LED lamp bead substrate facilitating heat dissipation

Abstract

The utility model discloses a LED lamp pearl substrate that is beneficial to heat dissipation relates to LED lamp technical field. Including heat dissipation aluminum support, the outer edge of heat dissipation aluminum support is equipped with heat dissipation fin, the bottom of heat dissipation aluminum support is equipped with fan groove, and the fan groove is installed with eddy current heat dissipation fan, the top of heat dissipation aluminum support is equipped with locating groove, and the middle part of locating groove is equipped with air hole, and the air hole is through with fan groove, and the both ends of locating groove are embedded with heat conduction plate. The LED lamp pearl substrate that is beneficial to heat dissipation, the heat conduction plate that sets up has the quick heat diffusion function, in the heat management application, can convert the point of high heat flux into the surface of low heat flux rapidly, is used for preventing the local overheating of substrate, and the design of air hole and mouth also is favorable to the enhancement of air convection, and the fin design on heat dissipation aluminum support can effectively increase the surface area of heat exchange, so that the heat can be more rapidly radiated to the surrounding environment, thereby improving the heat dissipation efficiency, so that the LED lamp has higher heat dissipation performance.

Description

Technical Field

[0001] This utility model relates to the field of LED lighting technology, specifically to an LED lamp bead substrate that facilitates heat dissipation. Background Technology

[0002] Aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. Generally, a single-sided board consists of three layers: a circuit layer (copper foil), an insulating layer, and a metal base layer. For high-end applications, there are also double-sided boards with a structure of circuit layer, insulating layer, aluminum base, insulating layer, and circuit layer.

[0003] LED aluminum substrate is the same as PCB circuit board, also known as printed circuit board. The only difference is that the circuit board is made of aluminum alloy. Because LEDs generate a lot of heat, the light produced when the LED light-emitting chip emits light does not contain ultraviolet and infrared rays. Therefore, its light cannot carry away the heat. The heat that is not dissipated in time after long-term operation will cause the temperature of the LED light-emitting chip to rise continuously, which will affect the light emission of the LED light-emitting chip and, in severe cases, directly cause the chip to die.

[0004] Existing technologies use aluminum substrates as heat dissipation substrates. However, the heat dissipation effect of a single aluminum substrate is limited, and it cannot completely dissipate the high heat generated by the LED, thus affecting the lifespan of the LED. Utility Model Content

[0005] This invention provides an LED lamp bead substrate that facilitates heat dissipation, thereby solving the problems in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an LED lamp bead substrate that facilitates heat dissipation, comprising a heat dissipation aluminum support, heat dissipation fins on the outer edge of the heat dissipation aluminum support, a fan slot at the bottom of the heat dissipation aluminum support, and a vortex cooling fan installed in the fan slot, a positioning groove at the top of the heat dissipation aluminum support, and a vent in the middle of the positioning groove, the vent communicating with the fan slot, thermal conductive plates embedded at both ends of the positioning groove, an LED aluminum substrate installed in the positioning groove, the bottom surface of the LED aluminum substrate being in contact with the top surface of the thermal conductive plate, and an opening in the middle of the LED aluminum substrate, the opening corresponding to the position of the vent.

[0007] Furthermore, the heat dissipation fins are arranged in a ring on the heat dissipation aluminum support, and the bottom surface of the heat dissipation fins protrudes from the bottom surface of the heat dissipation aluminum support, ranging from 1mm to 3mm.

[0008] Furthermore, an end cap is snapped onto the bottom of the fan slot, and the end cap is provided with heat dissipation holes.

[0009] Furthermore, the vortex cooling fan is fixed on the end cover, and the position of the vortex cooling fan corresponds to that of the heat dissipation hole.

[0010] Furthermore, the heat dissipation fins are provided with fixing holes, and the two ends of the positioning groove are provided with threaded holes.

[0011] Furthermore, the LED aluminum substrate is flush with the top surface of the heat dissipation aluminum support, and the two ends of the LED aluminum substrate are provided with waist-shaped holes, and the waist-shaped holes correspond to the positions of the threaded holes.

[0012] Compared with the prior art, the present invention provides an LED lamp bead substrate that facilitates heat dissipation, and has the following beneficial effects:

[0013] 1. This heat-dissipating LED lamp bead substrate features a heat-conducting plate with rapid heat diffusion capabilities. In thermal management applications, it can quickly convert high heat flux points into low heat flux surfaces to prevent localized overheating of the substrate. The design of the vents and openings also enhances air convection. The fin design on the heat-dissipating aluminum support effectively increases the surface area for heat exchange, allowing heat to be dissipated more quickly into the surrounding environment, thereby improving heat dissipation efficiency and giving the LED lamp high heat dissipation performance.

[0014] 2. This LED lamp bead substrate facilitates heat dissipation, while the heat dissipation aluminum support is used for the installation and fixation of the aluminum substrate. The structural design of the heat dissipation aluminum support can also provide a certain degree of protection for the aluminum substrate. The vortex cooling fan is used as a high-end version to cope with the heat dissipation of high-power LEDs. It is used to increase the airflow speed and flow rate through the heat dissipation aluminum support, enhance the heat dissipation capacity of the heat dissipation aluminum support, and ensure the best heat dissipation effect. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a top view of the present invention;

[0017] Figure 3 This is a top view of the heat dissipation aluminum support of this utility model.

[0018] In the diagram: 1. Aluminum heat sink support; 2. Heat sink fins; 3. Fan slot; 4. Vortex cooling fan; 5. Positioning slot; 6. Air vent; 7. Thermal conductive plate; 8. LED aluminum substrate; 9. Through port; 10. End cap; 11. Heat dissipation hole; 12. Fixing hole; 13. Threaded hole; 14. Waist-shaped hole. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figures 1-3 This utility model discloses an LED lamp bead substrate that facilitates heat dissipation, including a heat dissipation aluminum support 1. The outer edge of the heat dissipation aluminum support 1 is provided with heat dissipation fins 2. The bottom of the heat dissipation aluminum support 1 is provided with a fan groove 3, and a vortex cooling fan 4 is installed in the fan groove 3. The heat dissipation aluminum support 1 is used for mounting and fixing the aluminum substrate, and the structural design of the heat dissipation aluminum support 1 can also provide a certain degree of protection for the aluminum substrate. The vortex cooling fan 4 is used as a high-end version to cope with the heat dissipation of high-power LEDs. It is used to increase the airflow velocity and flow rate through the heat dissipation aluminum support 1, enhance the heat dissipation capacity of the heat dissipation aluminum support 1, and ensure the best heat dissipation effect. The top of the heat dissipation aluminum support 1 is provided with a positioning groove 5, and the middle of the positioning groove 5 is provided with a vent 6. The positioning groove 5 is connected to the fan slot 3. Heat-conducting plates 7 are embedded at both ends of the positioning groove 5. An LED aluminum substrate 8 is installed in the positioning groove 5, and the bottom surface of the LED aluminum substrate 8 is in contact with the top surface of the heat-conducting plate 7. The LED aluminum substrate 8 has a through-hole 9 in the middle, and the through-hole 9 corresponds to the position of the air hole 6. The heat-conducting plate 7 has a rapid heat diffusion function. In thermal management applications, it can quickly convert a high heat flux point into a low heat flux surface to prevent local overheating of the substrate. The design of the air hole 6 and the through-hole 9 also helps to enhance air convection. The fin design on the heat dissipation aluminum support 1 can effectively increase the surface area for heat exchange, so that heat can be dissipated to the surrounding environment more quickly, thereby improving heat dissipation efficiency and giving the LED lamp high heat dissipation performance.

[0021] Specifically, the heat dissipation fins 2 are distributed in a ring on the heat dissipation aluminum support 1, and the bottom surface of the heat dissipation fins 2 protrudes from the bottom surface of the heat dissipation aluminum support 1, ranging from 1mm to 3mm.

[0022] In this embodiment, the heat dissipation fins 2 are used to increase the surface area for heat exchange, so that heat can be dissipated to the surrounding environment more quickly.

[0023] Specifically, the bottom of the fan slot 3 is fitted with an end cover 10, and the end cover 10 is provided with heat dissipation holes 11.

[0024] In this embodiment, the end cap 10 mainly serves a protective function, while the heat dissipation hole 11 facilitates air circulation.

[0025] Specifically, the vortex cooling fan 4 is fixed on the end cover 10, and the position of the vortex cooling fan 4 corresponds to that of the heat dissipation hole 11.

[0026] In this embodiment, the working principle of the vortex cooling fan 4 is that the impeller is driven to rotate by the motor, and the blades in the impeller force the gas to rotate. The gas is thrown out by the centrifugal force, thereby achieving the heat dissipation effect. This design makes the vortex cooling fan 4 have the advantage of high-efficiency heat dissipation in small equipment.

[0027] Specifically, the heat dissipation fins 2 are provided with fixing holes 12, and the two ends of the positioning groove 5 are provided with threaded holes 13.

[0028] In this embodiment, the fixing hole 12 is a connection structure used to fix the heat dissipation aluminum bracket 1 to the lamp by screws.

[0029] Specifically, the LED aluminum substrate 8 is flush with the top surface of the heat dissipation aluminum support 1, and the two ends of the LED aluminum substrate 8 are provided with waist-shaped holes 14, and the waist-shaped holes 14 correspond to the positions of the threaded holes 13.

[0030] In this embodiment, the waist-shaped hole 14 is a connecting structure used to connect with the threaded hole 13 by screws, thereby fixing the LED aluminum substrate 8 to the heat dissipation aluminum support 1.

[0031] In use, the heat-conducting plate 7 (also known as a heat spreader or superconducting heat plate, whose function and working principle are the same as those of a heat pipe, which is to achieve rapid heat uniformity by circulating the evaporation and condensation of fluid within a plate-shaped cavity, thus enabling rapid heat conduction and diffusion) has a rapid heat diffusion function. In thermal management applications, it can quickly convert points with high heat flux into surfaces with low heat flux to prevent local overheating of the substrate. The design of the air vents 6 and the openings 9 also helps to enhance air convection. The fin design on the heat dissipation aluminum support 1 can effectively increase the surface area for heat exchange, allowing heat to be dissipated more quickly to the surrounding environment, thereby improving heat dissipation efficiency and giving the LED lamp high heat dissipation performance. The heat dissipation aluminum support 1 is used for the installation and fixation of the aluminum substrate, and the structural design of the heat dissipation aluminum support 1 can also provide a certain degree of protection for the aluminum substrate. The vortex cooling fan 4 is used as a high-end version to cope with the heat dissipation of high-power LEDs. It is used to increase the air velocity and flow rate through the heat dissipation aluminum support 1, enhance the heat dissipation capacity of the heat dissipation aluminum support 1, and ensure the best heat dissipation effect.

[0032] In summary, this heat-dissipating LED lamp bead substrate features a heat-conducting plate 7 with rapid heat diffusion capabilities. In thermal management applications, it can quickly convert high-heat-flux points into low-heat-flux surfaces to prevent localized overheating of the substrate. The design of the vents 6 and openings 9 also enhances air convection. The fin design on the heat-dissipating aluminum support 1 effectively increases the surface area for heat exchange, allowing heat to dissipate more quickly into the surrounding environment, thereby improving heat dissipation efficiency and giving the LED lamp high heat dissipation performance. Simultaneously, the heat-dissipating aluminum support 1 is used for mounting and fixing the aluminum substrate, and its structural design also provides some protection for the aluminum substrate. The included vortex cooling fan 4, a high-end version, is used to handle the heat dissipation of high-power LEDs. It increases the airflow velocity and volume through the heat-dissipating aluminum support 1, enhancing its heat dissipation capacity and ensuring optimal heat dissipation.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An LED lamp bead substrate with heat dissipation function, comprising a heat dissipation aluminum support (1), characterized in that: The outer edge of the heat dissipation aluminum support (1) is provided with heat dissipation fins (2), the bottom of the heat dissipation aluminum support (1) is provided with a fan groove (3), and a vortex cooling fan (4) is installed in the fan groove (3). The top of the heat dissipation aluminum support (1) is provided with a positioning groove (5), and the middle of the positioning groove (5) is provided with a wind hole (6). The wind hole (6) is connected to the fan groove (3). The two ends of the positioning groove (5) are fitted with heat-conducting plates (7). An LED aluminum substrate (8) is installed in the positioning groove (5), and the bottom surface of the LED aluminum substrate (8) is in contact with the top surface of the heat-conducting plate (7). The middle of the LED aluminum substrate (8) is provided with a through-hole (9), and the position of the through-hole (9) corresponds to that of the wind hole (6).

2. The LED lamp bead substrate with heat dissipation as described in claim 1, characterized in that: The heat dissipation fins (2) are distributed in a ring on the heat dissipation aluminum support (1), and the bottom surface of the heat dissipation fins (2) protrudes from the bottom surface of the heat dissipation aluminum support (1) in the range of 1mm-3mm.

3. The LED lamp bead substrate with heat dissipation as described in claim 1, characterized in that: The bottom of the fan slot (3) is fitted with an end cap (10), and the end cap (10) is provided with heat dissipation holes (11).

4. The LED lamp bead substrate with heat dissipation as described in claim 3, characterized in that: The vortex cooling fan (4) is fixed on the end cover (10), and the position of the vortex cooling fan (4) corresponds to the position of the heat dissipation hole (11).

5. The LED lamp bead substrate with heat dissipation as described in claim 1, characterized in that: The heat dissipation fins (2) are provided with fixing holes (12), and the two ends of the positioning groove (5) are provided with threaded holes (13).

6. The LED lamp bead substrate with heat dissipation as described in claim 5, characterized in that: The LED aluminum substrate (8) is flush with the top surface of the heat dissipation aluminum support (1). The LED aluminum substrate (8) has waist-shaped holes (14) at both ends, and the waist-shaped holes (14) correspond to the positions of the threaded holes (13).

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