wall of the baking oven is provided with a temperature sensor electrically connected to the temperature controller and the infrared heater.
[0008] Preferably, a handle is installed at the edge of the outer wall of the switch door.
[0009] Preferably, the notch end of the wafer clamp is inclined inward.
[0010] Preferably, the wafer clamps are all made of quartz.
[0011] Compared with the prior art, the beneficial effects of this utility model are as follows: the wafer clamp with its inwardly inclined notch end can better hold the wafer in place and prevent it from shifting during baking. Moreover, the wafer clamp is made of quartz material, which has good light transmittance and can reduce the obstruction of infrared rays, allowing infrared rays to radiate onto the wafer more effectively. Then, through the transmission structure composed of a motor, drive rod, worm gear, worm wheel and driven rod, the rotating support ring and the wafer clamp at the top are driven to rotate, so that the wafer rotates synchronously during baking. This allows the heat from the infrared heater to radiate more evenly to all parts of the wafer, avoiding uneven heating caused by the large thickness of the wafer. Attached Figure Description
[0012] Figure 1 This is a schematic diagram of the structure of this utility model;
[0013] Figure 2 This is a schematic diagram of the support plate structure of this utility model. Figure 1 ;
[0014] Figure 3 This is a schematic diagram of the support plate structure of this utility model. Figure 2 ;
[0015] Figure 4 This is a schematic diagram of the rotating support ring structure of this utility model;
[0016] Figure 5 For the present utility model Figure 2 Enlarged structural diagram at point A in the middle.
[0017] In the diagram: 1. Baking oven; 11. Temperature controller; 12. Infrared heater; 13. Temperature sensor; 2. Door switch; 21. Handle; 22. Mounting plate; 3. Support plate; 301. Push-in slot; 302. Rotary groove; 303. Through hole; 31. Motor; 32. Drive rod; 33. Worm gear; 34. Driven rod; 35. Worm wheel; 36. Rotary support ring; 37. Wafer clamp. Detailed Implementation
[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0019] Please see Figure 1-5 The present invention provides the following technical solution:
[0020] Example 1: A wafer baking device with precise temperature control includes a baking oven 1 and a switch door 2 hinged to one side of the baking oven 1. A temperature controller 11 is provided on the outer wall of the baking oven 1, and an infrared heater 12 electrically connected to the temperature controller 11 is provided on the inner wall of the baking oven 1. A temperature sensor 13 electrically connected to the temperature controller 11 and the infrared heater 12 is provided at the lower end of the inner wall of the baking oven 1. A handle 21 is installed at the edge of the outer wall of the switch door 2.
[0021] In use, the operator holds handle 21 to open the switch door 2, then places the wafer inside the baking oven 1, closes the switch door 2, and then starts the temperature controller 11 to drive the infrared heater 12 to bake the wafer. Turning off the temperature controller 11 can stop heating, and precise temperature control can be achieved through the temperature sensor 13.
[0022] Example 2: The technical solution of this example, which differs from Example 1, includes: an L-shaped mounting plate 22 installed in the middle of the outer wall of the switch door 2; a motor 31 installed at the bottom of the mounting plate 22; a support plate 3 fixedly installed in the middle of the inner wall of the switch door 2; two push-in slots 301 opened at the top edge of the support plate 3; a rotating groove 302 penetrating through the inner end of the push-in slots 301; a through hole 303 penetrating through the middle of the support plate 3 wall; and a through-hole extending to the switch door rotatably connected to the inner side wall of the through hole 303. 2. The drive rod 32 at the outer end is connected to the output end of the motor 31. A worm gear 33 is installed in the middle of the rod wall of the drive rod 32. A worm wheel 35 is meshed with the rod wall of the worm gear 33. A driven rod 34 is provided in the middle of the worm wheel 35, which rotates through two rotating slots 302. The rod wall of the driven rod 34 is located in the rotating slot 302 and a rotating support ring 36 is installed at the top of the rotating support ring 36. The notch end of the wafer clamp 37 is set in an inward shape. The wafer clamp 37 is made of quartz.
[0023] In use, the quartz wafer clamp 37 has good light transmittance and high temperature resistance. The wafer clamp 37 with its inwardly inclined notch end can hold the wafer. The operator first slides the wafer along the push-in slot 301 into the wafer clamp 37 and onto the rotating support ring 36. Then, the starting motor 31 drives the worm gear 33 to rotate through the drive rod 32. The worm gear 33 will mesh and drive the worm wheel 35 to rotate. The worm wheel 35 will drive the rotating support rings 36 at both ends to rotate through the driven rod 34. At that time, the wafer will rotate synchronously, so that the wafer can be baked evenly and avoid uneven heating due to the large wafer thickness.
[0024] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A wafer baking apparatus capable of precise temperature control, comprising a baking oven (1) and a hinged door (2) on one side of the baking oven (1), wherein a temperature controller (11) is provided on the outer wall of the baking oven (1); Its features are: An L-shaped mounting plate (22) is installed in the middle of the outer wall of the switch door (2). A motor (31) is installed at the bottom of the inner side of the mounting plate (22). A support plate (3) is fixedly installed in the middle of the inner wall of the switch door (2). Two push-in slots (301) are opened at the top edge of the support plate (3). A rotating groove (302) is opened through the inner end of the push-in slot (301). A through hole (303) is opened through the middle of the wall of the support plate (3). A through hole extending to the switch is rotatably connected to the inner side wall of the through hole (303). The drive rod (32) at the outer end of the door (2) is connected to the output end of the motor (31). A worm (33) is installed in the middle of the rod wall of the drive rod (32). A worm wheel (35) is meshed with the rod wall of the worm (33). A driven rod (34) is provided in the middle of the worm wheel (35) and rotates through two rotating slots (302). A rotating support ring (36) is located in the rotating slot (302) on the rod wall of the driven rod (34). A wafer clamp (37) is installed at the top of the rotating support ring (36).
2. The wafer baking apparatus with precise temperature control according to claim 1, characterized in that: The inner wall of the baking oven (1) is provided with an infrared heater (12) electrically connected to the temperature controller (11), and the lower end of the inner wall of the baking oven (1) is provided with a temperature sensor (13) electrically connected to the temperature controller (11) and the infrared heater (12).
3. The wafer baking apparatus with precise temperature control according to claim 1, characterized in that: A handle (21) is installed on the outer edge of the switch door (2).
4. The wafer baking apparatus with precise temperature control according to claim 1, characterized in that: The notch end of the wafer clamp (37) is set in an inward tilt.
5. The wafer baking apparatus with precise temperature control according to claim 4, characterized in that: The wafer clamps (37) are all made of quartz.