A white FCOB light strip

Abstract

The application provides a white FCOB lamp strip, which comprises a substrate, a plurality of inverted blue light chips, a plurality of fluorescent glue and milky white glue; the plurality of inverted blue light chips are arranged on the substrate, the plurality of fluorescent glue is respectively coated on surfaces of the plurality of inverted blue light chips, and the plurality of fluorescent glue is sealed in the milky white glue.

Description

Technical Field

[0001] This application relates to the field of decorative lighting technology, and in particular to a white FCOB light strip. Background Technology

[0002] Existing FCOB (Full Chip On Board) LED strips are widely used, especially in lighting scenarios requiring high brightness and uniform light sources. However, the yellow appearance resulting from the phosphor coating on the FCOB chip surface is considered "aggressive" by some international customers, and the imprecise application often leads to uneven light emission, unstable luminous efficacy, or inconsistent color temperature. These issues significantly impact the overall lighting effect in some international customer groups, particularly in cabinet lighting applications, especially in display and artistic lighting. Therefore, developing a precise dot-mapping coating method with a white appearance to improve these problems is of great significance. Utility Model Content

[0003] The purpose of this application is to provide a white FCOB light strip to solve the problems of existing FCOB light strips having a yellow appearance due to the surface coating with fluorescent glue, as well as uneven light emission, unstable light efficiency, or inconsistent color temperature.

[0004] On the one hand, this application provides a white FCOB light strip, including a substrate, multiple flip-chip blue light chips, multiple phosphors and white glue;

[0005] Multiple flip-chip blue light chips are disposed on the substrate, multiple fluorescent adhesives are respectively coated on the surface of the multiple flip-chip blue light chips, and the multiple fluorescent adhesives are sealed in the white glue.

[0006] The white glue is fixed on the substrate.

[0007] The milky white glue comprises transparent organosilicon, organosilicon-modified epoxy resin and a dispersant, wherein the weight ratio of the organosilicon, organosilicon-modified epoxy resin and dispersant is (1-1.5):(75-100):(0.1-0.3).

[0008] The thickness of the fluorescent adhesive ranges from 0.4 to 0.5 mm.

[0009] The fluorescent adhesive includes green phosphor, red phosphor, and far-red phosphor. The peak wavelength of the green phosphor ranges from 511.5 to 513.5 nm, the wavelength of the red phosphor ranges from 651.5 to 653.5 nm, and the wavelength of the far-red phosphor ranges from 711.5 to 748.5 nm. The weight ratio of the green phosphor, red phosphor, and far-red phosphor is 1:(0.11-0.24):(0.06-0.14).

[0010] As described above, the white FCOB light strip of this application has the following beneficial effects:

[0011] Precision dotting technology ensures the coating accuracy of the fluorescent adhesive, and the outer layer of diffusing milky white adhesive makes the light output of each white FCOB LED strip more uniform. The double-layer adhesive protects the light source, ensuring that the LED strip will not experience dead LEDs or short circuits during long-term use. The overall appearance of the LED strip has been changed from the conventional yellow to milky white, which is closer to the color of the FPC substrate and is more friendly to international customers. Attached Figure Description

[0012] Figure 1 An exploded view of the structure of a white FCOB light strip provided in an embodiment of this application;

[0013] Figure 2 This is a schematic diagram of the structure of a white FCOB light strip provided in an embodiment of this application. Detailed Implementation

[0014] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, unless otherwise specified, the following embodiments and features in the embodiments can be combined with each other.

[0015] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. Therefore, the drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0016] It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness or purpose of this application, should still fall within the scope of the technical content disclosed in this application. Furthermore, the terms such as "upper," "lower," "left," "right," "middle," and "one" used in this specification are merely for clarity and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application.

[0017] like Figure 1 and Figure 2 As shown, Figure 1 This is a schematic diagram of the structure of a white FCOB light strip provided in one embodiment of this application. Figure 2 This is a schematic diagram of a white FCOB LED strip according to an embodiment of this application. The white FCOB LED strip includes a substrate 1, a plurality of flip-chip blue LEDs 2, a plurality of fluorescent adhesives 3, and a white adhesive 4. The plurality of flip-chip blue LEDs 2 are disposed on the substrate 1, and the plurality of fluorescent adhesives 3 are respectively coated on the surfaces of the plurality of flip-chip blue LEDs 2. The plurality of fluorescent adhesives 3 are sealed within the white adhesive 4. The white adhesive 4 is fixed to the substrate 1.

[0018] In this embodiment, the white FCOB LED strip is composed of multiple FCOB flip-chip blue LEDs 2, each of which is uniformly coated with phosphor adhesive 3. The phosphor adhesive 3 is coated using a precision dot-mapping technique to ensure consistent light intensity and stable color temperature for each FCOB flip-chip blue LED 2. See also... Figures 1-2 The white glue 4 is fixedly connected to the substrate 1 at the bottom. The fluorescent glue 3 encapsulates the flip-chip blue light chip 2 and then seals it inside the white glue 4. There is a space between the white glue 4 and the substrate 1 to accommodate the fluorescent glue 3 and the flip-chip blue light chip 2. The substrate 1 is preferably an FPC (Flexible Printed Circuit) substrate 1.

[0019] The milky white glue 4 comprises transparent organosilicon, organosilicon-modified epoxy resin and a dispersant, wherein the weight ratio of the organosilicon, organosilicon-modified epoxy resin and dispersant is (1-1.5):(75-100):(0.1-0.3).

[0020] In this embodiment, the basic material of the aforementioned milky white adhesive layer is one or more of transparent organosilicon and organosilicon-modified epoxy resin. The organosilicon and organosilicon-modified epoxy resin are mixed in a ratio of (1-1.5):(75-100), preferably in a weight ratio of 1:75. The organosilicon and organosilicon-modified epoxy resin include: single-component room temperature vulcanizing silicone glass sealant, single-component room temperature vulcanizing silicone rubber, two-component condensation-type room temperature vulcanizing silicone rubber, two-component addition-type room temperature vulcanizing silicone rubber, high-temperature curing silicone rubber, two-component epoxy resin adhesive, etc. In addition, by weight, 0.1-0.3 parts of organosilicon light diffusing powder (average particle size D50 2.0), preferably 0.2 parts, are added, that is, the weight ratio of organosilicon, organosilicon-modified epoxy resin and diffusing agent is preferably 1:75:0.2.

[0021] The thickness of the fluorescent adhesive 3 is in the range of 0.4-0.5 mm.

[0022] In this embodiment, the thickness of the fluorescent adhesive 3 can be adjusted according to the actual light emission requirements to obtain the ideal light emission effect, and the preferred thickness is 0.45mm.

[0023] The fluorescent adhesive 3 includes green phosphor, red phosphor and far-red phosphor. The peak wavelength of the green phosphor is in the range of 511.5-513.5 nm, the wavelength of the red phosphor is in the range of 651.5-653.5 nm, and the wavelength of the far-red phosphor is in the range of 711.5-748.5 nm. The weight ratio of the green phosphor, red phosphor and far-red phosphor is 1:(0.11-0.24):(0.06-0.14).

[0024] In this embodiment, when the peak wavelength of the green phosphor is preferably 512nm, the peak wavelength of the red phosphor is preferably 652nm, and the peak wavelength of the far-red phosphor is preferably 735nm, the FCOB light strip exhibits the highest luminous efficacy, the best spectral continuity, and the highest yield with a color rendering index (Ra) of 99 or higher. The weight ratio of the green phosphor, red phosphor, and far-red phosphor is 1:(0.11-0.24):(0.06-0.14). Based on this weight ratio, the FCOB light strip can achieve a spectrum close to the solar spectrum within the range of low color temperature (2200K) to high color temperature (7000K), with a color rendering index (Ra) of 99 or higher. The combined use of green phosphor, red phosphor, and far-red phosphor also plays an important role in improving spectral continuity and enhancing the color rendering index (Ra), color saturation (Rg), and color fidelity (Rf).

[0025] In the manufacturing process of this white FCOB light strip, the strip is 1 meter long, and each meter contains 320 FCOB blue flip chips. The light-emitting area of ​​each chip is precisely coated with fluorescent adhesive 3, with the thickness of the coating controlled between 0.5-0.8mm to ensure uniform white light output. This light strip is used for display lighting, providing a uniform and stable light source, avoiding the light spots and color temperature variations found in traditional lighting methods.

[0026] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this application should still be covered by the claims of this application.

Claims

1. A white FCOB light strip, characterized in that, Includes a substrate, multiple flip-chip blue light-emitting diodes, multiple phosphors, and white glue; Multiple flip-chip blue light chips are disposed on the substrate, multiple fluorescent adhesives are respectively coated on the surface of the multiple flip-chip blue light chips, and multiple fluorescent adhesives are sealed in the white glue; The white glue is fixed on the substrate.

2. The white FCOB light strip according to claim 1, characterized in that, The thickness of the fluorescent adhesive ranges from 0.4 to 0.5 mm.

3. The white FCOB light strip according to claim 1, characterized in that, The substrate is an FPC substrate.

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