Heating assembly and aerosol-generating device thereof

Abstract

The application discloses a heating assembly and an aerosol generating device thereof. The heating assembly comprises a heat conduction member, a mounting member and a heating member. The mounting member is arranged at the end of the heat conduction member. The heating member is arranged on the heat conduction member. The heat conduction member and the mounting member are formed by double-color injection molding. The thermal conductivity of the heat conduction member is higher than that of the mounting member. The heat conduction member is used for transferring the heat generated by the heating member. The heat generated by the heating member is transferred by the heat conduction member, and the heat conduction member is in surface contact, so that the heat is uniformly distributed, the heating effect is improved, and the use experience is improved.

Description

Technical Field

[0001] This application relates to the field of aerosol generation technology, and in particular to a heating component and its aerosol generation device. Background Technology

[0002] An aerosol generating device generally includes a heating element and a power supply element that can supply power to the heating element. The heating element can heat the aerosol generating product to generate an aerosol for use.

[0003] However, existing heating components have uneven heat distribution when heating, resulting in poor heating effect and affecting the user experience. Utility Model Content

[0004] The embodiments of this application provide a heating component and its aerosol generating device, which can evenly distribute the heat of the heating component through a heat-conducting element, thereby improving the heating effect.

[0005] In a first aspect, embodiments of this application provide a heating component, the heating component comprising:

[0006] Thermal conductive components;

[0007] Mounting component, wherein the mounting component is disposed at the end of the heat-conducting component;

[0008] A heating element, wherein the heating element is disposed on the heat-conducting element;

[0009] The heat-conducting component and the mounting component are formed by two-color injection molding. The thermal conductivity of the heat-conducting component is higher than that of the mounting component. The heat-conducting component is used to transfer the heat generated by the heating component.

[0010] In some embodiments, the heating element includes:

[0011] A heating element is arranged around the circumferential exterior of the heat-conducting component;

[0012] A first pin, one end of which is connected to the heating element;

[0013] The second pin has one end connected to the heating element.

[0014] The first pin and the second pin are used for conducting electricity so that the heating element generates heat.

[0015] In some embodiments, the heating element is a mesh structure or a spiral filament structure.

[0016] In some embodiments, the heating element includes:

[0017] Heating circuit, wherein the heating circuit is formed on the circumferential surface outside the heat-conducting component by laser cutting;

[0018] The first lead, one end of which is connected to one end of the heating circuit;

[0019] The second lead has one end connected to the other end of the heating circuit;

[0020] The first lead and the second lead are used to conduct electricity so that the heating circuit generates heat.

[0021] In some embodiments, the heating circuit includes:

[0022] A pretreatment layer, one side of which is disposed on the circumferential surface outside the heat-conducting component;

[0023] An electroplated layer is disposed on the side of the pretreatment layer away from the heat-conducting component, and one end of the first lead and one end of the second lead are both connected to the side of the electroplated layer away from the pretreatment layer.

[0024] In some embodiments, the thickness of the pretreatment layer is between 0.1 μm and 3 μm, and / or the thickness of the electroplating layer is between 3 μm and 25 μm.

[0025] In some embodiments, the heating circuitry is arranged in a spiral pattern on the circumferential surface of the heat-conducting element.

[0026] In some embodiments, the heating component includes a connector and at least two heat-conducting elements, with adjacent heat-conducting elements connected by the connector;

[0027] The connector and the heat-conducting component are formed by two-color injection molding, and the thermal conductivity of the heat-conducting component is higher than that of the connector.

[0028] In some embodiments, the heat-conducting element is a hollow tubular structure.

[0029] Secondly, embodiments of this application provide an aerosol generating device, the aerosol generating device comprising:

[0030] A heating element, wherein the heating element is any one of the heating elements described above, and the heating element is used to heat the aerosol generating article to cause the aerosol generating article to generate aerosol;

[0031] A power supply component is electrically connected to the heating component and is used to supply power to the heating component so that the heating component generates heat.

[0032] The beneficial effects of this application are: this application transfers the heat of the heating element through the heat-conducting element, and through the surface contact of the heat-conducting element, the heat is evenly distributed, improving the heating effect and thus improving the user experience. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of the heating component structure according to one embodiment of this application;

[0035] Figure 2 This is a schematic diagram of the injection molding structure of the heat-conducting component and the mounting component according to an embodiment of this application;

[0036] Figure 3 This is a schematic diagram of the heating element structure according to one embodiment of this application;

[0037] Figure 4 This is a schematic diagram of the heating component structure according to another embodiment of this application;

[0038] Figure 5 This is a schematic diagram of the heating element structure according to another embodiment of this application;

[0039] Figure 6 This is a schematic diagram of the heating component structure according to another embodiment of this application;

[0040] Figure 7 This is a schematic diagram of the heating circuit structure of one embodiment of this application;

[0041] Figure 8 This is a schematic cross-sectional view of the heating circuit structure according to one embodiment of this application;

[0042] Figure 9 This is a schematic diagram of the injection-molded structure of a heat-conducting component, mounting component, and connector according to an embodiment of this application;

[0043] Figure 10 This is a schematic diagram of the heating component structure according to one embodiment of this application;

[0044] Figure 11 This is a schematic diagram of the heating component structure according to another embodiment of this application;

[0045] Figure 12 This is a schematic diagram of the heating component structure according to another embodiment of this application;

[0046] Figure 13 This is a schematic diagram of the structure of an aerosol generating device according to an embodiment of this application.

[0047] Explanation of reference numerals in the attached figures:

[0048] 10 Thermal conductive component; 20 Mounting component; 30 Heating component; 31 Heating part; 32 First pin; 33 Second pin; 34 Heating circuit; 35 First lead; 36 Second lead; 341 Pretreatment layer; 342 Electroplating layer; 40 Connector; 1000 Aerosol generating device; 100 Heating assembly; 200 Power supply assembly; 201 Circuit board; 202 Battery. Detailed Implementation

[0049] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0050] Please refer to Figure 1 , Figure 4 and Figure 6 One embodiment of this application provides a heating component 100, which includes:

[0051] Thermal conductive component 10;

[0052] Mounting component 20 is located at the end of the heat-conducting component 10;

[0053] A heating element 30 is disposed on a heat-conducting element 10;

[0054] The heat-conducting component 10 and the mounting component 20 are formed by two-color injection molding. The thermal conductivity of the heat-conducting component 10 is higher than that of the mounting component 20. The heat-conducting component 10 is used to transfer the heat generated by the heating component 30.

[0055] In this embodiment, the heating component 100 can be used to heat aerosol generating products, such as heating non-combustible cigarettes, and bake the aerosol generating products by raising the temperature to generate aerosols.

[0056] In this embodiment, the structure of the heating component 100 is further described. The heating element 30 is the core structure of the heating component 100. The heating element 30 can be connected to electricity and heat up, generating heat itself. The heat-conducting element 10 transfers the heat from the heating element 30 to the aerosol-generating product, thereby baking the aerosol-generating product and causing it to generate aerosol. Simultaneously, by transferring heat through the heat-conducting element 10, rather than the heating element directly contacting the aerosol-generating product, surface heating is achieved through surface-to-surface contact between the heat-conducting element 10 and the aerosol-generating product, resulting in uniform heat distribution and good heating effect. The mounting element 20 is located at the end of the heat-conducting element 10 and serves as a mounting structure for the heat-conducting element 10, enabling the heat-conducting element 10 to be installed in the required device or equipment.

[0057] In this embodiment, the heat-conducting component 10 and the mounting component 20 are integrally molded by two-color injection molding, which reduces the subsequent assembly steps and simplifies the production process of the heating component 100. At the same time, it can enhance the material bonding strength between the heat-conducting component 10 and the mounting component 20 and improve the reliability of the structure.

[0058] In this embodiment, the thermal conductivity of the heat-conducting component 10 is higher than that of the mounting component 20, which is beneficial to the heat conduction of the heat-conducting component 10, while reducing the thermal conductivity of the mounting component 20 to ensure the reliability of the mounting component 20.

[0059] In one embodiment, the thermal conductivity of the heat-conducting element 10 is higher than that of the mounting element 20. This can be achieved by injection molding the heat-conducting element 10 with a material of high thermal conductivity, while the mounting element 20 is injection molded with a material of low thermal conductivity.

[0060] In this embodiment, two-color injection molding is also described: Two-color injection molding requires a dedicated two-color injection molding machine. Two injections are completed on the same machine by rotating the mold (e.g., 180°), requiring only one set of molds. The rear mold has the same structure, while the front mold has a different design; material switching is achieved through rotation. Common materials for two-color injection molding include ABS (Acrylonitrile Butadiene Styrene) + PC (Polycarbonate), PP (Polypropylene) + TPR (Thermoplastic Rubber), PA (Polyamide) + TPE (Thermoplastic Elastomer), etc., with temperature resistance above 350℃.

[0061] In this embodiment, the axial length of the heat-conducting element 10 is greater than the axial length of the mounting element 20. In one embodiment, the ratio of the axial length of the heat-conducting element 10 to the axial length of the mounting element 20 is 5-10:1.

[0062] Please continue to refer to this. Figure 3 and Figure 5 In one embodiment, the specific structure of the heating element 30 is optimized, and the heating element 30 includes:

[0063] The heating element 31 is arranged circumferentially outside the heat-conducting element 10;

[0064] First pin 32, one end of first pin 32 is connected to heating element 31;

[0065] The second pin 33, one end of which is connected to the heating element 31;

[0066] The first pin 32 and the second pin 33 are used for conducting electricity so that the heating element 31 generates heat.

[0067] In this embodiment, the first pin 32 and the second pin 33 are used for energizing and conducting electricity to help the heating part 31 generate heat. The heating part 31 is arranged around the circumferential outside of the heat-conducting component 10, so that after being energized, the heat can be quickly transferred to the heat-conducting component 10 to avoid local overheating.

[0068] Please continue to refer to this. Figure 3 and Figure 5 Furthermore, the specific structure of the heating element 31 is optimized, and the heating element 31 is a mesh structure or a spiral filament structure.

[0069] In this embodiment, the heating element 31 has a mesh structure, which can be a metal heating mesh. Please refer to... Figure 5 In one embodiment, the heating element 31 is a heating mesh. After two-color injection molding, the heat-conducting component 10 is combined with the heating mesh to form a circumferential heating body. The heating mesh is prepared by an etching process.

[0070] In this embodiment, the heating element 31 has a spiral filament structure, that is, a structure in which the heating wire is coiled into a spiral. Please refer to... Figure 3 In one embodiment, after two-color injection molding, the heat-conducting component 10 is combined with the spiral heating wire to form a circumferential heating body. The heating wire can be prepared using existing winding methods, and the size parameters and tilt angle parameters of the heating wire can be designed according to actual needs.

[0071] Please continue to refer to this. Figure 7 In another embodiment, the specific structure of the heating element 30 is optimized, and the heating element 30 includes:

[0072] Heating circuit 34 is formed on the circumferential surface outside the heat-conducting component 10 by laser cutting;

[0073] The first lead 35, one end of which is connected to one end of the heating circuit 34;

[0074] The second lead 36, one end of which is connected to the other end of the heating circuit 34;

[0075] The first lead 35 and the second lead 36 are used to conduct electricity so that the heating circuit 34 generates heat.

[0076] In this embodiment, the heating element 30 is configured as a heating line 34 formed on the circumferential surface outside the heat-conducting element 10. Specifically, a heating line 34 layer is first deposited on the circumferential surface outside the heat-conducting element 10, and then the required heating line 34 is obtained by laser cutting.

[0077] In one embodiment, a heating circuit layer 34 is deposited on the circumferential surface of the heat-conducting component 10 using PVD (Physical Vapor Deposition). In another embodiment, a heating circuit layer 34 is deposited on the circumferential surface of the heat-conducting component 10 using electroplating.

[0078] In this embodiment, the heating circuit 34 formed by laser cutting can precisely control the cutting pattern, thereby matching the shape and heat distribution requirements of different heat-conducting components 10 and avoiding local temperature differences. Furthermore, by setting the heating component 30 as the heating circuit 34 formed on the surface of the heat-conducting component 10, heat can be conducted through the material at zero distance, improving heat transfer efficiency.

[0079] Please continue to refer to this. Figure 7 and Figure 8 The specific structure of the heating circuit 34 is optimized, and the heating circuit 34 includes:

[0080] A pretreatment layer 341 is provided on one side of the circumferential surface outside the heat-conducting component 10;

[0081] An electroplated layer 342 is disposed on the side of the pretreatment layer 341 away from the heat-conducting component 10. One end of the first lead 35 and one end of the second lead 36 are both connected to the side of the electroplated layer 342 away from the pretreatment layer 341.

[0082] In this embodiment, the pretreatment layer 341 is used to ensure that the cleanliness and roughness of the substrate surface meet the coating requirements.

[0083] In this embodiment, the electroplated layer 342, through the resistivity of the material itself, combined with the first lead 35 and the second lead 36, thereby converts electrical energy into heat energy.

[0084] In one embodiment, the following preparation process is employed: After the heat-conducting component 10 and the mounting component 20 (which may further include the connector 40) are injection molded in two colors, a PVD coating is applied to the surface of the heat-conducting component 10 to obtain a pretreatment layer 341, such as vacuum evaporation coating, vacuum sputtering coating, vacuum ion plating, etc. The thickness of the pretreatment layer 341 is typically between 0.1-3 μm. Then, electroplating is performed to obtain an electroplated layer 342. The electroplating can use materials with good conductivity such as copper, nickel, chromium, or silver. The thickness of the electroplated layer 342 is typically 3-25 μm. Then, laser cutting is performed to form the heating circuit 34, and finally, the first lead 35 and the second lead 36 are soldered.

[0085] In one embodiment, the thickness of the pretreatment layer 341 is set between 0.1 μm and 3 μm, and / or the thickness of the electroplating layer 342 is between 3 μm and 25 μm.

[0086] In one embodiment, the thickness of the pretreatment layer 341 is 0.1 μm; in another embodiment, the thickness of the pretreatment layer 341 is 1.5 μm; and in yet another embodiment, the thickness of the pretreatment layer 341 is 3 μm.

[0087] In one embodiment, the thickness of the electroplated layer 342 is 3 μm; in another embodiment, the thickness of the electroplated layer 342 is 10 μm; and in yet another embodiment, the thickness of the electroplated layer 342 is 25 μm.

[0088] Please continue to refer to this. Figure 7 In one embodiment, the heating lines 34 are arranged in a spiral pattern on the circumferential surface of the heat conductor 10.

[0089] In this embodiment, the spiral heating circuit 34 enables the current to flow through a uniformly distributed path, and the spiral design creates gaps between adjacent circuits, thereby better resisting the risk of cracking caused by mechanical stress during heating and improving reliability.

[0090] Please continue to refer to this. Figure 9 , Figure 10 , Figure 11 and Figure 12 This application also provides an embodiment in which the heating component 100 includes a connector 40 and at least two heat-conducting components 10, and adjacent heat-conducting components 10 are connected by the connector 40.

[0091] The connector 40 and the heat-conducting component 10 are formed by two-color injection molding, and the thermal conductivity of the heat-conducting component 10 is higher than that of the connector 40.

[0092] In this embodiment, based on the above-described single-segment design, it is further optimized into a multi-segment (multi-segment heat-conducting component 10) heat-conducting structure. Multiple heat-conducting components 10 are connected by connectors 40. Similarly, the heat-conducting components 10 and the connectors 40 are connected by two-color injection molding to simplify the subsequent assembly process.

[0093] In one embodiment, adjacent heat-conducting components 10 are connected by connectors 40, and the ends of the heat-conducting components 10 away from the connectors 40 are provided with mounting parts 20 for installation; wherein the heat-conducting components 10, connectors 40 and mounting parts 20 are all formed by two-color injection molding.

[0094] In this embodiment, the connector 40 is injection molded using a material with a lower thermal conductivity than the heat-conducting component 10, in order to reduce or prevent heat transfer or exchange between adjacent heat-conducting components 10, thus affecting the balance of heat distribution. In one embodiment, the connector 40 and the mounting component 20 are injection molded using the same material.

[0095] In this embodiment, each heat-conducting component 10 is assembled with a corresponding heating component 30, so that it can achieve segmented heating through a segmented structure, thereby improving the preheating speed and improving the aerosol suction experience.

[0096] It should be noted that this application does not limit the number of heat-conducting elements 10. When two or more heat-conducting elements 10 are provided, they can be connected by multiple connectors 40 to further improve the segmentation range of segmented heating.

[0097] Please continue to refer to this. Figure 2 and Figure 9 In one embodiment, the heat-conducting element 10 is a hollow tubular structure.

[0098] In this embodiment, the heat-conducting component 10 is configured as a hollow tubular structure, so that the aerosol generating product can be inserted into the heat-conducting component 10 and then come into contact with the heat-conducting component 10 and be heated.

[0099] It should be noted that in this application, the heat-conducting element 10 can also be other structures, such as a sheet structure. In this case, the heating element 30 is disposed on one side of the heat-conducting element 10, while the aerosol generating product is in contact with the heat-conducting element 10 on the other side and is heated. Of course, the heat-conducting element 10 can also be designed into other shapes according to actual needs, as long as it is ensured that the heat-conducting element 10 is in contact with the aerosol generating product.

[0100] In this embodiment, the axial length of the heat-conducting element 10 is greater than the axial length of the connector 40. In one embodiment, the ratio of the axial length of the heat-conducting element 10 to the axial length of the connector 40 is 5-10:1. In another embodiment, the axial length of the connector 40 is greater than or equal to the axial length of the mounting element 20.

[0101] Please continue to refer to this. Figure 13 Another embodiment of this application provides an aerosol generating device 1000, which includes:

[0102] Heating component 100, which is any one of the heating components 100 in the above embodiments, is used to heat the aerosol generating article so that the aerosol generating article generates aerosol.

[0103] The power supply component 200 is electrically connected to the heating component 100 and is used to supply power to the heating component 100 so that the heating component 100 generates heat.

[0104] In this embodiment, the heating element 100 and the power supply element 200 are assembled together within the housing of the aerosol generating device 1000 and electrically connected. The power supply element 200 supplies power to the heating element 100 to generate heat. The power supply element 200 includes a battery 202 for storing electrical energy and a circuit board 201 for controlling the operation of the heating element 100. Furthermore, the aerosol generating product can be inserted into the heat-conducting component 10 of the heating element 10.

[0105] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A heating element, characterized in that, The heating component includes: Thermal conductive components; Mounting component, wherein the mounting component is disposed at the end of the heat-conducting component; A heating element, wherein the heating element is disposed on the heat-conducting element; The heat-conducting component and the mounting component are formed by two-color injection molding. The thermal conductivity of the heat-conducting component is higher than that of the mounting component. The heat-conducting component is used to transfer the heat generated by the heating component.

2. The heating component according to claim 1, characterized in that, The heating element includes: A heating element is arranged around the circumferential exterior of the heat-conducting component; A first pin, one end of which is connected to the heating element; The second pin has one end connected to the heating element. The first pin and the second pin are used for conducting electricity so that the heating element generates heat.

3. The heating component according to claim 2, characterized in that, The heating element has a mesh structure or a spiral filament structure.

4. The heating component according to claim 1, characterized in that, The heating element includes: Heating circuit, wherein the heating circuit is formed on the circumferential surface outside the heat-conducting component by laser cutting; The first lead, one end of which is connected to one end of the heating circuit; The second lead has one end connected to the other end of the heating circuit; The first lead and the second lead are used to conduct electricity so that the heating circuit generates heat.

5. The heating component according to claim 4, characterized in that, The heating circuit includes: A pretreatment layer, one side of which is disposed on the circumferential surface outside the heat-conducting component; An electroplated layer is disposed on the side of the pretreatment layer away from the heat-conducting component, and one end of the first lead and one end of the second lead are both connected to the side of the electroplated layer away from the pretreatment layer.

6. The heating component according to claim 5, characterized in that, The thickness of the pretreatment layer is between 0.1 μm and 3 μm, and / or the thickness of the electroplating layer is between 3 μm and 25 μm.

7. The heating component according to claim 4, characterized in that, The heating circuits are arranged in a spiral pattern on the circumferential surface of the heat-conducting component.

8. The heating component according to any one of claims 1-7, characterized in that, The heating component includes a connector and at least two heat-conducting elements, with adjacent heat-conducting elements connected by the connector. The connector and the heat-conducting component are formed by two-color injection molding, and the thermal conductivity of the heat-conducting component is higher than that of the connector.

9. The heating component according to any one of claims 1-7, characterized in that, The heat-conducting component is a hollow tubular structure.

10. An aerosol generating device, characterized in that, The aerosol generating device includes: A heating element, wherein the heating element is the heating element described in any one of claims 1-9, and the heating element is used to heat the aerosol generating article to cause the aerosol generating article to generate aerosol; A power supply component is electrically connected to the heating component and is used to supply power to the heating component so that the heating component generates heat.

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