A PCB power board for parallel installation and contrast test of IGBT power modules

Abstract

This utility model provides a PCB power board for parallel installation and comparative testing of IGBT power modules, relating to the field of power electronics testing technology. It includes: a parallel installation area with multiple identical sub-areas, each sub-area for mounting one IGBT power module to be tested; a drive signal area with multiple drive signal interfaces corresponding to each sub-area; and a measurement circuit area with voltage and current measurement interfaces corresponding to each sub-area. The advantages are that by simultaneously setting multiple identical sub-areas on a single PCB power board, at least two IGBT power modules can be installed and tested independently, significantly shortening testing time, improving testing efficiency, meeting the needs of large-scale module testing, and ensuring the consistency of the testing platform and the accuracy of the test results.

Description

Technical Field

[0001] This utility model relates to the field of power electronics testing technology, and in particular to a PCB power board for parallel installation and comparative testing of IGBT power modules. Background Technology

[0002] As a core component in the field of power electronics, the performance of IGBT (Insulated Gate Bipolar Transistor) power modules directly affects the efficiency, reliability, and stability of power conversion systems. In practical applications and research and development, performance testing of IGBT power modules is crucial, and this testing typically focuses on several key parameters, primarily including switching speed, conduction losses, and thermal resistance.

[0003] Currently, in the field of IGBT power module performance testing, existing testing platforms generally have some significant limitations. The most prominent problem is that testing platforms typically only support testing a single IGBT power module. This single-module testing mode is extremely inefficient when faced with large-scale module performance comparison tests.

[0004] In actual testing, only one module can be installed and tested at a time. After testing one module, the next module needs to be disassembled and reinstalled. This not only consumes a significant amount of time and manpower but also increases the complexity of the testing operation and the possibility of errors due to the frequent disassembly and reassembly of modules. Furthermore, because only one module can be tested at a time, the time interval between tests of different modules is long, making it difficult to ensure that the testing conditions for all modules are completely consistent. For example, environmental factors such as ambient temperature and humidity may change during testing, affecting the test results and leading to a lack of comparability between the test results of different modules, making it impossible to accurately assess the performance differences between them.

[0005] Therefore, there is an urgent need for a PCB power board that can support the parallel installation and comparative testing of multiple IGBT power modules. Utility Model Content

[0006] To address the problems existing in the prior art, this utility model provides a PCB power board for parallel installation and comparative testing of IGBT power modules, comprising:

[0007] The parallel installation area is provided with multiple identical sub-areas, each of which is used to install one IGBT power module to be tested.

[0008] A drive signal area, wherein the drive signal area is provided with a plurality of drive signal interfaces respectively corresponding to each of the sub-regions;

[0009] The measurement circuit area is provided with voltage and current measurement interfaces corresponding to each of the sub-regions.

[0010] Preferably, each of the sub-regions adopts a symmetrical layout design.

[0011] Preferably, each of the sub-regions is provided with a plurality of mounting components, which are plugged into and connected to each pin of the IGBT power module to install the IGBT power module in the corresponding sub-region.

[0012] Preferably, the mounting element is a spring pin or a socket.

[0013] Preferably, the mounting component that is plugged into the gate pin of the IGBT power module is electrically connected to the drive signal interface provided in the corresponding sub-region.

[0014] Preferably, each of the IGBT power modules is connected to an external driver board through the corresponding drive signal interface.

[0015] Preferably, it also includes an overcurrent protection circuit for providing overcurrent protection for each of the IGBT power modules.

[0016] Preferably, the overcurrent protection circuit includes:

[0017] The comparator has its non-inverting input terminal connected to the sliding terminal of a first resistor and one end of a second resistor, the other end of the second resistor connected to the output terminal of the comparator, one fixed terminal of the first resistor connected to the positive terminal of a capacitor and the power supply terminal, and the other fixed terminal of the first resistor grounded and connected to the negative terminal of the capacitor.

[0018] The power device has its gate connected to the output of the comparator via a third resistor and grounded via a fourth resistor; its source is connected to the negative input of the comparator and grounded via a fifth resistor; and its drain is connected to the load ground.

[0019] The above technical solution has the following advantages or beneficial effects: by setting multiple identical sub-regions on a PCB power board at the same time, at least two IGBT power modules can be installed and tested independently at the same time, which greatly shortens the test time, improves the test efficiency, meets the needs of large-scale module testing, and ensures the consistency of the test platform and the accuracy of the test results. Attached Figure Description

[0020] Figure 1 A schematic diagram of a PCB power board for parallel installation and comparative testing of IGBT power modules is shown in a preferred embodiment of this utility model.

[0021] Figure 2 This is a schematic diagram of the structure of the IGBT power module in a preferred embodiment of the present invention.

[0022] Figure 3 A side view of the IGBT power module in a preferred embodiment of the present invention;

[0023] Figure 4 The equivalent circuit diagram of the IGBT power module is shown in a preferred embodiment of this utility model.

[0024] Figure 5 The circuit diagram of the overcurrent protection circuit is shown in a preferred embodiment of this utility model. Detailed Implementation

[0025] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. The present invention is not limited to this embodiment; other embodiments that conform to the spirit of the present invention may also fall within its scope.

[0026] In a preferred embodiment of this utility model, based on the above-mentioned problems existing in the prior art, a PCB power board for parallel installation and comparative testing of IGBT power modules is provided, comprising:

[0027] The parallel installation area is provided with multiple identical sub-areas 1, each sub-area 1 is used to install one IGBT power module to be tested;

[0028] The drive signal area is provided with multiple drive signal interfaces 2, each corresponding to a sub-region;

[0029] The measurement circuit area is equipped with voltage and current measurement interfaces 3 corresponding to each sub-region.

[0030] Specifically, in this embodiment, as Figure 1 As shown, this example uses two identical sub-regions 1 in a parallel installation area, but it is not a limitation. In practical applications, more sub-regions 1 can be set according to requirements. By setting two sub-regions 1 and adopting a symmetrical layout design, such as... Figure 1 As shown, the two IGBT power modules are symmetrical along the midline of the region between them, ensuring that the installation position, installation direction, and test conditions of the two IGBT power modules under test are consistent, which improves test efficiency and the comparability of test results. In addition, since there is a certain gap between the two adjacent sub-regions 1, it also ensures that the two adjacent IGBT power modules under test will not affect each other during the test, ensuring the independence of the test.

[0031] Furthermore, by providing an independent drive signal interface 2 for each sub-region 1, each IGBT power module can be connected to the external drive board through the corresponding drive signal interface 2. To ensure the consistency of the external drive input signal connected to the drive signal interface 2, in actual testing, the same drive interface of the external drive board can be connected to the drive signal interface 2 of the IGBT power module under test one after another to ensure the stability and safety of the external drive input signal.

[0032] Similarly, by providing independent voltage and current measurement interfaces 3 for each sub-region 1, independent voltage and current measurement channels are provided for each IGBT power module, thus meeting the testing requirements of the IGBT power module.

[0033] In a preferred embodiment of the present invention, each sub-region 1 is provided with a plurality of mounting parts 4, which are plugged into and connected to each pin of the IGBT power module so as to install the IGBT power module in the corresponding sub-region 1.

[0034] Specifically, as Figure 2 and Figure 3 Taking the IGBT power module shown as an example, this IGBT power module is a half-bridge structure with two IGBTs connected in series, such as... Figure 4 As shown, the IGBT power module has 11 pins. Pins 4, 10, 11, and 3 are power pins, providing circuit channels. When the IGBT power module is installed in the corresponding sub-area 1, each power pin is electrically connected to the voltage and current measurement interface 3. In practical applications, when it is necessary to collect the voltage and current signals of the IGBT power module, an oscilloscope probe can be connected to the corresponding voltage and current measurement interface 3. Pins 7, 8, 1, and 2 of the IGBT power module are gate pins, controlling the IGBT's turn-on and turn-off. Pins 5 and 6 are NTC pins for sampling the module temperature. During testing, each pin is plugged into the corresponding mounting component, which not only secures the IGBT power module but also provides circuit connection channels between the PCB power board and each pin.

[0035] In a preferred embodiment of this utility model, the mounting component 4 is a spring pin or a socket.

[0036] In a preferred embodiment of this utility model, the mounting component 4, which is plugged into the gate pin of the IGBT power module, is electrically connected to the drive signal interface 2 provided in the corresponding sub-region 1.

[0037] In a preferred embodiment of this invention, an overcurrent protection circuit is further included to provide overcurrent protection for each IGBT power module, ensuring the safety and reliability of the testing process.

[0038] In a preferred embodiment of this utility model, the overcurrent protection circuit includes:

[0039] Comparator L has its non-inverting input terminal connected to the sliding terminal of the first resistor R1 and one end of the second resistor R2. The other end of the second resistor R2 is connected to the output terminal of comparator L. One fixed end of the first resistor R1 is connected to the positive terminal of the capacitor C and the power supply terminal VCC. The other fixed end of the first resistor R1 is grounded and connected to the negative terminal of the capacitor C.

[0040] The gate of power device Q is connected to the output of comparator L through the third resistor R3 and grounded through the fourth resistor R4. The source of power device Q is connected to the negative input of comparator L and grounded through the fifth resistor R5. The drain of power device Q is connected to the load ground LOAG-GND.

[0041] Specifically, in this embodiment, the aforementioned power supply terminal VCC is connected to a 15V low-voltage DC source to power comparator L. The output of comparator L controls the switching of the power device Q in the IGBT power module. The voltage across the fifth resistor R5 is sampled. Given the known test current, the input voltage of comparator L is adjusted by calculating the voltage across the sampling resistor R5 and adjusting the size of the sliding rheostat R1 to be slightly greater than the voltage across the fifth resistor R5. At this time, the output of comparator L is positive, close to 15V, and the power device Q1 is turned on. When a short circuit occurs, the short circuit current is greater than the predetermined test current, and the voltage across the fifth resistor R5 is greater than the input voltage of comparator L. The output of comparator L is 0V, the power device Q1 is turned off, the circuit is interrupted, and overcurrent protection is achieved.

[0042] The above description is only a preferred embodiment of the present utility model and does not limit the implementation method and protection scope of the present utility model. Those skilled in the art should realize that all solutions obtained by equivalent substitutions and obvious changes made using the content of this specification and illustrations should be included within the protection scope of the present utility model.

Claims

1. A PCB power board for parallel installation and comparative testing of IGBT power modules, characterized in that, include: The parallel installation area is provided with multiple identical sub-areas, each of which is used to install one IGBT power module to be tested. A drive signal area, wherein the drive signal area is provided with a plurality of drive signal interfaces respectively corresponding to each of the sub-regions; The measurement circuit area is provided with voltage and current measurement interfaces corresponding to each of the sub-regions.

2. The PCB power panel of claim 1, wherein, Each of the sub-regions adopts a symmetrical layout design.

3. The PCB power panel of claim 1, wherein, Each of the sub-regions is provided with several mounting components, which are plugged into and connected to each pin of the IGBT power module to install the IGBT power module in the corresponding sub-region.

4. The PCB power panel of claim 3, wherein, The mounting component is a spring pin or a socket.

5. The PCB power panel of claim 3, wherein, The mounting component, which is plugged into the gate pin of the IGBT power module, is electrically connected to the drive signal interface provided in the corresponding sub-region.

6. The PCB power panel of claim 1, wherein, Each of the IGBT power modules is connected to an external driver board through the corresponding drive signal interface.

7. The PCB power panel of claim 1, wherein, It also includes an overcurrent protection circuit for providing overcurrent protection for each of the IGBT power modules.

8. The PCB power panel of claim 7, wherein, The overcurrent protection circuit includes: The comparator has its non-inverting input terminal connected to the sliding terminal of a first resistor and one end of a second resistor, the other end of the second resistor connected to the output terminal of the comparator, one fixed terminal of the first resistor connected to the positive terminal of a capacitor and the power supply terminal, and the other fixed terminal of the first resistor grounded and connected to the negative terminal of the capacitor. The power device has its gate connected to the output of the comparator via a third resistor and grounded via a fourth resistor. The source of the power device is connected to the negative input of the comparator and grounded via a fifth resistor. The drain of the power device is connected to the load ground.

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