An automobile and a radio frequency device thereof

Abstract

This utility model discloses an automobile and its radio frequency device. The radio frequency device includes at least: a first housing, a second housing, a first PCBA, and a second PCBA. The first housing and the second housing are assembled together. The first PCBA and the second PCBA are layered and assembled between the first housing and the second housing. The second PCBA is close to the second housing. The second housing can conduct heat outward. The portion of the second PCBA corresponding to the heat-generating device of the first PCBA has a hollow structure. A heat-conducting structure is provided between the heat-generating device of the first PCBA and the second housing, and passes through the hollow structure of the second PCBA. The heat generated by the heat-generating device of the first PCBA can be conducted to the second housing through the heat-conducting structure, so that the heat of the heat-generating device of the first PCBA can be dissipated outward. This satisfies the heat dissipation requirements of the heat-generating device of the first PCBA that is far away from the heat-conducting housing in the radio frequency device. Moreover, it can also meet the heat dissipation requirements of the heat-generating device of the first PCBA when there are many heat-generating devices of the first PCBA that are far away from the heat-conducting housing and have high power.

Description

Technical Field

[0001] This utility model relates to the field of automotive electronic product technology, and in particular to an automobile and its radio frequency device. Background Technology

[0002] In some automotive electronic products, there are double-layer or multi-layer PCBAs, with both the upper and lower shells made of metal. The heat-generating components on the PCBA can dissipate heat through both the upper and lower shells. However, in radio frequency products such as radar, since metal can shield radio frequency signals, the upper shell is generally made of plastic. Therefore, the heat-generating components of the upper PCBA cannot dissipate heat through the upper shell and can only transfer heat outward through the heat sink below or the metal lower shell.

[0003] When radar and other radio frequency products have double-layer or multi-layer PCBAs, the uppermost PCBA (such as the RF board) is separated from the lower housing by the lower PCBA (such as the digital board). The uppermost PCBA cannot directly transfer heat to the lower housing, leading to the problem of heat-generating components such as the RF chips in the uppermost PCBA exceeding their junction temperature. For example, Figure 1 and Figure 2 As shown, although some RF products such as radar use metal frames between their multi-layer PCBAs to dissipate heat from the upper PCBA, the limited size of the frame and the separation between the upper PCBA and the lower housing by the lower PCBA mean that the upper PCBA has no direct heat exchange with the outside world. Therefore, the existing methods are still insufficient to meet the heat dissipation requirements of the upper PCBA when there are many heat-generating devices (such as RF chips) with high power. Utility Model Content

[0004] In view of this, the present invention provides a radio frequency device that can meet the heat dissipation requirements of the heat-generating devices of the first PCBA that are far from the heat-conducting shell in the radio frequency device. Moreover, it can also meet the heat dissipation requirements of the heat-generating devices of the first PCBA when there are many heat-generating devices far from the heat-conducting shell in the radio frequency device and the power is high.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A radio frequency device for use in an automobile includes at least: a first housing, a second housing, a first PCBA, and a second PCBA. The first housing and the second housing are assembled together. The first PCBA and the second PCBA are layered and assembled between the first housing and the second housing. The heating element of the first PCBA faces away from the first housing. The second PCBA is close to the second housing. The second housing is capable of conducting heat outward. The portion of the second PCBA corresponding to the heating element of the first PCBA has a perforated structure. A heat-conducting structure is provided between the heating element of the first PCBA and the second housing, and passes through the perforated structure of the second PCBA. The heat generated by the heating element of the first PCBA can be conducted to the second housing through the heat-conducting structure.

[0007] Preferably, the thermally conductive structure includes a thermally conductive boss;

[0008] The heat-conducting protrusion is disposed on the inner wall corresponding to the hollow structure of the second housing and the second PCBA, and passes through the hollow structure of the second PCBA and cooperates with the heat-generating device of the first PCBA for heat conduction.

[0009] Preferably, the number of heat-generating devices in the first PCBA is multiple;

[0010] The second PCBA and the multiple parts corresponding one-to-one with the multiple heat-generating devices of the first PCBA are all provided with the hollow structure;

[0011] The second housing and the multiple hollow structures of the second PCBA each have multiple inner walls provided with the heat-conducting protrusions. The multiple heat-conducting protrusions pass through the multiple hollow structures of the second PCBA and are in thermal conduction cooperation with the multiple heat-generating devices of the first PCBA.

[0012] Preferably, it also includes a middle frame;

[0013] The middle frame is assembled between the first housing and the second housing, and is located between the first PCBA and the second PCBA; wherein, the middle frame is heat-conducting;

[0014] The heat-conducting structure includes: a first heat-conducting structure and a second heat-conducting structure;

[0015] The first thermally conductive structure is disposed between the heat-generating device of the first PCBA and the middle frame;

[0016] The second heat-conducting structure is disposed between the middle frame and the second housing, and passes through the hollow structure of the second PCBA.

[0017] Preferably, the first heat-conducting structure includes a first heat-conducting boss;

[0018] The first thermally conductive protrusion is disposed on the part of the middle frame corresponding to the heat-generating device of the first PCBA, and is used for thermal conduction cooperation with the heat-generating device of the first PCBA.

[0019] Preferably, the second heat-conducting structure includes: a heat-conducting groove and a second heat-conducting boss;

[0020] The heat-conducting groove is formed on the inner wall corresponding to the hollow structure of the second housing and the second PCBA;

[0021] The second heat-conducting protrusion is disposed on the part of the middle frame corresponding to the hollow structure of the second PCBA, and passes through the hollow structure of the second PCBA and cooperates with the heat-conducting groove of the second housing for heat conduction.

[0022] Preferably, the second heat-conducting boss includes: an edge heat-conducting boss and a center heat-conducting boss;

[0023] The edge heat-conducting boss and the middle heat-conducting boss are respectively disposed on the edge and the middle of the first side of the middle frame facing the second PCBA;

[0024] The cutout structure of the second PCBA includes: an edge cutout structure and a center cutout structure;

[0025] The edge cutout structure and the center cutout structure are respectively formed on the edge and center of the second PCBA, and correspond one-to-one with the edge heat-conducting boss and the center heat-conducting boss;

[0026] The heat-conducting groove includes: an edge heat-conducting groove and a central heat-conducting groove;

[0027] The edge heat-conducting groove and the center heat-conducting groove are respectively formed on the edge and center of the inner wall of the bottom of the second housing, and correspond one-to-one with the edge hollow structure and the center hollow structure; wherein, the edge heat-conducting boss and the center heat-conducting boss pass through the edge hollow structure and the center hollow structure, and cooperate with the edge heat-conducting groove and the center heat-conducting groove for heat conduction.

[0028] Preferably, a central step is provided around the central heat-conducting boss, and edge steps are provided on both sides and the inner side of the edge heat-conducting boss;

[0029] The end face of the middle step is in contact with the end face of the middle hollow structure of the second PCBA, the end face of the edge step is in contact with the end face of the edge hollow structure of the second PCBA, and the end face of the edge of the first side of the middle frame is flush with the end faces of the middle step and the edge step, and is in contact with the second PCBA, so that a closed first cavity is formed between the middle frame and the second PCBA.

[0030] Preferably, a first thermally conductive adhesive is provided between the heat-generating device of the first PCBA and the first thermally conductive boss of the middle frame;

[0031] And / or, a second thermally conductive adhesive is provided between the second thermally conductive protrusion of the middle frame and the thermally conductive groove of the second housing.

[0032] An automobile includes a radio frequency device, said radio frequency device being as described above.

[0033] As can be seen from the above technical solution, in the radio frequency device provided by this utility model, the portion of the second PCBA corresponding to the heat-generating device of the first PCBA is designed with a hollow structure, so that the first PCBA and the second housing are connected. A heat-conducting structure that penetrates the hollow structure of the second PCBA is provided between the heat-generating device of the first PCBA and the second housing, that is, a heat-conducting structure that penetrates the second PCBA is provided between the heat-generating device of the first PCBA and the second housing, so that a heat-conducting channel is formed between the heat-generating device of the first PCBA and the second housing, so that the heat generated by the heat-generating device of the first PCBA can be conducted to the second housing through the heat-conducting structure, and the heat of the heat-generating device of the first PCBA can be dissipated outward, thereby meeting the heat dissipation requirements of the heat-generating device of the first PCBA that is far away from the heat-conducting housing in the radio frequency device. Moreover, it can also meet the heat dissipation requirements of the heat-generating device of the first PCBA when there are many heat-generating devices of the first PCBA that are far away from the heat-conducting housing in the radio frequency device. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 Exploded view of the structure of an existing double-layer PCBA radar;

[0036] Figure 2 This is an exploded view of another structure of an existing double-layer PCBA radar;

[0037] Figure 3Exploded view of the frameless radar structure provided in this embodiment of the utility model;

[0038] Figure 4 Another exploded view of the frameless radar provided in this embodiment of the present invention;

[0039] Figure 5 Exploded view of the structure of the double-layer PCBA radar provided in this embodiment of the utility model;

[0040] Figure 6 Another exploded view of the dual-layer PCBA radar provided in this embodiment of the present invention;

[0041] Figure 7 A side sectional view of a dual-layer PCBA radar provided in an embodiment of this utility model;

[0042] Figure 8 A partially enlarged view of the side cross-sectional view of the double-layer PCBA radar provided in this embodiment of the utility model;

[0043] Figure 9 This is a schematic diagram of the structure of the middle frame provided in an embodiment of the present utility model;

[0044] Figure 10 This is another structural schematic diagram of the middle frame provided in an embodiment of the present utility model;

[0045] Figure 11 A bottom view of the middle frame provided in an embodiment of this utility model;

[0046] Figure 12 A side view of the structure of the middle frame provided in an embodiment of this utility model;

[0047] Figure 13 A bottom view of the structure of the second PCBA provided in this embodiment of the present invention;

[0048] Figure 14 A schematic diagram of the structure of the second housing provided in an embodiment of this utility model;

[0049] Figure 15 for Figure 16 AA section view;

[0050] Figure 16 A top view of the structure of the second housing provided in an embodiment of this utility model;

[0051] Figure 17 An exploded view of the structure of a three-layer PCBA radar provided in an embodiment of this utility model.

[0052] Wherein, 1 is the first housing, 2 is the first PCBA, 21 is the RF chip, 3 is the middle frame, 31 is the first thermally conductive boss, 32 is the edge thermally conductive boss, 33 is the middle thermally conductive boss, 34 is the middle step, 35 is the edge step, 4 is the second PCBA, 41 is the boss through hole, 42 is the edge through hole, 43 is the middle through hole, 5 is the second housing, 51 is the thermally conductive boss, 52 is the edge thermally conductive groove, 53 is the middle thermally conductive groove, 54 is the top surface of the groove, 6 is the first thermally conductive adhesive, 7 is the second thermally conductive adhesive, 8 is the third PCBA, 9 is the first middle frame, and 10 is the first chamber. Detailed Implementation

[0053] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0054] The radio frequency device provided in this embodiment of the invention is applied to automobiles, such as... Figure 3 and Figure 4 As shown, or as Figure 5 and Figure 6 As shown, it includes at least: a first housing 1, a second housing 5, a first PCBA 2, and a second PCBA 4, as follows. Figure 7 As shown, the first housing 1 and the second housing 5 are assembled together, and the first PCBA2 and the second PCBA4 are assembled in layers between the first housing 1 and the second housing 5. The heating element of the first PCBA2 faces away from the first housing 1, and the second PCBA4 is close to the second housing 5. The second housing 5 can conduct heat outward. The part of the second PCBA4 corresponding to the heating element 21 of the first PCBA2 has a hollow structure. A heat-conducting structure is provided between the heating element of the first PCBA2 and the second housing 4, and passes through the hollow structure of the second PCBA4. The heat generated by the heating element of the first PCBA2 can be conducted to the second housing 5 through the heat-conducting structure.

[0055] It should be noted that, as Figures 3 to 6 ,and Figure 17 As shown, the radio frequency device provided in this solution can be a millimeter-wave radar with a double-layer PCBA or a triple-layer PCBA; the first housing 1 can be the upper housing and can be injection molded (plastic material); the second housing 5 can be the lower housing and can be made of metal, capable of heat conduction and outward heat transfer; the first PCBA 2 can be the upper PCBA and can be a radio frequency board, whose heat-generating devices include, but are not limited to, the radio frequency chip 21 (such as...). Figure 4 or Figure 6 The second PCBA4 can be a lower-level PCBA and can be a digital board;

[0056] The heating element 21 of the first PCBA2 faces the second PCBA4. The second PCBA4 has a hollow structure (through hole) corresponding to the heating element 21 of the first PCBA2, so that the first PCBA2 and the second housing 5 are connected through the hollow structure of the second PCBA4. A heat-conducting structure is provided between the first PCBA2 and the second housing 5, passing through the hollow structure of the second PCBA4. That is, the heat-conducting structure passes through the hollow structure of the second PCBA4, and one end of it is thermally connected with the heating element 21 of the first PCBA2, and the other end is thermally connected with the second housing 5. In this way, a heat-conducting channel is formed between the first PCBA2 and the second housing 5, so that the heat generated by the heating element of the first PCBA2 can be conducted to the second housing 5 through the heat-conducting structure, and then dissipated to the environment from the second housing 5. This solves the problem of the heating element of the first PCBA2 being far from the heat-conducting housing in the radio frequency device being too hot at the junction.

[0057] In other words, in the RF device provided by this solution, based on the heat dissipation requirements of the heat-generating device 21 of the first PCBA2, which is far from the second housing 5, the portion of the second PCBA4 corresponding to the heat-generating device 21 of the first PCBA2 is designed with a hollow structure, enabling communication between the first PCBA2 and the second housing 5. A heat-conducting structure penetrating the hollow structure of the second PCBA4 is provided between the heat-generating device of the first PCBA2 and the second housing 4, thus forming a heat-conducting channel between the heat-generating device of the first PCBA2 and the second housing 4, facilitating heat dissipation of the first PCBA2. The heat generated by the heating device can be conducted to the second housing 5 through the heat-conducting structure, allowing the heat of the heating device of the first PCBA2 to dissipate outwards. This satisfies the heat dissipation requirements of the heating device of the first PCBA2 that is far from the heat-conducting housing in the radio frequency device. Moreover, it can also meet the heat dissipation requirements of the heating device of the first PCBA2 when there are many heating devices far from the heat-conducting housing in the radio frequency device and the power is high. Of course, this solution can also be applied to the heat dissipation of the upper PCBA that is far from the heat-conducting housing in radio frequency devices such as multi-layer PCBA radar. By adopting the above-mentioned penetrating heat conduction method, the heat dissipation requirements of the heating device of the uppermost PCBA can be met.

[0058] In this plan, such as Figure 3 As shown, the heat-conducting structure includes a heat-conducting boss 51;

[0059] A heat-conducting boss 51 is disposed on the inner wall corresponding to the hollow structure of the second housing 5 and the second PCBA4, and passes through the hollow structure of the second PCBA4 and engages with the heat-generating device of the first PCBA2 for heat conduction. The heat-conducting boss 51 can be a metal boss disposed on the inner wall corresponding to the hollow structure of the second housing 5 and the second PCBA4, and its structure can be referred to as follows. Figure 3 As shown, this enables the heat-generating components of the first PCBA2 to achieve penetrating heat conduction; moreover, this heat conduction method has a simple structure and is convenient for heat conduction; furthermore, as Figure 3 or Figure 4 As shown, the hollow structure of the second PCBA4 can be a boss through hole 41.

[0060] In other words, for dual-layer PCBA RF devices with small height dimensions and limited height that cannot accommodate a mid-frame 3 (such as radars with dual-layer PCBAs and no mid-frame), through holes (i.e., the aforementioned hollow structure) can be opened at the positions corresponding to the heat-generating devices of the second PCBA4 and the first PCBA2. Then, a heat-conducting protrusion 51 extends from the corresponding position of the second housing 5, passes through the through hole of the second PCBA4, and cooperates with the heat-generating device of the first PCBA2 for heat conduction, so that the heat-generating device of the first PCBA2 can achieve penetrating heat dissipation.

[0061] Specifically, such as Figure 4 As shown, the first PCBA2 has multiple heat-generating devices;

[0062] The second PCBA4 and the first PCBA2 each have a hollow structure in multiple parts corresponding to multiple heat-generating devices.

[0063] like Figure 3 As shown, the inner walls of the second housing 5 and the second PCBA4, which correspond one-to-one with the multiple hollow structures, are provided with heat-conducting protrusions 51. The multiple heat-conducting protrusions 51 pass through the multiple hollow structures of the second PCBA4 and cooperate with the multiple heat-generating devices of the first PCBA2 for heat conduction.

[0064] Among them, such as Figure 4 As shown, the first PCBA2 can have four heat-generating devices. The second PCBA4 has four sections corresponding to the multiple heat-generating devices of the first PCBA2, each with a hollow structure. The second housing 5 has four inner walls corresponding to the four hollow structures of the second PCBA4, each with a heat-conducting protrusion 51. The four heat-conducting protrusions 51 pass through the four hollow structures of the second PCBA4 and cooperate with the four heat-generating devices of the first PCBA2 for heat conduction. This allows for penetrating heat conduction to the multiple heat-generating devices of the first PCBA2. This is especially useful when there are many heat-generating devices in the first PCBA2 that are far from the heat-conducting housing in the RF device, as it can better meet the heat dissipation requirements of the multiple heat-generating devices of the first PCBA2.

[0065] Furthermore, such as Figure 5 and Figure 6 As shown, the radio frequency device provided in this embodiment of the present invention also includes a middle frame 3;

[0066] like Figure 7 As shown, the middle frame 3 is assembled between the first housing 1 and the second housing 5, and is located between the first PCBA2 and the second PCBA4; wherein, the middle frame 3 is capable of conducting heat;

[0067] The heat-conducting structure includes: a first heat-conducting structure and a second heat-conducting structure;

[0068] The first heat-conducting structure is disposed between the heat-generating device of the first PCBA2 and the middle frame 3;

[0069] The second heat-conducting structure is located between the middle frame 3 and the second housing 5, and passes through the hollow structure of the second PCBA4.

[0070] The middle frame 3 is made of metal, such as aluminum alloy or magnesium alloy, which are thermally conductive alloys. The first thermally conductive structure can be set between the heating device of the first PCBA2 and the second side (such as the top) of the middle frame 3, and one end of the structure can contact the heating device of the first PCBA2, while the other end can be fixed to the second side of the middle frame 3, so that the heat generated by the heating device of the first PCBA2 can be conducted to the middle frame 3 through the first thermally conductive structure. The second thermally conductive structure is set between the first side (such as the bottom) of the middle frame 3 and the second shell 5, and one end of the structure can be fixed to the first side of the middle frame 3, while the other end can contact the second shell 5, so that the heat conducted to the middle frame 3 can be conducted to the second shell 5 through the second thermally conductive structure, thereby realizing penetrating heat conduction of the heating device of the first PCBA2. The first side (such as the bottom) of the middle frame 3 faces the second PCBA4, and the second side (such as the top) faces the first PCBA2.

[0071] In other words, for a double-layer PCBA RF device with a middle frame 3 (such as a radar with a double-layer PCBA and a middle frame), a first heat-conducting structure can be provided between the heat-generating device of the first PCBA2 and the position corresponding to the second side of the middle frame 3, and a second heat-conducting structure can be provided between the position corresponding to the second side of the middle frame 3 and the position corresponding to the second housing 5, and pass through the hollow structure of the second PCBA4, so that the heat of the heat-generating device of the first PCBA2 can be conducted to the lower layer in a penetrating manner.

[0072] Furthermore, such as Figure 5 As shown, the first heat-conducting structure includes a first heat-conducting boss 31;

[0073] like Figure 7 As shown, the first thermally conductive protrusion 31 is disposed on the portion of the middle frame 3 corresponding to the heat-generating device of the first PCBA2, and is used for thermal conduction cooperation with the heat-generating device of the first PCBA2. Wherein, as Figure 9As shown, the first thermally conductive protrusion 31 is disposed on the top of the middle frame 3, corresponding to the heat-generating device of the first PCBA2, and can be used to contact multiple heat-generating devices of the first PCBA2 respectively, so that the heat generated by the multiple heat-generating devices of the first PCBA2 can be conducted to the middle frame 3; wherein, the structure of the first thermally conductive protrusion 31 can be referred to Figure 9 As shown, and related to the layout of multiple heat-generating devices in the first PCBA2; of course, the first heat-conducting structure is designed in this way, which makes the structure simple and heat conduction convenient.

[0074] In this solution, the second heat-conducting structure includes: a heat-conducting groove and a second heat-conducting boss;

[0075] The heat-conducting grooves are formed on the inner walls corresponding to the hollow structures of the second housing 5 and the second PCBA4;

[0076] The second heat-conducting protrusion is located in the part of the middle frame 3 corresponding to the hollow structure of the second PCBA4, and passes through the hollow structure of the second PCBA4 and cooperates with the heat-conducting groove of the second housing 5 for heat conduction.

[0077] Among them, such as Figure 5 As shown, the second housing 5 has a box-shaped structure; the heat-conducting groove is formed on the bottom of the second housing 5, corresponding to the inner wall of the hollow structure of the second PCBA4; the second heat-conducting protrusion is set on the bottom of the middle frame 3, corresponding to the hollow structure of the second PCBA4, and passes through the hollow structure of the second PCBA4 and is inserted into the heat-conducting groove of the second housing 5, that is, the bottom of the second heat-conducting protrusion can contact the bottom of the heat-conducting groove. In other words, the second heat-conducting structure uses the insertion of the heat-conducting groove and the heat-conducting protrusion to achieve heat conduction, which not only improves the stability of the middle frame 3 assembly, but also facilitates the conduction of more heat; of course, the heat-conducting groove and the second heat-conducting protrusion can also be interchanged, that is, the heat-conducting groove can be set on the bottom of the middle frame 3, corresponding to the hollow structure of the second PCBA4, and the second heat-conducting protrusion can be set on the bottom of the second housing 5, corresponding to the inner wall of the hollow structure of the second PCBA4.

[0078] Specifically, such as Figure 6 and Figure 12 As shown, the second heat-conducting boss includes: an edge heat-conducting boss 32 and a center heat-conducting boss 33;

[0079] Edge heat-conducting boss 32 and center heat-conducting boss 33 are respectively disposed on the edge and center of the first side of the middle frame 3 facing the second PCBA4;

[0080] The cutout structure of the second PCBA4 includes: edge cutout structure and center cutout structure;

[0081] The edge cutout structure and the center cutout structure are respectively opened at the edge and center of the second PCBA4, and correspond one-to-one with the edge heat conduction boss 32 and the center heat conduction boss 33;

[0082] like Figure 14 As shown, the heat-conducting groove includes: an edge heat-conducting groove 52 and a central heat-conducting groove 53;

[0083] Edge heat-conducting groove 52 and center heat-conducting groove 53 are respectively opened on the edge and center of the bottom inner wall of the second housing 5, and correspond one-to-one with the edge hollow structure and the center hollow structure; wherein, the edge heat-conducting boss 32 and the center heat-conducting boss 33 pass through the edge hollow structure and the center hollow structure, and cooperate with the edge heat-conducting groove 52 and the center heat-conducting groove 53 for heat conduction.

[0084] Among them, such as Figure 10 As shown, the edge heat-conducting boss 32 and the center heat-conducting boss 33 are respectively disposed at the bottom edge and center of the middle frame 3, and both can be metal bosses; as Figure 13 As shown, the second PCBA4 is an irregularly shaped board. Edge and center cutout structures are respectively located on the edge and center of the second PCBA4, corresponding one-to-one with the edge heat-conducting protrusions 32 and 33 of the middle frame 3. The edge cutout structure can be an edge through-hole 42, and the center cutout structure can be a center through-hole 43. The shapes of the edge through-holes 42 and 43 must match the shapes of the edge heat-conducting protrusions 32 and 33, but are not limited to rectangles; they can also be circular, square, triangular, etc. Figure 14 As shown, the edge heat-conducting groove 52 and the center heat-conducting groove 53 are respectively formed on the edge and center of the bottom inner wall of the second housing 5, and correspond one-to-one with the edge through hole 42 and the center through hole 43. This ensures that the edge heat-conducting protrusion 32 at the bottom of the middle frame 3, the edge hollow structure of the second PCBA4, and the edge heat-conducting groove 52 on the bottom inner wall of the second housing 5 correspond sequentially from top to bottom. Similarly, the center heat-conducting protrusion 33 at the bottom of the middle frame 3, the center hollow structure of the second PCBA4, and the center heat-conducting groove 53 on the bottom inner wall of the second housing 5 also correspond sequentially from top to bottom. This further ensures that the edge heat-conducting protrusion 32 and the center heat-conducting protrusion 33 of the middle frame 3 correspond sequentially from top to bottom. Once the edge and center cutout structures of the second PCBA4 are passed through, they are inserted one by one into the edge heat-conducting grooves 52 and 53 of the second housing 5, thus enabling the edge heat-conducting bosses 32 and 33 to connect and conduct heat with the edge heat-conducting grooves 52 and 53. The thickness of the edge heat-conducting bosses 32 and 33 can be matched with the groove depth of the edge heat-conducting grooves 52 and 53 according to the requirements. That is, after insertion, it is ensured that the bottom of the edge heat-conducting bosses 32 can contact the bottom of the edge heat-conducting grooves 52, and the same applies to the center heat-conducting bosses 33.

[0085] In other words, the heat conduction between the bottom of the middle frame 3 and the bottom inner wall of the second shell 5 includes edge-penetrating heat conduction and center-penetrating heat conduction. This not only improves the heat conduction efficiency between the middle frame 3 and the second shell 5, but also helps to improve the stability of the middle frame 3 assembly. Of course, the above-mentioned multiple penetrating heat conduction structures can also be located at the edge or center as needed, which will not be elaborated here.

[0086] Furthermore, such as Figure 10 and Figure 11 As shown, a central heat-conducting boss 33 is surrounded by a central step 34, and edge heat-conducting bosses 32 are provided on both sides and the inner side with edge steps 35.

[0087] like Figure 7 As shown, the step end face of the middle step 34 is in contact with the end face of the middle through hole 43 of the second PCBA4, the step end face of the edge step 35 is in contact with the end face of the edge through hole 42 of the second PCBA4, and the edge end face of the first side of the middle frame 3 is flush with the step end faces of the middle step 34 and the edge step 35, and is in contact with the second PCBA4, so that a closed first chamber 10 is formed between the middle frame 3 and the second PCBA4.

[0088] Among them, such as Figure 10 As shown, a central heat-conducting boss 33 is surrounded by a central step 34, and edge heat-conducting bosses 32 are provided on both sides and the inner side near the center with edge steps 35. The step end faces of the edge steps 35, the step end faces of the central steps 34, and the edge end faces of the first side of the middle frame 3 (i.e., the bottom of the middle frame 3) are flush. Figure 8 As shown, the step end face of the middle step 34 is attached to the upper end face of the middle through hole 43 of the second PCBA4, the step end face of the edge step 35 is attached to the upper end face of the edge through hole 42 of the second PCBA4, and the edge end face of the bottom of the middle frame 3 is attached to the second PCBA4. This allows the middle frame 3 to be tightly attached to the second PCBA4 and forms a closed first chamber 10 between them, which plays the role of EMC electromagnetic shielding.

[0089] In addition, the edge heat-conducting protrusion 32 and the central heat-conducting protrusion 33 of the middle frame 3 are respectively provided with steps, which increases the heat dissipation area of ​​the edge heat-conducting protrusion 32 and the central heat-conducting protrusion 33, thereby reducing thermal resistance and enhancing heat dissipation. Of course, the edge heat-conducting protrusion 32 is inserted into the edge heat-conducting groove 52 and contacts the bottom of the groove 52, and the central heat-conducting protrusion 33 is inserted into the central heat-conducting groove 53 and contacts the bottom of the groove 53, which also increases the heat dissipation area, reduces thermal resistance, and enhances heat dissipation. In addition, such as Figure 3 As shown, each heat-conducting boss 51 has a step around its perimeter, and the end face of the step is in contact with the lower end face of the corresponding heat-conducting through hole 41 of the second PCBA4.

[0090] Furthermore, such as Figure 7 As shown, a first thermally conductive adhesive 6 is provided between the heat-generating device of the first PCBA2 and the first thermally conductive protrusion 31 of the middle frame 3;

[0091] And / or, a second thermally conductive adhesive 7 is provided between the second thermally conductive protrusion of the middle frame 3 and the thermally conductive groove of the second housing 5.

[0092] Among them, such as Figure 7 As shown, the first thermally conductive adhesive 6 can be applied to the top of the first thermally conductive protrusion 31 of the middle frame 3 and is used to contact the heat-generating device (such as the RF chip 21) of the first PCBA2. The second thermally conductive adhesive 7 can be applied to the bottom of the middle thermally conductive protrusion 33 of the middle frame 3 and is used to contact the bottom of the middle thermally conductive groove 53 of the second housing 5. The second thermally conductive adhesive 7 can also be applied to the bottom of the edge thermally conductive protrusion 32 of the middle frame 3 and is used to contact the bottom of the edge thermally conductive groove 52 of the second housing 5. In this way, hard contact between the heat-generating device of the first PCBA2 and the first thermally conductive protrusion 31 of the middle frame 3, the edge thermally conductive protrusion 32 of the middle frame 3 and the edge thermally conductive groove 52 of the second housing 5, and the middle thermally conductive protrusion 33 of the middle frame 3 and the middle thermally conductive groove 53 of the second housing 5 can be avoided, and the heat of the heat-generating device of the first PCBA2 can be better conducted to the second housing 5. Of course, the first thermally conductive adhesive 6 and the second thermally conductive adhesive 7 can also be replaced by thermally conductive pads. In addition, such as Figure 3 As shown, each thermally conductive protrusion 51 and its corresponding heat-generating device in the first PCBA2 may also be provided with thermally conductive adhesive or thermally conductive pads to avoid hard contact between the two.

[0093] Furthermore, it should be noted that the area and size of the edge heat-conducting protrusion 32 and the middle heat-conducting protrusion 33 of the middle frame 3, as well as the edge through hole 42 and the middle through hole 43 of the second PCBA4, can be confirmed through CAE thermal simulation analysis. Among them, the shape of the opening of the second PCBA4 can be arbitrary and can be determined according to the heat dissipation requirements, device layout, and heat dissipation simulation temperature distribution. Of course, the greater the power consumption of the heat-generating device on the first PCBA2, the larger the area of ​​the opening of the second PCBA4 should be. However, there is usually an optimal value, that is, after the opening area reaches a certain area, the heat dissipation effect improves slowly when the opening area is further increased.

[0094] Furthermore, the penetrating heat dissipation method provided in this solution is not limited to two-layer PCBA RF devices, but can also be applied to three-layer PCBA RF devices. This method allows for layer-by-layer heat conduction downwards, and the location and size of the openings in the middle and lower layers of the PCBA can be flexibly designed according to the device distribution and heat dissipation requirements. For example... Figure 17As shown, compared to the double-layer PCBA RF device described above, this three-layer PCBA RF device also includes a third PCBA 8 and a first middle frame 9. The first middle frame 9 is capable of heat conduction. In this three-layer PCBA RF device, the heat-generating device of the first PCBA 2 is thermally conductively connected to the first thermally conductive protrusion 31 at the top of the middle frame 3. The edge thermally conductive protrusion 32 and the middle thermally conductive protrusion 33 at the bottom of the middle frame 3 pass through the corresponding through holes of the second PCBA 4 and are thermally conductively connected to the bottom of the first middle frame 9. The first edge thermally conductive protrusion and the first middle thermally conductive protrusion at the bottom of the first middle frame 9 pass through the corresponding through holes of the third PCBA 8 and are thermally conductively connected to the edge thermally conductive groove 52 and the middle thermally conductive groove 52 of the second housing 5, thereby enabling the heat of the heat-generating device of the first PCBA 2 to be conducted downwards layer by layer.

[0095] This utility model embodiment also provides a vehicle, including a radio frequency device, which is the radio frequency device as described above. Since this solution uses the aforementioned radio frequency device, it has corresponding beneficial effects, as detailed in the preceding description, which will not be repeated here.

[0096] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0097] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A radio frequency device for use in an automobile, comprising at least: The first housing (1), the second housing (5), the first PCBA (2), and the second PCBA (4) are assembled together. The first PCBA (1) and the second housing (5) are assembled in layers between the first housing (1) and the second housing (5). The heating element of the first PCBA (2) faces away from the first housing (1). The second PCBA (4) is close to the second housing (5). The second housing (5) can conduct heat outward. The second PCBA (4) is characterized by having a hollow structure in the part corresponding to the heating element of the first PCBA (2). A heat-conducting structure is provided between the heating element of the first PCBA (2) and the second housing (4), and passes through the hollow structure of the second PCBA (4). The heat generated by the heating element of the first PCBA (2) can be conducted to the second housing (5) through the heat-conducting structure.

2. The radio frequency device according to claim 1, characterized in that, The heat-conducting structure includes a heat-conducting boss (51). The heat-conducting protrusion (51) is disposed on the inner wall of the second housing (5) corresponding to the hollow structure of the second PCBA (4), and passes through the hollow structure of the second PCBA (4) and cooperates with the heat-generating device of the first PCBA (2) for heat conduction.

3. The radio frequency device according to claim 2, characterized in that, The first PCBA (2) has multiple heat-generating devices; The second PCBA (4) and the first PCBA (2) each have the aforementioned hollow structure in multiple parts that correspond one-to-one with the multiple heat-generating devices; The inner walls of the second housing (5) and the second PCBA (4) are provided with the heat-conducting protrusions (51) corresponding to the multiple hollow structures. The multiple heat-conducting protrusions (51) pass through the multiple hollow structures of the second PCBA (4) and cooperate with the multiple heat-generating devices of the first PCBA (2) for heat conduction.

4. The radio frequency device according to claim 1, characterized in that, It also includes the middle frame (3); The middle frame (3) is assembled between the first housing (1) and the second housing (5), and is located between the first PCBA (2) and the second PCBA (4); wherein the middle frame (3) is heat-conducting; The heat-conducting structure includes: a first heat-conducting structure and a second heat-conducting structure; The first heat-conducting structure is disposed between the heat-generating device of the first PCBA (2) and the middle frame (3); The second heat-conducting structure is disposed between the middle frame (3) and the second housing (5), and passes through the hollow structure of the second PCBA (4).

5. The radio frequency device according to claim 4, characterized in that, The first heat-conducting structure includes a first heat-conducting boss (31); The first heat-conducting protrusion (31) is disposed on the part of the middle frame (3) corresponding to the heat-generating device of the first PCBA (2), and is used to cooperate with the heat-generating device of the first PCBA (2) for heat conduction.

6. The radio frequency device according to claim 4, characterized in that, The second heat-conducting structure includes: a heat-conducting groove and a second heat-conducting boss; The heat-conducting groove is formed on the inner wall corresponding to the hollow structure of the second housing (5) and the second PCBA (4); The second heat-conducting protrusion is disposed on the part of the middle frame (3) corresponding to the hollow structure of the second PCBA (4), and passes through the hollow structure of the second PCBA (4) and cooperates with the heat-conducting groove of the second housing (5) for heat conduction.

7. The radio frequency device according to claim 6, characterized in that, The second heat-conducting boss includes: an edge heat-conducting boss (32) and a center heat-conducting boss (33). The edge heat-conducting boss (32) and the middle heat-conducting boss (33) are respectively disposed on the edge and the middle of the first side of the middle frame (3) facing the second PCBA (4); The hollow structure of the second PCBA (4) includes: an edge hollow structure and a center hollow structure; The edge cutout structure and the center cutout structure are respectively opened on the edge and center of the second PCBA (4), and correspond one-to-one with the edge heat-conducting boss (32) and the center heat-conducting boss (33); The heat-conducting groove includes: an edge heat-conducting groove (52) and a middle heat-conducting groove (53); The edge heat-conducting groove (52) and the middle heat-conducting groove (53) are respectively opened on the edge and the middle of the inner wall of the bottom of the second housing (5), and correspond one-to-one with the edge hollow structure and the middle hollow structure; wherein, the edge heat-conducting boss (32) and the middle heat-conducting boss (33) pass through the edge hollow structure and the middle hollow structure, and cooperate with the edge heat-conducting groove (52) and the middle heat-conducting groove (53) for heat conduction.

8. The radio frequency device according to claim 7, characterized in that, The central heat-conducting boss (33) is surrounded by a central step (34), and the edge heat-conducting boss (32) is provided with edge steps (35) on both sides and the inner side. The end face of the middle step (34) is in contact with the end face of the middle hollow structure of the second PCBA (4), the end face of the edge step (35) is in contact with the end face of the edge hollow structure of the second PCBA (4), and the edge end face of the first side of the middle frame (3) is flush with the end faces of the middle step (34) and the edge step (35) and is in contact with the second PCBA (4) so ​​that a closed first chamber (10) is formed between the middle frame (3) and the second PCBA (4).

9. The radio frequency device according to claim 5 or 6, characterized in that, A first thermally conductive adhesive (6) is provided between the heat-generating device of the first PCBA (2) and the first thermally conductive boss (31) of the middle frame (3). And / or, a second thermally conductive adhesive (7) is provided between the second thermally conductive protrusion of the middle frame (3) and the thermally conductive groove of the second housing (5).

10. A vehicle comprising a radio frequency device, characterized in that, The radio frequency device is the radio frequency device as described in any one of claims 1-9.

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