A nail bed tool for PCB solder mask

Abstract

The utility model provides a kind of nail bed tool for PCB solder mask, including substrate, several guide holes are provided on substrate, positioning nail is slidably arranged in guide hole, the lower end of guide hole is provided with the telescopic driving element connected with positioning nail, positioning nail is switched between the state of extension and retraction by telescopic driving element drive;The substrate is provided with the surface turning detection component for detecting whether the PCB board is surface turned.The nail bed tool of the utility model can dynamically select the extension position of positioning nail, can adapt to PCB boards of different specifications and different positioning hole layouts, without replacing hardware tool, reduce tooling cost, improve equipment versatility.And when the PCB board printing task of double-sided printing resist layer is needed, the surface turning action of PCB board can be detected and the positioning support state of nail bed tool is automatically switched, so that the nail bed tool can meet the positioning needs of PCB board before and after surface turning, thereby effectively meeting the double-sided printing task of PCB board.

Description

Technical Field

[0001] This utility model relates to the field of circuit board printing technology, and in particular to a universal nail bed. Background Technology

[0002] When printing solder mask on existing circuit boards (PCBs), a bed of nails is required to position the PCB. The bed of nails includes a base plate with several positioning nails; the PCB to be printed has positioning holes. Before printing, positioning nails are installed on the base plate of the bed of nails according to the positions of the positioning holes on the PCB, ensuring a one-to-one correspondence between the positioning nails and the positioning holes on the PCB. Then, the PCB is placed on the top bed of nails, and the tips of the positioning nails are inserted into the positioning holes on the PCB, thus achieving precise positioning of the PCB.

[0003] However, existing stapler systems have the following problems in use: 1. The positioning staples need to be manually installed according to the positions of the positioning holes on the circuit board, resulting in a long preparation time. Furthermore, after changing the specifications of the circuit board, the installation positions of the positioning staples need to be readjusted, making it cumbersome to use. 2. Some existing circuit boards require double-sided printing, meaning that after printing one side, the circuit board needs to be flipped. After flipping, the arrangement of the positioning holes may change, which means that the existing positioning staple installation method may not be compatible with the flipped circuit board, thus making it unsuitable for double-sided printing operations. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies and provide a nail bed fixture for solder mask application on PCB boards.

[0005] The purpose of this utility model is achieved through the following technical solution: a pin bed fixture for solder mask of PCB board, including a base plate, a plurality of guide holes are provided on the base plate, a positioning pin is slidably disposed in the guide holes, and a telescopic drive member connected to the positioning pin is provided at the lower end of the guide hole, the telescopic drive member drives the positioning pin to switch between an extended state and a retracted state; the base plate is provided with a flipping detection component for detecting whether the PCB board is flipped.

[0006] Preferably, the guide holes are arranged in a rectangular array on the substrate.

[0007] Preferably, the telescopic drive component is a pneumatic cylinder, a hydraulic cylinder, or an electric cylinder.

[0008] Preferably, a sliding sleeve is provided in the guide hole, and the positioning pin is disposed in the sliding sleeve and slides between the sliding sleeve and the sliding sleeve.

[0009] Preferably, the positioning pin includes a sliding section and a top contact section. The outer diameter of the sliding section is the same as the inner diameter of the sliding sleeve, and the top contact section is located at the upper end of the sliding section. The upper end of the top contact section has a pointed conical structure.

[0010] Preferably, the flipping detection component is an infrared sensor, which is disposed on the upper surface of the substrate.

[0011] Preferably, a support member is provided at the bottom of the substrate.

[0012] The beneficial effects of this utility model are:

[0013] 1. The nail bed fixture of this utility model can adapt to PCB boards of different specifications and different positioning hole layouts by dynamically selecting the extension position of the positioning nails, without the need to replace hardware fixtures (such as traditional mechanical fixtures which may require customized clamps), thereby reducing tooling costs and improving equipment versatility.

[0014] 2. When printing PCB boards that require double-sided solder mask, this utility model can detect the flipping action of the PCB board and automatically switch the positioning support state of the stapler fixture, so that the stapler fixture can simultaneously meet the positioning requirements of the PCB board before and after flipping, thereby effectively meeting the double-sided printing task of the PCB board. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model from one direction.

[0016] Figure 2 This is a schematic diagram of the structure from another direction of the present invention.

[0017] Figure 3 for Figure 1 Enlarged view of section A.

[0018] Figure 4 This is a schematic diagram of the positioning pin.

[0019] In the figure: 1. Base plate, 2. Positioning pin, 2-1. Sliding section, 2-2. Top contact section, 2-3. Connecting hole, 3. Sliding sleeve, 4. Support component, 5. Telescopic drive component, 6. Flipping detection component. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model are within the protection scope of the present utility model.

[0021] like Figures 1 to 4As shown, a pin bed fixture for solder mask application on a PCB includes a base plate 1. The base plate 1 has several guide holes, and positioning pins 2 are slidably disposed in the guide holes. A telescopic drive component 5 connected to the positioning pins 2 is disposed at the lower end of the guide holes, driving the positioning pins 2 to switch between an extended state and a retracted state via the telescopic drive component 5. The base plate 1 also has a flipping detection component 6 for detecting whether the PCB has been flipped. The guide holes are arranged in a rectangular array on the base plate 1.

[0022] When the positioning pin 2 is in the extended state, its upper end extends a certain distance beyond the guide hole; when the positioning pin 2 is in the retracted state, it is completely retracted into the guide hole. All telescopic drive components 5 and flipping detection components 6 are connected to the control system, which controls the operation of the telescopic drive components 5. In this application, the control system uses a PLC programmable controller.

[0023] When using this device, the position of the PCB board to be supported is first determined according to the position of the positioning hole on the PCB board. The positioning pin 2 corresponding to the positioning hole on the pin bed is controlled by the control system to extend upward to the extended state, while the other positioning pins 2 are in the retracted state. The PCB board to be printed is placed on the pin bed fixture, and the positioning pin 2 in the extended state is inserted into the positioning hole on the PCB board, thereby achieving precise positioning of the PCB board.

[0024] When a PCB board needs to undergo double-sided solder mask printing (i.e., after printing on one side of the PCB board, it needs to be flipped over to print on the other side), the position of the PCB board before flipping is determined based on the position of the positioning holes on the PCB board; then the position of the PCB board after flipping is determined; the first positioning support state is when the stapler fixture positions the PCB board before flipping, and the second positioning support state is when the stapler fixture positions the PCB board after flipping; the control system first controls the stapler fixture to reach the first positioning support state, then places the PCB board on the stapler fixture, and prints on one side of the PCB board; after one side is printed, the PCB board is flipped over. During the flipping process, the flipping detection component 6 will detect the flipping action of the PCB board and transmit the signal to the control system, which will automatically control the stapler fixture to switch to the second positioning support state, and then place the flipped PCB board on the stapler fixture for printing on the other side.

[0025] In this embodiment, the telescopic drive component 5 is a pneumatic cylinder, a hydraulic cylinder, or an electric cylinder.

[0026] The guide hole contains a sliding sleeve 3, and the positioning pin 2 is disposed in the sliding sleeve 3 and slides between the sliding sleeve 3 and the sliding sleeve 3. The sliding sleeve 3 is made of materials such as copper alloy or polytetrafluoroethylene. The sliding sleeve 3 is used to reduce the friction when the positioning pin 2 slides in the guide hole, so that the extension and retraction of the positioning pin 2 is smoother.

[0027] like Figure 3 As shown, the positioning pin 2 includes a sliding section 2-1 and a top contact section 2-2. The outer diameter of the sliding section 2-1 is the same as the inner diameter of the sliding sleeve 3. The top contact section 2-2 is located at the upper end of the sliding section 2-1, and the upper end of the top contact section 2-2 has a pointed conical structure. The lower end of the sliding section 2-1 is provided with a connecting hole 2-3, which is used to connect with the telescopic drive component 5.

[0028] In this embodiment, the flipping detection component 6 is an infrared sensor, which is disposed on the upper surface of the substrate 1. When the PCB board is placed on the substrate 1, the PCB board blocks the flipping detection component 6 (infrared sensor); when the PCB board is flipped, the PCB board will first move away from the flipping detection component 6, and then block the flipping detection component 6 again. When the PCB board moves away from the flipping detection component 6, the flipping detection component 6 (infrared sensor) changes from a blocked state to an unblocked state, thereby generating a trigger signal for the flipping detection component 6 to detect the flipping action of the PCB board.

[0029] A support member 4 is provided at the bottom of the substrate 1.

[0030] This utility model has the following advantages:

[0031] 1. This utility model's staple bed fixture dynamically selects the extension position of the positioning staples 2, adapting to PCBs of different specifications and positioning hole layouts without requiring replacement of hardware fixtures (as traditional mechanical fixtures may require customized jigs), reducing tooling costs and improving equipment versatility. 2. When printing PCBs requiring double-sided solder mask layers, this utility model can detect the PCB's flipping action and automatically switch the positioning support state of the staple bed fixture. This allows the staple bed fixture to simultaneously meet the PCB's positioning needs before and after flipping, effectively fulfilling the double-sided printing task.

[0032] This utility model is not limited to the above-described preferred embodiments. Anyone can derive other forms of products under the guidance of this utility model. However, regardless of any changes made in their shape or structure, any technical solution that is the same as or similar to this application falls within the protection scope of this utility model.

Claims

1. A nail bed fixture for solder mask application on PCB boards, characterized in that, The system includes a substrate with several guide holes. A positioning pin is slidably disposed in the guide holes. A telescopic drive connected to the positioning pin is disposed at the lower end of the guide holes. The telescopic drive drives the positioning pin to switch between an extended state and a retracted state. The substrate is provided with a flipping detection component for detecting whether the PCB board has been flipped.

2. The PCB board solder mask bed fixture according to claim 1, characterized in that, The guide holes are arranged in a rectangular array on the substrate.

3. The PCB board solder mask bed fixture according to claim 1, characterized in that, The telescopic drive component is a pneumatic cylinder, a hydraulic cylinder, or an electric cylinder.

4. The PCB board solder mask bed fixture according to claim 1, characterized in that, A sliding sleeve is provided in the guide hole, and a positioning pin is disposed in the sliding sleeve and slides between the sliding sleeve and the sliding sleeve.

5. The PCB board solder mask bed fixture according to claim 4, characterized in that, The positioning pin includes a sliding section and a top contact section. The outer diameter of the sliding section is the same as the inner diameter of the sliding sleeve. The top contact section is located at the upper end of the sliding section, and the upper end of the top contact section has a pointed conical structure.

6. The PCB board solder mask bed fixture according to claim 1, characterized in that, The flipping detection component is an infrared sensor, which is located on the upper surface of the substrate.

7. The PCB board solder mask bed fixture according to claim 1, characterized in that, A support component is provided at the bottom of the substrate.

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