Automatic substrate recycling device after laser peeling

Abstract

This utility model relates to an automatic substrate recycling device after laser peeling, comprising a lifting assembly, a substrate guiding assembly, and a hopper bottom plate assembly. The lifting assembly includes a lifting base frame, a lifting mechanism, and a mounting base. A mounting base is installed on one side of the lifting base frame. The lifting mechanism, installed within the lifting base frame, drives the upper hopper bottom plate assembly to move vertically. The hopper bottom plate assembly includes a hopper bottom plate. Several protrusions are evenly distributed along the circumference on the outer side of the hopper bottom plate. A hopper guide groove is formed within each protrusion, and a guide bushing is movably installed within the hopper guide groove. This utility model achieves 4-8 inch substrate compatibility through rapid switching, accommodating not only current mainstream 4-inch and 6-inch products but also future trending 8-inch products. It has a wide range of applications and is simple and reliable to operate.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor product processing, and in particular to an automatic substrate recycling device after laser stripping. Background Technology

[0002] Laser lift-off technology has broad application prospects in fields such as Micro LED, flexible electronics, and semiconductor packaging. As one of the key front-end processes for realizing mass transfer of Micro LEDs, its quality directly affects the efficiency of subsequent mass transfer and the performance of the final display.

[0003] In the Micro LED industry, the Micro LED array is first released using laser lift-off technology, and then millions of micron-sized LEDs are picked up and precisely placed using mass transfer technology to transfer them from the growth substrate to the driver backplane. Compared with mechanical and chemical etching lift-off, laser lift-off has the advantages of significantly improved precision and yield, less risk of chip damage, and applicability to substrates made of various materials such as sapphire, silicon, and glass. After mechanical and chemical polishing, the substrate can be reused 5-10 times, thereby reducing costs.

[0004] Currently, the main method for recovering the upper substrate in laser lift-off processes is manual operation. This involves the operator moving the laser-lifted double-layer substrate onto a worktable, using a hand-held suction cup to pull the upper substrate upwards, separating it from the lower substrate. The vacuum in the suction cup is then released, and the upper substrate is placed into a designated container.

[0005] While manual material collection has low initial costs and can meet the requirements for small-batch production, it faces challenges in large-scale production, including slow collection speed, low efficiency, difficulty in controlling the operation process leading to potential contaminants, and reliance on worker experience resulting in inconsistent yields due to a lack of standardized procedures.

[0006] In view of the above-mentioned shortcomings, the designer actively researched and innovated in order to create an automatic recycling device for the substrate after laser peeling, so as to make it more valuable for industrial use. Utility Model Content

[0007] To solve any of the above-mentioned technical problems, the purpose of this utility model is to provide an automatic recycling device for the upper substrate after laser stripping.

[0008] To achieve the above objectives, the present invention adopts the following technical solution:

[0009] An automatic substrate recycling device after laser peeling includes a lifting assembly, a substrate guiding assembly, and a hopper bottom plate assembly;

[0010] The lifting assembly includes a lifting base, a lifting mechanism, and a mounting base. The mounting base is installed on one side of the lifting base, and the lifting mechanism installed in the lifting base drives the upper hopper bottom plate assembly to move vertically.

[0011] The hopper bottom plate assembly includes a hopper bottom plate, on the outer side of the hopper bottom plate, a number of protrusions are evenly distributed along the circumferential direction, a hopper guide groove is opened in the protrusions, and a guide bushing is movably installed in the hopper guide groove.

[0012] A substrate guide assembly is installed on the lifting base frame below the protrusion. The substrate guide assembly includes a substrate guide base installed on the lifting base frame. A substrate guide groove adapted to the above-mentioned hopper guide groove is opened in the substrate guide base. The guide rod fixing block can slide in the substrate guide groove and be locked by a spring buckle assembly. Guide rods distributed in the vertical direction are installed on the guide rod fixing block, and guide bushings are installed on the guide rods.

[0013] As a further improvement of this utility model, the lifting mechanism includes a servo motor installed at the bottom of the lifting base frame. The drive end of the servo motor is connected to the ball screw module above through a coupling. The ball screw module drives the transmission connecting plate to move in the vertical direction. The transmission connecting plate is connected to the bottom plate of the hopper above through several support rods.

[0014] As a further improvement of this utility model, a number of linear guide mechanisms connected to the transmission connecting plate are installed inside the lifting base frame. The linear guide mechanism includes a linear guide shaft installed in the lifting base frame along the vertical direction, and the transmission connecting plate is connected to the linear guide shaft through a linear bearing.

[0015] As a further improvement of this utility model, a lower limit sensor is installed on the inner side of the bottom of the lifting base frame, an upper limit sensor is installed on the inner side of the top of the lifting base frame, and a sensing plate adapted to the aforementioned lower limit sensor and upper limit sensor is installed on the transmission connecting plate.

[0016] As a further improvement of this utility model, at least one lower mechanical limit is installed on the inner side of the bottom of the lifting base frame, and at least one upper mechanical limit is installed on the inner side of the top of the lifting base frame.

[0017] As a further improvement of this utility model, a substrate sensing sensor is installed on the top of the mounting base.

[0018] As a further improvement of this utility model, the spring buckle assembly includes a hook, a ring, and a buckle. Several hooks are evenly distributed on the base plate guide base, and the buckle is installed on the guide rod fixing block. The buckle is connected to the hook below through the ring.

[0019] As a further improvement of this utility model, a limiting block for limiting the guide bushing is also installed in the guide groove of the substrate.

[0020] By means of the above solution, this utility model has at least the following advantages:

[0021] This invention uses a servo motor and a ball screw as the drive, which has a strong load capacity. The hopper can hold 400 1mm thick upper substrates at a time, which has a large capacity and high material collection efficiency.

[0022] This invention uses a substrate sensing sensor to detect the placement height of the substrate, which has high sensing accuracy and avoids squeezing or dropping of the substrate due to inaccurate placement, thereby reducing substrate damage.

[0023] This invention enables 4-8 inch substrate compatibility through rapid switching, accommodating not only current mainstream 4-inch and 6-inch products, but also future trend 8-inch products. It has a wide range of applications and is easy and reliable to operate.

[0024] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of an automatic recycling device for upper substrate after laser peeling according to this utility model;

[0027] Figure 2 yes Figure 1 A structural diagram of the other side;

[0028] Figure 3 yes Figure 1 Schematic diagram of the structure of the middle substrate guide assembly;

[0029] Figure 4 yes Figure 3 A partially enlarged structural diagram;

[0030] Figure 5 yes Figure 1 A schematic diagram of the structure of the bottom plate assembly of the intermediate silo.

[0031] The meanings of the labels in the figures are as follows.

[0032] Servo motor 1, coupling 2, ball screw module 3, transmission connecting plate 4, linear guide mechanism 5, support rod 6, lower limit sensor 7, upper limit sensor 8, lower mechanical limit 9, upper mechanical limit 10, base plate guide assembly 11, hopper bottom plate assembly 12, base plate sensing sensor 13, mounting base 14.

[0033] Substrate guide base 21, guide rod fixing block 22, guide rod 23, substrate guide groove 24, hook 25, retaining ring 26, buckle 27;

[0034] 31. Hopper bottom plate, 32. Hopper guide groove, 33. Guide bushing, 34. Limiting block, 35. Detailed Implementation

[0035] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0036] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0037] like Figures 1-5 As shown, an automatic recycling device for upper substrates after laser stripping is applicable to the automatic recycling of upper substrates (sapphire substrates, silicon substrates) after laser stripping, thereby improving resource utilization and reducing costs.

[0038] An automatic substrate recycling device after laser stripping includes a lifting assembly, a substrate guiding assembly 11, and a hopper bottom plate assembly 12.

[0039] 1. The lifting assembly includes a lifting base frame, a lifting mechanism and a mounting base 14. The mounting base 14 is installed on one side of the lifting base frame. The lifting mechanism installed in the lifting base frame drives the upper hopper bottom plate assembly 12 to move in the vertical direction.

[0040] The lifting mechanism includes a servo motor 1 installed at the bottom of the lifting base frame. The drive end of the servo motor 1 is connected to the ball screw module 3 above via a coupling 2. The ball screw module 3 drives the transmission connecting plate 4 to move in the vertical direction. The transmission connecting plate 4 is connected to the bottom plate 31 of the hopper above via several support rods 6.

[0041] Several linear guide mechanisms 5 are installed inside the lifting base frame and connected to the transmission connecting plate 4. The linear guide mechanism 5 includes a linear guide shaft installed in the lifting base frame along the vertical direction. The transmission connecting plate 4 is connected to the linear guide shaft through a linear bearing.

[0042] A lower limit sensor 7 is installed on the inner bottom side of the lifting base frame, and an upper limit sensor 8 is installed on the inner top side of the lifting base frame. A sensing element adapted to the lower limit sensor 7 and the upper limit sensor 8 is installed on the transmission connecting plate 4. At least one lower mechanical limit 9 is installed on the inner bottom side of the lifting base frame, and at least one upper mechanical limit 10 is installed on the inner top side of the lifting base frame.

[0043] A substrate sensing sensor 13 is mounted on the top of the mounting base 14.

[0044] like Figure 1 and Figure 2 The servo motor 1 is connected to the ball screw module 3 via the coupling 2. The transmission connecting plate 4 connects the ball screw module 3 and the linear guide mechanism 5 to form a vertical transmission mechanism, which is mounted on the mounting base 14. The lower end of the support rod 6 is connected to the transmission connecting plate 4, and its upper end is connected to the hopper bottom plate assembly 12. The substrate guide base 21 in the substrate guide assembly 11 is fixed to the middle fixed plate of the mounting base 14, and the guide rod 23 passes through the guide bushing 32 in the hopper bottom plate assembly 12. The hopper bottom plate 31 in the hopper bottom plate assembly 12 is connected and fixed to the upper end of the support rod 6. The lower limit sensor 7 and the lower mechanical limit 9 are fixed to the bottom fixed plate of the mounting base 14, and the upper limit sensor 8 and the upper mechanical limit 10 are fixed to the middle fixed plate of the mounting base 14. The substrate sensing sensor 13 is fixed to the top of the mounting base 14. The servo motor 1 may have a brake device, and photoelectric limit and mechanical limit are set in the vertical direction, with multiple safety measures to prevent damage to the stacked substrates due to the transmission mechanism exceeding the limit.

[0045] 2. The hopper bottom plate assembly 12 includes a hopper bottom plate 31. Several protrusions 32 are evenly distributed along the circumferential direction on the outer side of the hopper bottom plate 31. A hopper guide groove 33 is formed in the protrusions 32, and a guide bushing 34 is movably installed in the hopper guide groove 33. A limiting block 35 for limiting the guide bushing 34 is also installed in the base plate guide groove 24.

[0046] like Figure 5The three guide bushings 32 slide freely in the slots of the bottom plate 31 of the hopper.

[0047] In addition, the bottom plate of the hopper and the guide rod are treated with an anti-static coating, which can greatly reduce the impact of static electricity on the upper substrate during stacking and receiving, and protect the substrate.

[0048] 3. A substrate guide assembly 11 is installed on the lifting base frame below the protrusion 32. The substrate guide assembly 11 includes a substrate guide base 21 installed on the lifting base frame. A substrate guide groove 24 adapted to the above-mentioned hopper guide groove 33 is opened in the substrate guide base 21. The guide rod fixing block 22 can slide in the substrate guide groove 24 and be locked by the spring buckle assembly. A guide rod 23 distributed in the vertical direction is installed on the guide rod fixing block 22. The guide bushing 34 is installed on the guide rod 23.

[0049] The spring clip assembly includes a hook 25, a ring 26, and a clip 27. Several hooks 25 are evenly distributed on the base plate guide base 21. The clip 27 is mounted on the guide rod fixing block 22. The clip 27 is connected to the hook 25 below through the ring 26.

[0050] like Figures 3-4 The guide rod 23 is inserted into the guide rod fixing block 22 and fixed by the side set screw. There are three spring clip assemblies, which can be labeled as 8-inch base plate spring clip assembly, 6-inch base plate spring clip assembly and 4-inch base plate spring clip assembly from the outside to the inside. The clip 27 is connected to the hook 25 below by the snap ring 26, so that the base plate 21 and the guide rod fixing block 23 can be combined together.

[0051] The 8-inch substrate clip assembly, the 6-inch substrate clip assembly, and the 4-inch substrate clip assembly are fixed to both sides of the base 21 in sequence at a distance; the snap ring 27 is fixed to both sides of the guide rod fixing block 22. Through the connection of the snap ring 27 and the snaps 24, 25, and 26, the guide rod fixing block 22 can be combined with the substrate guide base 21.

[0052] The working principle and process of this utility model:

[0053] Servo motor 1 drives ball screw module 3 to rotate. Under the action of linear guide mechanism 5, transmission connecting plate 4 drives support rod 6 and hopper bottom plate assembly 12 to move upward. It stops at a certain height below substrate sensing sensor 13 (this height can be set, generally the thickness of one upper substrate). The incoming upper substrate (in automated equipment, it is generally transported by a handling module) is placed on the upper surface of hopper bottom plate assembly 12. Under the action of substrate guiding component 11, the upper substrate is placed concentrically with hopper bottom plate assembly 12. After substrate sensing sensor 13 senses the upper substrate, servo motor 1 rotates, driving hopper bottom plate assembly 12 and the placed upper substrate downward, stopping immediately when substrate sensing sensor 13 no longer senses the upper substrate. The above action is repeated to collect upper substrates until transmission connecting plate 4 triggers lower limit sensor 7, at which point the hopper is full. During this process, the lower limit sensor 7 and the upper limit sensor 8 serve as the first line of defense, while the lower mechanical limit 9 and the upper mechanical limit 10 serve as the second line of defense, ensuring that the material hopper bottom plate assembly moves within a certain range and preventing damage to the substrate due to exceeding the limit. The servo motor's precision ensures accurate positioning of the material hopper bottom plate assembly, and the high-precision laser sensor (substrate sensing sensor 13) senses the position of the upper substrate, enabling accurate positioning of the stacked upper substrate height and preventing damage caused by squeezing or dropping due to inaccurate positioning when the upper substrate is placed. The guide rod 23 can be connected to the 8-inch substrate clip assembly, 6-inch substrate clip assembly, and 4-inch substrate clip assembly respectively through the guide rod fixing block 22, realizing rapid switching between 8-inch, 6-inch, and 4-inch substrates.

[0054] Driven by servo motors and ball screws, it boasts a strong load capacity, capable of holding 400 1mm thick upper substrates in a single full hopper, offering large capacity and high receiving efficiency. A substrate sensing sensor accurately detects substrate placement height, preventing squeezing or dropping due to inaccurate positioning and minimizing substrate damage. It features rapid switching for compatibility with 4-8 inch substrates, accommodating not only current mainstream 4-inch and 6-inch products but also future 8-inch trend products, offering wide applicability and simple, reliable operation.

[0055] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0056] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0057] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. An automatic substrate recycling device after laser peeling, characterized in that: It includes a lifting assembly, a base plate guide assembly (11), and a hopper bottom plate assembly (12); the lifting assembly includes a lifting base frame, a lifting mechanism, and a mounting base (14). The mounting base (14) is installed on one side of the lifting base frame, and the lifting mechanism installed in the lifting base frame drives the upper hopper bottom plate assembly (12) to move in the vertical direction. The hopper bottom plate assembly (12) includes a hopper bottom plate (31). Several protrusions (32) are evenly distributed along the circumferential direction on the outer side of the hopper bottom plate (31). A hopper guide groove (33) is provided in the protrusions (32). A guide bushing (34) is movably installed in the hopper guide groove (33). A substrate guide assembly (11) is installed on the lifting base frame below the protrusion (32). The substrate guide assembly (11) includes a substrate guide base (21) installed on the lifting base frame. A substrate guide groove (24) adapted to the above-mentioned hopper guide groove (33) is opened in the substrate guide base (21). The guide rod fixing block (22) can slide in the substrate guide groove (24) and be locked by a spring buckle assembly. A guide rod (23) distributed in the vertical direction is installed on the guide rod fixing block (22). The guide bushing (34) is installed on the guide rod (23).

2. The automatic substrate recycling device after laser stripping as described in claim 1, characterized in that, The lifting mechanism includes a servo motor (1) installed at the bottom of the lifting base frame. The drive end of the servo motor (1) is connected to the ball screw module (3) above through a coupling (2). The ball screw module (3) drives the transmission connecting plate (4) to move in the vertical direction. The transmission connecting plate (4) is connected to the bottom plate (31) of the hopper above through several support rods (6).

3. The automatic substrate recycling device after laser stripping as described in claim 2, characterized in that, Several linear guide mechanisms (5) connected to the transmission connecting plate (4) are installed inside the lifting base frame. The linear guide mechanism (5) includes a linear guide shaft installed in the lifting base frame along the vertical direction. The transmission connecting plate (4) is connected to the linear guide shaft through a linear bearing.

4. The automatic substrate recycling device after laser stripping as described in claim 2, characterized in that, A lower limit sensor (7) is installed on the inner side of the bottom of the lifting base frame, and an upper limit sensor (8) is installed on the inner side of the top of the lifting base frame. A sensing plate adapted to the lower limit sensor (7) and the upper limit sensor (8) is installed on the transmission connecting plate (4).

5. The automatic substrate recycling device after laser stripping as described in claim 2, characterized in that, At least one lower mechanical limiter (9) is installed on the inner side of the bottom of the lifting base frame, and at least one upper mechanical limiter (10) is installed on the inner side of the top of the lifting base frame.

6. The automatic substrate recycling device after laser stripping as described in claim 1, characterized in that, A substrate sensing sensor (13) is mounted on the top of the mounting base (14).

7. The automatic substrate recycling device after laser stripping as described in claim 1, characterized in that, The spring buckle assembly includes a hook (25), a ring (26) and a buckle (27). Several hooks (25) are evenly distributed on the base plate guide base (21). The buckle (27) is installed on the guide rod fixing block (22). The buckle (27) is connected to the hook (25) below through the ring (26).

8. The automatic substrate recycling device after laser stripping as described in claim 1, characterized in that, A limiting block (35) for limiting the guide bushing (34) is also installed in the substrate guide groove (24).

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