A positioning mechanism for an integrated circuit board package

By combining the gripping, limiting, and transmission units of the positioning mechanism for integrated circuit board packaging with visual recognition components, automated gripping and precise positioning are achieved, solving the problem of low automation efficiency in existing technologies and improving packaging quality and efficiency.

CN224306020UActive Publication Date: 2026-05-29QINGDAO WOXIN INTELLIGENT IND CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
QINGDAO WOXIN INTELLIGENT IND CO LTD
Filing Date
2025-06-18
Publication Date
2026-05-29

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Abstract

The utility model relates to circuit board processing technical field, and disclose a kind of positioning mechanism for integrated circuit board packaging, including grabbing mechanism and positioning mechanism, grabbing mechanism is movably connected in the top of positioning mechanism, and positioning mechanism includes limiting unit and conducting unit, limiting unit is movably connected in the both sides of conducting unit, and conducting unit is movably connected in the bottom of grabbing mechanism.The positioning mechanism for integrated circuit board packaging, through grabbing, lifting, transmission and negative pressure adsorption etc. Action cooperation visual identification, can automatically identify and conduct component, overall improve the automation effect of packaging work, reduce manual operation, improve production efficiency, through four groups of clamps can be positioned to the integrated circuit board on the top of first transmission belt and clamped, can accurately limit fixing integrated circuit board, so that negative pressure adsorption component can accurately grab and place component, ensure the position accuracy of component in packaging process, to improve packaging quality.
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Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, specifically to a positioning mechanism for integrated circuit board packaging. Background Technology

[0002] A positioning mechanism for integrated circuit board packaging is a device used to precisely fix and position the circuit board and related components during the integrated circuit board packaging process. It typically consists of components such as clamps, positioning pins, and guide rails, ensuring that the circuit board maintains an accurate position and orientation during packaging, avoiding problems such as offset or tilting, thereby improving packaging quality and production efficiency.

[0003] The prior art discloses a positioning mechanism for integrated circuit board packaging, application number 202022103884.7, including a fixing structure, a lifting structure, and a positioning structure. The fixing structure includes a chassis and a fixing plate with holes, and the fixing plate with holes is horizontally welded evenly on the outer circumference of the chassis. The lifting structure is horizontally arranged above the chassis, and the lifting structure includes a support plate and guide rods. Guide rods are vertically welded to both sides of the top surface of the support plate, and a linear motor is vertically fixed on the top surface of the support plate. The positioning structure includes a positioning slot frame and a hole plate. Holes are horizontally welded to both end faces of the positioning slot frame, and the positioning slot frame is horizontally arranged above the support plate. The bottom end of the positioning slot frame is connected to the output end of the linear motor, and the hole plates on both end faces of the positioning slot frame are slidably connected to the guide rods. The above-mentioned utility model can position the integrated circuit board during packaging, thereby ensuring the stability of the integrated circuit board and improving the stability and accuracy of packaging.

[0004] The aforementioned device can ensure the stability of the integrated circuit board by setting a limit mechanism. However, the automation efficiency of the device is low, manual installation is required, and the effect during use is not good. Improvements are needed. Utility Model Content

[0005] The purpose of this invention is to provide a positioning mechanism for integrated circuit board packaging, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a positioning mechanism for integrated circuit board packaging, comprising a gripping mechanism and a positioning mechanism, wherein the gripping mechanism is movably connected to the top of the positioning mechanism.

[0007] The positioning mechanism includes a limiting unit and a transmission unit. The limiting unit is movably connected to both sides of the transmission unit, and the transmission unit is movably connected to the bottom of the gripping mechanism.

[0008] Preferably, the gripping mechanism comprises a guide rail, a displacement motor, a conductive threaded rod, a slider, a lifting rod, a hydraulic assembly, a telescopic rod, and a negative pressure adsorption assembly. The displacement motor is fixedly connected to the side of the guide rail, the conductive threaded rod is rotatably connected to the inside of the guide rail, the slider is threadedly connected to the inside of the guide rail, the lifting rod is movably connected to the top of the slider, the hydraulic assembly is fixedly connected to the top of the lifting rod, the telescopic rod is movably connected to the side of the hydraulic assembly, and the negative pressure adsorption assembly is fixedly connected to the extension end of the telescopic rod, thus performing the function of gripping parts for encapsulation.

[0009] Preferably, the limiting unit consists of a processing table, an adjusting motor, a turntable, a cylinder, an extension rod, and a clamping plate. The processing table is fixedly connected to the side of the guide rail, the adjusting motor is fixedly connected to the inside of the processing table, the turntable is rotatably connected to the top of the processing table, the cylinder is fixedly connected to the top of the turntable, the extension rod is movably connected to the side of the cylinder, and the clamping plate is fixedly connected to the extension end of the extension rod, playing the main role of limiting and fixing.

[0010] Preferably, the transmission unit consists of a first transmission belt, a second transmission belt, a first vision recognition component, and a second vision recognition component. The first transmission belt is movably connected to the top of the processing table, the second transmission belt is fixedly connected to the side of the guide rail, the first vision recognition component is fixedly connected to the side of the first transmission belt, and the second vision recognition component is fixedly connected to the side of the second transmission belt, playing the main role of transmission and recognition, thereby improving the automation effect.

[0011] Preferably, the extension end of the lifting rod is provided with a tilting motor, wherein the hydraulic component is fixedly connected to the output end of the tilting motor, playing the main role of tilting and adjustment, so that the negative pressure adsorption component can move above the first and second conveyor belts.

[0012] Preferably, the negative pressure adsorption component is located at the top of the first and second conveyor belts and plays a key role in gripping circuit board components for encapsulation.

[0013] Preferably, four sets of clamps are provided and are located around the first conveyor belt to facilitate the limiting and clamping of the integrated circuit board at the top of the first conveyor belt.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. The positioning mechanism for integrated circuit board packaging, through actions such as gripping, lifting, stretching and negative pressure adsorption, and the first and second transmission belts of the transmission unit, together with the first and second vision recognition components, can automatically identify and transmit components, thereby improving the automation effect of the packaging work, reducing manual operation and increasing production efficiency.

[0016] 2. The positioning mechanism for the integrated circuit board packaging uses four sets of clamping plates to limit and hold the integrated circuit board at the top of the first conveyor belt, which can accurately limit and fix the integrated circuit board. At the same time, the gripping mechanism enables the negative pressure adsorption component to accurately grip and place the components, ensuring the positional accuracy of the components during the packaging process, thereby improving the packaging quality. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the appearance and structure of this utility model;

[0018] Figure 2 This utility model Figure 1 Enlarged structural diagram at point A in the middle;

[0019] Figure 3 This is a side view of the structure of this utility model;

[0020] Figure 4 This utility model Figure 3 Enlarged structural diagram at point B.

[0021] In the diagram: 1. Gripping mechanism; 101. Guide rail; 102. Displacement motor; 103. Transmission threaded rod; 104. Slider; 105. Lifting rod; 106. Tilting motor; 107. Hydraulic component; 108. Telescopic rod; 109. Negative pressure adsorption component; 2. Positioning mechanism; 201. Processing table; 202. Adjustment motor; 203. Turntable; 204. Cylinder; 205. Extension rod; 206. Clamping plate; 211. First transmission belt; 212. Second transmission belt; 213. First vision recognition component; 214. Second vision recognition component. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-4 The present invention provides the following technical solution: a positioning mechanism for integrated circuit board packaging, including a gripping mechanism 1 and a positioning mechanism 2, wherein the gripping mechanism 1 is movably connected to the top of the positioning mechanism 2.

[0024] The positioning mechanism 2 includes a limiting unit and a transmission unit. The limiting unit is movably connected to both sides of the transmission unit, and the transmission unit is movably connected to the bottom of the gripping mechanism 1.

[0025] The gripping mechanism 1 consists of a guide rail 101, a displacement motor 102, a transmission threaded rod 103, a slider 104, a lifting rod 105, a hydraulic assembly 107, a telescopic rod 108, and a negative pressure adsorption assembly 109. The displacement motor 102 is fixedly connected to the side of the guide rail 101, the transmission threaded rod 103 is rotatably connected to the inside of the guide rail 101, the slider 104 is threadedly connected to the inside of the guide rail 101, the lifting rod 105 is movably connected to the top of the slider 104, and a tilting motor 106 is provided at the extended end of the lifting rod 105. The hydraulic assembly 107 is fixedly connected to... Connected to the output end of the flip motor, it plays the main role of flip adjustment, allowing the negative pressure adsorption component 109 to move above the first conveyor belt 211 and the second conveyor belt 212. The hydraulic component 107 is fixedly connected to the top of the lifting rod 105, and the telescopic rod 108 is movably connected to the side of the hydraulic component 107. The negative pressure adsorption component 109 is fixedly connected to the extension end of the telescopic rod 108. The negative pressure adsorption component 109 moves above the first conveyor belt 211 and the second conveyor belt 212, playing the main role of gripping circuit board components for packaging.

[0026] The limiting unit consists of a processing table 201, an adjusting motor 202, a turntable 203, a cylinder 204, an extension rod 205, and a clamping plate 206. The processing table 201 is fixedly connected to the side of the guide rail 101. The adjusting motor 202 is fixedly connected to the inside of the processing table 201. The turntable 203 is rotatably connected to the top of the processing table 201. The cylinder 204 is fixedly connected to the top of the turntable 203. The extension rod 205 is movably connected to the side of the cylinder 204. The clamping plate 206 is fixedly connected to the extension end of the extension rod 205, playing the main role of limiting and fixing. Four sets of clamping plates 206 are provided and located on the first conveyor belt 21. The surrounding movement of the 1 facilitates the limiting and clamping of the integrated circuit board on the top of the first conveyor belt 211. The transmission unit consists of the first conveyor belt 211, the second conveyor belt 212, the first vision recognition component 213, and the second vision recognition component 214. The first conveyor belt 211 is movably connected to the top of the processing table 201, the second conveyor belt 212 is fixedly connected to the side of the guide rail 101, the first vision recognition component 213 is fixedly connected to the side of the first conveyor belt 211, and the second vision recognition component 214 is fixedly connected to the side of the second conveyor belt 212, playing the main role of transmission and recognition, and improving the automation effect.

[0027] In use, the displacement motor 102 drives the transmission threaded rod 103 to rotate within the guide rail 101, driving the slider 104 to move, which in turn drives the lifting rod 105 to move. The angle of the hydraulic component 107 is adjusted by the flip motor 106, allowing the negative pressure adsorption component 109 to move above the first transmission belt 211 and the second transmission belt 212, which can be used to adsorb parts. The first transmission belt 211 and the second transmission belt 212 transmit parts in cooperation with the first vision recognition component 213 and the second vision recognition component 214. The adjustment motor 202 in the processing table 201 drives the turntable 203 to rotate. The cylinder 204 and the extension rod 205 control the four sets of clamping plates 206 to limit and fix the integrated circuit board on the first transmission belt 211. All components work together to complete the packaging and positioning work.

[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A positioning mechanism for integrated circuit board packaging, comprising a gripping mechanism (1) and a positioning mechanism (2), characterized in that: The gripping mechanism (1) is movably connected to the top of the positioning mechanism (2); The positioning mechanism (2) includes a limiting unit and a transmission unit. The limiting unit is movably connected to both sides of the transmission unit, and the transmission unit is movably connected to the bottom of the gripping mechanism (1).

2. The positioning mechanism for integrated circuit board packaging according to claim 1, characterized in that: The gripping mechanism (1) consists of a guide rail (101), a displacement motor (102), a transmission threaded rod (103), a slider (104), a lifting rod (105), a hydraulic assembly (107), a telescopic rod (108), and a negative pressure adsorption assembly (109). The displacement motor (102) is fixedly connected to the side of the guide rail (101), the transmission threaded rod (103) is rotatably connected to the inside of the guide rail (101), the slider (104) is threadedly connected to the inside of the guide rail (101), the lifting rod (105) is movably connected to the top of the slider (104), the hydraulic assembly (107) is fixedly connected to the top of the lifting rod (105), the telescopic rod (108) is movably connected to the side of the hydraulic assembly (107), and the negative pressure adsorption assembly (109) is fixedly connected to the extension end of the telescopic rod (108).

3. The positioning mechanism for integrated circuit board packaging according to claim 2, characterized in that: The limiting unit consists of a processing table (201), an adjusting motor (202), a turntable (203), a cylinder (204), an extension rod (205), and a clamping plate (206). The processing table (201) is fixedly connected to the side of the guide rail (101). The adjusting motor (202) is fixedly connected to the inside of the processing table (201). The turntable (203) is rotatably connected to the top of the processing table (201). The cylinder (204) is fixedly connected to the top of the turntable (203). The extension rod (205) is movably connected to the side of the cylinder (204). The clamping plate (206) is fixedly connected to the extension end of the extension rod (205).

4. The positioning mechanism for integrated circuit board packaging according to claim 3, characterized in that: The transmission unit consists of a first transmission belt (211), a second transmission belt (212), a first visual recognition component (213), and a second visual recognition component (214). The first transmission belt (211) is movably connected to the top of the processing table (201), the second transmission belt (212) is fixedly connected to the side of the guide rail (101), the first visual recognition component (213) is fixedly connected to the side of the first transmission belt (211), and the second visual recognition component (214) is fixedly connected to the side of the second transmission belt (212).

5. The positioning mechanism for integrated circuit board packaging according to claim 4, characterized in that: The extension end of the lifting rod (105) is provided with a tilting motor (106), wherein the hydraulic component (107) is fixedly connected to the output end of the tilting motor.

6. The positioning mechanism for integrated circuit board packaging according to claim 5, characterized in that: The negative pressure adsorption component (109) is located on top of the first transmission belt (211) and the second transmission belt (212).

7. The positioning mechanism for integrated circuit board packaging according to claim 6, characterized in that: The clamps (206) are provided in four sets and are located around the first conveyor belt (211).