LED lamp bead and electronic equipment

Abstract

The utility model provides a kind of LED lamp pearl and electronic equipment, including substrate;First cup body being arranged on substrate and second cup body being arranged at the central position in first cup body, central cavity is formed in second cup body, and peripheral cavity is formed between first cup body and second cup body;At least two groups of RGB chip groups are equipped in central cavity, and white light chip group is equipped in peripheral cavity, white light chip in white light chip group is connected in series, and white light chip group is arranged around the periphery of RGB chip group, the RGB chip group in the utility model can be well color mixed with the white light emitted by surrounding white light chip group, and excellent color effect is realized.

Description

Technical Field

[0001] This utility model belongs to the technical field of LED beads, specifically relating to an LED bead and electronic device. Background Technology

[0002] LED technology demonstrates extremely broad development prospects, with its development trend focusing on achieving higher brightness, better weather resistance, higher luminous density and uniformity, and lower costs. As the market matures, more stringent requirements are being placed on the power, color, luminous efficiency, and integration level of LED lighting fixtures. Therefore, lighting product design needs to continuously optimize dimensions, improve circuit compatibility, enrich color choices, and extend lifespan.

[0003] To meet the aforementioned characteristics, LED chips also need to achieve improvements in photoelectric performance, color diversity, stability, and reliability. Regarding photoelectric characteristics, the voltage, power, and luminous efficiency of the chips need continuous improvement to cater to the design needs of different customers. In terms of color diversity, the options have expanded from single-color light and RGB chip combinations to RGBW, RGBWW, and more. Regarding reliability, the focus is on improving heat dissipation and increasing bracket strength.

[0004] For existing LED chips, taking the 5054RGBWW full-color dual-temperature LED chip as an example, it includes three cups separated by partitions. The middle cup contains the RGB chip, and the upper and lower cups contain the white light chip. They are encapsulated with transparent glue or transparent glue with added diffusing agent to form full-color RGB. The upper and lower cups are encapsulated with corresponding fluorescent glue to form white light of different color temperatures. However, it has the following problems:

[0005] 1. Uneven light distribution: The gaps between the LED chips and the lamp cup walls can easily cause uneven light distribution, resulting in problems such as light spots, shadows, and overlapping images at the edge of the cup. Since the LED chips are already spaced within the LED chips, the distance between the LED chips in the lamp is even greater, resulting in a larger spacing between the light-emitting points. This will reduce the overall brightness, and the color light distribution will be scattered, affecting the lighting effect.

[0006] 2. Unsatisfactory color mixing effect: In LED lighting fixtures, such as 5054RGBWW full-color dual-temperature LED beads, the cup-shaped and partition design affects the overall color mixing effect of the LED beads. The three cups are separated by plastic partitions and are distributed in a strip shape. At this time, the light of the LED chip in the corresponding cup can only be emitted from the upper surface of the corresponding cup. The upper and lower cups are on both sides, and the two white lights are located in different cups. The light emitted by the LED in each cup is separated by the cup wall, resulting in obvious light spots and shadows. The cup opening area is small and the spacing is large, resulting in a small light emission surface of the LED light and an unsatisfactory light mixing effect between the cups. Utility Model Content

[0007] To address the aforementioned technical problems, this utility model provides an LED lamp bead and an electronic device to solve the problems in the background art.

[0008] This utility model provides the following technical solution: an LED lamp bead, comprising:

[0009] substrate;

[0010] A first cup body is disposed on the substrate and a second cup body is disposed at the center of the first cup body. A central cavity is formed in the second cup body, and a peripheral cavity is formed between the first cup body and the second cup body. Both the first cup body and the second cup body are provided with an encapsulation layer.

[0011] The central cavity is equipped with at least two sets of RGB chips;

[0012] The peripheral cavity is equipped with a white light chip group, and the white light chips in the white light chip group are connected in series. The white light chip group is arranged around the RGB chip group.

[0013] Compared with existing technologies, the beneficial effects of this application are as follows: In terms of heat dissipation performance, this utility model achieves a significant reduction in thermal resistance by adopting a large solder pad heat dissipation and a direct-lit thermoelectric separation heat dissipation structure, thereby significantly reducing the risk of LED damage due to overheating. This improvement in heat dissipation performance not only enhances the reliability of the LED, but also provides convenience for the expansion of the LED power voltage. The LED chips can be evenly distributed on different pin functional area frames according to needs, ensuring uniform heat distribution of the LED chips. In terms of light distribution and color mixing effect, the reduction of LED thermal resistance and the optimization of functional area area allow more chips to be placed in the cup, thereby improving light density, light intensity and light emission uniformity. This utility model adopts a uniform complementary white light chip group to achieve overall white light complementarity. Only a small number of LED chips are needed to meet the photoelectric parameter requirements, achieve uniform illumination, which is beneficial to the uniformity design of the lamp and saves costs. Secondly, since the chips inside the LED chips are evenly distributed, the light source can illuminate the target area more evenly, reducing the occurrence of light spots and shadows. In particular, the RGB chip group is located in the middle, which can perform good color mixing with the surrounding white light to achieve excellent color effect.

[0014] Preferably, the inner edges of the first cup body and / or the second cup body are square or circular.

[0015] Preferably, the RGB chipset includes three monochrome chips, namely a red light chip, a green light chip and a blue light chip, and the monochrome chips with the same light emission color in each RGB chipset are connected in series.

[0016] Preferably, the white light chips in the white light chip group are provided with fluorescent adhesive layers of the same or different color temperatures, so that each white light chip emits white light of the same or different color temperatures.

[0017] Preferably, a first partition wall is provided between the first cup body and the second cup body, the first partition wall being used to divide the peripheral cavity into several first sub-regions.

[0018] Preferably, there are at least two white light chip groups, and a second partition wall is provided between two adjacent white light chip groups. The second partition wall is used to divide the peripheral cavity into several second sub-regions. At least two white light chip groups are independently or jointly arranged around the periphery of the RGB chip group.

[0019] Preferably, the second cup body is higher than the first cup body, and the encapsulation layer includes a first encapsulation adhesive layer disposed in the central cavity, a second encapsulation adhesive layer disposed in the peripheral cavity, and a third encapsulation adhesive layer disposed in the height gap between the first cup body and the second cup body.

[0020] Preferably, the substrate is provided with a plurality of pads, and the number of additional white light chip groups is equal to the number of additional pad groups.

[0021] Preferably, a marker corner is provided at the corner position of the first cup body.

[0022] The present invention provides the following technical solution: an electronic device, the electronic device comprising the aforementioned LED beads. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A perspective view of the LED lamp bead provided in Embodiment 1 of this utility model;

[0025] Figure 2 A plan view of the LED lamp bead provided in Embodiment 1 of this utility model;

[0026] Figure 3 A perspective view of the solder pads provided in Embodiment 1 of this utility model;

[0027] Figure 4 A perspective view of the LED lamp bead provided in Embodiment 2 of this utility model;

[0028] Figure 5 A plan view of the LED lamp bead provided in Embodiment 2 of this utility model;

[0029] Figure 6 A perspective view of the LED lamp bead provided in Embodiment 3 of this utility model;

[0030] Figure 7 A plan view of the LED lamp bead provided in Embodiment 3 of this utility model;

[0031] Figure 8 A perspective view of the LED lamp bead provided in Embodiment 4 of this utility model;

[0032] Figure 9 A perspective view of the solder pads provided in Embodiment 4 of this utility model;

[0033] Figure 10 A plan view of the LED lamp bead provided in Embodiment 5 of this utility model;

[0034] Figure 11 A perspective view of the solder pads provided in Embodiment 5 of this utility model;

[0035] Figure 12 This is a plan view of the LED lamp bead provided in Embodiment Six of this utility model.

[0036] Explanation of reference numerals in the attached figures:

[0037] substrate 1 solder pads 2 First cup 3 Second cup 4 RGB chipset 5 White light chipset 6 bond wire 7 fluorescent adhesive layer 8 First section retaining wall 9 Second section retaining wall 10 First encapsulating adhesive layer 11 Second encapsulating adhesive layer 12 Third encapsulating adhesive layer 13 Sign corner 14

[0038] The present invention will be further described below with reference to the accompanying drawings and description. Detailed Implementation

[0039] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0040] In the description of the embodiments of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0041] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0042] In this embodiment of the invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.

[0043] Example 1

[0044] like Figure 1-3 As shown, in the first embodiment of this utility model, an LED light bead is specifically disclosed, comprising:

[0045] substrate1;

[0046] Specifically, in this embodiment, the substrate 1 is further provided with several pads 2. The substrate 1 is made of plastic material, such as PPA, PCT, EMC, or other non-conductive materials. The pads 2 are directly disposed on the substrate 1. The pads 2 are made of metal material, such as copper, iron, aluminum, or alloys. The pads 2 are distributed planarly on the substrate 1. White tracks are provided between the pads 2. The number of pads 2 is determined according to the number of chips in the RGB chip group 5 and the white light chip group 6. In this application, the pads 2 and the RGB chip group 5 and the white light chip group 6 adopt a direct-down thermoelectric separation heat dissipation structure, which significantly reduces the thermal resistance and thus significantly reduces the risk of LED damage due to overheating. This improved heat dissipation performance not only enhances the reliability of the LED but also facilitates the expansion of the LED power voltage. The LED chips can be evenly distributed on the pin functional area frame of different pads 2 as needed to ensure uniform heat distribution of the LED.

[0047] A first cup body 3 is disposed on the substrate 1 and a second cup body 4 is disposed at the center position inside the first cup body 3. A central cavity is formed inside the second cup body 4, and a peripheral cavity is formed between the first cup body 3 and the second cup body 4. Both the first cup body 3 and the second cup body 4 are provided with an encapsulation layer.

[0048] Specifically, the first cup body 3 is fixed on the substrate 1, and the first cup body 3 has a bowl-shaped structure, thus forming a cavity inside the first cup body 3. A second cup body 4 is provided at the center of this cavity. The color and material of the second cup body 4 and the first cup body 3 can be designed in various ways according to the application: such as white PCT, white PPA, black PPA, transparent PC, white EMC, white ceramic, etc. Therefore, the first cup body 3 and the second cup body 4 form a cup-within-a-cup structure, and the second cup body 4 is also a cup-shaped structure, thus forming a central cavity inside the second cup body 4. An outer cavity is formed between the inner wall of the first cup body 3 and the outer wall of the second cup body 4. The outer cavity is located around the central cavity, and the two are separated by the second cup body 4.

[0049] The central cavity is equipped with several sets of RGB chip groups 5;

[0050] Specifically, in this embodiment, a single RGB chipset 5 includes three monochrome chips: a red chip, a green chip, and a blue chip. The monochrome chips with the same emitting color are connected in series, such as red chips connected in series, green chips connected in series, and blue chips connected in series. The voltage of the monochrome chips is 3V. In practice, the number of RGB chipsets 5, the number of monochrome chips, and the voltage of the monochrome chips can be adjusted according to actual needs. In this embodiment, there are three RGB chipsets.

[0051] The white light chips in the white light chip group 6 are connected in series, and the white light chip group 6 is arranged around the RGB chip group 5.

[0052] For a single white light chip group 6, it includes several white light chips connected in series. These white light chips are evenly distributed in the outer cavity, and several white light chips are arranged around the periphery of the RGB chip group 5. Through the cooperation and mixing of the central RGB chip group 5 and the peripheral white light chip group 6, good color mixing can be achieved, resulting in excellent color effects. At the same time, the overall complementarity of white light can also be achieved.

[0053] It should be noted that, in this embodiment, the white light chip group 6 has one set, which includes nine 3V white light chips. In this embodiment, there are eight pads 2 and three sets of RGB chip groups 5. Therefore, there are nine monochrome chips in the central cavity. The monochrome chips in this application are all dual-electrode chips. The pads 2 are labeled a to h from top to bottom and left to right. The pads 2 on the upper side are labeled a, c, e, and g, and the pads 2 on the lower side are labeled b, d, f, and h. The three red light chips are connected to pads e. On pad f, three green LEDs are connected to pads c, d, and f respectively, three blue LEDs are connected to pads f, g, and h respectively, and nine white LEDs are evenly distributed on pads a to h. This invention uses a combination of dual-electrode red light and insulating adhesive (approximately 99% silicone resin) to successfully remove silver paste, thus completely solving the problem of dead LEDs caused by the peeling of red light silver paste. It should also be noted that in the accompanying drawings of this application, the "+" and "-" at the top and bottom of the pads represent the positive and negative electrodes respectively.

[0054] It should also be noted that the number of additional white light chip groups 6 is equal to the number of additional pad groups 2.

[0055] In this embodiment, the white light chip group 6 is a group, so the initial number of pads 2 is 8, that is, four groups. When the white light chip group 6 is increased to two groups, the number of pads 2 needs to be increased by one group, that is, 5 groups, 10 pads.

[0056] In this embodiment, the RGB chip group 5 and the white light chip group 6 are uniformly connected to the corresponding pads 2 via bonding wires 7.

[0057] The inner edge of the first cup body 3 is circular, and the inner edge of the second cup body 4 is circular.

[0058] Specifically, its cup-within-a-cup structure features an inner and outer circle. By setting the first cup 3 and the second cup 4 in a circular configuration, the light source can be illuminated more evenly on the target area, reducing the appearance of light spots and shadows. At the same time, all the solder pads 2 can be tightly connected together, further improving the overall strength of the LED.

[0059] In this embodiment, each white light chip in the white light chip group 6 is provided with a fluorescent adhesive layer 8 with the same or different color temperatures, so that each white light chip emits white light with the same or different color temperatures.

[0060] Specifically, the fluorescent adhesive layer 8 can be prepared by spraying fluorescent adhesive with phosphor or dotting fluorescent adhesive with phosphor. As for the entire lamp bead structure, depending on the actual situation, different phosphor layers 8 can be selected and attached to the white light chip group 6. The color temperature of the light emitted by the white light chip can be set to be all the same, partially the same, or all different, thereby further improving the complementary and light mixing effect.

[0061] Wherein, the second cup body 4 is higher than the first cup body 3, and the encapsulation layer includes a first encapsulation adhesive layer 11 disposed in the central cavity, a second encapsulation adhesive layer 12 disposed in the peripheral cavity, and a third encapsulation adhesive layer 13 disposed in the height gap between the first cup body and the second cup body.

[0062] Specifically, the encapsulating adhesive can be a transparent adhesive or a transparent adhesive filled with a diffusing agent. The preparation sequence of the encapsulating layer is as follows: first, a first encapsulating adhesive layer 11 is prepared in the central cavity, and then a second encapsulating adhesive layer 12 is prepared in the outer cavity, with the first encapsulating adhesive layer 11 and the second encapsulating adhesive layer 12 having the same height. Then, a third encapsulating adhesive layer 13 is prepared on the first encapsulating adhesive layer 11 and the second encapsulating adhesive layer 12 to further enhance the light mixing effect.

[0063] In this embodiment, a marker corner 14 is provided at the corner position of the first cup body 3.

[0064] Specifically, the marking angle 14 is used to mark the direction of the LED beads to facilitate processing.

[0065] Example 2

[0066] like Figure 4-5 As shown, in the second embodiment of this utility model, an LED lamp bead is specifically disclosed. The difference between the LED lamp bead provided in this second embodiment and the LED lamp bead provided in the first embodiment is that the inner edge of the first cup body 3 is square.

[0067] Specifically, the cup-within-a-cup structure in this embodiment presents an inner circle and an outer square structure, which can also achieve uniform light output and mixed light output of RGB chip group 5 and white light chip group 6. Correspondingly, due to the change in the shape of the first cup body 3, the second encapsulation adhesive layer 12 and the third encapsulation adhesive layer 13 will change with the shape of the first cup body 3.

[0068] Example 3

[0069] like Figure 6-7 As shown, in the third embodiment of this utility model, an LED lamp bead is specifically disclosed. The difference between the LED lamp bead provided in this third embodiment and the LED lamp bead provided in the first embodiment is that the inner edge of the first cup body 3 is square and the inner edge of the second cup body 4 is square.

[0070] Specifically, the cup-within-a-cup structure in this embodiment presents an inner square and an outer square structure, which can also achieve uniform light output and mixed light output of RGB chip group 5 and white light chip group 6. Correspondingly, due to the change in the shape of the first cup body 3 and the second cup body 4, the first encapsulating adhesive layer 11, the second encapsulating adhesive layer 12, and the third encapsulating adhesive layer 13 will change with the shape of the first cup body 3 and the second cup body 4.

[0071] It should be noted that in another embodiment of this utility model, the cup-within-a-cup structure presents an inner square and outer circle structure, which will not be described in detail here for the sake of simplicity.

[0072] Example 4

[0073] like Figure 8-9 As shown, in the fourth embodiment of this utility model, an LED lamp bead is specifically disclosed. The difference between the LED lamp bead provided in this fourth embodiment and the LED lamp bead provided in the first embodiment is that the white light chip group 6 consists of two groups.

[0074] In this embodiment, two sets of white light chip groups 6 are provided in the peripheral cavity, and both sets of white light chip groups 6 surround the RGB chip 5. The two sets of white light chip groups 6 are arranged sequentially, that is, diffused outward from the central cavity. The two sets of white light chip groups 6 can emit white light with the same color temperature or white light with different color temperatures to improve the mixed light output effect. The two sets of white light chip groups 6 include a total of 18 3V white light chips. These white light chips are distributed in a similar way to the white light chips in Embodiment 1, and are evenly distributed on the pads. At the same time, in this embodiment, in order to enable the two sets of white light chip groups 6 to be connected smoothly, the number of pads 2 in this embodiment is increased to 10, as shown by pad aj in the figure, so that the 18 white light chips can be evenly connected to the corresponding pads 2 through bonding wires. That is, the increase in the number of white light chip groups 6 in the above embodiment is equal to the increase in the number of pads 2.

[0075] Example 5

[0076] like Figure 10-11 As shown, in the fifth embodiment of this utility model, an LED lamp bead is specifically disclosed. The LED lamp bead provided in this fifth embodiment differs from the LED lamp bead provided in the first embodiment in that: the inner edge of the first cup body 3 is square, and a first partition wall 9 is provided between the first cup body 3 and the second cup body 4. The first partition wall 9 is used to divide the outer cavity into several first sub-regions.

[0077] Specifically, one end of the first partition wall 9 is connected to the first cup body 3, and the other end is connected to the second cup body 4. Therefore, by setting at least two first partition walls 9, the outer cavity can be divided into several first sub-regions. The shape of the first sub-region can be determined according to the shape of the first cup body 3, the shape of the second cup body 4, and the number of first partition walls 9. In this embodiment, each first sub-region is provided with a set of white light chip groups 6, each group including 9 white light chips. As the number of white light chip groups 6 increases, the number of pads 2 in this embodiment is increased to 10, so that 18 white light chips can be evenly connected to the corresponding pads 2 through bonding wires. The color temperature of the phosphor layer 8 of each white light chip can be the same or different.

[0078] Meanwhile, in other embodiments of this utility model, the first partition wall 9 can be matched with the first cup body 3 and the second cup body 4 of different shapes, and there can be two sets of white light chip groups 6 in each first sub-region, or even more.

[0079] Example 6

[0080] like Figure 12 As shown, in the sixth embodiment of this utility model, an LED lamp bead is specifically disclosed. The LED lamp bead provided in this sixth embodiment is different from the LED lamp bead provided in the first embodiment in that: the inner edges of the first cup body 3 and the second cup body 4 are both square, and a second partition wall 10 is provided between two adjacent white light chip groups 6. The second partition wall 10 is used to divide the outer cavity into several second sub-regions.

[0081] Specifically, the second partition barrier 10 is disposed between two adjacent groups of white light chip groups 6. Therefore, by setting at least one second partition barrier 10, the peripheral cavity can be divided into several second sub-regions. The second sub-regions are arranged in a ring shape, and the number of second sub-regions can be determined according to the number of second partition barrier 10s. In this embodiment, each second sub-region is provided with a group of white light chip groups 6, and each group includes 9 white light chips. Since the number of white light chip groups 6 is increased, the number of pads 2 in this embodiment is increased to 10, so that 18 white light chips can be used. The light chips can be uniformly connected to the corresponding pads 2 via bonding wires. The color temperature of the phosphor layer 8 of each white light chip can be the same or different. The second partition barrier 10 can only be set when the number of outward-extending white light chip groups 6 is greater than 2. The number of outward-extending white light chip groups 6 is 1 to 5. When the second partition barrier 10 is not set, the two white light chip groups 6 together surround the RGB chip group 5. When the second partition barrier 10 is set, the two white light chip groups 6 independently surround the RGB chip group 5.

[0082] Meanwhile, in other embodiments of this utility model, the second partition wall 10 can be combined with the first cup body 3 and the second cup body 4 of different shapes. At the same time, there can also be two sets of white light chip groups 6 in each second sub-region. The number of second partition walls 10 can be two or more. The first partition wall 9 can also be combined with the second partition wall 10, that is, the second sub-region is divided by the first partition wall 9.

[0083] Meanwhile, in another embodiment of this utility model, an electronic device is also provided, which includes the LED beads provided in the above embodiment.

[0084] In summary, compared with the prior art, the beneficial effects of the LED beads in the above embodiments of this utility model are as follows: In terms of heat dissipation performance, this utility model achieves a significant reduction in thermal resistance by adopting a large solder pad heat dissipation and a direct-down thermoelectric separation heat dissipation structure, thereby significantly reducing the risk of LED damage due to overheating. This improvement in heat dissipation performance not only enhances the reliability of the LED but also facilitates the expansion of the power voltage of the LED beads. The LED chips can be evenly distributed on different pin functional area frames according to requirements, ensuring uniform heat distribution of the LED beads; in terms of light distribution and color mixing effect, the LED beads heat dissipation performance is significantly improved. The reduction in resistance and the optimization of the functional area allow for the placement of more chips inside the cup, thereby improving light density, light intensity, and light emission uniformity. This invention uses a white light chip group 6 for uniform complementarity, achieving overall complementarity of white light. Only a small number of LEDs are needed to meet the photoelectric parameter requirements, achieving uniform illumination. This is beneficial for the uniformity design of the lamp and saves costs. Secondly, since the chips inside the LEDs are evenly distributed, the light source can illuminate the target area more evenly, reducing the occurrence of light spots and shadows. In particular, the RGB chip group 5 is located in the middle, which can mix well with the surrounding white light to achieve excellent color effects.

[0085] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An LED lamp bead, characterized in that, include: base(1); A first cup body (3) is disposed on the substrate (1) and a second cup body (4) is disposed at the center position inside the first cup body (3). A central cavity is formed inside the second cup body (4), and a peripheral cavity is formed between the first cup body (3) and the second cup body (4). Both the first cup body (3) and the second cup body (4) are provided with an encapsulation layer. The central cavity is equipped with at least two sets of RGB chipsets (5); The peripheral cavity is provided with a white light chip group (6), and the white light chips in the white light chip group (6) are connected in series. The white light chip group (6) is arranged around the periphery of the RGB chip group (5).

2. The LED lamp bead according to claim 1, characterized in that, The inner edges of the first cup body (3) and / or the second cup body (4) are square or circular.

3. The LED lamp bead according to claim 1, characterized in that, The RGB chip group (5) includes three monochrome chips, namely a red light chip, a green light chip and a blue light chip. The monochrome chips with the same light emission color in each RGB chip group (5) are connected in series.

4. The LED lamp bead according to claim 1, characterized in that, The white light chip in the white light chip group (6) is provided with a fluorescent adhesive layer (8) with the same or different color temperature, so that each white light chip emits white light with the same or different color temperature.

5. The LED lamp bead according to claim 1, characterized in that, A first partition wall (9) is provided between the first cup body (3) and the second cup body (4), and the first partition wall (9) is used to divide the outer cavity into several first sub-regions.

6. The LED lamp bead according to claim 1, characterized in that, There are at least two white light chip groups (6), and a second partition wall (10) is provided between two adjacent white light chip groups (6). The second partition wall (10) is used to divide the peripheral cavity into several second sub-regions. At least two white light chip groups (6) are independently or jointly arranged around the periphery of the RGB chip group (5).

7. The LED lamp bead according to claim 1, characterized in that, The second cup body (4) is higher than the first cup body (3). The encapsulation layer includes a first encapsulation adhesive layer (11) disposed in the central cavity, a second encapsulation adhesive layer (12) disposed in the peripheral cavity, and a third encapsulation adhesive layer (13) disposed in the height gap between the first cup body (3) and the second cup body (4).

8. The LED lamp bead according to claim 1, characterized in that, The substrate (1) is provided with a plurality of pads (2), and the number of additional white light chip groups (6) is equal to the number of additional pads (2).

9. The LED lamp bead according to any one of claims 1-8, characterized in that, The first cup body (3) has a corner marker (14) at the corner position.

10. An electronic device, characterized in that, The electronic device includes LED beads as described in any one of claims 1-9.

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