Display panel, display module and electronic device

Abstract

Embodiments of the present application provide a display panel, a display module and an electronic device, and relate to the technical field of display. The display panel comprises a display area and a frame area, the frame area surrounds the display area, and the frame area comprises a light-transmitting area; the display panel further comprises a protective layer, an organic film layer, a crack barrier structure and at least one dam structure, the organic film layer, the crack barrier structure and the at least one dam structure are all located in the frame area, the protective layer covers the crack barrier structure, the organic film layer and the dam structure, and in a direction perpendicular to the thickness direction of the display panel, the organic film layer is located between the crack barrier structure and the at least one dam structure; in a plane perpendicular to the thickness direction of the display panel, the orthographic projection of the light-transmitting area is located inside the orthographic projection of the organic film layer. By arranging the light-transmitting area inside the frame area, the display panel can increase the light transmittance of the light-transmitting area while ensuring the integrity of the page display, and improve the optical effect of the optical module.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, display module and electronic device. Background Technology

[0002] Mobile phones, tablets, and other electronic devices often include a front-facing camera for functions such as selfies and video calls. In related technologies, the electronic device includes a display module and a camera module. The display module includes a cover plate, a laminated assembly, and a through-hole penetrating the laminated assembly. The laminated assembly includes stacked optical adhesive layers, polarizers, a display panel, and a support film. The camera module is positioned opposite the through-hole, receiving light from outside the electronic device through the through-hole. However, in these related technologies, the through-hole is located within the display area of ​​the display module, which cannot guarantee the integrity of the page display and degrades the user experience. Utility Model Content

[0003] This application provides a display panel, a display module, and an electronic device, which ensure the integrity of the page display while increasing the light transmittance of the light-transmitting area of ​​the display panel and improving the optical effect of the optical module.

[0004] A first aspect of this application provides a display panel including a display area and a bezel area surrounding the display area, the bezel area including a light-transmitting area. The display panel further includes a protective layer, an organic film layer, a crack-blocking structure, and at least one dam structure. The organic film layer, the crack-blocking structure, and the at least one dam structure are all located in the bezel area. The protective layer covers the crack-blocking structure, the organic film layer, and the dam structure. Along a direction perpendicular to the thickness direction of the display panel, the organic film layer is located between the crack-blocking structure and the at least one dam structure. In a plane perpendicular to the thickness direction of the display panel, the orthographic projection of the light-transmitting area lies within the orthographic projection of the organic film layer.

[0005] In this embodiment, the light-transmitting area is set inside the border area, which can ensure the integrity of the display area, will not affect the page display, and will not affect the appearance of the electronic device. The software running on the electronic device does not need to perform display adaptation.

[0006] Furthermore, the organic film layer is located between the crack-blocking structure and at least one dam structure. The organic film layer fills at least a portion of the space between the crack-blocking structure and the at least one dam structure, resulting in a higher thickness of the panel stack corresponding to the space. This makes the surfaces of the protective layer and the first stack corresponding to the space relatively flat. In this case, the light-transmitting area transmits light through the flat surface of the first stack, resulting in high light transmittance in the light-transmitting area. Because of the high light transmittance in the light-transmitting area, after the display module is assembled, the photosensitive surface of the optical module is positioned opposite the light-transmitting area, resulting in better optical performance of the optical module.

[0007] In some possible implementations, the border area includes an annular area and a first protruding area, the annular area surrounding the display area and located between the first protruding area and the display area, and at least a portion of the light-transmitting area is located in the first protruding area.

[0008] Thus, with the same display area, the area of ​​the border area including the first protrusion is smaller than that of the border area excluding the first protrusion. The ratio of the border area to the total area of ​​the display panel is reduced, thereby increasing the screen-to-body ratio of the display panel.

[0009] Furthermore, with the same display module area, compared to the border area excluding the first protruding area, the area of ​​the border area including the first protruding area is reduced, which allows the display area to be increased accordingly. The ratio of the border area area to the display area area can also be reduced, which can also increase the screen ratio of the display panel.

[0010] In some possible implementations, the bezel area further includes a second protruding area, which is spaced apart from the first protruding area. Along a direction perpendicular to the thickness direction of the display panel, the second protruding area is located on the side of the annular area away from the display area, and the second and first protruding areas are located on the same side of the annular area. The display panel also includes a touch layer disposed on the protective layer, and the touch layer includes a wire exit portion located in the second protruding area.

[0011] In this way, the top of the touch layer can also achieve the function of wire exit, so that the impedance of the electrode array that is far from the bottom wire exit area of ​​the touch layer is lower, thereby improving the touch effect of the touch layer.

[0012] In some possible implementations, the organic film layer includes at least one first organic layer, the crack-blocking structure includes at least one second organic layer, each second organic layer corresponds to one first organic layer, and each second organic layer and its corresponding first organic layer are integrally formed.

[0013] In this way, by setting each second organic layer and the corresponding first organic layer as an integrated structure, the width of the bezel area of ​​the display panel is reduced, thereby increasing the screen-to-body ratio of the display panel.

[0014] In some possible implementations, the first organic layer corresponds one-to-one with the second organic layer.

[0015] In this way, the organic film layer can be fabricated simultaneously with the crack-blocking structure, making the fabrication process of the organic film layer simple and efficient.

[0016] In some possible implementations, the first organic layer and the second organic layer of the integral structure are disposed in the same layer.

[0017] In this way, the fabrication of the first organic layer can be compatible with existing processes. That is to say, the first organic layer can be fabricated using the same process as the second organic layer, making the fabrication process of the organic film layer simple and efficient.

[0018] In some possible implementations, the organic membrane layer includes at least one first organic layer, and at least one dam structure closest to the crack-blocking structure includes at least one third organic layer, each third organic layer corresponding to one first organic layer, and each third organic layer and its corresponding first organic layer forming an integral structure.

[0019] In this way, by setting each third organic layer and the corresponding first organic layer as an integrated structure, the width of the bezel area of ​​the display panel is reduced, thereby increasing the screen-to-body ratio of the display panel.

[0020] In some possible implementations, the first organic layer corresponds one-to-one with the third organic layer.

[0021] In this way, the organic membrane layer can be fabricated at the same time as the dam structure closest to the crack barrier structure, making the fabrication process of the organic membrane layer simple and efficient.

[0022] In some possible implementations, the first organic layer and the third organic layer of the integral structure are disposed on the same layer.

[0023] In this way, the fabrication of the first organic layer can be compatible with existing processes. That is to say, the first organic layer can be fabricated using the same process as the third organic layer, making the fabrication process of the organic film layer simple and efficient.

[0024] In some possible implementations, the display panel further includes a planarization layer, a pixel definition layer, and a support layer stacked along the thickness direction of the display panel, wherein portions of the planarization layer, the pixel definition layer, and the support layer constitute an organic film layer.

[0025] In this way, an organic film layer can be formed during the fabrication of the planarization layer, pixel definition layer, and support layer, making the fabrication process of the organic film layer simple and efficient.

[0026] In some possible implementations, the crack blocking structure includes portions of a planarization layer, a pixel definition layer, and a support layer.

[0027] In this way, at least part of the crack blocking structure can be formed during the production of the planarization layer, pixel definition layer and support layer, making the production process of the crack blocking structure simple and efficient.

[0028] A second aspect of this application provides a display panel including a display area and a bezel area, the bezel area surrounding the display area and including a light-transmitting area. The display panel includes an encapsulation layer and at least one dam structure, the at least one dam structure being located in the bezel area. The encapsulation layer includes an organic encapsulation layer, a portion of which is located in the bezel area. In a plane perpendicular to the thickness direction of the display panel, the orthographic projection of the light-transmitting area lies between the orthographic projection of the display area and the orthographic projection of the dam structure closest to the display area, and is located within the orthographic projection of the organic encapsulation layer.

[0029] By placing the light-transmitting area inside the border area, the integrity of the display area can be guaranteed, the page display will not be affected, and the appearance of the electronic device will not be affected. Software running on the electronic device does not need to be adapted for display.

[0030] Because the panel stack corresponding to the organic encapsulation layer is relatively thick along the thickness direction of the display panel, the surfaces of the protective layer and the first stack corresponding to the organic encapsulation layer are relatively flat. In this case, the light-transmitting area transmits light through the flat surface of the first stack, resulting in high light transmittance. Due to the high light transmittance of the light-transmitting area, after the display module is assembled, the photosensitive surface of the optical module is positioned opposite the light-transmitting area, resulting in better optical performance of the optical module.

[0031] In some possible implementations, the border area includes an annular area and a first protruding area, the annular area surrounding the display area and located between the first protruding area and the display area, and at least a portion of the light-transmitting area is located in the first protruding area.

[0032] Thus, with the same display area, the area of ​​the border area including the first protrusion is smaller than that of the border area excluding the first protrusion. The ratio of the border area to the total area of ​​the display panel is reduced, thereby increasing the screen-to-body ratio of the display panel.

[0033] Furthermore, with the same display module area, compared to the border area excluding the first protruding area, the area of ​​the border area including the first protruding area is reduced, which allows the display area to be increased accordingly. The ratio of the border area area to the display area area can also be reduced, which can also increase the screen ratio of the display panel.

[0034] In some possible implementations, the bezel area further includes a second protruding area, which is spaced apart from the first protruding area. Along a direction perpendicular to the thickness direction of the display panel, the second protruding area is located on the side of the annular area away from the display area, and the second and first protruding areas are located on the same side of the annular area. The display panel also includes a touch layer disposed on the encapsulation layer. The touch layer includes a lead-out portion located in the second protruding area.

[0035] In this way, the top of the touch layer can also achieve the function of wire exit, so that the impedance of the electrode array that is far from the bottom wire exit area of ​​the touch layer is lower, thereby improving the touch effect of the touch layer.

[0036] In some possible implementations, the display panel further includes a circuit layer, a planarization layer, and a pixel definition layer. Along the thickness direction of the display panel, both the planarization layer and the pixel definition layer are located between the encapsulation layer and the circuit layer, with the planarization layer located between the circuit layer and the pixel definition layer. In a plane perpendicular to the thickness direction of the display panel, the orthographic projection of the light-transmitting area lies within the orthographic projection of the planarization layer and also within the orthographic projection of the pixel definition layer.

[0037] In this way, because the panel stack corresponding to the planarization layer and pixel definition layer has a relatively high thickness along the thickness direction of the display panel, and the surfaces of the protective layer and the first stack corresponding to the planarization layer and pixel definition layer are relatively flat, the light-transmitting area transmits light through the flat surface of the first stack, resulting in high light transmittance in the light-transmitting area. After the display module is assembled, the photosensitive surface of the optical module is positioned opposite the light-transmitting area, resulting in better optical performance of the optical module.

[0038] In some possible implementations, the display panel further includes a touch buffer layer and a protective layer, wherein the touch buffer layer covers the encapsulation layer and the protective layer covers the touch buffer layer.

[0039] In this way, the touch buffer layer can be used to protect the encapsulation layer, the protective layer can be used to protect the touch buffer layer, and the protective layer can also be used to planarize the surface of the touch buffer layer.

[0040] In some possible implementations, the encapsulation layer further includes a first inorganic encapsulation layer and a second inorganic encapsulation layer, with the organic encapsulation layer located between the first inorganic encapsulation layer and the second inorganic encapsulation layer along the thickness direction of the display panel.

[0041] In this way, both the first and second inorganic encapsulation layers can be used to isolate water and oxygen.

[0042] A third aspect of this application provides a display module, including a cover plate and any of the display panels provided in the first or second aspect.

[0043] A fourth aspect of this application provides an electronic device including an optical module and a display module as provided in the third aspect. The optical module includes a photosensitive surface. Along the thickness direction of the display panel, the photosensitive surface is opposite to the light-transmitting area of ​​the display panel.

[0044] In some possible implementations, the optical module is a camera module or an optical sensor. Attached Figure Description

[0045] Figure 1An exploded view of an electronic device provided in an embodiment of this application;

[0046] Figure 2 for Figure 1 A cross-sectional schematic diagram of a local structure in the middle;

[0047] Figure 3 for Figure 2 A cross-sectional schematic diagram of the cooperation between the display module and the optical module;

[0048] Figure 4 for Figure 3 A schematic diagram of a crack-blocking structure;

[0049] Figure 5 for Figure 3 A structural schematic diagram of the first dam in China;

[0050] Figure 6 for Figure 3 A structural schematic diagram of the second dam in the middle;

[0051] Figure 7 for Figure 1 A diagram showing the positional relationship between the display panel and the cover plate of the display module when viewed from the non-display side to the display side of the display module.

[0052] Figure 8 for Figure 7 Enlarged view of point A in the image;

[0053] Figure 9 A cross-sectional schematic diagram illustrating the cooperation between a second display module and an optical module, as provided in an embodiment of this application;

[0054] Figure 10 for Figure 9 Schematic diagram of the structure of the organic film layer;

[0055] Figure 11 A cross-sectional schematic diagram illustrating the cooperation between a third display module and an optical module provided in an embodiment of this application;

[0056] Figure 12 A cross-sectional schematic diagram illustrating the cooperation between a fourth display module and an optical module as provided in an embodiment of this application;

[0057] Figure 13 A diagram showing the positional relationship between the display panel and the cover plate of the fifth display module provided in this application embodiment;

[0058] Figure 14 for Figure 13 Enlarged view of point B in the image;

[0059] Figure 15 A diagram showing the positional relationship between the touch layer and the cover plate of the sixth display module provided in this application embodiment;

[0060] Figure 16 A diagram showing the positional relationship between the display panel and the cover plate of the sixth display module provided in this application embodiment.

[0061] Explanation of reference numerals in the attached figures:

[0062] 10. Mid-frame;

[0063] 20. Display module; 21. Cover plate; 22. Display panel; 23. Optical adhesive layer; 24. Polarizing film; 25. Supporting film layer; 26. Flexible component; 27. Reinforcing component; 28. Adhesive component;

[0064] 30. Back cover; 40. Optical module; 41. Photosensitive surface;

[0065] L1, first stack; L2, second stack;

[0066] 100. Protective layer;

[0067] 200. Panel stacking;

[0068] 201. First planarization layer; 202. Second planarization layer; 203. Pixel definition layer; 204. Support layer; 205. Touch buffer layer;

[0069] 210. Organic film layer; 211. First organic layer;

[0070] 220. Crack-blocking structure; 221. Second organic layer;

[0071] 230. First dam structure; 231. Third organic layer;

[0072] 240. Second dam structure; 241. First source drain electrode; 242. Second source drain electrode;

[0073] 250. Touch layer; 251. Touch unit; 252. Outgoing cable;

[0074] 260. Encapsulation layer; 261. Organic encapsulation layer; 262. First inorganic encapsulation layer; 263. Second inorganic encapsulation layer;

[0075] 270. Array layer;

[0076] 280. Circuit layer;

[0077] 290. Basal layer;

[0078] 300. Display area;

[0079] 400, Border Area;

[0080] 401. Translucent area; 402. Surrounding area; 403. Annular area; 404. First protruding area; 405. Second protruding area;

[0081] W1, first width; W2, second width; W3, third width; W4, fourth width; W5, fifth width. Detailed Implementation

[0082] In related technologies, electronic devices include display modules and camera modules. The display module includes a cover plate, a laminated assembly, and a through-hole. The laminated assembly includes stacked optical adhesive layers, polarizers, a display panel, and a support film. The cover plate and the laminated assembly together form the display area and the bezel area of ​​the display module. The display area surrounds the bezel area and is used to display images. The through-hole penetrates the laminated assembly along the thickness direction of the display module. The camera module is positioned opposite the through-hole, receiving light from outside the electronic device through it. The through-hole penetrating the laminated assembly ensures that the light transmittance of the area opposite the laminated assembly and the camera module meets requirements, ensuring high image quality from the camera module.

[0083] However, in related technologies, the vias are located in the display area of ​​the display module, which will affect the page display. In other words, the software running on the electronic device needs to be adapted for display.

[0084] In view of this, embodiments of this application provide a display panel, a display module, and an electronic device, which ensure the integrity of the page display while increasing the light transmittance of the light-transmitting area of ​​the display panel and improving the light transmittance of the area opposite the display module and the optical module, thereby enhancing the optical effect of the optical module.

[0085] This application provides an electronic device, which can be a mobile phone, tablet computer, laptop computer, ultra-mobile personal computer (UMPC), handheld computer, walkie-talkie, netbook, point of sale (POS) machine, personal digital assistant (PDA), wearable device, virtual reality device, television, or other device with a display module.

[0086] The electronic device can be a foldable device, such as a foldable mobile phone. It can also be a non-foldable device, such as a candybar phone. This application uses a candybar phone as an example for illustration.

[0087] The specific structure of the electronic device will be described in detail below using specific embodiments.

[0088] Figure 1 This is an exploded view of an electronic device provided in an embodiment of this application. In each figure, the X-axis is defined as the length direction of the electronic device, the Y-axis is defined as the width direction of the electronic device, and the Z-axis is defined as the thickness direction of the electronic device.

[0089] like Figure 1 As shown, the electronic device includes a mid-frame 10, a back cover 30, a display module 20, and an optical module 40. The display module 20 and the back cover 30 are respectively connected to the mid-frame 10, located on opposite sides of the mid-frame 10. The display module 20 and the mid-frame 10 together form a device mounting cavity, which is used to accommodate other components of the electronic device, such as the optical module 40, which can be located within this cavity. Along the thickness direction of the electronic device (e.g., ... Figure 1 In the Z direction, the display module 20 has a display side for displaying images and a non-display side disposed opposite to the display side, and the optical module 40 is located on the non-display side of the display module 20.

[0090] In some embodiments, the back cover 30 may also be referred to as the battery cover.

[0091] In some embodiments, the middle frame 10 and the back cover 30 can be separate structures, and the middle frame 10 and the back cover 30 can be fixedly connected by means of adhesive, snap-fit, fastener connection, etc.

[0092] In some embodiments, the middle frame 10 and the back cover 30 can be an integral structure, that is, the middle frame 10 and the back cover 30 can be integrally formed.

[0093] The optical module 40 can be a camera module, an optical sensor, an indicator light, an infrared lamp, etc. The optical sensor can be a color temperature sensor, an ambient light sensor, etc. The following explanation uses a camera module as an example.

[0094] In some embodiments, the optical module 40 can be connected to the middle frame 10, so that the middle frame 10 can support the optical module 40.

[0095] Figure 2 for Figure 1 A cross-sectional schematic diagram of a local structure.

[0096] like Figure 2 As shown, the display module 20 may include a cover plate 21, a first layer L1, a display panel 22, and a second layer L2 stacked together. Specifically, in a plane perpendicular to the thickness direction of the display module 20, the orthographic projections of the second layer L2, the display panel 22, and the first layer L1 are all located inside the orthographic projection of the cover plate 21, thus enabling the cover plate 21 to protect the second layer L2, the display panel 22, and the first layer L1.

[0097] like Figure 2As shown, in a plane perpendicular to the thickness direction of the display module 20, the orthographic projection of the photosensitive surface 41 of the optical module 40 is located inside any one of the orthographic projections of the cover plate 21, the first stack L1, and the display panel 22. The orthographic projection of the photosensitive surface 41 does not coincide with the orthographic projection of the second stack L2. In this way, the light transmittance of the area of ​​the display module 20 opposite to the photosensitive surface 41 can be improved, which helps to improve the optical effect of the optical module 40.

[0098] In this embodiment, the length direction of the display module 20 is parallel to the length direction of the electronic device, the width direction of the display module 20 is parallel to the length direction of the electronic device, and the thickness direction of the display module 20 is parallel to the thickness direction of the electronic device.

[0099] It should be noted that when two directions are parallel, the two directions can be absolutely parallel, or a certain degree of error is allowed. For example, the angle between the length direction of the display module 20 and the length direction of the electronic device can be 1° or 2°, etc.

[0100] To ensure that light enters the optical module 40, the cover plate 21 is made of a light-transmitting material, such as cover glass (CG). In some embodiments, to improve the surface hardness of the cover plate 21, the surface of the cover plate 21 may also be coated with a hardening layer such as aluminum oxide to avoid scratching the surface of the cover plate 21.

[0101] like Figure 2 As shown, the cover plate 21 is fixedly connected to the middle frame 10 to achieve a fixed connection between the display module 20 and the middle frame 10. In some embodiments, the display module 20 may further include an adhesive member 28, through which the cover plate 21 is bonded to the middle frame 10.

[0102] The adhesive component 28 can be double-sided tape, adhesive glue, etc.

[0103] It should be noted that, in addition to including the first stack L1 and the second stack L2, in some embodiments, the display module 20 may also include one of the first stack L1 and the second stack L2.

[0104] In some possible implementations, the first stack L1 may include at least one layer structure. For example, as shown... Figure 2As shown, at least one layer structure of the first stack L1 may include an optical clear adhesive (OCA) layer 23 and a polarizer (POL) 24. Along the thickness direction of the display module 20, both the optical clear adhesive layer 23 and the polarizer 24 are located between the cover plate 21 and the display panel 22. The optical clear adhesive layer 23 may be located between the cover plate 21 and the polarizer 24, and the polarizer 24 is connected to the cover plate 21 via the optical clear adhesive layer 23.

[0105] Of course, the first stack L1 can also be other structures. For example, the first stack L1 includes an optical adhesive layer 23. That is, the first stack L1 is formed by the optical adhesive layer 23. In this case, the cover plate 21 is bonded to the display panel 22 by the optical adhesive layer 23.

[0106] In some possible implementations, the second stack L2 may include at least one layer structure. For example, as... Figure 2 As shown, at least one layer structure of the second stack L2 may include a support film layer 25, a flexible element 26, and a reinforcing element 27. Specifically, along the thickness direction of the display module 20, the display panel 22, the support film layer 25, the flexible element 26, and the reinforcing element 27 are arranged sequentially, that is, the display panel 22, the support film layer 25, the flexible element 26, and the reinforcing element 27 are stacked sequentially.

[0107] It should be noted that the flexible component 26 can be made of flexible materials such as foam, and the flexible component 26 can also be named according to the type of flexible material; for example, the flexible component 26 can also be called a foam component. The reinforcing component 27 can be a metal component, such as a stainless steel (SUS) component, a copper (Cu) component, or an aluminum (Al) component. The reinforcing component 27 can be laid flat on the flexible component 26 to ensure good flatness of the bottom of the display panel 22.

[0108] Of course, the second stack L2 can also be other structures. For example, the second stack L2 may include one of the supporting membrane layer 25, the flexible element 26, and the reinforcing element 27.

[0109] Figure 3 for Figure 2 The diagram shows a cross-sectional view of the display module 20 and the optical module 40 in operation.

[0110] like Figure 3As shown, the display panel 22 may include a protective layer 100 (overcoating, OC), a panel stack 200, and a touch layer 250. The protective layer 100 is connected to the panel stack 200 and serves to protect the panel stack 200 and planarize its surface. The touch layer 250 may be disposed on the protective layer 100, and along the thickness direction of the display panel 22, it may be located between the protective layer 100 and the first stack L1. The touch layer 250 enables the display panel 22 to have touch functionality.

[0111] In this embodiment, the length direction of the display panel 22 is parallel to the length direction of the electronic device, the width direction of the display panel 22 is parallel to the length direction of the electronic device, and the thickness direction of the display panel 22 is parallel to the thickness direction of the electronic device.

[0112] In some embodiments, the protective layer 100 may be formed by coating an organic material onto the panel stack 200, and thus the protective layer 100 may also be referred to as an organic coating layer.

[0113] In some embodiments, the touch layer 250 may be removed from the display panel 22. In this case, the display module 20 may also include a touch panel (TP) stacked on top of the display panel 22.

[0114] like Figure 3 As shown, the panel stack 200 includes a support layer 204 (photo spacer, PS), an array layer 270, an encapsulation layer 260 (thin film encapsulation, TFE), a touch barrier layer 205 (touch barrier layer, TBL), a circuit layer 280, and a substrate layer 290. Along the thickness direction of the display panel 22, the substrate layer 290, circuit layer 280, array layer 270, encapsulation layer 260, and touch barrier layer 205 can be stacked sequentially.

[0115] The touch buffer layer 205 can cover the encapsulation layer 260, and the protective layer 100 can cover the touch buffer layer 205. In this way, the touch buffer layer 205 can be used to protect the encapsulation layer 260, the protective layer 100 can be used to protect the touch buffer layer 205, and the protective layer 100 can also be used to planarize the surface of the touch buffer layer 205.

[0116] For example, along the thickness direction of the display panel 22, the support layer 204 may be located on the side of the circuit layer 280 facing the protective layer 100.

[0117] In some possible implementations, the substrate layer 290 may include a first flexible layer (not shown in the figure), a buffer layer (not shown in the figure), and a second flexible layer (not shown in the figure). The buffer layer may be disposed between the first flexible layer and the second flexible layer, and both the first and second flexible layers may be polyimide (PI) layers.

[0118] In some possible implementations, the array layer 270 may include a planarization layer (PLN) and a pixel definition layer (PDL) stacked together. Exemplarily, the planarization layer includes a first planarization layer 201 and a second planarization layer 202. Along the thickness direction of the display panel 22, the second planarization layer 202 is located between the first planarization layer 201 and the pixel definition layer 203, and the pixel definition layer 203 is located between the second planarization layer 202 and the encapsulation layer 260. It should be noted that the array layer 270 may also be called an array.

[0119] In some possible implementations, the encapsulation layer 260 may include an organic encapsulation layer 261, a first inorganic encapsulation layer 262, and a second inorganic encapsulation layer 263. Specifically, along the thickness direction of the display panel 22, the organic encapsulation layer 261 may be located between the first inorganic encapsulation layer 262 and the second inorganic encapsulation layer 263, and the first inorganic encapsulation layer 262 may be located between the organic encapsulation layer 261 and the array layer 270. Thus, both the first inorganic encapsulation layer 262 and the second inorganic encapsulation layer 263 can be used to isolate water and oxygen.

[0120] In some possible implementations, the organic encapsulation layer 261 can be an inkjet print (IJP) layer, which can be an acrylate or cured polyester polymer organic layer formed by inkjet printing technology.

[0121] In some possible implementations, at least one of the first inorganic encapsulation layer 262 and the second inorganic encapsulation layer 263 may be a chemical vapor deposition (CVD) layer, which may be an inorganic layer made by chemical vapor deposition.

[0122] like Figure 3 As shown, the panel stack 200 also includes a crack dam 220 and at least one dam structure. Specifically, along the thickness direction of the display panel 22, at least one dam structure may be disposed on the side of the circuit layer 280 facing the protective layer 100, and the protective layer 100 covers the crack dam structure 220 and at least one dam structure. Along a direction perpendicular to the thickness direction of the display panel 22 (e.g.) Figure 3In the X direction, crack-blocking structure 220, at least one dam structure, and encapsulation layer 260 can be sequentially and alternately arranged. Crack-blocking structure 220 can be used to block cracks, and at least one dam structure can be used to block the material used to form organic encapsulation layer 261.

[0123] It should be noted that the specific number of dam structures is not limited in the embodiments of this application. It can be one, two or three, etc. When there are more than two dam structures, the dam structure closest to the organic encapsulation layer 261 plays the main role in blocking the material, while the other dam structures play a redundant role.

[0124] For example, there are two dam structures, namely a first dam structure 230 and a second dam structure 240. Along the direction perpendicular to the thickness direction of the display panel 22 (e.g.) Figure 3 In the X direction, the crack blocking structure 220, the first dam structure 230, the second dam structure 240 and the encapsulation layer 260 can be arranged in sequence at intervals. That is, the first dam structure 230 can be arranged around the second dam structure 240, the crack blocking structure 220 can be arranged around the first dam structure 230, and the crack blocking structure 220 is located at the edge of the display panel 22.

[0125] This application does not limit the shape of the orthographic projection of the crack blocking structure 220, the first dam structure 230, and the second dam structure 240 onto a plane perpendicular to the thickness direction of the display panel 22. For example, the shape of the orthographic projection of the crack blocking structure 220, the first dam structure 230, and the second dam structure 240 onto a plane perpendicular to the thickness direction of the display panel 22 can be a square ring, a circular ring, etc.

[0126] Figure 4 for Figure 3 A schematic diagram of the medium crack blocking structure 220.

[0127] In this embodiment, the crack-blocking structure 220 may include at least one layered structure, such as Figure 4 As shown, the crack-blocking structure 220 may include multiple stacked layer structures.

[0128] In some possible implementations, each layer of the crack-blocking structure 220 can be formed of an organic material, and the layer closest to the circuit layer 280 is at least partially embedded within the circuit layer 280. The number of layer structures in the crack-blocking structure 220 can be one or more.

[0129] In some possible implementations, the crack-blocking structure 220 is composed of multiple layered structures. Some of the layered structures of the crack-blocking structure 220 can be formed by organic materials, while another part of the layered structures of the crack-blocking structure 220 can be formed by inorganic materials. The layered structure closest to the circuit layer 280 is formed by organic materials, and at least part of the layered structure closest to the circuit layer 280 is embedded inside the circuit layer 280.

[0130] In some possible implementations, a portion of the touch buffer layer 205 may be used to form one of the layer structures of the crack blocking structure 220.

[0131] In this way, the crack blocking structure 220 can be formed during the fabrication of the touch buffer layer 205, making the fabrication process of the crack blocking structure 220 simple and efficient.

[0132] In some possible implementations, the crack-blocking structure 220 may include portions of a planarization layer, a portion of a pixel definition layer 203, and a portion of a support layer 204. That is, portions of the planarization layer, the pixel definition layer 203, and the support layer 204 can all be used to form the layer structure of the crack-blocking structure 220. For example, portions of the first planarization layer 201, the second planarization layer 202, the pixel definition layer 203, and the support layer 204 can all be used to form the layer structure of the crack-blocking structure 220.

[0133] In this way, at least a portion of the crack blocking structure 220 can be formed during the fabrication of the planarization layer, pixel definition layer 203 and support layer 204, making the fabrication process of the crack blocking structure 220 simple and efficient.

[0134] Figure 5 for Figure 3 A structural schematic diagram of the first dam structure 230.

[0135] In this embodiment of the application, the first dam structure 230 may include at least one layered structure, such as Figure 5 As shown, the first dam structure 230 can be constructed from multiple layers.

[0136] In some possible implementations, each layer of the first dam structure 230 can be formed by organic materials, in which case the number of layers of the first dam structure 230 is one or more.

[0137] In some possible implementations, the first dam structure 230 is composed of multiple layered structures, some of which can be formed by organic materials, and others can be formed by inorganic materials.

[0138] In some possible implementations, portions of the touch buffer layer 205, the first inorganic encapsulation layer 262, and the second inorganic encapsulation layer 263 can all be used to form the layer structure of the first dam structure 230.

[0139] In this way, the first dam structure 230 can be formed during the process of making the touch buffer layer 205, the first inorganic encapsulation layer 262 and the second inorganic encapsulation layer 263, making the manufacturing process of the first dam structure 230 simple and efficient.

[0140] In some possible implementations, the first dam structure 230 may further include portions of a planarization layer, a pixel definition layer 203, and a support layer 204. That is, portions of the planarization layer, the pixel definition layer 203, and the support layer 204 can all be used to form the layer structure of the first dam structure 230. For example, portions of the first planarization layer 201, the second planarization layer 202, the pixel definition layer 203, and the support layer 204 can all be used to form the layer structure of the first dam structure 230.

[0141] In this way, at least a portion of the first dam structure 230 can be formed during the process of creating the planarization layer, pixel definition layer 203 and support layer 204, making the manufacturing process of the first dam structure 230 simple and efficient.

[0142] Figure 6 for Figure 3 A schematic diagram of the structure of the second dam in the middle of the dam.

[0143] The second dam structure 240 and the first dam structure 230 may have the same structure or different structure. In some embodiments, the second dam structure 240 and the first dam structure 230 have different structures, for example, such as... Figure 6 As shown, at least one layer structure of the second dam structure 240 may also include at least one source drain (SD), for example, at least one layer structure of the second dam structure 240 may also include a first source drain 241 and a second source drain 242.

[0144] In addition to including two planarization layers, in some embodiments, the second dam structure 240 may include only one planarization layer, such as a second planarization layer 202.

[0145] Figure 7 for Figure 1 A diagram showing the positional relationship between the display panel 22 and the cover plate 21 of the display module 20 when viewed from the non-display side to the display side. Figure 8 for Figure 7 Enlarged view of point A in the image.

[0146] like Figure 7 As shown, the display panel 22 may include a display area 300 (active area, AA) and a border area 400 (non-active area, NA). The border area 400 surrounds the display area 300, that is, the border area 400 is disposed around the periphery of the display area 300. The display area 300 is the area on the display panel 22 used to display the image.

[0147] like Figure 8 As shown, the bezel area 400 may include a light-transmitting area 401 and a peripheral area 402. The orthographic projections of the light-transmitting area 401 and the peripheral area 402 in a plane perpendicular to the thickness direction of the display panel 22 do not coincide. The light-transmitting area 401 can be used to transmit light, that is, the light-transmitting area 401 can be used to allow light to pass through. Figure 3 As shown, along the thickness direction of the display panel 22, the photosensitive surface 41 of the optical module 40 is opposite to the light-transmitting area 401 of the display panel 22, ensuring that the optical module 40 receives light passing through the display panel 22.

[0148] like Figure 8 As shown, setting the light-transmitting area 401 inside the border area 400 can ensure the integrity of the display area 300, will not affect the page display, and will not affect the appearance of the electronic device. The software running on the electronic device does not need to be adapted for display.

[0149] The fact that the photosensitive surface 41 is opposite to the light-transmitting area 401 of the display panel 22 can be understood as follows: in a plane perpendicular to the thickness direction of the display panel 22, the orthographic projection of the photosensitive surface 41 and the orthographic projection of the light-transmitting area 401 at least partially coincide, ensuring that the photosensitive surface 41 receives light passing through the light-transmitting area 401.

[0150] In a plane perpendicular to the thickness direction of the display panel 22, the shape of the orthographic projection of the light-transmitting area 401 can be circular, rectangular, or elliptical, etc. In addition, the size of the light-transmitting area 401 can be determined according to the field of view (FOV) of the optical module 40.

[0151] The number of light-transmitting areas 401 is one or more. In some embodiments, the number of light-transmitting areas 401 is multiple, and each light-transmitting area 401 corresponds to an optical module 40. The photosensitive surface 41 of the optical module 40 receives the light transmitted through the corresponding light-transmitting area 401.

[0152] like Figure 3 As shown, in some embodiments, the crack-blocking structure 220 and at least one dam structure are both located in the frame area 400, and the light-transmitting area 401 is disposed between the crack-blocking structure 220 and at least one dam structure. For example, the light-transmitting area 401 is disposed between the crack-blocking structure 220 and the first dam structure 230.

[0153] However, along the thickness direction of the display panel 22, there is a gap between the crack blocking structure 220 and the first dam structure 230. The thickness of the panel stack 200 corresponding to this gap is lower than that of other areas (e.g., the display area 300). When the protective layer 100 is fabricated on the panel stack 200 corresponding to this gap, the surface of the protective layer 100 (e.g., the upper and lower surfaces along the thickness direction of the display panel 22) will be uneven, for example, bent toward or away from the panel stack 200. As a result, after the protective layer 100 is fabricated, fabricating the first stack L1 on the protective layer 100 will cause the first stack L1 to bend along with the protective layer 100. At this time, the light-transmitting area 401 transmits light through the bent first stack L1, resulting in a low light transmittance of the light-transmitting area 401.

[0154] Since the light-transmitting area 401 has low light transmittance, after the display module 20 is assembled, setting the photosensitive surface 41 of the optical module 40 opposite to the light-transmitting area 401 will result in poor optical performance of the optical module 40.

[0155] The following examples illustrate some of the reasons why the light-transmitting area 401 has a low light transmittance due to light passing through the curved first layer L1:

[0156] In some possible scenarios, the first stack L1 is bent away from the panel stack 200, and the first stack L1 is convex relative to the external light. The first stack L1 will change the propagation path of the light to make the light converge, resulting in a lower light transmittance of the light-transmitting area 401.

[0157] In some other possible scenarios, the first stack L1 bends toward the panel stack 200, and the first stack L1 is concave relative to the external light. The first stack L1 changes the propagation path of the light to cause the light to diverge, resulting in a lower light transmittance in the light-transmitting area 401.

[0158] Figure 9 This is a cross-sectional schematic diagram showing the cooperation between the second display module 20 and the optical module 40 provided in the embodiments of this application.

[0159] To improve the light transmittance of the light-transmitting area 401, some possible implementation methods include, Figure 9 As shown, the panel stack 200 also includes an organic film layer 210, which is located in the border area 400, and the protective layer 100 covers the organic film layer 210.

[0160] Along the direction perpendicular to the thickness direction of the display panel 22 (e.g.) Figure 9In the X direction), the organic film layer 210 is located between the crack barrier structure 220 and at least one dam structure. Specifically, the organic film layer 210 may be located between the crack barrier structure 220 and the dam structure closest to the crack barrier structure 220, for example, the organic film layer 210 is located between the crack barrier structure 220 and the first dam structure 230.

[0161] In a plane perpendicular to the thickness direction of the display panel 22, the orthographic projection of the light-transmitting area 401 can be located inside the orthographic projection of the organic film layer 210, that is, the orthographic projection of the light-transmitting area 401 can completely coincide with at least a portion of the orthographic projection of the organic film layer 210.

[0162] This application does not limit the shape of the orthographic projection of the organic film layer 210 in a plane perpendicular to the thickness direction of the display panel 22. For example, the shape of the orthographic projection of the organic film layer 210 in a plane perpendicular to the thickness direction of the display panel 22 can be a square ring, a circular ring, or a non-circular shape.

[0163] In this embodiment, the organic film layer 210 fills at least a portion of the space between the crack-blocking structure 220 and at least one dam structure, resulting in a higher thickness of the panel stack 200 corresponding to the space. This makes the surfaces of the protective layer 100 and the first stack L1 corresponding to the space relatively flat. At this time, the light-transmitting area 401 transmits light through the flat surface of the first stack L1, resulting in a higher light transmittance. Because the light-transmitting area 401 has a high light transmittance, after the display module 20 is assembled, the photosensitive surface 41 of the optical module 40 is positioned opposite the light-transmitting area 401, resulting in better optical performance of the optical module 40.

[0164] Of course, in addition to being disposed between the crack-blocking structure 220 and the dam structure, in some embodiments, the organic film layer 210 can also be disposed between two dam structures.

[0165] Of course, in addition to placing the organic film layer 210 inside the spacer, in some embodiments, the panel stack 200 may also include an inorganic film layer (not shown in the figure). The inorganic film layer may be disposed within the organic film layer 210 and located inside the spacer. The inorganic film layer may include at least one layer structure, and each layer structure of the inorganic film layer may be formed by an inorganic material. In this way, the thickness of the panel stack 200 corresponding to the spacer can be higher, making the first stack L1 flatter.

[0166] The inorganic film layer and the organic film layer 210 can be stacked, or the inorganic film layer can be disposed between two of the layer structures of the organic film layer 210, or when the inorganic film layer includes multiple layer structures composed of inorganic materials, the multiple layer structures of the inorganic film layer and at least one layer structure of the organic film layer 210 can also be stacked in other ways.

[0167] Figure 10 for Figure 9 A schematic diagram of the structure of the organic film layer 210.

[0168] In this embodiment of the application, the organic film layer 210 may include at least one layer structure, such as Figure 10 As shown, the organic membrane layer 210 comprises a layer structure of multiple stacked devices. Each layer structure of the organic membrane layer 210 can be formed using organic materials.

[0169] In some possible implementations, such as Figure 10 As shown, portions of the planarization layer, the pixel definition layer 203, and the support layer 204 constitute the organic film layer 210. That is, portions of the planarization layer, the pixel definition layer 203, and the support layer 204 can all be used to form the layer structure of the organic film layer 210. For example, portions of the first planarization layer 201, the second planarization layer 202, the pixel definition layer 203, and the support layer 204 can all be used to form the layer structure of the organic film layer 210.

[0170] In this way, the organic film layer 210 can be formed during the fabrication of the planarization layer, pixel definition layer 203 and support layer 204, making the fabrication process of the organic film layer 210 simple and efficient.

[0171] In some possible implementations, such as Figure 9 As shown, the crack-blocking structure 220, the organic film layer 210, and the dam structure closest to the crack-blocking structure 220 are arranged at any two intervals.

[0172] In some possible implementations, one of the crack-blocking structure 220 and the dam structure closest to the crack-blocking structure 220 can be integrally formed with the organic film layer 210, while the other can be spaced apart from the organic film layer 210. In this way, the integral formation can make the width of the bezel area 400 of the display panel 22 smaller, thereby making the screen-to-body ratio of the display panel 22 larger.

[0173] Figure 11 This is a cross-sectional schematic diagram showing the cooperation between the third display module 20 and the optical module 40 provided in the embodiments of this application.

[0174] In some possible implementations, the layer structure of the organic film layer 210 composed of organic materials can be a first organic layer 211 (e.g., Figure 10 The first organic layer 211 in the crack-blocking structure 220 can be a second organic layer 221 (e.g., the first organic layer 211 in the crack-blocking structure 220), and the layer structure formed by organic materials in the crack-blocking structure 220 can be a second organic layer 221 (e.g., the first organic layer 211 in the crack-blocking structure 220). Figure 4 The second organic layer 221 in the middle.

[0175] Each second organic layer 221 corresponds to one first organic layer 211, and each second organic layer 221 and its corresponding first organic layer 211 can be an integral structure. Specifically, each second organic layer 221 corresponds to one first organic layer 211, which means that the number of first organic layers 211 should be at least equal to the number of second organic layers 221, that is, the number of first organic layers 211 can be equal to or greater than the number of second organic layers 221.

[0176] The second organic layer 221 and the first organic layer 211 of the integrated structure are such that the second organic layer 221 and the first organic layer 211 are in a direction perpendicular to the thickness direction of the display panel 22 (e.g., Figure 9 The maximum distance in the X direction is relatively short. Since the second organic layer 221 and the first organic layer 211 can both be located in the border area 400, and the orthographic projections of the second organic layer 221 and the first organic layer 211 on the reference plane can not overlap, the width of the border area 400 of the display panel 22 is small, thereby making the screen ratio of the display panel 22 larger.

[0177] The number of first organic layers 211 is one or more. In some embodiments, the number of first organic layers 211 is two or more, and each first organic layer 211 can be stacked along the thickness direction of the display panel 22.

[0178] It should be noted that the thicknesses of the first organic layer 211 and the second organic layer 221 can be the same or different along the thickness direction of the display panel 22.

[0179] In some possible implementations, the first organic layer 211 and the second organic layer 221 correspond one-to-one, and the number of first organic layers 211 is equal to the number of second organic layers 221. In this way, the organic film layer 210 can be fabricated at the same time as the crack-blocking structure 220, making the fabrication process of the organic film layer 210 simple and efficient.

[0180] Of course, in addition to the one-to-one correspondence between the first organic layer 211 and the second organic layer 221, in some embodiments the first organic layer 211 and the second organic layer 221 may not correspond one-to-one, that is, the number of the first organic layer 211 and the second organic layer 221 may be different.

[0181] In some possible implementations, the first organic layer 211 and the second organic layer 221 of the integrated structure can be disposed in the same layer. In this way, the fabrication of the first organic layer 211 can be compatible with existing processes. That is to say, the first organic layer 211 can be fabricated using the same process as the second organic layer 221, making the fabrication process of the organic film layer 210 simple and efficient.

[0182] Of course, in addition to being disposed in the same layer, the first organic layer 211 and the second organic layer 221 of the integrated structure can also be disposed in a staggered manner in some embodiments.

[0183] In some possible implementations, the layered structure formed by organic materials in the dam structure closest to the crack-blocking structure 220 can be a third organic layer 231 (e.g., Figure 5 The third organic layer 231 is provided, and the number of third organic layers 231 is at least one. Each third organic layer 231 corresponds to one first organic layer 211, and each third organic layer 231 and its corresponding first organic layer 211 can be an integral structure. For example, the dam structure closest to the crack-blocking structure 220 can be as follows: Figure 5 The first dam structure 230 shown includes at least one third organic layer 231.

[0184] Specifically, each third organic layer 231 corresponds to one first organic layer 211, which means that the number of first organic layers 211 should be at least equal to the number of third organic layers 231, that is, the number of first organic layers 211 can be equal to or greater than the number of third organic layers 231.

[0185] The third organic layer 231 and the first organic layer 211 of the integrated structure are such that the third organic layer 231 and the first organic layer 211 are in a direction perpendicular to the thickness direction of the display panel 22 (e.g., Figure 9 The maximum distance in the X direction is relatively short. Since the third organic layer 231 and the first organic layer 211 can both be located in the border area 400, and the orthographic projections of the third organic layer 231 and the first organic layer 211 on the reference plane can not overlap, the width of the border area 400 of the display panel 22 is small, thereby making the screen ratio of the display panel 22 larger.

[0186] It should be noted that the thicknesses of the first organic layer 211 and the third organic layer 231 can be the same or different along the thickness direction of the display panel 22.

[0187] In some possible implementations, the first organic layer 211 and the third organic layer 231 correspond one-to-one, and the number of first organic layers 211 is equal to the number of third organic layers 231. In this way, the organic film layer 210 can be fabricated at the same time as the dam structure closest to the crack-blocking structure 220, making the fabrication process of the organic film layer 210 simple and efficient.

[0188] Of course, in addition to a one-to-one correspondence between the first organic layer 211 and the third organic layer 231, in some embodiments, the first organic layer 211 and the third organic layer 231 may not correspond one-to-one.

[0189] In some possible implementations, the first organic layer 211 and the third organic layer 231 of the integrated structure can be disposed in the same layer. In this way, the fabrication of the first organic layer 211 can be compatible with existing processes. That is to say, the first organic layer 211 can be fabricated using the same process as the third organic layer 231, making the fabrication process of the organic film layer 210 simple and efficient.

[0190] Of course, in addition to being disposed in the same layer, the first organic layer 211 and the third organic layer 231 of the integrated structure can also be disposed in a staggered manner in some embodiments.

[0191] In some possible implementations, each second organic layer 221 may correspond to a first organic layer 211, and each third organic layer 231 may correspond to a first organic layer 211. Each second organic layer 221 and its corresponding first organic layer 211 are integral structures, and each third organic layer 231 and its corresponding first organic layer 211 are integral structures.

[0192] In some possible implementations, any two of the first organic layer 211, the second organic layer 221, and the third organic layer 231 can correspond one-to-one.

[0193] In some possible implementations, the first organic layer 211, the second organic layer 221, and the third organic layer 231 of the integrated structure can be arranged in the same layer.

[0194] Figure 12 This is a cross-sectional schematic diagram showing the cooperation between the fourth display module 20 and the optical module 40 provided in the embodiments of this application.

[0195] In order to improve the light transmittance of the light-transmitting area 401, in addition to... Figure 11 Besides the method mentioned above, in other possible implementations, such as Figure 12As shown, the display panel 22 may not include the organic film layer 210. In this case, in a plane perpendicular to the thickness direction of the display panel 22, the orthographic projection of the light-transmitting area 401 may be located between the orthographic projection of the display area 300 and the orthographic projection of the at least one dam structure closest to the display area 300, and within the orthographic projection of the organic encapsulation layer 261. For example, the orthographic projection of the light-transmitting area 401 may be located between the orthographic projection of the display area 300 and the orthographic projection of the second dam structure 240.

[0196] In this embodiment, because the thickness of the panel stack 200 corresponding to the organic encapsulation layer 261 along the thickness direction of the display panel 22 is relatively high, the surfaces of the protective layer 100 and the first stack L1 corresponding to the organic encapsulation layer 261 are relatively flat. At this time, the light-transmitting area 401 transmits light through the flat surface of the first stack L1, resulting in high light transmittance of the light-transmitting area 401. Because the light-transmitting area 401 has high light transmittance, after the display module 20 is assembled, the photosensitive surface 41 of the optical module 40 is positioned opposite the light-transmitting area 401, resulting in better optical performance of the optical module 40.

[0197] Since a portion of the organic encapsulation layer 261 is located in the bezel area 400 and another portion is located in the display area 300, the orthographic projection of the light-transmitting area 401 coincides with a portion of the orthographic projection of the organic encapsulation layer 261 in a plane perpendicular to the thickness direction of the display panel 22.

[0198] In some possible implementations, such as Figure 12 As shown, in a plane perpendicular to the thickness direction of the display panel 22, the orthographic projection of the light-transmitting region 401 is located inside the orthographic projection of the planarization layer and inside the orthographic projection of the pixel definition layer 203. That is, at least a portion of the orthographic projection of the planarization layer and at least a portion of the orthographic projection of the pixel definition layer 203 completely coincide with the orthographic projection of the light-transmitting region 401. For example, at least a portion of the orthographic projection of the first planarization layer 201, at least a portion of the orthographic projection of the second planarization layer 202, and at least a portion of the orthographic projection of the pixel definition layer 203 completely coincide with the orthographic projection of the light-transmitting region 401.

[0199] Similarly, since the panel stack 200 corresponding to the planarization layer and pixel definition layer 203 has a relatively high thickness along the thickness direction of the display panel 22, the surfaces of the protective layer 100 and the first stack L1 corresponding to the planarization layer and pixel definition layer 203 are relatively flat. At this time, the light-transmitting area 401 transmits light through the flat surface of the first stack L1, and the light-transmitting area 401 has a high light transmittance. After the display module 20 is assembled, the photosensitive surface 41 of the optical module 40 is positioned opposite to the light-transmitting area 401, so that the optical effect of the optical module 40 is better.

[0200] like Figure 8 As shown, along a direction perpendicular to the thickness direction of the display panel 22, the edge of the bezel area 400 and the edge of the cover plate 21 have a first width (e.g., ...). Figure 8 In the W1), the first width W1 can ensure that the cover plate 21 is aligned with the middle frame 10 (e.g., W1). Figure 2 Sufficient bonding width exists between the middle frame 10 and the light-transmitting area 401. The border area 400 corresponding to the light-transmitting area 401 may have a second width (e.g., Figure 8 In the context of W2), the second width W2 ensures that the light-transmitting area 401 is located within the bezel area 400. The second width W2 is the width of the bezel area 400 after widening. However, the area of ​​the bezel area 400 is relatively large, and the ratio of the area of ​​the bezel area 400 to the area of ​​the display panel 22 is relatively large, resulting in a relatively small screen-to-body ratio of the display panel 22.

[0201] Figure 13 A diagram showing the positional relationship between the display panel 22 and the cover plate 21 of the fifth display module 20 provided in this application embodiment, viewed from the non-display side to the display side. Figure 14 for Figure 13 Enlarged view of point B in the image.

[0202] To increase the screen-to-body ratio of the display panel 22, some possible implementation methods include, Figure 13 As shown, the display panel 22 partially widens the bezel area 400. In this case, the bezel area 400 may include an annular area 403 and a first protruding area 404. The annular area 403 surrounds the display area 300 and is located between the first protruding area 404 and the display area 300. Figure 14 As shown, at least a portion of the light-transmitting area 401 is located in the first protruding area 404.

[0203] In some embodiments, the orthographic projection of the light-transmitting region 401 may be entirely located within the orthographic projection of the first protruding region 404. Alternatively, in some embodiments, a portion of the orthographic projection of the light-transmitting region 401 may be located within the orthographic projection of the first protruding region 404, while another portion may be located within the orthographic projection of the annular region 403. Thus, the light-transmitting region 401 may be partially or entirely located within the first protruding region 404.

[0204] like Figure 14 As shown, along the direction perpendicular to the thickness direction of the display panel 22 (e.g.) Figure 14 In the X direction), the annular region 403 and the edge of the cover plate 21 have a third width (e.g., in the X direction), Figure 14 The third width W3 ensures that the cover plate 21 is aligned with the middle frame 10 (e.g., W3). Figure 2There is sufficient bonding width between the middle frame 10 and the first protrusion 404, and the third width W3 can be equal to the first width W1. Figure 14 The fourth width W4 ensures that the light-transmitting area 401 is located within the border area 400. The fourth width W4 can be equal to the second width (e.g., W4 in the second width). Figure 8 In the W2 section, the first protruding area 404 can be the widened area after the border area 400 is locally widened. The annular area 403 can have a fifth width (e.g., for...). Figure 14 In the context of W5), the fifth width W5 is smaller than the second width (e.g., W5). Figure 8 In W2), the annular area 403 is the unwidened area of ​​the border area 400.

[0205] Therefore, it can be concluded that, given the same display area of ​​300, compared to Figure 8 The border area shown is 400. Figure 14 The area of ​​the bezel area 400 shown is reduced, and the ratio of the area of ​​the bezel area 400 to the area of ​​the entire display panel is reduced, thereby increasing the screen-to-body ratio of the display panel.

[0206] Furthermore, with the same area of ​​display module 20, compared to Figure 8 The border area shown is 400. Figure 14 The area of ​​the border region 400 shown is reduced. Figure 14 The area of ​​the display area 300 shown can be increased accordingly, and the ratio of the area of ​​the bezel area 400 to the area of ​​the entire display panel 22 can be reduced, which can also increase the screen ratio of the display panel 22.

[0207] It should be noted that, as Figure 14 As shown, the width of the bonding area between the first protruding area 404 and the edge of the cover plate 21 in the first direction is relatively small, but the width of the annular area 403 in the second direction is much larger than that of the first protruding area 404. This allows the cover plate 21 to be bonded to the middle frame 10 mainly by the bonding area between the annular area 403 and the edge of the cover plate 21 in the first direction, and the width of this bonding area in the first direction is sufficient to meet the requirements for bonding reliability. Therefore, the presence of the first protruding area 404 will not have a significant negative impact on the connection between the middle frame 10 and the cover plate 21, and the reliability of the bonding between the middle frame and the cover plate 21 can still be ensured.

[0208] In this embodiment, any two of the first direction, the second direction, and the thickness direction of the display panel 22 are perpendicular to each other.

[0209] In some possible implementations, in a plane perpendicular to the thickness direction of the display panel 22, the orthographic projection of the light-transmitting area 401 can be located inside the orthographic projection of the organic film layer 210, a part of the crack-blocking structure 220 can be located in the annular area 403, and another part of the crack-blocking structure 220 can be located in the first protruding area 404. The crack-blocking structure 220 is an annular structure.

[0210] In some possible implementations, the orthographic projection of the light-transmitting region 401 in a plane perpendicular to the thickness direction of the display panel 22 may be located inside the orthographic projection of the organic film layer 210. At least a portion of the organic film layer 210 may be located in the first protrusion region 404, and the organic film layer 210 may be a ring-shaped structure or a non-ring-shaped structure.

[0211] In some possible implementations, the orthographic projection of the light-transmitting region 401 in a plane perpendicular to the thickness direction of the display panel 22 can be located inside the orthographic projection of the organic encapsulation layer 261. A portion of the organic encapsulation layer 261 can be located in the annular region 403, and another portion of the organic encapsulation layer 261 can be located in the first protrusion region 404, thus the organic encapsulation layer 261 has an annular structure.

[0212] In related technologies, the touch layer of the display panel utilizes its bottom edge to achieve a cable exit function along a direction perpendicular to the thickness direction of the display panel (such as along the length direction of the display panel). However, the farther away from the bottom cable exit area of ​​the touch layer, the higher the impedance of the electrode array (sensor) of the touch layer, resulting in poor touch performance.

[0213] Figure 15 A diagram showing the positional relationship between the touch layer 250 and the cover plate 21 of the sixth display module 20 provided in this application embodiment, viewed from the non-display side to the display side. Figure 16 A diagram showing the positional relationship between the display panel 22 and the cover plate 21 of the sixth type of display module 20 provided in this application embodiment when viewed from the non-display side to the display side of the display module 20.

[0214] In some possible implementations, to improve the touch performance of the touch layer 250, such as Figure 15 As shown, the touch layer 250 may include a lead-out portion 252 and a touch portion 251. The lead-out portion 251 is located along a direction perpendicular to the thickness direction of the display panel 22 (e.g., ...). Figure 15 (in the X direction), the cable exiting part 252 can be disposed on one side of the touch unit 251, the touch unit 251 is used to implement the touch function, and the cable exiting part 252 is used to implement the cable exiting function. For example... Figure 16As shown, the bezel area 400 may also include a second protruding area 405. The second protruding area 405 may be spaced apart from the first protruding area 404. Along the direction perpendicular to the thickness direction of the display panel 22, the second protruding area 405 may be located on the side of the annular area 403 away from the display area 300. The second protruding area 405 and the first protruding area 404 may be located on the same side of the annular area 403. The wire exit portion 252 may be located in the second protruding area 405, which makes the wire exit portion 252 located on the top of the touch layer 250, thereby enabling the top of the touch layer 250 to also realize the wire exit function.

[0215] Since the top of the touch layer 250 can be used for cable routing, the impedance of the electrode array that is far from the bottom cable routing area (not shown in the figure) of the touch layer 250 is lower, thereby improving the touch effect of the touch layer 250.

[0216] It should be noted that the number of the second protruding area 405 is, in addition to being... Figure 16 In addition to the two shown, there may be other quantities, and this application embodiment does not limit this.

[0217] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal connection of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances. The terms "first," "second," "third," "fourth," etc. (if present) are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0218] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A display panel, characterized in that, It includes a display area and a border area, the border area surrounding the display area, and the border area including a light-transmitting area; The display panel further includes a protective layer, an organic film layer, a crack-blocking structure, and at least one dam structure. The organic film layer, the crack-blocking structure, and the at least one dam structure are all located in the frame area. The protective layer covers the crack-blocking structure, the organic film layer, and the dam structure. Along a direction perpendicular to the thickness direction of the display panel, the organic film layer is located between the crack-blocking structure and the at least one dam structure. In a plane perpendicular to the thickness direction of the display panel, the orthographic projection of the light-transmitting area lies inside the orthographic projection of the organic film layer.

2. The display panel according to claim 1, characterized in that, The border area includes an annular area and a first protruding area. The annular area surrounds the display area and is located between the first protruding area and the display area. At least a portion of the light-transmitting area is located in the first protruding area.

3. The display panel according to claim 2, characterized in that, The border area also includes a second protruding area, which is spaced apart from the first protruding area. Along a direction perpendicular to the thickness direction of the display panel, the second protruding area is located on the side of the annular area away from the display area, and the second protruding area and the first protruding area are located on the same side of the annular area. The display panel further includes a touch layer disposed on the protective layer, and the touch layer includes a wire outlet located in the second protruding area.

4. The display panel according to claim 1, characterized in that, The organic film layer includes at least one first organic layer, and the crack blocking structure includes at least one second organic layer. Each second organic layer corresponds to one first organic layer, and each second organic layer and its corresponding first organic layer are integral structures.

5. The display panel according to claim 4, characterized in that, The first organic layer corresponds one-to-one with the second organic layer.

6. The display panel according to claim 4, characterized in that, The first organic layer and the second organic layer are disposed in the same layer in the integral structure.

7. The display panel according to any one of claims 1-6, characterized in that, The organic membrane layer includes at least one first organic layer, and the dam structure closest to the crack barrier structure in the at least one dam structure includes at least one third organic layer, each third organic layer corresponds to one first organic layer, and each third organic layer and the corresponding first organic layer are an integral structure.

8. The display panel according to claim 7, characterized in that, The first organic layer corresponds one-to-one with the third organic layer.

9. The display panel according to claim 7, characterized in that, The first organic layer and the third organic layer of the integrated structure are disposed in the same layer.

10. The display panel according to any one of claims 1-6, characterized in that, The display panel further includes a planarization layer, a pixel definition layer, and a support layer stacked along the thickness direction of the display panel, wherein a portion of the planarization layer, a portion of the pixel definition layer, and a portion of the support layer constitute the organic film layer.

11. The display panel according to claim 10, characterized in that, The crack blocking structure includes a portion of the planarization layer, a portion of the pixel definition layer, and a portion of the support layer.

12. A display panel, characterized in that, It includes a display area and a border area, the border area surrounding the display area, and the border area including a light-transmitting area; The display panel includes an encapsulation layer and at least one dam structure located in the bezel area. The encapsulation layer includes an organic encapsulation layer, a portion of which is located in the bezel area. In a plane perpendicular to the thickness direction of the display panel, the orthographic projection of the light-transmitting area is located between the orthographic projection of the display area and the orthographic projection of the dam structure closest to the display area among the at least one dam structures, and is located inside the orthographic projection of the organic encapsulation layer.

13. The display panel according to claim 12, characterized in that, The border area includes an annular area and a first protruding area. The annular area surrounds the display area and is located between the first protruding area and the display area. At least a portion of the light-transmitting area is located in the first protruding area.

14. The display panel according to claim 13, characterized in that, The border area also includes a second protruding area, which is spaced apart from the first protruding area. Along a direction perpendicular to the thickness direction of the display panel, the second protruding area is located on the side of the annular area away from the display area, and the second protruding area and the first protruding area are located on the same side of the annular area. The display panel further includes a touch layer disposed on the encapsulation layer, and the touch layer includes a wire outlet located in the second protruding area.

15. The display panel according to any one of claims 12-14, characterized in that, The display panel also includes a circuit layer, a planarization layer, and a pixel definition layer; Along the thickness direction of the display panel, both the planarization layer and the pixel definition layer are located between the encapsulation layer and the circuit layer, with the planarization layer located between the circuit layer and the pixel definition layer. In a plane perpendicular to the thickness direction of the display panel, the orthographic projection of the light-transmitting area is located inside the orthographic projection of the planarization layer and inside the orthographic projection of the pixel definition layer.

16. The display panel according to any one of claims 12-14, characterized in that, The display panel further includes a touch buffer layer and a protective layer, wherein the touch buffer layer covers the encapsulation layer and the protective layer covers the touch buffer layer.

17. The display panel according to any one of claims 12-14, characterized in that, The encapsulation layer further includes a first inorganic encapsulation layer and a second inorganic encapsulation layer. Along the thickness direction of the display panel, the organic encapsulation layer is located between the first inorganic encapsulation layer and the second inorganic encapsulation layer.

18. A display module, characterized in that, Includes a cover plate and a display panel as described in any one of claims 1-17.

19. An electronic device, characterized in that, Includes an optical module and a display module as described in claim 18; The optical module includes a photosensitive surface; Along the thickness direction of the display panel, the photosensitive surface is opposite to the light-transmitting area of ​​the display panel.

20. The electronic device according to claim 19, characterized in that, The optical module is a camera module or an optical sensor.

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