Transient temperature control device for unmanned vehicle

Abstract

The utility model provides a kind of unmanned vehicle transient temperature control device, it is related to unmanned vehicle thermal management technical field, including at least one chip, at least one temperature sensor, air pump, gas holder, electromagnetic valve, nozzle and temperature control unit;Chip and temperature sensor one-to-one correspondence, the output end of air pump is connected with the input end of gas holder, the output end of gas holder is connected nozzle, and electromagnetic valve is connected between the output end of gas holder and nozzle;Temperature control unit is connected with at least one temperature sensor, electromagnetic valve and air pump respectively;The airflow output direction of nozzle is towards at least one chip.The device can realize accurate prediction and active intervention to chip instantaneous temperature rise, and the chip is rapidly cooled during intervention process, with high service life, stable heat dissipation operation, low noise, which can effectively avoid the hysteresis of traditional fixed threshold control, and temperature control is activated only when needed, without continuous operation energy consumption, and the comprehensive energy consumption is greatly reduced compared with traditional fan cooling mode.

Description

Technical Field

[0001] This utility model relates to the field of thermal management technology for unmanned vehicles, specifically to a transient temperature control device for unmanned vehicles. Background Technology

[0002] Autonomous vehicles place extremely stringent demands on high-performance computing units (HPCs) such as AI chips and GPUs, requiring them to meet core requirements such as low latency, high computing power, high energy efficiency, and high reliability to support complex tasks like real-time perception, decision-making, planning, and control execution. HPCs experience instantaneous temperature rises under sudden loads. This issue stems from the rapid increase in power consumption when the chip switches from low to high load in a very short time, leading to insufficient heat dissipation and a sudden increase in localized temperature. Instantaneous temperature rise is one of the core challenges restricting the performance, reliability, and energy efficiency of HPCs. For example, chip frequency throttling due to instantaneous temperature rise is a common thermal management challenge in HPC systems such as those used in autonomous vehicles. The core mechanism is that when the chip temperature exceeds a safe threshold, hardware or software triggers a protection mechanism to actively reduce the frequency to decrease power consumption and heat generation. The key impacts of chip frequency throttling on autonomous driving systems include real-time risks such as increased perception latency and extended decision-making cycles, functional safety threats such as ASIL-D compliance failures and sensor fusion errors, and risks of decreased system stability such as thermal oscillations and shortened hardware lifespan.

[0003] Currently, autonomous vehicles are usually equipped with air-cooling systems to mitigate the impact of instantaneous temperature rise, but the following problems still exist: (1) Traditional air-cooling systems have a slow response speed (5-10 seconds) and cannot cope with instantaneous temperature rise of ΔT / Δt>5℃ / s; (2) The fan starts late and cannot cope with the instantaneous thermal shock of the chip; (3) The fan motor has insufficient heat dissipation capacity during acceleration, which may cause the chip temperature to spike in a short time; (4) When the fan motor rotates, mechanical bearing wear and dust accumulation reduce the life of the fan, and the high-frequency start and stop of the motor further shortens the life of the fan; (5) The current when the fan motor starts will reach 5 to 10 times the rated value, resulting in a huge waste of battery power consumption; (6) The high-speed rotation of the fan motor will also generate noise, which will interfere with the perception system, affect the reliability of decision-making, and affect the comfort of passengers.

[0004] If other cooling technologies are applied to autonomous vehicles, liquid cooling systems are bulky and unsuitable for the confined space inside autonomous vehicles, while phase change materials have limitations in their recycling and heat dissipation, and still cannot effectively solve the problem of instantaneous temperature rise. Utility Model Content

[0005] This invention addresses the problems existing in the prior art by providing a transient temperature control device for unmanned vehicles that can accurately predict and actively intervene in the instantaneous temperature rise of chips, rapidly cool the chips during the intervention process, has a long service life, stable heat dissipation operation, and low noise. It can effectively avoid the lag of traditional fixed threshold control, and the temperature control is only activated when needed, with no continuous operating energy consumption. The overall energy consumption is greatly reduced compared to traditional fan cooling methods.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a transient temperature control device for unmanned vehicles, comprising at least one chip, at least one temperature sensor, an air pump, an air tank, a solenoid valve, a nozzle, and a temperature control unit; the at least one chip and the at least one temperature sensor correspond one-to-one, the output end of the air pump is connected to the input end of the air tank, the output end of the air tank is connected to the nozzle, and the solenoid valve is connected between the output end of the air tank and the nozzle;

[0007] The temperature control unit is connected to the at least one temperature sensor, the solenoid valve, and the air pump respectively; the airflow output direction of the nozzle is towards the at least one chip.

[0008] In some embodiments, the number of chips is at least two, and a positioning structure is connected to the nozzle, the positioning structure being connected to the temperature control unit;

[0009] The positioning structure is used to control the airflow output direction of the nozzle toward either of the chips.

[0010] In some embodiments, the nozzle includes a nozzle body and an injection head, and the positioning structure is disposed on the nozzle body for controlling the movement of the injection head.

[0011] In some embodiments, the nozzle is disposed on the positioning structure, which is used to control the movement of the nozzle.

[0012] In some embodiments, the number of chips is at least two, the number of nozzles is at least two, the number of output terminals of the solenoid valve is at least two, each output terminal of the solenoid valve is connected to one of the nozzles, and the nozzles correspond one-to-one with the chips.

[0013] In some embodiments, the temperature control unit includes a calculation module, a sampling circuit, and a control circuit; the calculation module is connected to both the sampling circuit and the control circuit.

[0014] The sampling circuit is connected to the at least one temperature sensor;

[0015] The control circuit is connected to the solenoid valve and the air pump, respectively.

[0016] In some embodiments, the temperature sensor is a MEMS temperature sensor.

[0017] In some embodiments, the sampling circuit includes a high-speed ADC circuit.

[0018] In some embodiments, the computing module includes an FPGA.

[0019] In some embodiments, a pressure sensor is installed inside the gas storage tank, and the pressure sensor is connected to the temperature control unit.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. This utility model achieves rapid cooling of the chip by real-time monitoring of the chip's temperature change trend and triggering the release of pre-charged high-pressure air from the gas storage tank to the chip surface under preset conditions. It achieves accurate prediction and active intervention, effectively avoiding the lag of traditional fixed threshold control. Moreover, the temperature control is only activated when needed, with no continuous operating energy consumption. The overall energy consumption is greatly reduced compared to traditional fan cooling methods.

[0022] 2. This utility model achieves millisecond-level response through an electromagnetic valve, directly triggering the directional instantaneous release of high-pressure air to meet the chip's millisecond-level heat dissipation needs, effectively coping with sudden thermal shocks to electronic devices. Furthermore, high-pressure air has high thermal conductivity, which can quickly remove heat and significantly reduce the chip surface temperature. The heat dissipation efficiency is 3-5 times higher than that of traditional air cooling.

[0023] 3. This utility model uses an electromagnetic valve and a high-pressure gas system as the main components of the temperature control process. There is no mechanical wear, and the service life can reach tens of millions of times, which is far longer than that of traditional fans.

[0024] 4. This utility model uses an air pump and an air storage tank to replenish the air pressure in the air storage tank in real time, ensuring the continuous and stable operation of the device. The air storage tank, as an energy buffer unit, provides instantaneous energy support for sudden heat dissipation needs. It can provide a stable pressure source during temperature control, ensuring the consistency of gas release and avoiding the impact of pressure fluctuations on the heat dissipation effect. Through the "filling-releasing-replenishing" cycle mechanism, efficient and stable operation of temperature control heat dissipation is achieved. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the connection structure of the transient temperature control device for unmanned vehicles in embodiments 1-5 of this utility model;

[0026] Figure 2 This is a schematic diagram of the transient temperature control device for unmanned vehicles in embodiments 3 and 4 of this utility model.

[0027] Figure 3 This is a schematic diagram of the connection structure of the transient temperature control device for unmanned vehicles in Embodiment 6 of this utility model;

[0028] The reference numerals in the attached drawings are as follows: 10, chip unit; 11, chip; 12, temperature sensor; 20, temperature control unit; 21, calculation module; 22, sampling circuit; 23, control circuit; 30, air pump; 40, air tank; 41, air supply pipe; 42, pressure sensor; 50, solenoid valve; 60, nozzle; 70, outer shell; 71, first cavity; 72, second cavity; 80, positioning structure; 81, first threaded rod; 82, slide groove; 83, slider; 84, second threaded rod; 85, guide rod; 86, mounting block; I, first direction; II, second direction. Detailed Implementation

[0029] To clearly illustrate the technical features of this solution, the implementation methods of this application will be described in detail below with reference to the accompanying drawings and embodiments. This will allow for a full understanding and implementation of how this application uses technical means to solve technical problems and achieve corresponding technical effects. The embodiments of this application and the various features within them can be combined with each other without conflict, and the resulting technical solutions are all within the protection scope of this application.

[0030] Example 1

[0031] See Figure 1 This utility model provides a transient temperature control device for an unmanned vehicle, including at least one chip 11, at least one temperature sensor 12, an air pump 30, an air tank 40, a solenoid valve 50, a nozzle 60, and a temperature control unit 20. At least one chip 11 and at least one temperature sensor 12 are paired one-to-one. The output end of the air pump 30 is connected to the input end of the air tank 40. The air pump 30 is a miniature air pump to meet the space requirements inside the unmanned vehicle. The output end of the air tank 40 is connected to the nozzle 60, and the solenoid valve 50 is connected between the output end of the air tank 40 and the nozzle 60. The air pump 30 compresses air into the air tank 40 to maintain a constant pressure inside the air tank 40. In standby mode, under normal working conditions, the solenoid valve 50 is closed, and the air tank 40 maintains a certain pre-charged high-pressure air. Preferably, the air pressure of the pre-charged high-pressure air meets the injection conditions. The injection conditions are: when the solenoid valve 50 is opened to release a preset opening to the nozzle 60, the jet air velocity of the nozzle 60 is not less than 20m / s, so as to achieve the effect of rapid cooling. In this embodiment, the researchers found that when the temperature rise rate ΔT / Δt of the chip 11 is >5℃ / s, the solenoid valve 50 is opened, and when the jet air velocity of the nozzle 60 is not less than 20m / s, the temperature rise rate of the chip 11 can be suppressed to ΔT / Δt <2℃ / s within 1 second.

[0032] The temperature control unit 20 is connected to at least one temperature sensor 12, a solenoid valve 50 and an air pump 30 respectively. The temperature sensor 12 is used to collect the real-time temperature change of the corresponding chip 11, such as the real-time temperature rise rate, and transmit it to the temperature control unit 20. The airflow output direction of the nozzle 60 is towards at least one chip 11.

[0033] When the temperature sensor 12 detects that the temperature rise rate ΔT / Δt of the corresponding chip 11 is greater than 5℃ / s, thus predicting that the corresponding chip 11 will experience a sudden temperature rise, the temperature control unit 20 controls the solenoid valve 50 to open, releasing the pre-charged high-pressure air in the air tank 40. The high-pressure air is then sprayed onto the surface of the chip 11 through the nozzle 60, achieving rapid cooling of the corresponding chip 11. After the high-pressure air injection is completed, the air pump 30 restarts to replenish the high-pressure air in the air tank 40, preparing for the next response.

[0034] The temperature control unit 20 uses the temperature rise rate ΔT / Δt of the chip 11 > 5℃ / s as the trigger condition for the opening of the solenoid valve 50 to release the pre-charged high-pressure air in the air tank 40 to the surface of the chip 11, thereby achieving rapid cooling of the chip 11. By monitoring the real-time temperature change trend of the chip 11, the temperature control response is dynamically adjusted to achieve accurate prediction and active intervention, effectively avoiding the lag of traditional fixed threshold control. Moreover, the temperature control is only activated when needed, with no continuous operating energy consumption, and the overall energy consumption is greatly reduced compared to traditional fan cooling methods. The solenoid valve 50, air pump 30, and air tank 40 are integrated. The solenoid valve 50 can open / close within 10-50ms, achieving millisecond-level response and directly triggering the directional instantaneous release of high-pressure air. This rapidly reduces the temperature of the hot spot, i.e., the chip 11 with a temperature rise rate ΔT / Δt > 5℃ / s, meeting millisecond-level heat dissipation requirements and effectively coping with sudden thermal shocks to electronic devices. Furthermore, the high-pressure air has high thermal conductivity, quickly carrying away heat and significantly reducing the surface temperature of the chip 11. The heat dissipation efficiency is 3-5 times higher than traditional air cooling. The solenoid valve 50 and the high-pressure gas system have no mechanical wear, and their service life can reach tens of millions of cycles, far exceeding that of traditional fans. Simultaneously, it achieves zero or low mechanical noise startup. The air pump 30, in conjunction with the air tank 40, replenishes pressure in real time, ensuring continuous and stable operation of the device. The air tank 40, as an energy buffer unit, provides instantaneous energy support for sudden heat dissipation needs and can provide a stable pressure source during temperature control, ensuring consistent gas release and avoiding the impact of pressure fluctuations on heat dissipation. The system achieves efficient and stable operation of temperature control and heat dissipation through a "charge-release-replenish" cycle mechanism.

[0035] The chip unit 10 includes at least one chip 11 and at least one temperature sensor 12. The chip 11 includes at least an AI chip, a GPU and a high-performance computing chip. The temperature sensor 12 is arranged on the corresponding chip 11. The position of the temperature sensor 12 on the corresponding chip 11 can be adjusted as needed, and it can be located above, below or in the middle of the chip 11.

[0036] Preferably, the temperature sensor 12 is a MEMS sensor (Micro-Electro-Mechanical Systems), with a size ranging from micrometers to millimeters. It can be easily integrated into small systems such as automotive electronics, and its highly integrated design makes its power consumption significantly lower than that of traditional sensors, making it suitable for long-term operation. At the same time, it can accurately capture changes in minute physical quantities, such as minute pressure fluctuations or acceleration changes, and has good monitoring performance.

[0037] Preferably, the temperature control unit 20 performs PWM (pulse width modulation) regulation on the solenoid valve 50. By changing the duration (i.e., duty cycle) of the high level (or low level) through a square wave signal of fixed frequency, it achieves precise control of the average output voltage, current or power, thereby achieving precise control of the solenoid valve 50. It can accurately control the gas flow rate and release time, achieve heat dissipation on demand, and avoid energy waste.

[0038] Preferably, when ΔT / Δt≤2℃ / s, the solenoid valve 50 does not open, maintaining the standby state under normal operation;

[0039] When 2℃ / s<ΔT / Δt≤5℃ / s, the solenoid valve 50 achieves 50% power injection of high-pressure gas when it is opened;

[0040] When ΔT / Δt>5℃ / s, the full-power injection of high-pressure gas is achieved when the solenoid valve 50 is opened;

[0041] When solenoid valve 50 is open, it will close when ΔT / Δt < 2℃ / s.

[0042] In some embodiments, the transient temperature control device for the unmanned vehicle further includes an alarm unit connected to the temperature control unit 20; the alarm unit is a warning light, and preferably, under the control of the temperature control unit 20, the warning light can display a yellow or red light;

[0043] When 2℃ / s<ΔT / Δt≤5℃ / s, when the solenoid valve 50 opens, it achieves 50% power injection of high-pressure gas, and at the same time, the temperature control unit 20 also controls the alarm unit to issue a yellow warning.

[0044] When ΔT / Δt>5℃ / s, the solenoid valve 50 opens to achieve full-power injection of high-pressure gas, while the temperature control unit 20 also controls the alarm unit to issue a red alarm.

[0045] In some embodiments, the temperature control unit 20 includes a calculation module 21, a sampling circuit 22, and a control circuit 23; the calculation module 21 is connected to the sampling circuit 22 and the control circuit 23 respectively.

[0046] The computing module 21 includes an FPGA (Field Programmable Gate Array). The FPGA processes data directly through hardware circuits without the need for operating system scheduling. The response time can be precisely controlled to the nanosecond level. Moreover, the hardware logic of the FPGA is fixed, and the execution time is predictable, avoiding uncertain delays in software operation. It is suitable for scenarios with extremely high timeliness requirements. In addition, the FPGA supports customized hardware architecture for specific algorithms. In this embodiment, the ΔT / Δt algorithm is implemented, and then the control circuit 23 controls the switching of the solenoid valve 50. The energy efficiency ratio is significantly better than that of general-purpose processors.

[0047] The sampling circuit 22 is connected to at least one temperature sensor 12. The sampling circuit 22 includes a high-speed ADC (analog-to-digital converter) circuit. The sampling frequency of the high-speed ADC circuit is not less than 100Hz, which ensures high sampling rate to achieve lossless signal restoration, high resolution to improve quantization accuracy, low noise design to enhance signal-to-noise ratio, and high integration to reduce peripheral circuits and low power consumption design to extend the device's battery life, thus meeting the real-time monitoring needs of unmanned vehicles.

[0048] The control circuit 23 is connected to the solenoid valve 50, the air pump 30 and the alarm unit respectively, and the response time of the control circuit 23 is less than 100ms.

[0049] Example 2

[0050] Based on Embodiment 1, everything else is the same as in Embodiment 1. The difference from Embodiment 1 is that the nozzle 60 is a focusing nozzle 60, the number of chips 11 is at least two, and a positioning structure 80 is connected to the nozzle 60. The positioning structure 80 is connected to the control circuit 23.

[0051] The positioning structure 80 is used to control the airflow output direction of the nozzle 60 toward any chip 11. When the airflow output direction of the nozzle 60 is toward any chip 11, high-pressure air can be focused and released toward that chip 11.

[0052] In some embodiments, the nozzle 60 includes a nozzle 60 body and an injection head. A positioning structure 80 is disposed on the nozzle 60 body and is used to control the movement of the injection head. That is, the nozzle 60 is an adjustable-direction nozzle 60. At least two chips 11 are arranged within the airflow output range of the nozzle 60. The adjustable-direction nozzle 60 is prior art and will not be described in detail here.

[0053] Example 3

[0054] Based on Embodiment 1, everything else is the same as in Embodiment 1. The difference from Embodiment 1 is that the number of chips 11 is at least two, and a positioning structure 80 is connected to the nozzle 60. The positioning structure 80 is connected to the control circuit 23.

[0055] The positioning structure 80 is used to control the airflow output direction of the nozzle 60 toward either chip 11.

[0056] The nozzle 60 is mounted on the positioning structure 80, which controls the movement of the nozzle 60. The nozzle 60 is connected to the output end of the gas storage tank 40 through the gas supply pipe 41. The gas supply pipe 41 is a flexible hose that can accommodate the movement of the nozzle 60.

[0057] See Figure 2 In some embodiments, the positioning structure 80 includes a first threaded rod 81, a slide groove 82, a slider 83, a second threaded rod 84, a guide rod 85, and a mounting block 86; the first threaded rod 81 and the second threaded rod 84 are respectively controlled to rotate by stepper motors, preferably, the first threaded rod 81 and the second threaded rod 84 each correspond to a stepper motor;

[0058] The first threaded rod 81 and the slide groove 82 are respectively arranged along the second direction II. The first threaded rod 81 is placed in the slide groove 82, and the two ends of the first threaded rod 81 are respectively rotatably engaged with the two ends of the slide groove 82. The slider 83 is threadedly engaged with the first threaded rod 81, and the slider 83 is slidably engaged with the slide groove 82 along the second direction II.

[0059] Guide rod 85 and second threaded rod 84 are respectively arranged along the first direction I. Preferably, the first direction I and the second direction II are perpendicular to each other. The second threaded rod 84 is rotatably engaged with the slider 83. The guide rod 85 is fixedly connected with the slider 83. The mounting block 86 is threadedly engaged with the second threaded rod 84, and the mounting block 86 and the guide rod 85 are slidably engaged along the first direction I. The nozzle 60 is mounted on the mounting block 86.

[0060] Within the two-dimensional coordinate system formed by the first direction I and the second direction II, the position, i.e., the coordinates, of each chip 11 can be determined. In use, the coordinates of the chip 11 that needs to be temperature controlled are determined by controlling the number of rotations or the rotation angle of the first threaded rod 81 and the second threaded rod 84 respectively through the stepper motor. This allows the mounting block 86 to be quickly moved above the chip 11, so that the nozzle 60 can spray high-pressure air directionally onto the chip 11.

[0061] It is worth noting that, in order to ensure the stability of the movement of the mounting block 86, there are two of each of the first threaded rod 81, the sliding groove 82 and the slider 83. The sliding groove 82 is located at both ends of the second threaded rod 84. Each sliding groove 82 has a slider 83 that slides in it. Each slider 83 has a threaded engagement with a first threaded rod 81. The guide rod 85 and the second threaded rod 84 are connected between the two sliders 83 respectively.

[0062] The positioning structure 80 can drive the nozzle 60 to adjust its displacement along the two-dimensional coordinate system formed by the first direction I and the second direction II through a stepper motor. Combined with the mapping relationship between the position of the chip 11 and the two-dimensional coordinate system, the coordinates of the battery cell that needs to be temperature controlled can be locked in real time, and the nozzle 60 can be moved to the target position along the two-dimensional coordinate system.

[0063] In addition to the solutions described above, the positioning structure 80 uses a stepper motor to drive the nozzle 60 to adjust its displacement along a preset two-dimensional coordinate system, which is an existing technology. The coordinate positioning logic of 3D printing technology can be referenced, and will not be elaborated here.

[0064] Example 4

[0065] Based on Embodiment 3, everything else is the same as in Embodiment 3. The difference from Embodiment 3 is that the transient temperature control device of the unmanned vehicle is provided with an outer shell 70, which includes a first cavity 71 and a second cavity 72.

[0066] The chip unit 10, nozzle 60 and positioning structure 80 are respectively located in the first cavity 71. The chip unit 10 includes at least one chip 11 and at least one temperature sensor 12; the gas delivery pipe 41 passes through the space between the first cavity 71 and the second cavity 72.

[0067] The air pump 30, air tank 40, solenoid valve 50 and temperature control unit 20 are located in the second chamber 72 respectively;

[0068] The chip unit 10 has high sealing requirements. By separating components with low correlation to the operation of the chip 11 from the chip unit 10, the influence of each component on the chip unit 10 during operation can be avoided. At the same time, modular design can be achieved, reducing maintenance difficulty and avoiding the need to replace faulty components as a whole, thus reducing maintenance costs. Separating the chip 11 from the temperature control unit 20 can reduce signal interference and radiation emissions, while ensuring the stable operating temperature of each circuit in the temperature control unit 20. In addition, mixing the chip 11 with some control circuits 23, such as the low-voltage control circuit 23, may cause electric shock risk. Separating the chip 11 from the temperature control unit 20 can reduce or avoid this risk and improve the operational safety of the device.

[0069] Example 5

[0070] Based on Example 1, everything else is the same as in Example 1. The difference is that there are at least two chips 11, at least two nozzles 60, and at least two output terminals of the solenoid valve 50. Each output terminal of the solenoid valve 50 is connected to a nozzle 60. Each nozzle 60 corresponds to a chip 11. When any chip 11 experiences a momentary temperature rise, the control circuit 23 controls the corresponding output terminal of the solenoid valve 50 to open. This allows high-pressure air to be directed and sprayed onto the chip 11 with a temperature rise rate ΔT / Δt > 5℃ / s through the nozzle 60 connected to the opened output terminal, achieving rapid cooling of the corresponding chip 11. When multiple chips 11 experience a temperature rise rate ΔT / Δt > 5℃ / s simultaneously, multiple output terminals of the solenoid valve 50 can be opened to achieve rapid and precise cooling of multiple chips 11. Furthermore, by setting multiple output terminals of the solenoid valve 50 in conjunction with multiple nozzles 60, the mechanical load can be further reduced, thereby reducing the noise and starting current of the temperature control process.

[0071] Example 6

[0072] See Figure 3 Based on any one of Embodiments 1-5, the rest is the same as any one of Embodiments 1-5. The difference from any one of Embodiments 1-5 is that a pressure sensor 42 is provided inside the gas storage tank 40, and the pressure sensor 42 is connected to the temperature control unit 20.

[0073] It is worth noting that the gas storage tank 40 can also be filled with gas based on the real-time gas pressure inside the gas storage tank 40: the pressure sensor 42 is used to collect the real-time gas pressure inside the gas storage tank 40. When the real-time pressure inside the gas storage tank 40 is lower than the first threshold, the temperature control unit 20 controls the air pump 30 to start. When the real-time pressure inside the gas storage tank 40 is higher than the second threshold, the temperature control unit 20 controls the air pump 30 to stop.

[0074] The pressure sensor 42 is connected to the sampling circuit 22. The calculation module 21 controls the air pump 30 to start or stop according to the pressure signal collected by the sampling circuit 22, so as to cope with the instantaneous temperature rise scenario with large air consumption.

[0075] Finally, it should be noted that the above content is only used to illustrate the technical solution of this utility model, and is not intended to limit the scope of protection of this utility model. Simple modifications or equivalent substitutions made by those skilled in the art to the technical solution of this utility model do not depart from the essence and scope of the technical solution of this utility model.

Claims

1. A transient temperature control device for unmanned vehicles, characterized in that, It includes at least one chip, at least one temperature sensor, an air pump, an air tank, a solenoid valve, a nozzle, and a temperature control unit; the at least one chip and the at least one temperature sensor correspond one-to-one, the output end of the air pump is connected to the input end of the air tank, the output end of the air tank is connected to the nozzle, and the solenoid valve is connected between the output end of the air tank and the nozzle; The temperature control unit is connected to the at least one temperature sensor, the solenoid valve, and the air pump respectively; the airflow output direction of the nozzle is towards the at least one chip.

2. The transient temperature control device for unmanned vehicles according to claim 1, characterized in that, The number of chips is at least two, and a positioning structure is connected to the nozzle, which is connected to the temperature control unit; The positioning structure is used to control the airflow output direction of the nozzle toward either of the chips.

3. The transient temperature control device for unmanned vehicles according to claim 2, characterized in that, The nozzle includes a nozzle body and an injection head. The positioning structure is disposed on the nozzle body and is used to control the movement of the injection head.

4. The transient temperature control device for unmanned vehicles according to claim 2, characterized in that, The nozzle is disposed on the positioning structure, and the positioning structure is used to control the movement of the nozzle.

5. The transient temperature control device for unmanned vehicles according to claim 1, characterized in that, The number of chips is at least two, the number of nozzles is at least two, the number of output terminals of the solenoid valve is at least two, each output terminal of the solenoid valve is connected to one of the nozzles, and the nozzles correspond one-to-one with the chips.

6. The transient temperature control device for unmanned vehicles according to claim 1, characterized in that, The temperature control unit includes a calculation module, a sampling circuit, and a control circuit; the calculation module is connected to both the sampling circuit and the control circuit. The sampling circuit is connected to the at least one temperature sensor; The control circuit is connected to the solenoid valve and the air pump, respectively.

7. The transient temperature control device for unmanned vehicles according to claim 6, characterized in that, The temperature sensor is a MEMS temperature sensor.

8. The transient temperature control device for unmanned vehicles according to claim 6, characterized in that, The sampling circuit includes a high-speed ADC circuit.

9. The transient temperature control device for unmanned vehicles according to claim 6, characterized in that, The computing module includes an FPGA.

10. The transient temperature control device for unmanned vehicles according to any one of claims 1-9, characterized in that, A pressure sensor is installed inside the gas storage tank, and the pressure sensor is connected to the temperature control unit.

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