Display module and display device

Abstract

The utility model discloses a display module and display device. One embodiment of the display module includes: a first substrate, the first substrate includes oppositely arranged first surface and second surface, an electrostatic discharge layer on the second surface, and a drive circuit board, wherein the drive circuit board includes a first binding part and a second binding part, the first binding part is bound to the first surface, and the second binding part is attached to the surface of the electrostatic discharge layer away from the first substrate. The display module of the utility model sets up the electrostatic discharge layer on the second surface of the first substrate, and the structure of the drive circuit board is designed, the static electricity generated on the surface of the first substrate is conducted to the electrostatic discharge layer, the static electricity is released through the second binding part from the electrostatic discharge layer to the second binding part, the static electricity is avoided to burn out the drive signal line of the first substrate and cause black screen defect, and the internal voltage of the display module is avoided to be influenced by the static electricity and cause the remaining display abnormality and other defects.

Description

Technical Field

[0001] This utility model relates to the field of display technology. More specifically, it relates to a display module and a display device. Background Technology

[0002] In related technologies, large-size displays and narrow-bezel displays are the main products. These types of displays are prone to display defects such as black screens during ESD (electrostatic discharge) testing. Utility Model Content

[0003] The purpose of this utility model is to provide a display module and a display device to solve at least one of the problems existing in the prior art.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] The first aspect of this utility model provides a display module, the display module comprising:

[0006] A first substrate, the first substrate including a first surface and a second surface disposed opposite to each other;

[0007] An electrostatic discharge layer located on the second surface; and

[0008] A driving circuit board, wherein the driving circuit board includes:

[0009] The first binding part is bound to the first surface;

[0010] The second bonding portion is attached to the surface of the electrostatic discharge layer on the side away from the first substrate.

[0011] In an optional embodiment, the first substrate includes:

[0012] The first bonding point is located on the first surface and is electrically connected to the first bonding part; and

[0013] The second bonding point is located on the second surface and is attached to the surface of the electrostatic discharge layer near the first substrate.

[0014] In an optional embodiment, the first substrate further includes a drive signal line connected to the first bonding point;

[0015] The drive circuit board includes a ground wire connected to the second bonding point and a connection signal line connected to the first bonding point.

[0016] In an optional embodiment, the driving circuit board further includes a main body portion, the main body portion facing the first substrate in a first direction.

[0017] The first binding portion protrudes from the edge of the main body portion and extends along the first direction;

[0018] The second binding part protrudes from the edge of the main body where the first binding part is located and extends along the first direction;

[0019] The length of the second binding part in the first direction is greater than the length of the first binding part in the first direction.

[0020] In an optional embodiment, the main body includes:

[0021] A substrate layer, the substrate layer including a third surface and a fourth surface disposed opposite to each other;

[0022] The first conductive layer is located on the third surface;

[0023] A first adhesive layer located on the side of the first conductive layer away from the substrate layer;

[0024] A first protective layer located on the side of the first adhesive layer away from the substrate layer;

[0025] The second conductive layer is located on the fourth surface;

[0026] The second adhesive layer is located on the side of the second conductive layer away from the substrate layer; and

[0027] A second protective layer located on the side of the second adhesive layer away from the substrate layer.

[0028] In an optional embodiment, the substrate layer extends to the second bonding portion, and at the location of the second bonding portion, the third surface is closer to the first substrate than the fourth surface;

[0029] The second binding part includes:

[0030] A third conductive layer is located on the third surface, and the third conductive layer is disposed in the same layer as the first conductive layer;

[0031] The third conductive layer is attached to the surface of the electrostatic discharge layer on the side away from the first substrate.

[0032] In an optional embodiment, the display module further includes a conductive adhesive layer.

[0033] The orthographic projection of the conductive adhesive layer onto the first substrate covers the overlapping area of ​​the second bonding portion and the electrostatic discharge layer onto the first substrate.

[0034] The conductive adhesive layer is located between the surface of the electrostatic discharge layer away from the first substrate and the surface of the third conductive layer close to the electrostatic discharge layer.

[0035] In an optional embodiment, the display module further includes:

[0036] A first polarizer is located on the side of the electrostatic discharge layer away from the second surface. The orthographic projection of the first polarizer onto the first substrate falls within the first substrate. The edge of the first substrate and the driving circuit board bonded together protrudes from the first polarizer.

[0037] A backlight source located on the side of the first polarizer away from the second surface, the orthogonal projection of the backlight source onto the first substrate covers the first substrate;

[0038] The conductive adhesive layer is spaced from the edge of the first polarizer near the second bonding portion.

[0039] The distance between the surface of the backlight source near the first substrate and the surface of the electrostatic discharge layer away from the first substrate is greater than the thickness of the second bonding portion.

[0040] The second aspect of this utility model provides a display device, including the display module described in the first aspect of this utility model.

[0041] The beneficial effects of this utility model are as follows:

[0042] The display module of this utility model has an electrostatic discharge layer disposed on the second surface of the first substrate, and the structure of the driving circuit board is designed. The first bonding part is bonded to the first surface of the first substrate to drive the first substrate, and the second bonding part is attached to the electrostatic discharge layer to release the static electricity on the entire surface of the first substrate. Based on this configuration, the static electricity generated on the surface of the first substrate is conducted to the electrostatic discharge layer, and then conducted to the second bonding part to release the static electricity. This avoids the electrostatic discharge burning the driving signal line of the first substrate, which would cause a black screen, and also avoids the electrostatic discharge affecting the internal voltage of the display module, which would cause other display abnormalities, thus improving display stability. Attached Figure Description

[0043] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings.

[0044] Figure 1 This diagram shows a structural schematic of a display module according to an embodiment of the present invention;

[0045] Figure 2 Show Figure 1 An enlarged schematic diagram of the bonding position of the first substrate is shown;

[0046] Figure 3 A top view of one side of the first surface of the first substrate is shown;

[0047] Figure 4 A schematic diagram of the conductive adhesive layer on one side of the second surface is shown;

[0048] Figure 5 and Figure 6 A schematic diagram showing the electrostatic discharge path of the display module according to this utility model is shown;

[0049] Figure 7 This diagram shows the structure of the drive circuit board according to an embodiment of the present invention;

[0050] Figure 8 Show Figure 7 A schematic diagram of the layer structure of the drive circuit board at the cross-section location. Detailed Implementation

[0051] To more clearly illustrate this utility model, the following description, in conjunction with embodiments and accompanying drawings, further explains the present utility model. Similar components in the drawings are indicated by the same reference numerals. Those skilled in the art should understand that the specific description below is illustrative rather than restrictive and should not be construed as limiting the scope of protection of this utility model.

[0052] In related technologies, large-size displays and narrow-bezel displays are the main products. These types of displays are prone to display defects such as black screens during ESD (electrostatic discharge) testing.

[0053] Through research and testing of defective products, the inventors discovered that display malfunctions such as black screens were related to excessive static electricity inside and on the surface of the display module. The narrow bezel structure of the display product resulted in less space for internal metal traces, leaving insufficient space for a ground wire to effectively release static electricity. Therefore, during ESD testing, static electricity could easily travel along the metal traces into the display module, burning out the circuitry and causing a black screen. Alternatively, static electricity could affect the internal voltage of the display module, leading to display abnormalities.

[0054] To address display abnormalities in the display module caused by electrostatic discharge, the following improvement solutions are proposed:

[0055] (1) The light-shielding adhesive uses conductive materials, but because the substrate is conductive, the adhesion between the adhesive layer and the substrate is weak, and the adhesive layer is prone to separation. Also, the substrate of the conductive light-shielding tape is prone to burrs and unevenness when cut, resulting in a high defect rate. In addition, the material cost is high, so it is not suitable for mass production.

[0056] (2) The backlight and back panel are integrated, but this design is not suitable for narrow bezel and ultra-thin display module designs.

[0057] (3) The product is protected by adhesive around it, but there is no dedicated equipment for this purpose, and the adhesive application efficiency is low, making it unsuitable for mass production.

[0058] Therefore, in the improvement scheme of electrostatic discharge of narrow bezel display products, a display module and display device need to be designed to improve at least one of the above problems.

[0059] The first embodiment of this utility model proposes a display module, such as... Figure 1 As shown, the display module includes:

[0060] The first substrate 10 includes a first surface 10A and a second surface 10B disposed opposite to each other. In this embodiment, the first surface 10A is a light-emitting surface and the second surface 10B is a non-light-emitting surface. The first substrate 10 in this embodiment is a TFT driving substrate.

[0061] An electrostatic discharge layer 20 is located on the second surface 10B. The electrostatic discharge layer 20 is used to conduct static electricity generated by the first substrate 10. In this embodiment, the electrostatic discharge layer 20 has the same area as the second surface 10B, achieving full-surface electrostatic discharge; and

[0062] The driving circuit board 30 includes a first bonding portion 31 and a second bonding portion 32. The first bonding portion 31 is bonded to the first surface 10A, and the second bonding portion 32 is attached to the surface of the electrostatic discharge layer 20 away from the first substrate 10. The second bonding portion 32 is used to release the static electricity conducted by the electrostatic discharge layer 20 from the first substrate 10.

[0063] The display module of this utility model is provided with an electrostatic discharge layer 20 on the second surface 10B of the first substrate 10, and the structure of the driving circuit board 30 is designed. The first bonding part 31 is bonded to the first surface 10A of the first substrate 10 to drive the first substrate 10. The second bonding part 32 is attached to the electrostatic discharge layer 20 to release the static electricity on the entire surface of the first substrate 10. Based on this setting, the static electricity generated on the surface of the first substrate 10 is conducted to the electrostatic discharge layer 20, and then conducted to the second bonding part 32 to release the static electricity. This avoids the static electricity burning the driving signal line of the first substrate 10, which would cause a black screen, and also avoids the static electricity affecting the internal voltage of the display module, which would cause other display abnormalities, thus improving display stability.

[0064] In this embodiment, the electrostatic discharge layer 20 is a transparent conductive film, preferably an ITO (indium tin oxide) film with a thickness of 50-100nm. The electrostatic discharge layer 20 not only covers the display area of ​​the second surface 10B, but also covers the edge area of ​​the second surface 10B corresponding to the bonding position of the first bonding part 31, so as to realize the overall electrostatic discharge of the driving signal line inside the first substrate 10 and the surface of the first substrate 10.

[0065] The driving circuit board 30 in this embodiment is preferably a flexible printed circuit board, possessing flexible and bendable characteristics to adapt to the thin and light design of the module. The driving circuit board 30 includes two functional parts, a first bonding part 31 and a second bonding part 32, which are bonded to the first substrate 10. In an optional embodiment, such as Figure 2 Show Figure 1 This diagram shows an enlarged view of the bonding location of the first substrate 10, which includes:

[0066] like Figure 3 As shown, a first bonding point 11 is located on the first surface 10A, and the first bonding point 11 is electrically connected to the first bonding part 31; and

[0067] like Figure 2 As shown, the second bonding point 12 is located on the second surface 10B, and the second bonding point 12 is attached to the surface of the electrostatic discharge layer 20 near the first substrate 10.

[0068] In this embodiment, the first bonding points 11 are located in the edge region of the first surface 10A and are linearly arranged along the edge extension direction of the edge region, that is, along the second direction. The number of the first bonding points 11 is matched with the number of drive signal lines of the first substrate 10. The first bonding points 11 are made of metal electrodes and are electrically connected to the drive signal lines of the first surface 10A.

[0069] The second bonding point 12 and the first bonding point 11 are located on the same edge of different surfaces. The material of the second bonding point 12 is the same as that of the first bonding point 11, for example, it can also be a metal electrode, used to bond with the surface of the electrostatic discharge layer 20 close to the first substrate 10. The electrostatic discharge layer 20 and the second bonding point 12 are fixed and electrically connected to ensure that static electricity can be conducted from the electrostatic discharge layer 20 to the second bonding point 12, and then discharged through the second bonding part 32.

[0070] In this embodiment, the bonding points of the first substrate 10 are designed to ensure accurate docking between the first bonding part 31 and the drive signal line, thereby reducing signal transmission loss. At the same time, the bonding point 12 is attached to the electrostatic discharge layer 20 to ensure the conduction of the electrostatic discharge path. For example, the area of ​​a single second bonding point 12 is larger than the area of ​​a single first bonding point 11, thereby reducing contact resistance and avoiding poor conduction of the electrostatic discharge path.

[0071] Based on the different bonding points of the first substrate 10 described above, this embodiment further clarifies the different circuit designs of the display module. In an optional embodiment, the first substrate 10 further includes a drive signal line (not shown in the figure), which is connected to the first bonding point 11.

[0072] In an optional embodiment, such as Figure 7 As shown, exemplarily, the drive circuit board 30 includes a ground line 35 connected to the second bonding point 12 and a connection signal line 34 connected to the first bonding point 11. Figure 7 As shown, one end of the ground wire 35 extends to the second bonding portion 32, and one end of the connecting signal line 34 extends to the second bonding portion 31. The driving signal line of the first substrate 10 is electrically connected to the connecting signal line 34 of the driving circuit board 30 through the first bonding point 11, and is used to transmit control signals to control the display module to display the screen.

[0073] Based on the ground line 35 of the driver circuit board 30 combined with the bonding point design of the first substrate 10, this embodiment forms two electrostatic discharge paths, such as... Figure 5 As shown, the first path is the electrostatic discharge path inside the first substrate 10. The ground line 35 of the driving circuit layer forms a conductive electrostatic discharge circuit with the electrostatic discharge layer 20 through the second bonding point 12, which is used to release the static electricity generated by the internal driving signal line, such as... Figure 6 As shown, the second path is the electrostatic discharge path on the surface of the first substrate 10. The electrostatic discharge layer 20 is in direct contact with the surface of the second bonding part 32 to form another electrostatic discharge circuit, which is used to release the static electricity on the surface of the first substrate 10.

[0074] In this embodiment, the drive signal lines include various drive signal lines such as gate drive signal lines, source drive signal lines, timing control signal lines or voltage signal lines. It is worth noting that the drive signal lines do not include ground line 35.

[0075] In other words, the ground wire 35 does not need to be laid inside the first substrate 10 in this embodiment. Based on this setting, the space available for laying drive signal lines inside the first substrate 10 is increased, and the line width of the signal lines does not need to be reduced, which can effectively avoid line breakage under high temperature and high humidity conditions. Furthermore, through optimized line layout, the display module of this embodiment can be applied to ultra-narrow bezel display modules, and the bezel size can be reduced to less than 2.3mm, which has wide adaptability.

[0076] In an optional embodiment, such as Figure 7 As shown, the driving circuit board 30 also includes a main body portion, the main body portion facing the first substrate 10 in a first direction, that is, as... Figure 1 , Figure 3 , Figure 4 and Figure 7 The longitudinal direction shown is the first direction. The main body provides a support base for circuits, etc. The side of the main body near the first substrate 10 is a bonding edge, and the bonding edge is used to extend the first bonding part 31 and the second bonding part 32.

[0077] In this embodiment, the first binding part 31 protrudes from the edge of the main body part along the first direction; the second binding part 32 protrudes from the edge of the main body part where the first binding part 31 is located along the first direction. The first binding part 31 and the second binding part 32 protrude from the same binding edge, which can be formed by a single etching process without additional cutting or bending steps, thereby improving process efficiency and reducing processing costs.

[0078] In this embodiment, the length of the second bonding part 32 in the first direction is greater than the length of the first bonding part 31 in the first direction. The length difference design adapts to the difference in bonding position between the first surface 10A and the second surface 10B of the first substrate 10, thereby improving the assembly yield.

[0079] In an optional embodiment, such as Figure 7 As shown, the first binding part 31 and the second binding part 32 are arranged along a second direction, which is perpendicular to the first direction. Figure 7 The horizontal direction shown is the second direction. The first binding part 31 and the second binding part 32 are spaced apart in the second direction. The connection signal line 34 of the driving circuit board 30 is responsible for transmitting the display driving signal, and the ground line 35 is responsible for releasing static electricity. The two are physically isolated on the driving circuit board 30 to avoid static electricity interference with the driving signal and effectively solve the display flickering and screen distortion problems caused by static electricity.

[0080] In an optional embodiment, such as Figure 8 As shown, the main body 33 includes:

[0081] Substrate layer 331, the substrate layer 331 includes a third surface and a fourth surface disposed opposite to each other;

[0082] The first conductive layer 332 is located on the third surface;

[0083] The first adhesive layer 333 is located on the side of the first conductive layer 332 away from the substrate layer 331;

[0084] A first protective layer 334 is located on the side of the first adhesive layer 333 away from the substrate layer 331;

[0085] The second conductive layer 335 is located on the fourth surface;

[0086] The second adhesive layer 336 is located on the side of the second conductive layer 335 away from the substrate layer 331; and

[0087] A second protective layer 337 is located on the side of the second adhesive layer 336 away from the substrate layer 331.

[0088] The driver circuit board 30 in this embodiment adopts a multi-layer stacked structure to improve mechanical strength, insulation performance, and circuit integration. The specific structure includes:

[0089] The substrate layer 331, which serves as the basic support layer for the drive circuit board 30, is made of polyimide material and possesses properties such as high temperature resistance and bending resistance. Figure 8 The upper surface of the substrate layer 331 shown is the third surface, and the lower surface of the substrate layer 331 is the fourth surface.

[0090] A first conductive layer 332, a first adhesive layer 333, and a first protective layer 334 are sequentially stacked on the third surface. The first conductive layer 332 is made of electrolytic copper foil and is used to arrange the connection signal line 34 and the ground line 35. The first adhesive layer 333 is used to bond the first protective layer 334 and the first conductive layer 332. The first protective layer 334 is attached to the surface of the first conductive layer 332 to protect the first conductive layer 332 from oxidation and scratches.

[0091] On the fourth surface away from the third surface, a second conductive layer 335, a second adhesive layer 336, and a second protective layer 337 are sequentially disposed from the substrate layer 331. The second conductive layer 335 has the same material and thickness as the first conductive layer 332, and a parallel structure is achieved through vias. The second adhesive layer 336 has the same material and thickness as the first adhesive layer 333, and covers the surface of the second conductive layer 335. The second protective layer 337 has the same material and thickness as the first protective layer 334, and the second conductive layer 335 and the second protective layer 337 are bonded together through the second adhesive layer 336, protecting the second conductive layer 335 from oxidation and scratches.

[0092] The multi-layer structure design of the drive circuit board 30 can improve its bending life, while the first protective layer 334 and the second protective layer 337 effectively isolate external moisture and dust, ensuring the overall performance of the drive circuit board 30. The first conductive layer 332 and the second conductive layer 335 can be used to arrange circuits with different functions, optimizing the circuit integration and adapting to the miniaturization requirements of the drive circuit board 30 under narrow bezel conditions.

[0093] like Figure 8 Show Figure 7 A schematic diagram of the cross-section at position AA, in one optional embodiment,

[0094] The substrate layer 331 extends to the second bonding portion 32, and at the location of the second bonding portion 32, the third surface is closer to the first substrate 10 than the fourth surface;

[0095] The second binding part 32 includes:

[0096] A third conductive layer 3321 is located on the third surface, and the third conductive layer 3321 is disposed in the same layer as the first conductive layer 332.

[0097] The third conductive layer 3321 is attached to the surface of the electrostatic discharge layer 20 on the side away from the first substrate 10.

[0098] Based on the layered structure design of the main body 33, this embodiment further clarifies the specific structure of the second binding part 32.

[0099] The substrate layer 331 extends from the main body 33 to the second bonding part 32, forming the load-bearing base layer of the second bonding part 32.

[0100] At the second bonding portion 32, the third surface of the substrate layer 331 faces the first substrate 10, and the fourth surface is away from the first substrate 10, ensuring that the third conductive layer 3321 on the third surface can approach the electrostatic discharge layer 20 without bending the second bonding portion 32.

[0101] The third conductive layer 3321 is disposed on the third surface of the second bonding portion 32 and has the same structure as the first conductive layer 332 of the main body portion 33, that is, it is formed by the same process, thereby simplifying the processing technology.

[0102] The material and thickness of the third conductive layer 3321 are the same as those of the first conductive layer 332. The surface of the third conductive layer 3321 away from the substrate layer 331 is directly attached to the surface of the electrostatic discharge layer 20 away from the first substrate 10 to achieve electrical connection. The direct attachment of the third conductive layer 3321 to the electrostatic discharge layer 20 reduces intermediate connection links and improves the electrostatic discharge speed.

[0103] In a specific example, such as Figure 8 As shown, the second conductive layer 335, the second adhesive layer 336, and the second protective layer 337 at the position of the main body 33 all extend to the second bonding portion 32.

[0104] During the manufacturing process of the drive circuit board 30, the first conductive layer 332 and the third conductive layer 3321 are formed by the same process. The first protective layer 334, the first adhesive layer 333, the first conductive layer 332 (third conductive layer 3321), the substrate layer 331, the second conductive layer 335, the second adhesive layer 336 and the second protective layer 337 are formed at the positions of the first bonding part 31, the second bonding part 32 and the main body part 33. Then, the first protective layer 334 and the second adhesive layer 336 at the position of the second bonding part 32 are peeled off to expose the first conductive layer 332 (third conductive layer 3321), thereby improving the process efficiency.

[0105] In this embodiment, the thickness of the second bonding part 32 is the vertical distance between the surface of the third conductive layer 3321 away from the third surface and the surface of the second protective layer 337 away from the third surface at the corresponding position. That is, the thickness of the second bonding part 32 is less than the thickness of the main body part 33, so as to realize the design of different thicknesses at different positions of the drive circuit board 30. The third conductive layer 3321 of the second bonding part 32 is directly attached to the conductive release layer to form an electrostatic release path.

[0106] In an optional embodiment, such as Figure 2 and Figure 4 As shown, the display module also includes a conductive adhesive layer 40, which is made of ACF (anisotropic conductive film) and has the characteristics of "conductivity in the thickness direction and insulation in the horizontal direction". That is, it conducts electricity in the direction perpendicular to the first surface 10A and is insulated in the direction parallel to the first surface 10A, ensuring that the electrostatic discharge path is transmitted according to the designed path. Furthermore, the conductive particles of the conductive adhesive layer 40 can fill the tiny gaps between the third conductive layer 3321 and the electrostatic discharge layer 20, such as gaps caused by surface roughness, to avoid poor contact caused by vibration and temperature changes.

[0107] In this embodiment, the conductive adhesive layer 40 is located between the surface of the electrostatic discharge layer 20 away from the first substrate 10 and the surface of the third conductive layer 3321 close to the electrostatic discharge layer 20. The conductive adhesive layer 40 covers the overlapping area of ​​the second bonding portion 32 and the electrostatic discharge layer 20 in the orthographic projection of the first substrate 10, that is, the overlapping area completely covers the conductive adhesive layer 40, ensuring that the conductive adhesive layer 40 can fully contact the first substrate 10 and the third conductive layer 3321 to achieve electrical connection.

[0108] like Figure 1As shown, the display module further includes a first polarizer 50 and a backlight 60. In an optional embodiment, the first polarizer 50 is located on the side of the electrostatic discharge layer 20 away from the second surface 10B. The orthographic projection of the first polarizer 50 onto the first substrate 10 falls within the first substrate 10. The edge where the first substrate 10 and the driving circuit board 30 are bonded protrudes beyond the first polarizer 50. That is, the first polarizer 50 does not extend beyond the edge of the first substrate 10, while the edge where the first substrate 10 and the driving circuit board 30 are bonded protrudes beyond the first polarizer 50. Specifically, the edge where the first bonding portion 31 and the second bonding portion 32 are located protrudes beyond the first polarizer 50, reserving assembly space for the bonding portion.

[0109] The backlight 60 is located on the side of the first polarizer 50 away from the second surface 10B. The orthographic projection of the backlight 60 onto the first substrate 10 covers the first substrate 10, ensuring uniform brightness in the display area.

[0110] The conductive adhesive layer 40 is spaced from the edge of the first polarizer 50 near the second bonding portion 32 to prevent the conductive adhesive layer 40 from directly contacting the first polarizer 50.

[0111] This embodiment designs the structures of the first polarizer 50 and the backlight 60 to ensure display quality and assembly compatibility. The spacing between the conductive adhesive layer 40 and the first polarizer 50 avoids tensile stress on the conductive adhesive layer 40 during thermal expansion and contraction, thus extending the module's lifespan.

[0112] In an optional embodiment, such as Figure 1 As shown, the distance between the surface of the backlight 60 near the first substrate 10 and the surface of the electrostatic discharge layer 20 away from the first substrate 10 is greater than the thickness of the second bonding portion 32.

[0113] This embodiment further optimizes the thickness relationship between the backlight 60 and the second bonding part 32. The distance between the surface of the backlight 60 near the first substrate 10 (i.e., the upper surface of the backlight 60) and the surface of the electrostatic discharge layer 20 away from the first substrate 10 (i.e., the lower surface of the electrostatic discharge layer 20) is H1, and the thickness of the second bonding part 32 is H2. The design of H1>H2 ensures that the backlight 60 will not directly squeeze the second bonding part 32 after assembly. Furthermore, the difference between H1 and H2 forms a small gap that can serve as a heat dissipation channel for the backlight 60. When the temperature of the backlight 60 changes during operation, the high temperature is avoided from affecting the conductivity of the conductive adhesive layer 40 and the polarization efficiency of the first polarizer 50, thereby improving the reliability of the display module.

[0114] In an optional embodiment, such as Figure 1As shown, the display module also includes a second substrate 70 located on the side of the first substrate 10 away from the backlight 60, a second polarizer 80 located on the side of the second substrate 70 away from the first substrate 10, and a driving chip 90 bonded to the first substrate 10. The driving chip 90 and the driving circuit board 30 are located on the same side of the first substrate 10, further reducing the bezel.

[0115] In this embodiment, the second substrate 70 is a color filter substrate. The area of ​​the second substrate 70 is smaller than that of the first substrate 10, and it does not occupy the bonding space at the edge of the first substrate 10. The second substrate 70 covers the first polarizer 50 in the orthographic projection of the first substrate 10, and the second polarizer 80 falls within the orthographic projection of the second substrate 70 in the orthographic projection of the first substrate, thus avoiding light leakage and color deviation and improving display uniformity. At the same time, the second substrate 70 does not extend to the bonding edge of the first substrate 10, avoiding the superposition of stress generated by the bonding process and reducing the risk of substrate warping and cracking.

[0116] Another embodiment of this utility model provides a display device, which includes the liquid crystal display module of the above embodiments of this utility model. The display device can be any product or component with display function, such as electronic paper, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator; this embodiment does not limit this.

[0117] In the description of this utility model, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0118] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating this utility model, and are not intended to limit the implementation of this utility model. For those skilled in the art, other variations or modifications can be made based on the above description. It is impossible to exhaustively list all the implementation methods here. All obvious variations or modifications derived from the technical solutions of this utility model are still within the protection scope of this utility model.

Claims

1. A display module, characterized in that, The display module includes: A first substrate, the first substrate including a first surface and a second surface disposed opposite to each other; An electrostatic discharge layer located on the second surface; and A driving circuit board, wherein the driving circuit board includes: The first binding part is bound to the first surface; The second bonding portion is attached to the surface of the electrostatic discharge layer on the side away from the first substrate.

2. The display module according to claim 1, characterized in that, The first substrate includes: The first bonding point is located on the first surface and is electrically connected to the first bonding part; and The second bonding point is located on the second surface and is attached to the surface of the electrostatic discharge layer near the first substrate.

3. The display module according to claim 2, characterized in that, The first substrate further includes a drive signal line, which is connected to the first bonding point; The drive circuit board includes a ground wire connected to the second bonding point and a connection signal line connected to the first bonding point.

4. The display module according to claim 2, characterized in that, The driving circuit board further includes a main body portion, the main body portion facing the first substrate in a first direction. The first binding portion protrudes from the edge of the main body portion and extends along the first direction; The second binding part protrudes from the edge of the main body where the first binding part is located and extends along the first direction; The length of the second binding part in the first direction is greater than the length of the first binding part in the first direction.

5. The display module according to claim 4, characterized in that, The main body includes: A substrate layer, the substrate layer including a third surface and a fourth surface disposed opposite to each other; The first conductive layer is located on the third surface; A first adhesive layer located on the side of the first conductive layer away from the substrate layer; A first protective layer located on the side of the first adhesive layer away from the substrate layer; The second conductive layer is located on the fourth surface; The second adhesive layer is located on the side of the second conductive layer away from the substrate layer; and A second protective layer located on the side of the second adhesive layer away from the substrate layer.

6. The display module according to claim 5, characterized in that, The substrate layer extends to the second bonding portion, and at the location of the second bonding portion, the third surface is closer to the first substrate than the fourth surface; The second binding part includes: A third conductive layer is located on the third surface, and the third conductive layer is disposed in the same layer as the first conductive layer; The third conductive layer is attached to the surface of the electrostatic discharge layer on the side away from the first substrate.

7. The display module according to claim 6, characterized in that, The display module also includes a conductive adhesive layer. The orthographic projection of the conductive adhesive layer onto the first substrate covers the overlapping area of ​​the second bonding portion and the electrostatic discharge layer onto the first substrate. The conductive adhesive layer is located between the surface of the electrostatic discharge layer away from the first substrate and the surface of the third conductive layer close to the electrostatic discharge layer.

8. The display module according to claim 7, characterized in that, The display module also includes: A first polarizer is located on the side of the electrostatic discharge layer away from the second surface. The orthographic projection of the first polarizer onto the first substrate falls within the first substrate. The edge of the first substrate and the driving circuit board bonded together protrudes from the first polarizer. A backlight source located on the side of the first polarizer away from the second surface, the orthogonal projection of the backlight source onto the first substrate covers the first substrate; The conductive adhesive layer is spaced from the edge of the first polarizer near the second bonding portion.

9. The display module according to claim 8, characterized in that, The distance between the surface of the backlight source near the first substrate and the surface of the electrostatic discharge layer away from the first substrate is greater than the thickness of the second bonding portion.

10. A display device, characterized in that, The display device includes the display module according to any one of claims 1 to 9.

Images