A loop impedance testing device for high-speed optical communication products
By combining the sliding stage mechanism, the vertical pressing mechanism, and the adapter plate docking module, the problems of low efficiency, poor accuracy, and poor repeatability in the loop impedance testing of existing high-speed optical communication products are solved, achieving efficient and accurate test results that are suitable for mass production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- PRIME TECH GUANGZHOU INC
- Filing Date
- 2025-04-02
- Publication Date
- 2026-05-29
AI Technical Summary
Existing high-speed optical communication products suffer from problems such as low operational efficiency, poor contact consistency, difficulty in ensuring probe positioning accuracy, easy damage to test points, and poor repeatability of test results, making it difficult to meet the needs of mass production.
The sliding stage mechanism enables rapid loading, unloading, and precise positioning of the product under test. Combined with the vertical pressing mechanism, it provides stable pressing force. The integrated test probe group and adapter plate docking module ensure the correct construction of the test circuit. The mechanical foolproof structure ensures the reliability and safety of operation.
It enables efficient, accurate, and repeatable testing of the loop impedance of high-speed optical communication products, improves operational efficiency and automation, enhances the stability and consistency of test contacts, reduces the skill requirements for operators and the risk of product damage, and is suitable for mass production.
Smart Images

Figure CN224303758U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic product testing technology, and in particular to a loop impedance testing device for high-speed optical communication products. Background Technology
[0002] High-speed optical communication technology is the core support of modern information networks. Its continuously increasing transmission rates place extremely high demands on the signal integrity of key optical communication products such as optical transceiver modules and high-speed connectors. Loop impedance is one of the key parameters for evaluating the characteristics of high-speed signal transmission channels; its consistency and accuracy directly affect signal reflection, loss, and overall transmission quality. Therefore, in the research and development and production of high-speed optical communication products, high-precision and high-efficiency impedance testing of specific loops is crucial.
[0003] In existing technologies, loop impedance testing of high-speed optical communication products typically employs manual probe testing. This involves using a vector network analyzer or a TDR (time domain reflectometer) in conjunction with a manual probe to directly contact the test points of the product under test. While this method offers high flexibility, it suffers from problems such as low operational efficiency, poor contact consistency, difficulty in ensuring probe positioning accuracy, and easy damage to the test points of the product under test. Consequently, it struggles to meet the demands of mass production, and the repeatability of test results is poor.
[0004] Therefore, it is necessary to improve the loop impedance testing technology of existing high-speed optical communication products in order to overcome the shortcomings of the existing technology. Utility Model Content
[0005] To overcome the problems existing in related technologies, the purpose of this utility model is to provide a loop impedance testing device for high-speed optical communication products. This device achieves rapid loading, unloading, and precise positioning of the product under test (DUT) through a sliding stage mechanism; provides stable and repeatable pressing force through a vertical pressing mechanism; and utilizes an integrated test probe set to achieve reliable and synchronous contact with the test points of the DUT. Furthermore, it combines a connector plate docking module with a mechanically foolproof structure to ensure the correct construction of the test loop. This solves the technical problems of low operational efficiency, poor contact consistency, difficulty in guaranteeing probe positioning accuracy, easy damage to the test points of the DUT, and poor repeatability of test results caused by existing manual probe testing methods. Therefore, it achieves efficient, accurate, and repeatable testing of the loop impedance of high-speed optical communication products and is suitable for mass production environments.
[0006] A loop impedance testing device for high-speed optical communication products includes:
[0007] abutment;
[0008] A sliding stage mechanism is disposed on the base for carrying the product under test and moving between the loading / unloading station and the testing station. The sliding stage mechanism includes a probe positioning base and a linear sliding base. The upper surface of the probe positioning base is provided with a positioning nest for placing and positioning the product under test. The linear sliding base connects the probe positioning base and the base. The linear sliding base is provided with a test probe group for contacting the test point on the bottom of the product under test. The test probe group passes through the probe positioning base.
[0009] A vertical pressing mechanism is fixedly mounted on the base and located above the test station. It is used to apply downward pressure to press the product under test toward the test probe group. The vertical pressing mechanism includes a pressure plate and a pressing drive source. The pressure plate is arranged parallel to the probe positioning base above the probe positioning base. The pressing drive source is used to drive the pressure plate to reciprocate in the vertical direction.
[0010] The adapter board docking module is equipped with a signal adapter board, which is used to cooperate with the test probe group to form a circuit under test. The product under test includes a board body and a connector interface fixed on the board body. The signal adapter board is used to dock with the connector interface. The interface between the adapter board docking module and the probe positioning base is provided with a mutually cooperating mechanical anti-foolproof support structure.
[0011] Furthermore, the mechanical error-proof support structure includes:
[0012] A positioning groove is provided on the docking interface of one of the adapter plate docking module and the probe positioning base, and a positioning protrusion or positioning beam that matches the shape of the positioning groove is provided at the corresponding position on the docking interface of the other.
[0013] The foolproof structure employs a matching method of positioning grooves and positioning protrusions / beams. This structure utilizes the unique shape matching to ensure that the adapter plate docking module and the probe positioning base can only be fully inserted and engaged in one direction. Any other incorrect orientation (such as reverse, inversion, or misalignment) will be prevented due to physical interference. This ensures the correct connection of the test circuit during each operation, improving the reliability and safety of the device operation and avoiding test failures or potential damage caused by misoperation.
[0014] Furthermore, two sets of connector interfaces are symmetrically provided on both sides of the same area of the plate.
[0015] The adapter board docking module includes two signal adapter boards arranged in parallel to each other and a positioning groove disposed between the two signal adapter boards;
[0016] The probe positioning base is provided with a positioning beam, the position of which corresponds to the position of the plate of the product to be tested placed on the probe positioning base.
[0017] The product under test (DUT) features symmetrical interfaces on both sides, and the adapter board docking module accordingly employs a dual-signal adapter board design. Furthermore, the position of the foolproof structure (groove / beam) corresponds to the position of the DUT's board body. This further improves the reliability and efficiency of testing this specific type of product, while the foolproof structure ensures simplicity and error prevention in this complex docking operation.
[0018] Furthermore, several support springs are provided between the probe positioning base and the linear sliding base, with the two ends of the support springs respectively abutting against the probe positioning base and the linear sliding base; this not only ensures the correct orientation of the overall module, but also, through the cooperation of the anti-foolproof crossbeam and the board body, ensures that the two signal adapter boards are simultaneously and accurately aligned and inserted into the connector interfaces on both sides.
[0019] The linear sliding base is fixed with a plurality of first limiting posts arranged in a vertical direction. The first limiting posts pass through the probe positioning base. The first limiting posts are used to guide the relative movement of the linear sliding base and the probe positioning base, and / or to limit the relative movement range of the linear sliding base and the probe positioning base.
[0020] The probe positioning base is provided with a first guide rod in the vertical direction, and the linear sliding base is provided with a first sleeve that cooperates with the first guide rod. The first guide rod and the first sleeve are slidably engaged, and the first guide rod and the first sleeve are used to guide the relative movement of the linear sliding base and the probe positioning base.
[0021] The probe positioning base and the linear sliding base are connected by a support spring and guided and limited by a first limiting post and / or a first guide rod / sleeve. This allows the probe positioning base carrying the product under test to have controlled vertical floating capability relative to the fixed test probe assembly. When the vertical pressing mechanism presses down, the spring is compressed, providing a buffer stroke and compensation capability. This effectively compensates for minor flatness differences in the product under test itself or after installation, ensuring that even with minor deformation or tolerances, all test probes can establish uniform and reliable contact pressure with the test points of the product under test, significantly improving contact consistency and stability, thereby enhancing the accuracy and repeatability of impedance measurements.
[0022] Furthermore, the lower surface of the pressure plate is provided with a plurality of pressure bars and a plurality of support pins along the vertical direction. The support pins are used to keep the product under test stable during the pressing process, and the pressure bars are used to keep the product under test stable in the pressed state.
[0023] By incorporating pressure bars and support pins, more precise control and protection of the product under test can be achieved during the pressing process and in the final pressed state. The support pins improve stability during pressing, preventing product displacement that could lead to poor contact or damage; the pressure bars allow for targeted pressure application, avoiding damage to sensitive components and ensuring pressure is applied evenly to the intended location. Together, these enhance the reliability, stability, and safety of the test contact.
[0024] Furthermore, the lower surface of the pressure plate is provided with a plurality of second limiting posts and a plurality of third limiting posts in the vertical direction. The second limiting posts are used to limit the relative movement range between the pressure plate and the probe positioning base, and the third limiting posts are used to limit the relative movement range between the pressure plate and the base.
[0025] By incorporating second and third limit posts, the movement range of the pressure plate can be precisely controlled. The second limit post prevents the pressure plate from excessively pressing down, avoiding overload damage to the test probe assembly or the product under test; the third limit post ensures the pressure plate is raised to a sufficient height for operation and may define a lower working limit. This stroke limitation improves the operational safety of the device, protects critical components, and helps achieve repeatable pressing depths.
[0026] Furthermore, the linear sliding base includes a push-pull platform and a slide rail assembly disposed at the bottom of the push-pull platform;
[0027] A cable chain is provided below the push-pull platform. One end of the cable chain is connected to the linear sliding base, and the other end is connected to the base. The cable chain is used to accommodate and protect the cable between the linear sliding base and the base.
[0028] A locking component is provided between the linear sliding component and the base, the locking component being used to restrict the relative movement between the linear sliding component and the base.
[0029] Cable chains are used to store and guide cables connected to the moving parts (linear sliding base). Locking components are used to secure the push-pull platform at the test station. Cable chains effectively protect signal cables from wear, tangling, and signal interference, ensuring stable signal transmission; locking components ensure the push-pull platform remains stable during testing, eliminating measurement errors caused by accidental movement and improving test reliability and safety.
[0030] Furthermore, a plurality of second guide rods are provided on the lower surface of the pressure plate in the vertical direction, and the linear sliding base is provided with a second sleeve that cooperates with the second guide rods. The second guide rods and the second sleeve are slidably engaged and are used to guide the relative movement of the pressure plate and the linear sliding base. The probe positioning base is provided with an avoidance opening for the passage of the second guide rods, and the radius of the avoidance opening is larger than the radius of the second guide rods.
[0031] By incorporating a second guide rod / sleeve, a direct and precise relative motion guide is established between the pressure plate and the linear sliding base carrying the probes. This helps ensure that the downward pressing direction of the pressure plate is strictly perpendicular to the plane containing the probe array, maintaining extremely high parallelism and alignment accuracy even when the probe positioning base is floating. The clearance opening ensures that the free movement of the floating components is not interfered with. This further improves the uniformity and accuracy of pressure application, contributing to enhanced contact consistency and measurement accuracy.
[0032] Furthermore, the probe positioning base is provided with a plurality of positioning blocks, which are set according to the three-dimensional contour of the product to be tested;
[0033] The positioning nest is provided with multiple positioning posts, which are set to correspond to the openings on the plate of the product under test, and are used to constrain and position the product under test.
[0034] By combining positioning blocks and positioning posts, extremely precise and stable three-dimensional spatial positioning of high-speed optical communication products can be achieved. Positioning blocks provide initial coarse positioning and attitude constraints, while positioning posts provide a high-precision final positioning reference. This multi-faceted, multi-feature positioning method ensures that the position of the product under test relative to the test probe group is consistent each time, which is a key foundation for achieving high-precision, high-repeatability impedance measurements.
[0035] Furthermore, the vertical pressing mechanism also includes a fixed frame, and a plurality of guide columns are provided between the fixed frame and the base. The pressure plate is provided with a flange bearing that slides with the guide columns.
[0036] The clamping drive source is a manual toggle clamp, which is mounted on the fixed frame, and the output end of the manual toggle clamp is fixedly connected to the pressure plate.
[0037] By employing a combination of a fixed frame, precision guide columns, and flange bearings, a vertical motion frame with high rigidity and guiding accuracy is constructed, ensuring smooth, wobbly, and highly vertical movement of the pressure plate during pressing. The use of a manual toggle clamp as the drive source, fixedly connected to the pressure plate, provides advantages such as labor-saving operation, large and stable clamping force, and rapid action, while maintaining a relatively simple and reliable structure. The combination of these structures guarantees the accuracy, stability, and repeatability of the pressing action, providing a strong guarantee for reliable probe contact and precise measurement.
[0038] The beneficial effects of this utility model are as follows:
[0039] This invention provides a loop impedance testing device for high-speed optical communication products. This device utilizes a sliding stage mechanism with probe positioning bases and positioning nests to achieve rapid loading and unloading and precise, repeatable positioning of the product under test, replacing the time-consuming and error-prone manual positioning process. A vertical pressing mechanism applies stable, consistent, and vertical pressure using its pressure plate and pressing drive source, ensuring uniform and repeatable contact pressure between the test probe group and the test points of the product under test, avoiding the uncertainty and potential damage of manual pressure application. An adapter board docking module integrates a signal adapter board, and modular docking and mechanical foolproof structures ensure rapid, accurate, and error-free connection of the test loop auxiliary components (adapter board). The organic combination of these three core mechanisms transforms the key testing steps (positioning, pressing, and loop construction) that originally relied on manual skills and experience into a process completed automatically or semi-automatically by precision mechanical structures. Through the aforementioned structured collaborative work, the inherent defects of existing manual testing methods, such as low efficiency, poor consistency, low accuracy, poor repeatability, and fragility, are effectively overcome. This greatly improves the operational efficiency and automation of high-speed optical communication product loop impedance testing, significantly improves the stability and consistency of test contacts, ensures high accuracy and high repeatability of measurement results, and reduces the skill requirements for operators and the risk of product damage, making it particularly suitable for high-precision testing needs on mass production lines. Attached Figure Description
[0040] Figure 1 This is a front view of the loop impedance testing device for the high-speed optical communication product provided in Embodiment 1 of this application;
[0041] Figure 2 This is a side view of the loop impedance testing device for the high-speed optical transmission product provided in Embodiment 1 of this application;
[0042] Figure 3 This is a rear perspective view of the loop impedance testing device for the high-speed optical communication product provided in the embodiments of this application;
[0043] Figure 4This is a top view of the sliding platform mechanism, pressure plate, and adapter plate docking module provided in Embodiment 1 of this application;
[0044] Figure 5 This is a top view of the sliding platform mechanism, the product under test, and the adapter plate docking module provided in Embodiment 1 of this application;
[0045] Figure 6 This is a top view of the sliding platform mechanism and the adapter plate docking module provided in Embodiment 1 of this application;
[0046] Figure 7 This is a front view of the sliding platform mechanism and the adapter plate docking module provided in Embodiment 1 of this application;
[0047] Figure 8 This is a perspective view of the sliding platform mechanism and the adapter plate docking module provided in Embodiment 1 of this application;
[0048] Figure 9 This is a cross-sectional view of the sliding stage mechanism, the product under test, and the adapter board docking module provided in Embodiment 1 of this application at the signal adapter board;
[0049] Figure 10 This is a perspective view of the mechanical error-proofing support structure provided in Embodiment 1 of this application;
[0050] Figure 11 This is a top view of the slide rail assembly, locking assembly, and cable chain provided in Embodiment 1 of this application;
[0051] Figure 12 This is a perspective view of the locking component in the separated state provided in Embodiment 1 of this application;
[0052] Figure 13 This is a cross-sectional view of the sliding platform mechanism and pressure plate provided in Embodiment 1 of this application at one of the first limiting posts;
[0053] Figure 14 This is a schematic diagram of the loop impedance testing device provided in Embodiment 1 of this application when the product under test is not placed inside;
[0054] Figure 15 This is a schematic diagram of the state of the loop impedance testing device provided in Embodiment 1 of this application when the product under test is placed inside;
[0055] Figure 16 This is a schematic diagram showing the state of the loop impedance testing device provided in Embodiment 1 of this application when it is inserted into the adapter plate docking module;
[0056] Figure 17 This is a schematic diagram of the state of the loop impedance testing device provided in Embodiment 1 of this application when it is pushed into the differential platform mechanism;
[0057] Figure 18 This is a schematic diagram of the state of the loop impedance testing device provided in Embodiment 1 of this application when the pressure bar just touches the product under test;
[0058] Figure 19 This is a schematic diagram of the state of the loop impedance testing device provided in Embodiment 1 of this application when the pressure plate is fully depressed;
[0059] Figure label:
[0060] 100. Abutment;
[0061] 200. Sliding platform mechanism;
[0062] 210. Probe positioning base; 211. Positioning nest; 212. First guide rod; 213. Clearance opening; 214. Positioning block; 215. Positioning post;
[0063] 220. Linear sliding base; 221. Test probe assembly; 222. First limiting post; 223. First sleeve; 224. Push-pull platform; 225. Slide rail assembly; 226. Cable chain; 227. Locking assembly; 228. Second sleeve;
[0064] 300. Vertical pressing mechanism;
[0065] 310. Pressure plate; 311. Pressure bar; 312. Support pin; 313. Second limiting post; 314. Third limiting post; 315. Second guide rod; 316. Flange bearing;
[0066] 320. Compression drive source;
[0067] 330. Fixture; 331. Guide post;
[0068] 400. Adapter board docking module; 410. Signal adapter board;
[0069] 500. Product under test; 510. Board body; 520. Connector interface;
[0070] 600. Mechanical error-proof support structure; 610. Positioning groove; 620. Positioning crossbeam;
[0071] 700. Support spring. Detailed Implementation
[0072] Preferred embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present invention will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art.
[0073] Example 1
[0074] like Figures 1 to 19 As shown, this embodiment provides a loop impedance testing device for high-speed optical communication products, such as... Figures 1 to 3 The loop impedance testing device for the high-speed optical communication product shown includes a base 100, a sliding stage mechanism 200, a vertical pressing mechanism 300, and an adapter plate docking module 400.
[0075] The base 100 is the fundamental support structure of the entire device, typically made of metal to ensure sufficient rigidity and stability. The base 100 internally houses electronic components such as the power module that supplies power to the device, and control circuit boards for signal processing and control logic. The front panel of the base 100 features an operation panel, including a main power switch with indicator lights, a start button for initiating the test process, and PASS (green) and FAIL (red) status indicator lights to indicate whether the test results are passed or failed. The upper surface of the base 100 is fitted with the guide rails of the sliding stage mechanism 200 and the support frame of the vertical pressing mechanism 300.
[0076] The sliding stage mechanism 200 is used to support the high-speed optical communication product under test and can move smoothly and precisely in a straight line between the loading / unloading station (in front of the operator) and the testing station (below the vertical pressing mechanism 300). Figures 4 to 13 As shown, the mechanism mainly consists of the following components:
[0077] 1. Linear Sliding Assembly: This assembly includes two parallel, high-precision linear guide rails fixed to the upper surface of the base 100, and a slider mounted on the guide rails. This assembly ensures the linearity and low friction of subsequent component movements. A locking assembly 227 is also provided to reliably secure the sliding stage when it reaches the test position, preventing displacement during testing.
[0078] 2. Linear Sliding Base 220: The main moving platform mounted on the aforementioned slider, comprising a push-pull platform 224 for easy operation and a handle. A test probe array 221 is mounted and fixed within a specific area of this linear sliding base 220. The test probe array 221 consists of multiple precision spring probes, i.e., Pogo Pins, with the probe tips facing upwards. The signal cable connecting the test probe array 221 converges at the bottom of the linear sliding base 220 and is led out via a cable chain 226.
[0079] 3. Probe positioning base 210: Located above the linear sliding base 220. Its upper surface is precisely machined with a positioning nest 211 according to the three-dimensional shape of the product under test 500. The positioning nest 211 contains a positioning block 214 (adapted to the product's outline) and / or a positioning post 215 (inserted into the positioning hole on the product plate 510) to place and constrain the product under test 500 with extremely high precision in the horizontal and vertical directions. The bottom of the probe positioning base 210 has a through hole, allowing the test probe assembly 221 below to pass through and contact the bottom test point of the product under test 500 placed in the positioning nest 211.
[0080] 4. Floating and Guiding Mechanism: The probe positioning base 210 is not rigidly fixed to the linear sliding base 220, but is connected by several support springs 700, with both ends of the springs abutting against the probe positioning base 210 and the linear sliding base 220 respectively. Simultaneously, the vertical movement range of the probe positioning base 210 relative to the linear sliding base 220 is guided and limited by a first limiting post 222 (passing upwards from the linear sliding base 220 through the probe positioning base 210) and / or a first guide rod 212 / sleeve engagement structure. This "floating" design allows the probe positioning base 210 to sink a small distance when subjected to downward pressure, using the elasticity of the springs to compensate for minor differences in product or installation flatness, ensuring uniform contact pressure for all probes.
[0081] 5. Cable Carrier 226: One end connects to the linear sliding base 220, and the other end connects to the fixed part of the base 100. Internal wiring connects the test probe group 221 to the interface circuit board inside the base 100 (or leads directly to the outside) to protect the signal cable from damage during sliding and ensure stable signal transmission.
[0082] The vertical pressing mechanism 300 is fixedly mounted on the base 100, located directly above the test position of the sliding stage mechanism 200. Its function is to apply stable and repeatable vertical downward pressure, pressing the product under test 500 placed on the probe positioning base 210 against the downward-extending test probe assembly 221, establishing reliable electrical contact. Figure 3 Figure 4 As shown, the organization mainly includes:
[0083] 1. Fixing frame 330: It is firmly mounted on the base 100 and serves as the support frame for the entire pressing mechanism.
[0084] 2. Guiding mechanism: including two or more high-precision guide columns 331 vertically installed between the fixed frame 330 and the base 100.
[0085] 3. Pressure Plate 310: Guided by the guide post 331 (through the flange bearing 316 mounted on the pressure plate 310 and engaging with the guide post 331), the pressure plate 310 can precisely move vertically up and down. The lower surface of the pressure plate 310 is equipped with a pressure head structure as needed, including a support pin 312 for stabilizing the product during pressing and a pressure bar 311 for applying the main pressure in the final pressed state. The shape and position of the pressure bar 311 are carefully designed to apply pressure evenly and avoid sensitive areas of the product. The pressure plate 310 is also provided with a second limiting post 313 and a third limiting post 314 to limit its vertical travel.
[0086] 4. Clamping Drive Source 320: In this embodiment, a manual toggle clamp (quick clamp) is used and mounted on the mounting bracket 330. The output end (push rod) of the clamp is fixedly connected to the pressure plate 310 via a connector. When the operator pulls the clamp handle, the lever and toggle principle can quickly and effortlessly generate a strong and stable vertical downward pressure to lock the pressure plate 310 in the clamping position; the reverse operation quickly releases the pressure and lifts the pressure plate 310.
[0087] The adapter board docking module 400 is used in conjunction with the test probe group 221 to form a specific circuit under test. For example... Figure 9 and Figure 10 As shown, it mainly includes:
[0088] 1. Module body: Structural components designed for easy hand-holding and plugging / unplugging.
[0089] 2. Signal Adapter Board 410: Mounted and fixed on the module body. This adapter board is designed according to test requirements and may include internal jumpers (forming a loopback) or specific lead-out circuitry. One end has a connector designed to precisely insert into the high-speed connector interface 520 (e.g., an optical module slot) on the product under test 500.
[0090] 3. Mechanical anti-foolproof support structure 600: On the interface between the adapter plate docking module 400 and the probe positioning base 210, there are mutually cooperating positioning grooves 610 and positioning protrusions (or crossbeams). This asymmetrical design ensures that the adapter plate docking module 400 can only be inserted into and dock with the probe positioning base 210 in the only correct direction, preventing reverse insertion or misalignment.
[0091] The working process and testing scheme of the loop impedance testing device in this embodiment are as follows:
[0092] 1. Preparation: The operator connects the device and supporting testing instruments (VNA / TDR), and the control computer to the power supply. The main power switch on the base 100 is turned on, and the device is in standby mode. The sliding platform mechanism 200 is in the pulled-out loading / unloading position, as shown below. Figure 14 As shown.
[0093] 2. Manual Product Placement: The operator carefully places the high-speed optical communication product to be tested (e.g., a PCB board with connector interface 520) into the positioning nest 211 of the probe positioning base 210 on the sliding stage mechanism 200, ensuring that it is precisely constrained by the positioning block 214 and / or positioning post 215. Figure 15 As shown.
[0094] 3. Connecting the adapter board: The operator picks up the adapter board and connects the module 400. Utilizing the mechanical anti-foolproof structure between the adapter board and the probe positioning base 210 (groove aligned with the protrusion / beam), the module is inserted into place, ensuring that the connection end of the signal adapter board 410 is accurately inserted into the connector interface 520 of the product under test 500. Figure 16 As shown.
[0095] 4. Pushing in and locking: The operator grasps the handle of the sliding stage mechanism 200, smoothly pushes it along the linear guide rail to the test station, and locks it using the locking component 227. Figure 17 As shown.
[0096] 5. Manually press down the quick clamp: The operator pulls down the manual toggle clamp handle on the vertical pressing mechanism 300. The pressure plate 310 descends smoothly under the guidance of the guide post 331. The support pin 312 at its bottom first contacts and stabilizes the product 500 to be tested. Then, the pressure bar 311 applies the main pressure, such as... Figure 18 As shown, the product under test 500 is pressed down, causing the probe positioning base 210 to sink against the spring force. The test point at its bottom eventually establishes stable and uniform contact with all corresponding probes of the test probe group 221 extending from the linear sliding base 220. The clamp reaches the locked position, maintaining pressure, as... Figure 19 As shown.
[0097] 6. Automatic Test Start: After the pressure is fully engaged (either detected by a sensor or triggered by the operator pressing the start button), the device sends a start signal to the control computer via an interface. Upon receiving the signal, the test software program on the control computer automatically controls the test instrument (VNA / TDR) to send a test signal to the test probe group 221 via the cable connected by the cable chain 226. The signal flows through the probes, a specific internal loop of the product under test 500 (including the loopback or lead-out path formed through the signal adapter board 410), and returns from other probes. The test instrument measures and collects relevant data such as the loop impedance.
[0098] 7. Result Judgment and Display: The testing instrument sends the measurement data to the control computer. The testing software program compares the data with the preset standard and determines the test result as PASS or FAIL. The software program then controls the PASS or FAIL indicator light on the base station 100 operation panel to light up accordingly.
[0099] 8. Waiting for the indicator light to illuminate: The operator observes the indicator light to understand the test results.
[0100] 9. Manual Product Removal: The operator reverses the manual toggle clamp handle to release pressure, raising the pressure plate 310. Grasp the handle to pull out the sliding platform mechanism 200, unlocking the locking component 227, and move the sliding platform mechanism 200 to the loading / unloading station. First, disconnect the adapter plate docking module 400, then remove the tested product from the positioning nest 211.
[0101] 10. Test complete: One test cycle is over, and you can prepare to test the next product.
[0102] The loop impedance testing device provided in this embodiment utilizes a sliding platform mechanism 200 with a precision positioning nest 211 and smooth linear sliding components to achieve rapid loading and unloading of the product under test 500 relative to the test probe assembly 221, as well as highly accurate and repeatable positioning, significantly improving operational efficiency. The vertical pressing mechanism 300, driven by a manual toggle clamp and precisely guided by a guide post 331, replaces uncertain manual pressing force, ensuring stable, consistent, and repeatable pressure applied to the product under test 500. Combined with the spring-floating structure between the probe positioning base 210 and the linear sliding base 220, it effectively compensates for minor flatness differences, ensuring uniform contact pressure across all probes and measurement stability. The adapter plate docking module 400 with a mechanically foolproof structure ensures rapid and error-free docking of the test loop auxiliary components, eliminating the risk of test failure or damage due to incorrect insertion. The synergy of these structures transforms the originally inefficient and unreliable manual testing process into a highly efficient, accurate, stable, repeatable, and less demanding semi-automated testing solution that is safer for products and requires less operator skill. It is particularly suitable for the high-precision quality control needs of mass production lines for high-speed optical communication products.
[0103] Example 2
[0104] This embodiment discloses the structure and operation of another loop impedance testing device for high-speed optical communication products. The testing device in this embodiment mainly includes a base 100, a sliding stage mechanism 200, a vertical pressing mechanism 300, and an adapter plate docking module 400.
[0105] The base is cast or welded from high-strength alloy materials, providing a stable and vibration-resistant mounting platform for the entire device. The base integrates a power conversion unit, a pneumatic control unit (including solenoid valve assemblies, air pressure regulating valves, etc.), and an interface control board for communication with the control computer. An embedded touchscreen interface is located in the front operating area of the base, replacing physical buttons and indicator lights. It displays equipment status, test progress, and test results (PASS / FAIL), and provides virtual operation buttons for start, stop, and reset.
[0106] The sliding stage mechanism 200 is used to precisely support the product 500 under test and to achieve linear reciprocating movement between a convenient loading / unloading area and the internal testing area. The sliding stage mechanism 200 in this embodiment has the following structure:
[0107] 1. Linear Sliding Assembly: Two parallel, heavy-duty ball linear guides are securely mounted on designated tracks on the equipment base, in conjunction with corresponding precision sliders. This combination provides extremely high motion accuracy, load-bearing capacity, and service life. The following loading platform is fixedly mounted on the slider. A pneumatic locking pin is provided, which automatically extends upon command from the control system to precisely lock the sliding platform in the test position.
[0108] 2. Loading Platform: In this embodiment, the functions of carrying the product under test 500 and installing the test probe are combined into a rigid loading platform, which is directly fixed to the aforementioned slider. The upper surface of the loading platform is formed into an integrated positioning nest 211 through precision CNC machining. Its complex geometry perfectly matches the bottom and side contours of the product under test 500, achieving high-precision three-dimensional positioning.
[0109] 3. High-stroke conformance probe assembly: The test probe assembly 221 is directly mounted and fixed in the bottom opening area of the platform. The probe tip extends upward through the surface of the platform to reach the bottom of the positioning nest 211. Since the platform is rigid, this embodiment uses special test probes with a large working stroke and built-in high conformance elasticity. The elastic deformation range of these probes is sufficient to compensate for possible flatness tolerances and installation height differences in the product under test 500, ensuring that all probes achieve appropriate contact pressure after pressing.
[0110] 4. The flexible cable management system adopts an energy chain, with one end connected to the bottom of the platform and the other end connected to the signal transfer area inside the equipment base, protecting the high-frequency coaxial cable or other signal harnesses of the connecting probe group from damage during the reciprocating motion of the platform.
[0111] The vertical pressing mechanism 300 is fixed on the equipment base and located directly above the testing station, and includes the following structure:
[0112] 1. The gantry-type support frame, consisting of columns and beams forming a robust gantry structure, ensures extremely high rigidity and provides stable support for precision pressing.
[0113] 2. Precision guiding system: Four large-diameter precision guide optical shafts are vertically mounted on the support frame, and together with the self-lubricating linear bearings mounted on the movable pressure plate 310, they form a high-precision vertical guiding system to ensure the absolute parallelism and stability of the movement of the pressure plate 310.
[0114] 3. The movable pressure plate 310 rises and falls under the guidance of the guide system. Its lower surface is designed as an integral elastic pressure head. This pressure head is made of conductive silicone or custom polyurethane material with specific hardness and resilience. Its contact surface shape is optimized so that it can cover and press a large area evenly on the top non-sensitive area of the product under test 500 when pressed down, and the elasticity of the material itself ensures uniform pressure distribution.
[0115] 4. A servo electric cylinder serves as the drive source. It is vertically mounted at the center of the top crossbeam of the gantry frame, and its output ball screw directly drives the movable pressure plate 310 for precise lifting and lowering movements. The servo motor is controlled by a dedicated driver that receives commands from the control computer.
[0116] Servo electric cylinders can achieve precise closed-loop control of pressing speed, position, and pressure. The precise pressing target position (contact point), final pressing position (stroke), and maximum allowable pressure can be set in the software to achieve a very fine and repeatable pressing process, and pressure changes can be monitored in real time.
[0117] The plug-in adapter module is a vertical plug-in docking module. This module includes a handle and a slot for mounting the signal adapter board 410. The plug-in docking module docks with the platform via a miniature dovetail guide rail. Matching guide rail structures are machined onto the module and the platform. Asymmetrical protrusions and grooves are provided at the entrance or side of the guide rail as mechanical error-proofing features, ensuring that the module can only slide in along the guide rail in the single correct direction, ultimately allowing the signal adapter board 410 to be precisely aligned and inserted into the connector interface 520 of the product under test 500.
[0118] The working process and testing scheme of the loop impedance testing device in this embodiment are as follows:
[0119] 1. Preparation: The operator turns on the equipment power and initializes the device through the touch screen interface on the base. The control computer loads the test program, and the test instrument warms up and stands ready. The sliding platform automatically moves to the loading and unloading station.
[0120] 2. Product placement: The operator places the product to be tested 500 into the precision positioning nest 211 on the loading platform.
[0121] 3. Inserting the adapter module: The operator slides the plug-in adapter module along the guide rail on the platform. The foolproof structure ensures the correct orientation until the signal adapter board 410 is fully inserted into the board-side connector of the product under test 500.
[0122] 4. Start the cycle: The operator clicks the "Start Cycle" virtual button on the touch screen.
[0123] 5. Automatic Feeding and Locking: The control system commands the linear sliding component to drive the platform to the testing station automatically, quickly, and smoothly. Upon arrival, the pneumatic locking pin automatically extends to lock the platform.
[0124] 6. Automatic Pressing: The control system activates the servo electric cylinder based on preset parameters (speed, target position, pressure threshold). The movable pressure plate 310 descends precisely under the guidance of the guide system, and its elastic pressure head at the bottom evenly contacts and presses against the product under test 500, establishing reliable contact between the test point on the bottom of the product and the high-stroke probe assembly below. The servo system monitors the pressure and position in real time, stopping and maintaining the position once the set conditions are met.
[0125] 7. Automatic Testing: After the pressing is stable, the control system triggers the control computer to execute the test program. The computer controls the testing instrument to measure the loop impedance and collect data.
[0126] 8. Result Judgment and Display: The computer analyzes the data, determines PASS / FAIL, and displays the result prominently on the touch screen interface, while also saving the result to the log.
[0127] 9. Automatic Release and Retraction: After the test is completed, the control system instructs the servo electric cylinder to run in reverse, and the movable pressure plate 310 is quickly lifted. Subsequently, the pneumatic locking pin retracts, and the linear sliding assembly drives the loading platform to automatically return to the loading and unloading station.
[0128] 10. Remove product and module: The operator slides the plug-in adapter module off the guide rail and then removes the tested product from the positioning nest 211.
[0129] 11. Cycle complete: The device is ready to test the next product.
[0130] This embodiment provides a loop impedance testing device for high-speed optical communication products. By employing different technical means such as a rigid loading platform combined with a high-stroke probe, a servo electric cylinder for precise control of pressing, and a plug-in docking module, it is also possible to achieve high-precision and automated testing of the loop impedance of high-speed optical communication products, and provides more precise motion and pressure control capabilities.
[0131] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps set forth in these embodiments do not limit the scope of this application. Any specific values in all examples shown and discussed herein should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.
[0132] Furthermore, it should be noted that the use of terms such as "first" and "second" is merely for ease of distinction, and unless otherwise stated, these terms have no special meaning and therefore should not be construed as limiting the scope of protection of this application.
[0133] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A loop impedance testing device for high-speed optical communication products, characterized in that, include: abutment(100); A sliding stage mechanism (200) is disposed on the base (100) for carrying the product under test (500) and moving between the loading / unloading station and the testing station. The sliding stage mechanism (200) includes a probe positioning base (210) and a linear sliding base (220). The upper surface of the probe positioning base (210) is provided with a positioning nest (211) for placing and positioning the product under test (500). The linear sliding base (220) connects the probe positioning base (210) and the base (100). The linear sliding base (220) is provided with a test probe group (221) for contacting the test point at the bottom of the product under test (500). The test probe group (221) passes through the probe positioning base (210). A vertical pressing mechanism (300) is fixedly mounted on the base (100) and located above the test station. It is used to apply downward pressure to press the product under test (500) against the test probe group (221). The vertical pressing mechanism (300) includes a pressure plate (310) and a pressing drive source (320). The pressure plate (310) is arranged parallel to the probe positioning base (210) above it. The pressing drive source (320) is used to drive the pressure plate (310) to reciprocate in the vertical direction. The adapter board docking module (400) is equipped with a signal adapter board (410) for use with the test probe group (221) to form a circuit under test. The product under test (500) includes a board body (510) and a connector interface (520) fixed on the board body (510). The signal adapter board (410) is used to dock with the connector interface (520). The interface between the adapter board docking module (400) and the probe positioning base (210) is provided with a mechanically anti-foolproof support structure (600) that cooperates with each other.
2. The loop impedance testing device for high-speed optical communication products according to claim 1, characterized in that, The mechanical error-proof support structure (600) includes: A positioning groove (610) is provided on the docking interface of one of the adapter plate docking module (400) and the probe positioning base (210), and a positioning protrusion or positioning beam (620) that matches the shape of the positioning groove (610) is provided at the corresponding position on the docking interface of the other.
3. The loop impedance testing device for high-speed optical communication products according to claim 2, characterized in that, The two sides of the same area of the plate (510) are symmetrically provided with two sets of connector interfaces (520); The adapter board docking module (400) includes two signal adapter boards (410) arranged in parallel to each other and a positioning groove (610) provided between the two signal adapter boards (410); The probe positioning base (210) is provided with a positioning beam (620), the position of which corresponds to the position of the plate (510) of the product under test (500) placed on the probe positioning base (210).
4. The loop impedance testing device for high-speed optical transmission products according to claim 1, characterized in that, A plurality of support springs (700) are provided between the probe positioning base (210) and the linear sliding base (220), and the two ends of the support springs (700) respectively abut against the probe positioning base (210) and the linear sliding base (220); The linear sliding base (220) is fixed with a plurality of first limiting posts (222) arranged in the vertical direction. The first limiting posts (222) pass through the probe positioning base (210). The first limiting posts (222) are used to guide the relative movement of the linear sliding base (220) and the probe positioning base (210), and / or to limit the relative movement range of the linear sliding base (220) and the probe positioning base (210). The probe positioning base (210) is provided with a first guide rod (212) in the vertical direction, and the linear sliding base (220) is provided with a first sleeve (223) that cooperates with the first guide rod (212). The first guide rod (212) and the first sleeve (223) are slidably engaged, and the first guide rod (212) and the first sleeve (223) are used to guide the relative movement of the linear sliding base (220) and the probe positioning base (210).
5. The loop impedance testing device for high-speed optical transmission products according to claim 1, characterized in that, The lower surface of the pressure plate (310) is provided with a plurality of pressure bars (311) and a plurality of support pins (312) in the vertical direction. The support pins (312) are used to keep the product under test (500) stable during the pressing process, and the pressure bars (311) are used to keep the product under test (500) stable in the pressed state.
6. The loop impedance testing device for high-speed optical communication products according to claim 1, characterized in that, The lower surface of the pressure plate (310) is provided with a plurality of second limiting posts (313) and a plurality of third limiting posts (314) in the vertical direction. The second limiting posts (313) are used to limit the relative movement range between the pressure plate (310) and the probe positioning base (210), and the third limiting posts (314) are used to limit the relative movement range between the pressure plate (310) and the base (100).
7. The loop impedance testing device for high-speed optical transmission products according to claim 1, characterized in that, The linear sliding base (220) includes a push-pull platform (224) and a slide rail assembly (225) disposed at the bottom of the push-pull platform (224); A drag chain (226) is provided below the push-pull platform (224). One end of the drag chain (226) is connected to the linear sliding base (220), and the other end is connected to the base (100). The drag chain (226) is used to accommodate and protect the cable between the linear sliding base (220) and the base (100). A locking component (227) is provided between the linear sliding base (220) and the base (100), and the locking component (227) is used to restrict the relative movement between the linear sliding base (220) and the base (100).
8. The loop impedance testing device for high-speed optical communication products according to claim 1, characterized in that, The lower surface of the pressure plate (310) is provided with a plurality of second guide rods (315) in the vertical direction. The linear sliding base (220) is provided with a second sleeve (228) that cooperates with the second guide rods (315). The second guide rods (315) and the second sleeve (228) are slidably engaged. The second guide rods (315) and the second sleeve (228) are used to guide the relative movement of the pressure plate (310) and the linear sliding base (220). The probe positioning base (210) is provided with a clearance opening (213) for the passage of the second guide rods (315).
9. The loop impedance testing device for high-speed optical transmission products according to claim 1, characterized in that, The probe positioning base (210) is provided with a plurality of positioning blocks (214), and the positioning blocks (214) are set according to the three-dimensional contour of the product to be tested (500); The positioning nest (211) is provided with a plurality of positioning posts (215), which are set with corresponding openings on the plate (510) of the product under test (500) to constrain and position the product under test (500).
10. The loop impedance testing device for high-speed optical transmission products according to claim 1, characterized in that, The vertical pressing mechanism (300) also includes a fixed frame (330), and a plurality of guide columns (331) are provided between the fixed frame (330) and the base (100). The pressure plate (310) is provided with a flange bearing (316) that slides with the guide columns (331). The clamping drive source (320) is a manual toggle clamp, which is mounted on the fixed frame (330), and the output end of the manual toggle clamp is fixedly connected to the pressure plate (310).