A vibration damping structure, a dynamic microphone core, and an audio device.

Abstract

This application discloses a vibration damping structure, a dynamic microphone, and an audio device. The vibration damping structure includes a mounting component and a damping component. The mounting component has a mounting position for mounting structural components. The mounting component is made of a flexible material, allowing it to deform flexibly when the structural components are subjected to force. The damping component is connected to the mounting component and can absorb energy and dampen vibrations as the mounting component deforms. In this application, the mounting component provides a mounting position for mounting structural components, allowing the mounting component to sense vibration energy transmitted from the outside and quickly transmit it to the damping component. The damping component then dissipates the vibration energy in a timely manner, effectively reducing vibration transmission and achieving the effects of vibration damping, buffering, and protecting system stability. When this vibration damping structure is applied to a dynamic microphone, it can reduce distortion and interference in all aspects, significantly improving sound quality purity and meeting the requirements of applications with high sound quality and stability.

Description

Technical Field

[0001] This application relates to the field of electroacoustic conversion technology, and in particular to a vibration damping structure, a dynamic microphone core, and an audio device. Background Technology

[0002] Dynamic microphones, as key components in converting sound signals into electrical signals, are widely used in audio equipment. However, the diaphragm of dynamic microphones in related technologies is susceptible to external environmental influences, resulting in additional vibrations and sound distortion. Furthermore, existing dynamic microphones struggle to maintain sound quality under various complex vibration environments, making them unsuitable for demanding sound quality requirements in scenarios such as music recording, professional broadcasting, and high-end conferences. Utility Model Content

[0003] This application proposes a vibration damping structure to effectively solve the technical problem in related technologies where external vibrations easily affect the dynamic microphone core, making it difficult to guarantee sound quality.

[0004] This application also proposes a moving coil microphone core that includes the above-mentioned shock-absorbing structure.

[0005] This application also proposes an audio device including the aforementioned dynamic microphone core.

[0006] The first aspect of this application provides a shock-absorbing structure, including: a mounting component and a shock-absorbing component;

[0007] The mounting component has mounting positions for mounting structural members;

[0008] The mounting component is made of a flexible material so that it can undergo flexible deformation when the structural member is subjected to force.

[0009] The shock-absorbing component is connected to the mounting component, and the shock-absorbing component can perform energy-dissipating shock absorption as the mounting component deforms.

[0010] Furthermore, the shock-absorbing component is made of a flexible material so that it can absorb energy through flexible deformation in response to the deformation of the mounting component.

[0011] Furthermore, the shock-absorbing component is disposed around the circumference of the mounting component.

[0012] Furthermore, the shock-absorbing component includes a first step portion and a second step portion distributed in a stepped structure. The first step portion is disposed at the edge of the surface of the mounting component, and the second step portion is adjacent to the first step portion and disposed around the circumferential sidewall of the mounting component.

[0013] Furthermore, the outer surface of the first stepped portion adjacent to the second stepped portion is configured as an inclined surface;

[0014] And / or, a chamfered structure is formed on the outer side of the second step portion at the end adjacent to the first step portion.

[0015] Furthermore, the mounting component includes a first interlayer portion and a second interlayer portion;

[0016] The first interlayer and the second interlayer are spaced apart along the installation direction of the structural member;

[0017] The mounting positions are respectively formed on the first interlayer and the second interlayer, and the structural member is disposed through each of the mounting positions;

[0018] The shock-absorbing component is connected to the first interlayer and the second interlayer respectively, and performs energy-dissipating shock absorption as the first interlayer and the second interlayer deform.

[0019] As can be seen from the above technical solutions, the embodiments of this application have at least the following beneficial effects: by providing mounting positions for mounting structural components through mounting components, the mounting components can sense the vibration energy transmitted from the outside and quickly transmit it to the damping components, and then the damping components can dissipate the vibration energy in a timely manner, thereby effectively reducing the transmission of vibration and achieving the effects of damping, buffering, and protecting the stability of the system. When this vibration damping structure is applied to a dynamic microphone core, it can reduce distortion and interference in all aspects of the dynamic microphone core, and the sound quality purity is greatly improved compared with traditional dynamic microphone cores. The sound reproduction is more realistic and delicate, which meets the requirements of professional recording studios, high-end conference systems, live performances and other occasions with high requirements for sound quality and stability.

[0020] A second aspect of this application provides a dynamic microphone core, including: a base, a structural component, and a shock-absorbing structure as described in the first aspect of this application;

[0021] The structural component is a microphone core assembly, and the microphone core assembly is disposed at the mounting position;

[0022] The shock-absorbing structure is mounted on the base.

[0023] Furthermore, the microphone assembly includes a sound chamber component having a protrusion that extends radially on a circumferential sidewall;

[0024] The mounting component includes a first interlayer and a second interlayer;

[0025] The first interlayer portion and the second interlayer portion are spaced apart along the mounting direction of the microphone core assembly to form an interlayer interval;

[0026] The mounting positions are respectively formed on the first interlayer and the second interlayer, and the microphone core assembly is disposed through each of the mounting positions;

[0027] The protrusion is located within the interlayer section, and the first interlayer section and the second interlayer section are used to limit the protrusion.

[0028] Furthermore, the microphone assembly includes a diaphragm;

[0029] The diaphragm is configured as a composite structure comprising at least three layers of polyester film;

[0030] And / or, the edge of the diaphragm is provided with a flexible structure, and the flexible structure is arranged in a wave shape.

[0031] A third aspect of this application provides an audio device, including a dynamic microphone as described in the second aspect of this application.

[0032] It is easy to understand that the dynamic microphone core in the second aspect embodiment of this application and the audio device in the third aspect embodiment of this application both have the technical effects of the shock absorption structure in the first aspect embodiment, and therefore will not be described again.

[0033] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a cross-sectional view of a dynamic microphone core provided in one embodiment of this application;

[0036] Figure 2 This is a schematic diagram of the structure of a dynamic microphone core provided in one embodiment of this application;

[0037] Figure 3 An exploded view of a dynamic microphone core provided in one embodiment of this application;

[0038] Figure 4 This is a cross-sectional schematic diagram of the shock-absorbing structure provided in one embodiment of this application.

[0039] Figure label:

[0040] 100. Mounting component; 110. Mounting position; 120. First mezzanine section; 130. Second mezzanine section; 140. Mezzanine interval;

[0041] 200. Vibration damping component; 210. First step section; 211. Inclined surface; 220. Second step section; 221. Chamfered structure;

[0042] 300. Microphone core assembly; 310. Sound chamber component; 311. Protrusion; 320. Diaphragm; 321. Flexible structure;

[0043] 400. Base. Detailed Implementation

[0044] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0045] It is understood that the vibration damping structure proposed in this application can provide good vibration damping protection for the dynamic microphone core under various complex vibration environments. However, it should be understood that, based on the content disclosed in the embodiments of this application, simple adaptive improvements made by those skilled in the art without creative effort, so that the resulting vibration damping structure can be used for vibration damping of structural components in other fields, should also be considered to fall within the scope of protection of this application.

[0046] See Figures 1 to 4 As shown, an embodiment of the first aspect of this application discloses a shock-absorbing structure, including a mounting component 100 and a shock-absorbing component 200.

[0047] Mounting component 100 has mounting positions 110 for mounting structural members; mounting component 100 is made of a flexible material so that mounting component 100 can flexibly deform when the structural member is subjected to force; damping component 200 is connected to mounting component 100 and damping component 200 can perform energy dissipation and vibration reduction as mounting component 100 deforms.

[0048] In the embodiments of this application, the mounting component 100 provides a mounting position 110 for mounting structural components. The mounting component 100 can sense the vibration energy transmitted from the outside and quickly transmit it to the vibration damping component 200. The vibration damping component 200 then dissipates the vibration energy in a timely manner, thereby effectively reducing the transmission of vibration and achieving the effects of vibration damping, buffering, and protecting the stability of the system. When this vibration damping structure is applied to a dynamic microphone core, it can reduce distortion and interference in all aspects of the dynamic microphone core. The sound quality purity is greatly improved compared to traditional dynamic microphone cores, and the sound reproduction is more realistic and delicate, meeting the requirements of professional recording studios, high-end conference systems, live performances, and other occasions with high requirements for sound quality and stability.

[0049] It is understood that in some embodiments, when the structural component is installed at the mounting position 110 and connected to the vibration damping structure, when the structural component senses external vibration energy, since the mounting component 100 is made of flexible material, it will deform with the force transmitted by the structural component. After dissipating part of the vibration energy, it will transmit most of the remaining energy to the vibration damping component 200 connected to the mounting component 100. Finally, the vibration damping component 200 fully converts and dissipates the vibration energy, thereby effectively reducing the transmission of vibration, protecting the overall structure from the impact of vibration energy, and meeting application requirements.

[0050] In some embodiments, the damping component 200 is connected to the mounting component 100 and triggers an action based on the flexible deformation of the mounting component 100 to achieve energy-dissipating damping. The energy-dissipating damping method of the damping component 200 can be set to include, but is not limited to, friction energy dissipation, deformation energy dissipation, or sliding, rotation energy dissipation, etc. for damping and buffering. Specifically, the appropriate action can be selected according to the actual situation to achieve the corresponding energy dissipation method.

[0051] In some embodiments, the connection between the shock absorber 200 and the mounting component 100 can be a direct connection, whereby the mounting component 100 directly drives the shock absorber 200 to absorb vibration and complete shock damping. Alternatively, it can be an indirect connection, such as a connection between the shock absorber 200 and the mounting component 100 via a connector or transmission component. This transmission method can also transfer the vibration energy from the outside to the shock absorber 200 and convert and dissipate it, thereby effectively achieving the shock damping function.

[0052] The following will combine Figures 1 to 4 The vibration damping structure disclosed in the embodiments of this application will be explained and described in detail.

[0053] It should be understood that the structural design of the damping component 200 is key to achieving the above functions in order to make the vibration absorption capacity of the shock-absorbing structure more outstanding. In this regard, in some embodiments of this application, the damping component 200 is made of a flexible material so that the damping component 200 can perform energy-dissipating vibration reduction through flexible deformation in response to the deformation of the mounting component 100.

[0054] It is understandable that the shock absorber 200 can undergo elastic deformation when subjected to force and can return to its original shape after the force is released, providing a physical basis for "shock absorption". Through the "deformation-energy storage-internal friction-reset" cycle of the elastic structure, the energy of vibration / impact force is gradually absorbed and attenuated, preventing it from being directly transmitted to other components, thereby achieving the functions of shock absorption, buffering and protecting the stability of the system.

[0055] In some embodiments, at least one of the damping component 200 or the mounting component 100 is made of a high-quality rubber material with high elasticity and high damping properties, thereby possessing excellent vibration absorption capabilities.

[0056] In some embodiments of this application, combined with Figures 1 to 4 The vibration damping component 200 is arranged around the mounting component 100 in the circumferential direction. It is understood that the structural components installed on the mounting position 110 of the mounting component 100 are easily affected by external forces in multiple different directions. In this regard, by arranging the vibration damping component 200 around the mounting component 100, the vibration damping component 200 can fully and comprehensively convert the vibration energy transmitted from the outside into heat energy and dissipate it, thereby effectively reducing the transmission of vibration.

[0057] Exemplary, in some embodiments, reference is made to Figure 1 and Figure 4 The damping component 200 includes a first step portion 210 and a second step portion 220 arranged in a stepped structure. The first step portion 210 is disposed at the edge of the surface of the mounting component 100, and the second step portion 220 is adjacent to the first step portion 210 and arranged around the circumferential sidewall of the mounting component 100. It is understood that the stepped structure with flexible deformation capability can better absorb and gradually attenuate the energy of vibration / impact forces, ensuring that vibration energy is dissipated gradually, minimizing the impact of vibration energy on other structures, and protecting the stability of the overall structure.

[0058] In some embodiments, the first step portion 210 and the second step portion 220 are integral structures made of a material with high elasticity and high damping properties. Furthermore, the shock-absorbing component 200 and the mounting component 100 are also integral structures made of a material with high elasticity and high damping properties, thereby possessing excellent vibration absorption capabilities and being able to quickly convert and dissipate the vibration energy transmitted from the outside, thereby effectively reducing the transmission of vibration.

[0059] In other embodiments, the first step portion 210 and the second step portion 220 are separate structures, or the shock-absorbing component 200 and the mounting component 100 are separate structures. The shock-absorbing structure of the present application embodiment is obtained by manufacturing them separately and then connecting them, which can also achieve the effect of effectively reducing the transmission of vibration.

[0060] Exemplary, in some embodiments, reference is made to Figure 4 The outer surface of the first step 210 adjacent to the second step 220 is set as an inclined surface 211. It can be understood that by connecting the adjacent first step 210 and second step 220 through the inclined surface 211, the vibration energy can be transmitted more evenly between the first step 210 and the second step 220, giving full play to the energy dissipation and vibration reduction function of the stepped structure based on flexible deformation, and achieving better vibration reduction, buffering and protection of system stability.

[0061] In some embodiments, the stepped portion is designed as a frustum-shaped structure with a trapezoidal cross-section, thereby enabling the shock-absorbing component 200 to have excellent vibration absorption capabilities and achieve better shock absorption function.

[0062] Exemplary, in some embodiments, reference is made to Figure 4 A chamfered structure 221 is formed on the outer side of the second step portion 220 at the end adjacent to the first step portion 210. It can be understood that the chamfered structure 221 optimizes the conversion and dissipation process of vibration energy, thereby improving the vibration absorption capacity of the second step portion 220 and the overall vibration damping component 200.

[0063] In some embodiments, the chamfer structure 221 may be configured to include, but is not limited to, a chamfer structure 221 formed by rounded corners or right angles, and may be designed specifically according to the analysis of specific mechanical properties.

[0064] It should be understood that the structural design of the mounting component 100 is also key to achieving the above functions in order for the vibration absorption capacity of the shock-absorbing structure to be more outstanding.

[0065] In this regard, in some embodiments of this application, reference is made to Figure 1 and Figure 4 The mounting component 100 includes a first interlayer portion 120 and a second interlayer portion 130; the first interlayer portion 120 and the second interlayer portion 130 are spaced apart along the mounting direction of the structural member; mounting positions 110 are respectively formed on the first interlayer portion 120 and the second interlayer portion 130, and the structural member is disposed through each mounting position 110; the damping component 200 is respectively connected to the first interlayer portion 120 and the second interlayer portion 130, and performs energy dissipation and damping respectively according to the deformation of the first interlayer portion 120 and the second interlayer portion 130.

[0066] It is understandable that the installation component 100 can transmit the received vibration force to the shock absorber 200 in a timely manner for dissipation. To this end, by setting the installation component 100 to include a first interlayer portion 120 and a second interlayer portion 130, the vibration force can be transmitted to different positions of the shock absorber 200 and dissipated simultaneously. This makes full use of the overall structure of the shock absorber 200 to achieve a better vibration absorption effect. With sufficient thickness and area to provide vibration absorption capacity, it ensures that the shock absorber can be fully utilized.

[0067] In some embodiments, the first interlayer portion 120 and the second interlayer portion 130 are arranged in a circular plate-like structure, and the shock-absorbing component 200 is evenly arranged around the first interlayer portion 120 and the second interlayer portion 130, so that when subjected to vibration forces from different directions, the shock-absorbing component 200 can achieve the corresponding energy-dissipating and shock-absorbing effect.

[0068] The shock-absorbing structure of this application is described in detail below with a specific embodiment. It should be noted that the following embodiment is merely an exemplary description and should not be construed as limiting the embodiments of this application.

[0069] See Figures 1 to 4 As shown, the shock-absorbing structure in this embodiment is located between the base 400 and other key components inside the core. It is the core component for realizing the shock-absorbing function. It is made of high-quality rubber material with high elasticity and high damping characteristics, which has excellent vibration absorption capacity. While ensuring that the shock-absorbing pad has sufficient thickness and area to provide sufficient buffer space, it can quickly convert the vibration energy transmitted from the outside into heat energy and dissipate it, thereby effectively reducing the transmission of vibration.

[0070] For example, the vibration damping structure includes a mounting component 100 and a damping component 200. The mounting component 100 has flexible deformation capability and is used to support the microphone core assembly 300. The damping component 200 adopts a stepped design and is a structure with flexible deformation capability. When the mounting component 100 is subjected to force, it deforms and transmits the force to the damping component 200. The damping component 200 can undergo elastic deformation when subjected to force and can return to its original shape after the force is released, thereby providing a physical basis for vibration damping.

[0071] It should be understood that the vibration damping structure in this application embodiment involves: through a cycle of deformation-energy storage-internal friction-reset of the elastic structure, gradually absorbing and attenuating the energy of vibration / impact force, preventing it from being directly transmitted to the lower components, thereby achieving the functions of shock absorption, buffering, and protecting the stability of the system. Based on the above-mentioned force transmission and buffering logic, when the sound chamber component 310 may be subjected to forces from all directions, the vibration damping structure can still ensure the normal operation of the microphone core assembly 300 and the base 400.

[0072] See Figures 1 to 4 As shown, an embodiment of the second aspect of this application discloses a dynamic microphone core, including: a base 400, a structural component, and a shock-absorbing structure according to the first aspect of this application.

[0073] The structural component is the microphone core assembly 300, which is installed on the mounting position 110; the shock absorption structure is installed on the base 400.

[0074] Understandably, the shock-absorbing structure is located between the base 400 and other key components inside the microphone core. It is the core component for realizing the shock-absorbing function. It can quickly convert the vibration energy transmitted from the outside into heat energy and dissipate it, thereby effectively reducing the transmission of vibration, suppressing external interference and internal distortion, reducing the impact of external vibration on the microphone core, significantly improving the purity of sound quality, and meeting the needs of high-end audio applications.

[0075] In some embodiments, the dimensions can be designed to ensure that the shock-absorbing structure has sufficient thickness and area to provide adequate buffer space, without being too large and affecting the overall structural compactness.

[0076] Exemplary, in some embodiments, reference is made to Figure 1 and Figure 3 The microphone assembly 300 includes a chamber component 310, which has a protrusion 311 that protrudes radially on a circumferential sidewall; the mounting component 100 includes a first interlayer portion 120 and a second interlayer portion 130; the first interlayer portion 120 and the second interlayer portion 130 are spaced apart along the mounting direction of the microphone assembly 300 and form an interlayer interval 140; mounting positions 110 are respectively formed on the first interlayer portion 120 and the second interlayer portion 130, and the microphone assembly 300 is disposed through each mounting position 110; the protrusion 311 is located within the interlayer interval 140, and the first interlayer portion 120 and the second interlayer portion 130 are used to limit the protrusion 311.

[0077] Understandably, the mounting component 100 can promptly transmit the received vibration force to the damping component 200 for dissipation. This is achieved by configuring the mounting component 100 with a structure including a first interlayer portion 120 and a second interlayer portion 130. The first interlayer portion 120 and the second interlayer portion 130 cooperate to limit the installation position of the protrusion 311, ensuring a reliable connection between the sound chamber component 310 and the damping structure. Furthermore, based on the configuration of the first interlayer portion 120 and the second interlayer portion 130, vibration force can be simultaneously transmitted to different locations on the damping component 200 for dissipation, fully utilizing the overall structure of the damping component 200 to achieve better vibration absorption. Furthermore, the protrusion 311 allows vibration force to be promptly transmitted from the sound chamber component 310 to the first interlayer portion 120 and the second interlayer portion 130, improving vibration transmission and enabling the damping component 200 to dissipate energy and reduce vibration in a timely manner.

[0078] In some embodiments, the protrusion 311 may be configured as including, but not limited to, an annular boss formed around the circumferential sidewall of the sound chamber component 310, and protrusions protruding from opposite sides of the circumferential sidewall of the sound chamber component 310, etc., so that when the sound chamber component 310 is installed in the mounting position 110, the protrusion 311 can be reliably limited by the first interlayer portion 120 and the second interlayer portion 130, ensuring reliable installation. At the same time, when the sound chamber component 310 is subjected to force, the protrusion 311 can transmit the vibration force to the first interlayer portion 120 and the second interlayer portion 130 in a timely manner.

[0079] Due to the limitations of related technologies, the diaphragm 320 suffers from a single material and structure, making it susceptible to external environmental influences and resulting in additional vibrations and sound distortion. To address this, the dynamic microphone cores in this application, through optimization of at least one of their materials or structures, can reduce distortion to a certain extent.

[0080] In some embodiments, such as Figure 1 and Figure 3 The microphone core assembly 300 includes a diaphragm 320, which is configured as a composite structure comprising at least three layers of polyester film; it is understood that the diaphragm 320 employs a three-layer polyester (PET) composite structure. Exemplarily, a 12μm thick high-strength polyester film is used, which undergoes a special surface hardening treatment to exhibit excellent abrasion resistance and tear resistance.

[0081] In some embodiments, such as Figure 1 and Figure 3 The microphone core assembly 300 includes a diaphragm 320, and the edge of the diaphragm 320 is provided with a flexible structure 321, which is wavy. It can be understood that the wavy flexible suspension design at the edge increases the vibration degree of freedom of the diaphragm 320, reduces nonlinear deformation during vibration, and makes the sound response more linear.

[0082] In some embodiments of this application, to address the technical problems of unreasonable voice coil design, low electromagnetic conversion efficiency, poor heat dissipation, and performance degradation over long periods in the prior art, the moving microphone core of this application includes a voice coil assembly. The voice coil uses high-purity copper-clad aluminum wire, which combines the good conductivity of copper with the lightweight properties of aluminum, effectively reducing the weight of the voice coil while ensuring electromagnetic conversion performance. It is wound tightly and uniformly onto a lightweight glass fiber skeleton using high-precision winding equipment. The DHT (high-tensile wire) has a tensile strength of 255-415 N / mm², making it less prone to breakage during winding.

[0083] It is understood that the dynamic microphone core in this application embodiment, through the synergistic effect of a multi-dimensional composite structure, comprehensively reduces distortion and interference through 320° diaphragm vibration control, efficient voice coil conversion, and a special vibration damping structure. This results in a significant improvement in sound purity compared to traditional dynamic microphone cores, leading to more realistic and delicate sound reproduction. Furthermore, based on a robust anti-interference structural design, the microphone core maintains stable performance under prolonged and complex environments, significantly improving reliability and extending its lifespan by 2-3 times. It can meet the needs of various applications requiring extremely high sound quality and stability, such as professional recording studios, high-end conference systems, and live performances.

[0084] The audio device according to the third aspect of this application may be an audio device for scenarios such as music recording, professional broadcasting, and high-end conferences. The audio device includes: the dynamic microphone core according to the second aspect of this application.

[0085] It is easy to understand that the dynamic microphone core in the second aspect embodiment of this application and the audio device in the third aspect embodiment of this application both have the technical effects of the shock absorption structure in the first aspect embodiment, and therefore will not be described again.

[0086] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0087] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "multiple" means two or more. It should be noted that the term "and / or" used herein is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. Similarly, at least one of A or B can also represent: A alone, A and B simultaneously, or B alone.

[0088] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0089] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

Claims

1. A shock-absorbing structure, characterized in that, include: Mounting components and shock-absorbing components; The mounting component has mounting positions for mounting structural members; The mounting component is made of a flexible material so that it can undergo flexible deformation when the structural member is subjected to force. The shock-absorbing component is connected to the mounting component, and the shock-absorbing component can perform energy-dissipating shock absorption as the mounting component deforms.

2. The shock-absorbing structure according to claim 1, characterized in that: The shock-absorbing component is made of a flexible material so that it can absorb energy through flexible deformation in response to the deformation of the mounting component.

3. The shock-absorbing structure according to claim 2, characterized in that: The shock-absorbing components are arranged around the circumference of the mounting components.

4. The shock-absorbing structure according to claim 3, characterized in that: The shock-absorbing component includes a first step portion and a second step portion distributed in a stepped structure. The first step portion is disposed at the edge of the surface of the mounting component, and the second step portion is adjacent to the first step portion and disposed around the circumferential sidewall of the mounting component.

5. The shock-absorbing structure according to claim 4, characterized in that: The outer surface of the first stepped portion adjacent to the second stepped portion is set as a slope. And / or, a chamfered structure is formed on the outer side of the second step portion at the end adjacent to the first step portion.

6. The shock-absorbing structure according to claim 1, characterized in that: The mounting component includes a first interlayer and a second interlayer; The first interlayer and the second interlayer are spaced apart along the installation direction of the structural member; The mounting positions are respectively formed on the first interlayer and the second interlayer, and the structural member is disposed through each of the mounting positions; The shock-absorbing component is connected to the first interlayer and the second interlayer respectively, and performs energy-dissipating shock absorption as the first interlayer and the second interlayer deform.

7. A dynamic microphone core, characterized in that, include: The base, structural components, and the shock-absorbing structure as described in any one of claims 1 to 6; The structural component is a microphone core assembly, and the microphone core assembly is disposed at the mounting position; The shock-absorbing structure is mounted on the base.

8. The dynamic microphone core according to claim 7, characterized in that: The microphone assembly includes a sound chamber component having a protrusion that protrudes radially on a circumferential sidewall; The mounting component includes a first interlayer and a second interlayer; The first interlayer portion and the second interlayer portion are spaced apart along the mounting direction of the microphone core assembly to form an interlayer interval; The mounting positions are respectively formed on the first interlayer and the second interlayer, and the microphone core assembly is disposed through each of the mounting positions; The protrusion is located within the interlayer section, and the first interlayer section and the second interlayer section are used to limit the protrusion.

9. The dynamic microphone core according to claim 7, characterized in that: The microphone assembly includes a diaphragm; The diaphragm is configured as a composite structure comprising at least three layers of polyester film; And / or, the edge of the diaphragm is provided with a flexible structure, and the flexible structure is arranged in a wave shape.

10. An audio device, characterized in that, include: The dynamic microphone core as described in any one of claims 7 to 9.

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