A sensor system and aircraft
By integrating TENG, EMG, and PENG modules into a sensor system, combined with magnetic levitation and streamlined design, the problems of signal cross-interference and external power supply in aircraft wing vibration and deformation monitoring are solved, enabling high-precision, real-time monitoring and aerodynamic performance optimization.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEIJING INST OF NANOENERGY & NANOSYST
- Filing Date
- 2025-06-17
- Publication Date
- 2026-06-02
Smart Images
Figure CN224317084U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of aviation technology, and in particular to a sensor system and an aircraft. Background Technology
[0002] As modern aircraft develop towards higher speeds, lighter structures, and higher mission loads, load-bearing components such as wings are subjected to continuous and complex aerodynamic loads during flight, making them prone to structural vibration, deformation, and fatigue damage. The aeroelastic response of wings not only directly affects lift and stability but can also induce serious consequences such as stall, propagation of microcracks in materials, and even structural disintegration.
[0003] In aerospace structures, vibration and deformation often occur simultaneously. The output signals of sensors in related technologies are prone to cross-interference, especially under high-frequency excitation or nonlinear response, where the signal superposition error rate can be as high as 30% or more.
[0004] Therefore, there is an urgent need for a sensor system to monitor wing vibration and deformation with high precision and in real time. Utility Model Content
[0005] This application discloses a sensor system and an aircraft for sensing the vibration and deformation of objects with high precision and in real time.
[0006] To achieve the above objectives, this application provides the following technical solution:
[0007] In a first aspect, this application provides a sensor system, comprising: a vibration sensing sensor and a deformation sensing sensor, wherein the vibration sensing sensor includes a triboelectric nanogenerator (TENG) module and an electromagnetic generator (EMG) module, and the deformation sensing sensor includes a piezoelectric nanogenerator (PENG) module, wherein...
[0008] Both the TENG module and the EMG module are used to sense the vibration of an object and output electrical signals that characterize the vibration information of the object.
[0009] The PENG module is used to sense the deformation and vibration of the object, acquire a first electrical signal characterizing the deformation and vibration of the object and a second electrical signal characterizing only the vibration of the object, and differentially decouple the first electrical signal and the second electrical signal to output a target electrical signal characterizing the deformation of the object.
[0010] The sensor system provided in this application embodiment senses the vibration of an object through the TENG module and EMG module, and outputs an electrical signal characterizing the vibration information of the object. It senses the vibration and deformation of the object through the PENG module, and outputs a target electrical signal characterizing the deformation of the object through differential decoupling. Thus, it can accurately distinguish the vibration information and deformation information of an object in a complex dynamic environment, and realize high-precision, real-time sensing of the vibration and deformation of the object. At the same time, the TENG module, EMG module and PENG module can all be self-powered, without the need for external power supply or centralized wiring, thereby reducing system complexity, weight and reliability risks.
[0011] Furthermore, the TENG module includes: a first electrode, a second electrode, a permanent magnet, multiple support pillars, and a first load assembly, wherein,
[0012] The plurality of support pillars are disposed between the first electrode and the second electrode, forming a cavity between the plurality of support pillars. The permanent magnet is placed in the cavity. A first material is disposed on the surface of the permanent magnet. A second material is disposed on the side of the first electrode opposite to the permanent magnet. A second material or a third material is disposed on the side of the second electrode opposite to the permanent magnet. The first material and the second material have different electronegativity. The first material and the third material have different electronegativity. A first end of the first load assembly is connected to the first electrode, and a second end is connected to the second electrode.
[0013] The sensor system provided in this application uses a magnetic levitation structure for the TENG module, which can avoid mechanical wear, enhance fatigue resistance, and avoid problems such as signal drift, adhesion failure, and response lag under high flow rate and strong vibration environment.
[0014] Furthermore, the EMG module includes: a coil, a non-magnetic housing, and a second load assembly. The non-magnetic housing is arranged around the permanent magnet and disposed within the cavity. The coil is wound around the non-magnetic housing. A first end of the second load assembly is connected to one end of the coil, and a second end is connected to the other end of the coil.
[0015] Furthermore, the PENG module includes: a first piezoelectric unit, a second piezoelectric unit, and a differential circuit. The first piezoelectric unit is fixed to the surface of the object with silicone, the second piezoelectric unit is rigidly fixed to the first piezoelectric unit, and the input terminals of the differential circuit are respectively connected to the first piezoelectric unit and the second piezoelectric unit.
[0016] Furthermore, the TENG module, the EMG module, and the PENG module are integrated into the same housing.
[0017] Furthermore, the housing has a streamlined structure.
[0018] Furthermore, the housing is provided with a vortex generator structure and / or an airflow guiding channel.
[0019] The sensor system provided in this application integrates the TENG module, EMG module, and PENG module into the same housing. Through the design of the streamlined housing and vortex generator, when the sensor system is installed on the wing of an aircraft, the optimal aerodynamic performance can be achieved by choosing a suitable installation position, minimizing drag and increasing lift, thus taking into account both monitoring function and aerodynamic stability from the source.
[0020] Secondly, embodiments of this application provide an aircraft, including a fuselage, a wing, and a sensor system provided in the first aspect of this application. The sensor system is disposed on the wing and is used to sense the deformation information and vibration information of the wing.
[0021] The aircraft provided in this application embodiment, by being equipped with the sensor system provided in this application embodiment, is able to accurately distinguish between the vibration information and deformation information of the wing in a complex dynamic environment, thereby achieving high-precision and real-time perception of the wing's vibration and deformation.
[0022] Furthermore, after integration, the TENG module and the EMG module are distributed along with the PENG module on the wing, or...
[0023] The TENG module, EMG module, and PENG module are integrated and installed on the wing.
[0024] Furthermore, the distance between the sensor system location and the leading edge of the wing is equal to 30% of the wing chord length. Attached Figure Description
[0025] Figure 1 This application provides a schematic diagram of the architecture of a sensor system.
[0026] Figure 2 This is a schematic diagram of the structure of a TENG module provided in an embodiment of this application;
[0027] Figure 3 This is a schematic diagram of another TENG module provided in an embodiment of this application;
[0028] Figure 4 This is a schematic diagram of the structure of an EMG module provided in an embodiment of this application;
[0029] Figure 5 This is a schematic diagram illustrating the working principle of the TENG module and EMG module provided in the embodiments of this application;
[0030] Figure 6 This is a schematic diagram of the structure of a PENG module provided in an embodiment of this application;
[0031] Figure 7 This is a schematic diagram illustrating the working principle of the PENG module provided in the embodiments of this application;
[0032] Figure 8 This is a schematic diagram of the integrated structure of a sensor system provided in an embodiment of this application;
[0033] Figure 9 This is a schematic diagram of the integrated structure of another sensor system provided in an embodiment of this application;
[0034] Figure 10 A schematic diagram illustrating the signal response characteristics of the TENG module during the wind speed increase process, as provided in this embodiment of the application.
[0035] Figure 11 A schematic diagram illustrating the signal response characteristics of the EMG module during the wind speed increase process provided in this embodiment of the application;
[0036] Figure 12 A schematic diagram illustrating the signal response characteristics of the PENG module during the deformation increment process provided in this application embodiment. Detailed Implementation
[0037] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0038] The application scenarios described in this application are for the purpose of more clearly illustrating the technical solutions of this application, and do not constitute a limitation on the technical solutions provided in this application. Those skilled in the art will understand that with the emergence of new application scenarios, the technical solutions provided in this application are also applicable to similar technical problems. In the description of this application, unless otherwise stated, "multiple" means two or more.
[0039] Before introducing the sensor system and aircraft provided in the embodiments of this application, the technical background of the embodiments of this application will be described in detail for ease of understanding.
[0040] As modern aircraft develop towards higher speeds, lighter structures, and higher mission loads, load-bearing components such as wings are subjected to continuous and complex aerodynamic loads during flight, making them prone to structural vibration, deformation, and fatigue damage. The aeroelastic response of wings not only directly affects lift and stability but can also induce serious consequences such as stall, propagation of microcracks in materials, and even structural disintegration.
[0041] In aerospace structures, vibration and deformation often occur simultaneously. The output signals of sensors in related technologies are prone to cross-interference, especially under high-frequency excitation or nonlinear response, where the signal superposition error rate can be as high as 30% or more.
[0042] Therefore, there is an urgent need for a sensor system to monitor wing vibration and deformation with high precision and in real time.
[0043] In view of this, this application provides a sensor system and an aircraft that senses the vibration of an object through a TENG module and an EMG module, and outputs an electrical signal characterizing the vibration information of the object. It senses the vibration and deformation of the object through a PENG module, and outputs a target electrical signal characterizing the deformation of the object through differential decoupling. This enables accurate differentiation between the vibration information and deformation information of an object in a complex dynamic environment, achieving high-precision and real-time sensing of the vibration and deformation of the object. At the same time, the TENG module, EMG module, and PENG module can all be self-powered, eliminating the need for external power supply or centralized wiring, thereby reducing system complexity, weight, and reliability risks.
[0044] It should be noted that the sensor system provided in this application embodiment can be applied to various types of aircraft, such as fixed-wing aircraft, rotorcraft, and drones, and can also be extended to real-time status perception of flexible structures such as wind turbine blades, bridges, track beams, and ship masts.
[0045] After introducing the background technology of the embodiments of this application, the overall concept of the embodiments of this application will be described below.
[0046] Currently, aircraft wings face vibration and deformation coupling behaviors under complex aerodynamic loads during long-term service. This is not only the root cause of material fatigue, structural cracks, and aerodynamic performance degradation, but also directly threatens flight safety and aircraft life assessment. However, existing sensor technologies still face the following critical technical challenges in sensing principles, structural design, energy supply, and data processing capabilities:
[0047] 1. The signal mode aliasing is severe, making it difficult to achieve effective decoupling and identification of vibration and deformation.
[0048] Existing sensors typically can only acquire signals of a single physical mode and are susceptible to interference from overlapping structural responses, making it difficult to accurately distinguish between vibration and deformation effects in complex dynamic environments.
[0049] 2. The structure is highly invasive and causes significant turbulence, making it difficult to meet the requirements for high aerodynamic performance.
[0050] Existing sensors require destructive embedding or external attachment, which compromises airfoil integrity and causes boundary layer separation, vortex generation, and reduced aerodynamic efficiency.
[0051] 3. Reliance on external power supply systems makes it difficult to achieve distributed deployment and long-term monitoring.
[0052] Existing sensors require external power supply or centralized wiring, which increases system complexity, weight, and reliability risks.
[0053] 4. The signal is severely interfered with, making it difficult to achieve high stability and reliability monitoring.
[0054] In high-flow-rate and high-vibration environments, existing contact sensors suffer from problems such as signal drift, adhesion failure, and response lag.
[0055] To address the aforementioned technical challenges, the sensor system provided in this application integrates a TENG module, an EMG module, and a PENG module to construct a magnetic levitation vibration detection structure and a hardware-software integrated differential deformation detection structure. Furthermore, it optimizes aerodynamic performance through a streamlined shell and an eddy current generator, thereby resolving the aforementioned technical difficulties. Specifically:
[0056] The sensor system provided in this application embodiment senses vibration information through the TENG and EMG modules, and deformation information through the double-layer piezoelectric unit and differential decoupling mechanism in the PENG module, achieving physical differentiation and high-precision identification of coupled signals under in-situ sensing conditions. The TENG and EMG modules adopt a magnetic levitation triboelectric-electromagnetic dual power generation structure, combined with a flexible piezoelectric film, to achieve self-powered operation, supporting multi-point distribution and lightweight deployment, significantly improving system integration and maintenance convenience. Moreover, the magnetic levitation structure avoids mechanical wear and enhances fatigue resistance. Its stability is verified through a 24-hour wind tunnel fatigue test, and the signal attenuation rates of both TENG and PENG are superior to the existing technology level. Finally, the TENG, EMG, and PENG modules are integrated into the same housing. Through the streamlined housing and eddy current generator integration design, and installation at a suitable position on the wing, optimal aerodynamic performance can be achieved, minimizing drag and increasing lift, thus taking into account both monitoring function and aerodynamic stability from the source.
[0057] After introducing the background technology and overall concept of the embodiments of this application, the sensor system and aircraft provided in the embodiments of this application will be described in detail below with reference to specific embodiments.
[0058] See Figure 1As shown, it is a schematic diagram of the architecture of a sensor system in an embodiment of this application, including: a vibration sensing sensor 11 and a deformation sensing sensor 12. The vibration sensing sensor 11 includes a TENG module 111 and an EMG module 112, and the deformation sensing sensor 12 includes a PENG module 121.
[0059] Both the TENG module 111 and the EMG module 112 are used to sense the vibration of an object and output electrical signals that characterize the vibration information of the object.
[0060] The PENG module 121 is used to sense the deformation and vibration of an object, acquire a first electrical signal characterizing the deformation and vibration of the object and a second electrical signal characterizing only the vibration of the object, and perform differential decoupling on the first and second electrical signals to output a target electrical signal characterizing the deformation of the object.
[0061] In specific implementation, such as Figure 2 As shown, the TENG module includes: a first electrode 21, a second electrode 22, a permanent magnet 23, multiple support pillars (not shown in the figure), and a first load assembly 24. Multiple support pillars are disposed between the first electrode 21 and the second electrode 22, forming a cavity between them. The permanent magnet 23 is placed within the cavity. A first material is disposed on the surface of the permanent magnet 23. A second material is disposed on the side of the first electrode 21 opposite to the permanent magnet 23. A second material or a third material is disposed on the side of the second electrode 22 opposite to the permanent magnet 23. The first material and the second material have different electronegativity, and the first material and the third material have different electronegativity. The first end of the first load assembly 24 is connected to the first electrode 21, and the second end is connected to the second electrode 22.
[0062] The first material and the second material can be any pair of materials with different electronegativity, such as nylon film, polyamide PA, polytetrafluoroethylene PTFE, fluorinated ethylene propylene copolymer FEP, polyimide Kapton, and polyvinylidene fluoride PVDF. Similarly, the first material and the third material can also be any pair of materials with different electronegativity, such as nylon film, PA, PTFE, FEP, Kapton, and PVDF.
[0063] like Figure 3 As shown, the TENG module in this embodiment of the application uses four-pole support columns (four support columns 30) arranged at equal intervals to support the permanent magnet. This structure can be extended to other magnetic arrangement schemes, including but not limited to three-pole, six-pole, or even ring permanent magnet array structures. In this embodiment of the application, the permanent magnet is a cylindrical permanent magnet, but it can also be replaced with a spherical, ellipsoidal, or multi-segment stacked structure according to the actual vibration response requirements.
[0064] Taking the example of a nylon film on the surface of a permanent magnet and a PTFE film on the side of the first electrode facing the permanent magnet and the side of the second electrode facing the permanent magnet, the TENG module in this embodiment is based on a magnetic levitation design and adopts a symmetrical triboelectric structure. During the up-and-down movement of the permanent magnet, the nylon film and the upper and lower PTFE films alternately contact and separate, generating periodic triboelectric signals. These triboelectric signals can be extracted by the first load component and used as electrical signals to characterize the vibration information of the object.
[0065] In specific implementation, such as Figure 4 As shown, the EMG module includes: a coil 41, a non-magnetic housing, and a second load assembly. The non-magnetic housing is arranged around the permanent magnet and is disposed in the cavity. The coil 41 is wound around the non-magnetic housing. The first end of the second load assembly is connected to one end of the coil, and the second end is connected to the other end of the coil.
[0066] In practical applications, the coil in the EMG module can be a copper coil, with the number of turns adjustable within the range of 1500±100 according to sensitivity requirements. The coil material can be copper, silver-plated copper wire, alloy wire, or printed conductive ink. Furthermore, the magnetic flux cutting path can be enhanced by optimizing the grooving method of the structural housing, adjusting the angle of the support pillars, and designing spiral magnetic flux guide grooves to improve signal response under low amplitude conditions.
[0067] In the EMG module provided in this application embodiment, when an object vibrates, the permanent magnet cuts the magnetic field lines during the vibration, generating an EMG electrical signal according to Faraday's law of electromagnetic induction. The EMG electrical signal is extracted through the second resistor component and can then be used as an electrical signal characterizing the vibration information of the object.
[0068] The following is combined Figure 5 The working principles of the TENG module and EMG module in the sensor system provided in the embodiments of this application are explained.
[0069] like Figure 5 As shown, the initial states of the TENG module and the EMG module are as follows: Figure 5 As shown in (A), when the object vibrates, the permanent magnet generates periodic vertical motion under vibration excitation. Figure 5 (A) state to Figure 5 In state B, the magnet cuts through the copper coil, generating an electromagnetically induced current, the direction of which is determined by the change in the magnetic field. Figure 5 From state B Figure 5 From the state of (C) to Figure 5 In the middle (D) state, the nylon film on the magnet comes into contact with and separates from the PTFE cylinder wall, resulting in the transfer of triboelectric charge and the formation of triboelectric current. The triboelectric current and the electromagnetically induced current together characterize the vibration features, and their generation process is directly related to the mechanical stimulus.
[0070] In specific implementation, the PENG module provided in the embodiments of this application, such as Figure 6 As shown, it includes: a first piezoelectric unit 61, a second piezoelectric unit 62, and a differential circuit 63. The first piezoelectric unit 61 is fixed to the surface of the object with silicone, and the second piezoelectric unit 62 is rigidly fixed to the first piezoelectric unit 61. The input terminals of the differential circuit 63 are respectively connected to the first piezoelectric unit 61 and the second piezoelectric unit 62.
[0071] The first piezoelectric unit 61 and the second piezoelectric unit 62 can both be in the form of two electrode layers and one PVDF film layer, with the PVDF film layer sandwiched between the two electrode layers. The electrode layer material can be copper, aluminum, gold, silver, carbon nanofiber ink, etc., and the PVDF film layer can also be replaced with other piezoelectric materials such as PZT piezoelectric ceramics, PVDF-TrFE composite films, BaTiO microfilms, and ZnO nanoarrays.
[0072] In practical applications, the first piezoelectric unit 61 can be embedded in the silicone layer to sense the overall strain of the object, and the second piezoelectric unit 62 can be mounted on the rigid upper shell 64 to respond only to the vibration of the object. The electrical signals generated by the two are decoupled through the differential circuit 63 to extract the deformation signal.
[0073] It should be noted that the PENG module in this embodiment includes two layers of piezoelectric units. In other embodiments of this application, the PENG module can also be extended to a structure of three or more layers to achieve multi-layer sensitization. This embodiment does not limit the number of piezoelectric units in the PENG module.
[0074] The following is combined Figure 7 The working principle of the PENG module in the sensor system provided in the embodiments of this application will be explained.
[0075] like Figure 7 As shown, the initial state of the PENG module is as follows: Figure 7 As shown in (A), the double-layer piezoelectric structure is used to synchronously acquire deformation and vibration signals. The upper piezoelectric unit is mounted on a rigid base plate (e.g., a PLA rigid base plate) and only responds to vibration. The lower piezoelectric unit is embedded in flexible silicone and is sensitive to both vibration and deformation, generating a composite current. The pure deformation signal can be extracted through differential operations. As vibration and deformation occur, the distributed current within the PENG module throughout the process is as follows: Figure 7 As shown in (B)(C)(D), the final output is the current i. PENG1 and i PENG2 The differential signal.
[0076] In practical applications, vibration sensing sensors and deformation sensing sensors can be deployed in a distributed manner or integrated together. In other words, the TENG module and EMG module can be deployed as a whole, along with the PENG module, either in a distributed manner or integrated into a single housing.
[0077] In the case where the TENG module, EMG module, and PENG module are integrated into the same housing, in order to improve the aerodynamic compatibility of the sensor system in high-speed flight environment, the embodiments of this application implement aerodynamic optimization of the sensor system housing. Specifically, the housing can adopt a streamlined structure, and a vortex generator structure and / or airflow guiding channel can also be set on the housing. The airflow adhesion and boundary layer control are optimized through CFD simulation to reduce the airflow separation area at high angles of attack.
[0078] In practical implementation, a streamlined shell is used for aerodynamic optimization. Multiple front and rear guide holes, vortex generating edges, and curved surface contraction channels can be designed to match flow fields with different angles of attack. Its geometric arrangement can be extended to asymmetric perforation, variable angle adjustable structure, or foldable shell design. Shell materials can include, but are not limited to, polycarbonate, PETG, carbon fiber reinforced composite materials, and aerospace-grade PEEK.
[0079] like Figure 8 As shown, the TENG module, EMG module, and PENG module are integrated in the same housing 80. The TENG and EMG modules adopt a magnetic levitation structure 81 with multiple support columns. Specifically, four equally spaced magnetic columns can be used to support a cylindrical permanent magnet to achieve non-contact levitation vibration response. The PENG module serves as the base plate 82, which can be a soft and hard composite base plate with an embedded double-layer PVDF piezoelectric film. One layer is fixed with silicone to simultaneously sense vibration and deformation, while the other layer is rigidly fixed to the base plate and only responds to vibration, thereby achieving signal decoupling through a differential structure.
[0080] The internal structure of the TENG module, EMG module, and PENG module integrated into the same housing will be described below with reference to the top view. Figure 9 As shown, a cavity is formed between four equally spaced magnetic pillars 90. A cylindrical permanent magnet can be placed in the cavity. A non-magnetic shell 91 is also provided in the cavity, and a coil can be wound on the non-magnetic shell 91.
[0081] The following is combined Figures 10-12 The wind tunnel test verification results of each module in the sensor system provided in the embodiments of this application are explained.
[0082] like Figure 10 As shown, Figure 10The signal response characteristics of the TENG module during the increasing wind speed process are demonstrated. From 9.6 m / s to 36.9 m / s, the signal strength increases significantly, indicating that the sensor system is sensitive to changes in vibration state. In particular, the TENG signal strengthens significantly after 20.9 m / s, characterizing the critical amplitude triggering the contact layer.
[0083] like Figure 11 As shown, Figure 11 The signal response characteristics of the EMG module during the increasing wind speed process are demonstrated. From 9.6 m / s to 36.9 m / s, the signal strength increases significantly, indicating that the sensor system is sensitive to changes in vibration state.
[0084] like Figure 12 As shown, Figure 12 The voltage response of the PENG module was demonstrated as the deformation increased from 0 to 10 mm, with the signal amplitude showing a significant linear increase, verifying the deformation sensing capability of the PVDF film and the reliability of the decoupling structure.
[0085] Based on the same concept, this application also provides an aircraft, including a fuselage, a wing, and a sensor system provided in this application. The sensor system is disposed on the wing and is used to sense the deformation information and vibration information of the wing.
[0086] The aircraft provided in this application embodiment, by being equipped with the sensor system provided in this application embodiment, is able to accurately distinguish between the vibration information and deformation information of the wing in a complex dynamic environment, thereby achieving high-precision and real-time perception of the wing's vibration and deformation.
[0087] Furthermore, the TENG module and EMG module are integrated and distributed on the wing along with the PENG module, or the TENG module, EMG module and PENG module are integrated and installed on the wing.
[0088] Furthermore, the sensor system can be installed at any location on the wing, which can increase lift by up to 1.75% and reduce drag by up to 0.8%. When the distance between the sensor system and the leading edge of the wing is equal to 30% of the wing chord length, lift can be increased by 1.75% and drag reduced by 0.8%.
[0089] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A sensor system, characterized in that, include: The system includes a vibration sensing sensor and a deformation sensing sensor. The vibration sensing sensor comprises a triboelectric nanogenerator (TENG) module and an electromagnetic generator (EMG) module. The deformation sensing sensor comprises a piezoelectric nanogenerator (PENG) module. Both the TENG module and the EMG module are used to sense the vibration of an object and output electrical signals that characterize the vibration information of the object. The PENG module is used to sense the deformation and vibration of the object, acquire a first electrical signal characterizing the deformation and vibration of the object and a second electrical signal characterizing only the vibration of the object, and differentially decouple the first electrical signal and the second electrical signal to output a target electrical signal characterizing the deformation of the object.
2. The system according to claim 1, characterized in that, The TENG module includes: a first electrode, a second electrode, a permanent magnet, multiple support pillars, and a first load component, wherein... The plurality of support pillars are disposed between the first electrode and the second electrode, forming a cavity between the plurality of support pillars. The permanent magnet is placed in the cavity. A first material is disposed on the surface of the permanent magnet. A second material is disposed on the side of the first electrode opposite to the permanent magnet. A second material or a third material is disposed on the side of the second electrode opposite to the permanent magnet. The first material and the second material have different electronegativity. The first material and the third material have different electronegativity. A first end of the first load assembly is connected to the first electrode, and a second end is connected to the second electrode.
3. The system according to claim 2, characterized in that, The EMG module includes a coil, a non-magnetic housing, and a second load assembly. The non-magnetic housing is arranged around the permanent magnet and is disposed within the cavity. The coil is wound around the non-magnetic housing. A first end of the second load assembly is connected to one end of the coil, and a second end is connected to the other end of the coil.
4. The system according to claim 1, characterized in that, The PENG module includes a first piezoelectric unit, a second piezoelectric unit, and a differential circuit. The first piezoelectric unit is fixed to the surface of the object with silicone, and the second piezoelectric unit is rigidly fixed to the first piezoelectric unit. The input terminals of the differential circuit are respectively connected to the first piezoelectric unit and the second piezoelectric unit.
5. The system according to any one of claims 1-4, characterized in that, The TENG module, the EMG module, and the PENG module are integrated into the same housing.
6. The system according to claim 5, characterized in that, The shell has a streamlined structure.
7. The system according to claim 5, characterized in that, The housing is provided with a vortex generator structure and / or an airflow guiding channel.
8. An aircraft, characterized in that, It includes a fuselage, a wing, and a sensor system as described in any one of claims 1-7, the sensor system being disposed on the wing for sensing deformation and vibration information of the wing.
9. The aircraft according to claim 8, characterized in that, After integration, the TENG module and the EMG module are distributed along with the PENG module on the wing, or The TENG module, EMG module, and PENG module are integrated and installed on the wing.
10. The aircraft according to claim 8, characterized in that, The distance between the sensor system location and the leading edge of the wing is equal to 30% of the wing chord length.